基于Abaqus的砂带磨削单磨粒建模与仿真

对砂带磨削中单颗磨粒磨削过程进行了分析与建模,并利用Abaqus软件对具有不同负前角、切削速度与切削深度的单磨粒磨削过程中磨削力和温度的变化进行了仿真。分析结果表明,随着磨粒前角以及磨削深度的增大,磨削力和磨削温度都会增大。当磨削厚度达到一定程度时,将会出现锯齿型切屑,而切削速度对切向力影响较小。     

单颗粒金刚石加工SiCp/Al复合材料的仿真与实验研究

通过运用有限元分析软件ABAQUS建立二维平面单颗磨粒切削模型,对Si C颗粒体积分数为45%的Si Cp/Al的加工过程进行了仿真与实验研究,分析了不同的加工参数对切削力产生的影响,并研究了切削后已加工表面的表面形貌。实验结果和仿真结果均表明在一定条件下切削深度比切削速度对切削力的影响更显著,当切削深度一定时,切削速度对切削力的变化影响不大;当切削速度一定时,切削深度越大,切削力越大。单颗金刚石磨粒对复合材料中增强相的作用主要表现在Si C颗粒的旋转、移动,而由此造成的不连续的坑洞是加工过程中表面形成的主要缺陷。     

基于LS-DYNA的单颗磨粒超高速磨削成屑动态研究

磨削过程是由砂轮表面成千上万个形状各异的磨粒共同参与的切削过程。考虑到材料的本构关系、切屑与工件的分离准则及切屑与磨粒间的接触和摩擦,利用非线性显式动力学分析软件LS-DYNA对单颗磨粒切削过程进行了数值仿真模拟,得到了工件内部应力的变化规律。结果表明:成屑过程是材料受到切削刃挤压产生剪切滑移的过程;在切削初始,切削力急剧增大,当切削达到稳定状态时,材料的最大等效应力在某一值附近波动;当切削速度增大时,材料的最大等效应力将增大。运用此方法可以直观地观察切削过程的变化,进而可对磨削工艺参数进行优化。     

切削速度影响切削力的有限元模拟

运用有限元数值模拟技术对三维金属切削过程进行仿真。分析了切削速度对切削力的影响,并对仿真数据进行拟合处理,导出了不同方向上切削力与切削速度的关系式。探讨了刀具和工件不同阶段应力变化特征。模拟结果表明,刀尖处等效应力最大,切削力在低速切削时,随切削速度的增加而增大,当到达某临界速度时,将随着切削速度的增加而减小。     

钎焊金刚石砂轮高速磨削氧化铝的磨削比能研究

采用自制的钎焊金刚石砂轮对氧化铝陶瓷进行高速磨削试验研究,重点探讨不同磨削参数对磨削比能的影响。结果表明:磨削比能随砂轮线速度的增大而增大,而随磨削深度、工件速度和材料去除率的增大而减小;磨削比能与单颗磨粒最大切削厚度有直接的关系;在磨削过程中,大部分磨削能量消耗于金刚石磨粒对陶瓷工件的滑擦与塑性耕犁。     

基于ABAQUS的工程陶瓷单颗磨粒磨削仿真

设计单因素仿真实验,利用ABAQUS对单颗磨粒磨削过程进行仿真,分析结果。对单颗粒磨削过程中划擦、耕犁及切削三个阶段中材料应变进行讨论。并对不同仿真磨削参数下的法向磨削力进行比较,随砂轮线速度的增大而减小,随工件线速度的增大而增大。表明ABAQUS有限元仿真对磨削过程研究具有参考价值。     

氧化锆陶瓷磨削表面质量仿真与实验研究

研究高速磨削条件下砂轮线速度、切削深度等工艺参数对氧化锆陶瓷工件加工表面质量的影响。通过对单颗磨粒切削氧化锆陶瓷试件过程进行仿真,确定磨粒切削深度与切削速度对磨削力和磨削表面形貌的影响。同时,采用金刚石砂轮对氧化锆陶瓷进行平面磨削实验,获取磨削力和表面形貌等实验数据,对仿真结果进行实验验证。随着切削深度从2μm增大到8μm,单颗磨粒磨削力呈单调递增的趋势,工件表面质量逐渐恶化;当切削深度保持在2μm时,砂轮线速度对工件表面形貌影响不大;当切削深度加大到4μm以上时,提高砂轮线速度可以有效减轻磨削表面的破碎损伤。     

