Investigation of SiOxCy film as the encapsulation layer for full transparent OLED using hollow cathode discharge plasma at room temperature

The plasma polymer of SiO_xC_y film has attracted much attention because it could possess both the organic and inorganic properties simultaneously for wide range applications. In this work, a SiO_xC_y film with a gradient composition through tuning the N₂O/N₂O + Ar ratio from 0% to 100% was used for TOLED encapsulation using hollow cathode discharge plasma. In order to confirm whether the plasma damage was caused during the PECVD process, a ZnO buffer layer prepared using RF sputtering was deposited before encapsulation. Furthermore, the reference samples with glass lid encapsulation were also used for comparison. The results showed that the SiO_xC_y film with a gradient composition cooperated with the sputtering ZnO buffer layer was a simple and effective method for TOLED encapsulation.     

Enhanced performance in organic light-emitting diodes by sputtering TiO2 ultra-thin film as the hole buffer layer

Organic light-emitting diodes were prepared using titanium oxide (TiO₂) ultra-thin film by RF magnetron sputtering as the hole buffer layer. The device configuration is ITO/TiO₂/N-N′-diphenyl-N-N′-bis(1-naphthyl)-1,1′-biphenyl-4,4′-diamine/tris(8-quinolinolato)-aluminum/LiF/Al. The maximum luminous efficiency for the 1.2 nm TiO₂ device is increased by approximately 46% (6.0 cd/A), in comparison with that of the control device (4.1 cd/A). The atomic force microscopy shows that with the insertion of TiO₂ buffer layer, the roughness of ITO surface decreases, which is favorable to improve the device luminance and increase the device lifetime. The mechanism behind the enhanced performance is that the TiO₂ layer enhances most of the holes injected from the anode and improves the balance of the hole and electron injections.     

Surface characteristics of parylene-C films in an inductively coupled O2/CF4 gas plasma

In this article, we report the results obtained from a study carried out on the inductively coupled plasma (ICP) etching of poly-monochloro-para-xylylene (parylene-C) thin films using an O₂/CF₄ gas mixture. The effects of adding CF₄ to the O₂ plasma on the etch rates were investigated. As the CF₄ gas fraction increases up to approximately 16%, the polymer etch rate increases in the range of 277-373 nm/min. In this work, the atomic force microscopy (AFM) analysis indicated that the surface roughness was reduced by the addition of CF₄ to the O₂ plasma. Contact angle measurements showed that the surface energy decreases with increasing CF₄ fraction. At the same time, X-ray photoelectron spectroscopy (XPS) demonstrated the increase in the relative F atomic content on the surface.     

Surface etching effects of amorphous C:H and CNx:H films formed by supermagnetron plasma for field emission use

Supermagnetron plasma was used to deposit amorphous hydrogenated carbon (a-C:H) and hydrogenated carbon nitride (a-CN_x:H) films for field-emission devices using i-C₄H₁₀/(H₂ or N₂). It was also used to improve the field-emission characteristics by surface etching using N₂/H₂ plasma. The best emission threshold electric field (E_TH) was 13 and 12 V/μm for devices using as-deposited a-C:H and as-deposited a-CN_x:H films, respectively, while they were remarkably improved to 11 and 8 V/μm by surface etching using N₂/H₂ (120/40 sccm) gas, though surface roughness was slightly increased by the surface etching. The hardness of as-deposited films was higher than 22 GPa.     

Electrical properties of AlNx/Al/Mo composite film prepared for use in thin-film transistors

In the present study, AlN_x/Al/Mo composite films with various thicknesses of AlN_x and Al layers were prepared to replace commercial AlNd/Mo composite film as the gate metal of the two metal layers (namely the gate metal and the source-drain metal) in thin-film transistor (TFT) specimens. The prerequisite for the TFT device is that no hillock is formed. The electrical properties of the AlN_x/Al/Mo TFT device rival those of the AlNd/Mo TFT device. One of eight kinds of AlN_x/Al/Mo composite films (0.05 µm/0.2 µm/0.07 µm) without hillocks was compared with the AlNd/Mo (0.25 µm/0.07 µm) composite film. The line width after development and strip inspections, the I_g (gate leakage current)-V_g (gate voltage) curve, the coating film resistance to electricity, the contact resistance between the indium tin oxide (ITO) film and the metal film, the I_d-V_g curve, and the critical dimension loss (CD loss) were compared. The experimental results indicate that the metal line widths for these two composite films are similar. The coating film resistance, the contact resistance between the ITO film and the metal film, and the I_d-V_g curve for the AlN_x/Al/Mo TFT device were similar to those for the AlNd/Mo TFT device. The CD loss shown in the AlN_x/Al/Mo TFT device was lower than that for the AlNd/Mo TFT device.     

Influence of oxygen/argon pressure ratio on the morphology, optical and electrical properties of ITO thin films deposited at room temperature

Transparent conductive oxides (TCOs) such as indium tin oxide (ITO) thin films onto glass substrates are widely used as transparent and conductive electrodes for a variety of technological applications including flat panel displays, solar cells, smart windows, touch screens, etc.ITO films on glass and polycarbonate (PC) substrates were prepared at room temperature (RT) and at different PO₂. The films were characterized in terms of the surface roughness (δ), sheet resistance, the refractive index (n) and extinction coefficient (k). The free carrier density (n_c) and the carrier mobility (μ) of the ITO (In₂O₃:Sn) films were measured and studied. The n_c and μ values vary in different ratio of oxygen partial pressure (PO₂) of ITO deposition. The observed changes in the ITO film resistivity are due to the combined effect of different parameter values for n_c and μ. From AFM analysis and spectra calculations, the surface roughness values of the ITO films were studied and it was observed that the δ values were lower than 15 nm. The energy band gap E_g ranges from 3.26 eV to 3.66 eV as determined from the absorption spectrum. It was observed an increase on the energy band gap as the PO₂ decrease in the range of 20-2% PO₂. The Lorentz oscillator classical model has also been used to fit the ellipsometric spectra in order to obtain both refractive index n and extinction coefficient κ values.     