高速铣削中切削力的研究

在高速铣削试验的基础上，研究高速切削时切削速度对切削力的影响。结果表明，在切削速度较低的情况下，切削力随切削转速的增加而增大，但达到某一临界速度后，随着切削速度继续增大，剪切角增大，造成切向切削分力下降。不同刀具材料与工件材料的匹配在不同切削条件下有不同的临界切削速度。     

轴向超声辅助单颗CBN磨粒切削运动分析及切削力试验研究

为了研究CBN磨粒砂轮在轴向超声振动条件下的磨削特性,通过轴向超声振动辅助条件下单颗CBN磨粒切削试件的试验,以磨削力为研究对象,研究了轴向超声振动辅助条件下单颗CBN磨粒切削力,从微观角度进行磨粒的运动分析。研究表明:轴向超声辅助条件下的切削力,无论是单颗磨粒所受的法向力F_n还是切向力F_t的值均小于普通条件下的切削力。轴向超声振动辅助条件下单颗CBN磨粒切削运动轨迹是由刀具围绕工件的旋转运动和刀具的高频振动复合而成,其轨迹整体符合正弦曲线轨迹。通过正交试验得出,在一定条件下,轴向超声辅助下的切削力随磨粒切削速度、磨削深度的增大而增大,普通加工中随磨粒大小的增大而增大,超声加工时随磨粒增大有先增后减的趋势。此次试验研究对后期整个CBN砂轮在超声辅助条件下磨削的研究以及CBN砂轮的制备方面都有一定的意义和价值。     

基于ABAQUS的单颗磨粒磨削GH4169高温合金有限元分析

通过建立单颗磨粒磨削模型,采用ABAQUS软件对GH4169高温合金的磨削过程进行有限元仿真,探究单颗磨粒在不同参数下对GH4169高温合金工件磨削过程的影响。研究表明：磨粒从切入工件后到切出工件前,磨削力稳定波动,且与磨粒前角和磨削深度显著相关,切向磨削力随着磨粒前角增大而显著减小,随着磨削深度的增大而显著增大;最高磨削温度出现在磨粒切入工件的时刻,且与磨粒前角、磨削深度和磨削速度相关;磨粒前角对磨屑的形状影响显著,磨粒前角越大,磨屑越难排出,磨削速度对磨屑的形状影响较小,磨削深度影响磨屑的厚度和长度。     

Molecular dynamics modeling of a single diamond abrasive grain in grinding

In this paper the nano-metric simulation of grinding of copper with diamond abrasive grains, using the molecular dynamics (MD) method, is considered. An MD model of nano-scale grinding, where a single diamond abrasive grain performs cutting of a copper workpiece, is presented. The Morse potential function is used to simulate the interactions between the atoms involved in the procedure. In the proposed model, the abrasive grain follows a curved path with decreasing depth of cut within the workpiece to simulate the actual material removal process. Three different initial depths of cut, namely 4 ?, 8 ? and 12 ?, are tested, and the influence of the depth of cut on chip formation, cutting forces and workpiece temperatures are thoroughly investigated. The simulation results indicate that with the increase of the initial depth of cut, average cutting forces also increase and therefore the temperatures on the machined surface and within the workpiece increase as well. Furthermore, the effects of the different values of the simulation variables on the chip formation mechanism are studied and discussed. With the appropriate modifications, the proposed model can be used for the simulation of various nano-machining processes and operations, in which continuum mechanics cannot be applied or experimental techniques are subjected to limitations.     

A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel,workpiece characteristics,and grinding parameters

Wafer rotational grinding is widely employed for back-thinning and flattening of semiconducting wafers during the manufacturing process of integrated circuits. Grit cutting depth is a comprehensive indicator that characterizes overall grinding conditions, such as the wheel structure, geometry, abrasive grit size, and grinding parameters. Furthermore, grit cutting depth directly affects wafer surface/subsurface quality, grinding force, and wheel performance. The existing grit cutting depth models for wafer rotational grinding cannot provide reasonable results due to the complex grinding process under extremely small grit cutting depth. In this paper, a new grit cutting depth model for wafer rotational grinding is proposed which considers machining parameters, wheel grit shape, wheel surface topography, effective grit number, and elastic deformation of the wheel grit and the workpiece during the grinding process. In addition, based on grit cutting depth and ground surface roughness relationship, a series of grinding experiments under various grit cutting depths are conducted to produce silicon wafers with various surface roughness values and compare the predictive accuracy of the proposed model and the existing models. The results indicate that predictions obtained by the proposed model are in better agreement with the experimental results, while accuracy is improved by 40%–60% compared to the previous models.     

Effect of parameters on grinding forces and energy while grinding Al (A356)/SiC composites

Abstract

Grinding processes require a high energy input per unit volume of material removed, which is converted to heat at the grinding zone, resulting in increased force and wear. In the present study, the influence of grinding parameters like work speed and depth of cut on grinding forces and energy was studied. An attempt has been made to study the forces and energy involved while grinding aluminium alloy (A356)/silicon carbide (SiC) composite material with different grinding wheels. Experiments were carried out on a surface grinding machine. Three different types of wheels like SiC, cubic boron nitride (CBN) and diamond wheels were used. The grinding forces increased with increase in depth of cut and work speed. SiC exhibited high grinding force compared to the CBN wheel. In the case of the diamond wheel, it was even less. The specific grinding energy was highest for the diamond wheel followed by CBN and SiC wheels. The specific grinding energy decreased with increase in depth of cut and work speed.     

磨削加工中的尺寸效应机理研究

从比切削能和比摩擦能的大小变化与磨削参数的关系出发,研究了磨削加工中的尺寸效应问题,结果认为：比切削能的尺寸效应是金属剪切流动应力的尺寸效应和磨粒顶端钝圆影响的综合作用结果;当磨削深度或工件进给速度减小时,平均未变形切屑厚度减小,金属材料的剪应变效应和剪应变率效应增强,而热软化效应减弱,从而金属材料的剪切流动应力增大;当未变形切屑厚度减小时,磨粒顶端钝圆的影响增大;比摩擦能的尺寸效应是由于工件和砂轮的实际接触面积与磨削深度之间存在非线性关系及工件和砂轮间的摩擦因数的速度效应造成的;当工件进给速度减小时,工件与砂轮磨损平面间的摩擦因数增大。     

Some factors affecting the efficiency of individual grits in simulated grinding experiments

This study of the mechanics of grinding used a single grit approach and involved the development of a high frequency dynamometer to measure grinding forces at speeds of up to 37 m s^?1. Experiments have been carried out using idealised cutters to simulate abrasive grits; the grinding forces, the grinding coefficient and the specific energy were measured for a wide range of cutting speeds and workpiece hardness. For a grit of a given geometry the main factors affecting efficiency were found to be the hardness of the workpiece and the cutting speed.A theoretical model of the grinding process has been developed which enables normal grinding forces to be predicted from the flow pressure of the workpiece and the geometry and cutting efficiency of the grit.The implications of the work are discussed with particular reference to surface finish.     

切削用量对立铣加工钛合金Ti6Al4V切削力和切削温度影响规律的有限元仿真研究

利用软件AdvantEdge建立硬质合金涂层立铣刀三维铣削Ti6Al4V钛合金的有限元分析模型,模拟分析切削参数(切削速度、每齿进给量、轴向切削深度及径向切削深度)对刀具切削温度、切削力的影响规律。研究发现:切削力及切削温度随每齿进给量、轴向切削深度及径向切削深度的增加而增加:切削温度对切削深度的变化较敏感,随轴向切削深度和径向切削深度的增加显著增加;随着切削速度的增加,切削力先增大后减小,临界切削速度为120m/min。     

基于DEFORM的整体CBN刀具切削钛合金的有限元分析

利用DEFORM-3D有限元软件对整体CBN刀具车削钛合金进行了三维仿真,采用单因素试验法模拟分析CBN刀具车削钛合金时切削速度、背吃刀量和进给量对切削力和切削温度的影响。仿真结果表明:对切削力影响最大的是背吃刀量,其次是进给量,切削速度的影响最弱。切削温度方面,切削速度对其影响最大,背吃刀量最小。     

基于单颗磨粒玻璃磨削机理的仿真研究

从仿真角度研究了单颗金刚石磨粒的磨削机理;建立了单颗磨粒磨削玻璃等脆性材料的仿真模型,在此基础上,通过有限元软件对不同磨削条件下的单颗金刚石磨粒的磨削过程进行了仿真。最后从最大拉应力、磨削力两个方面对仿真结果进行了分析,研究了砂轮线速度、磨削深度对最大拉应力和磨削力的影响。