APMOVPE growth and characterisation of undoped GaAsN/GaAs heterostructures

Unusual properties of the diluted nitrides A_IIIB_V-N make them very attractive in the point of view of fundamental investigations and practical applications. This work presents the growth characteristics and properties of the undoped GaAs_1−xN_x/GaAs heterostructures obtained by the atmospheric pressure metal organic vapour phase epitaxy (APMOVPE). The properties of the heterostructures were examined using high-resolution X-ray diffraction (HRXRD), photoreflectance spectroscopy (PR), photoluminescence (PL), photovoltage spectroscopy (PVS) and mercury probe C-V set-up with an HP 4192A impedance analyser (5 Hz-13 MHz). The maximum nitrogen content in GaAs_1−xN_x epilayers, determined from PR spectra, did not exceed 1.74%. The influence of the growth temperature (T_g) and the nitrogen source concentration in gas phase (X_g) on the properties of the GaAs_1−xN_x/GaAs heterostructures is presented and discussed.     

Improvement of color purity in white OLED based on Zn(HPB)2 as blue emitting layer

We synthesized zinc (II) [2-(2-hydroxyphenyl)benzoxazole] (Zn(HPB)₂) as blue emitting materials and evaluated in the organic light emitting diodes (OLEDs). The layer of Zn(HPB)₂ doped with 4-(dicyanomethylene)-2-t-butyl-6(1,1,7,7-tetramethyljulolidyl-9-enyl)-4H-pyran (DCJTB) (Zn(HPB)₂:DCJTB) as emitters has been demonstrated. The structure of the device is indium-tin-oxide (ITO)/N,N′-bis-(1-naphthl)-diphenyl-1,1′-biphenyl-4,4′-diamine (NPB, 40 nm)/Zn(HPB)₂/Zn(HPB)₂:DCJTB/Alq₃ (20 nm)/LiF/Al. The thickness of Zn(HPB)₂ layer was 0, 10, 20, 30 nm at the same time the thickness of Zn(HPB)₂:DCJTB layer were 40, 30, 20, 10 nm. When thickness of Zn(HPB)₂ layer was 30 nm and the thickness of Zn(HPB)₂:DCJTB layer was 10 nm, white emission is achieved. The Commission Internationale de l'Eclairage (CIE) coordinates of the white emission are (0.304, 0.332) at an applied voltage of 10.5 V.     

Electronic and junction properties of poly(2,5-dimethoxyaniline)-polyethylene oxide blend/metal Schottky diodes

Schottky barrier diode devices were fabricated in a sandwich configuration with a blend film consisting of a conducting polymer, poly(2,5-dimethoxyaniline), PDMA in an insulating matrix, polyethylene oxide (PEO). The influence of two different dopants, sulphate anion (SA) or methane sulfonate anion (MSA), in the electronic properties of the device was followed using the devices: ITO/PDMA (SA)-PEO/Al and ITO/PDMA (MSA)-PEO/Al. Current (I)-Voltage (V) characteristics were recorded for making a comparative evaluation of the electronic and junction properties of the devices. The junction and electronic parameters were analyzed and compared in the light of differences in the electronic state, morphology and transport of carriers. The device turn on voltage was found to be higher for Al/ PEO-PDMA (MSA)/ITO (∼3.0 V) in comparison to Al/ PEO-PDMA (SA)/ITO (∼2.85 V). The electronic states of PDMA doped with SA or MSA dopant were ascertained by optical UV-Visible spectroscopy. AC-impedance measurements were made for the devices and the values of bulk resistance (R_c), depletion resistance (R_d) and depletion layer width (W) were deduced through a proposed equivalent circuit. W for the device with PEO-PDMA (MSA) is more (∼24 nm) than the device with PEO-PDMA (SA) (∼8.5 nm). The observed higher Φ_B for PDMA-PEO (MSA) is consistent with this observation.     

Material properties and growth control of undoped and Sn-doped In2O3 thin films prepared by using ion beam technologies

Undoped (IO) and Sn-doped In₂O₃ (ITO) films have been deposited on glass and polymer substrates by an advanced ion beam technologies including ion-assisted deposition (IAD), hybrid ion beam, ion beam sputter deposition (IBSD), and ion-assisted reaction (IAR). Physical and chemical properties of the oxide films and adhesion between films and substrates were improved significantly by these technologies. By using the IAD method, non-stoichiometry and microstructure of the films were controlled by changing assisted oxygen ion energy and arrival ratio of assisted oxygen ion to evaporated atoms. Relationships between structural and electrical properties in ITO films on glass substrates were intensively investigated by using the IBSD method with changing ion energy, reactive gas environment, and substrate temperature. Smooth-surface ITO films (R_rms ≤ 1 nm and R_p-v ≤ 10 nm) for organic light-emitting diodes were developed with a combination of deposition conditions with controlling microstructure of a seed layer on glass. IAR surface treatment enormously enhanced the adhesion of oxide films to polymer substrate. The different dependence of IO and ITO films' properties on the experimental parameters, such as ion energy and oxygen gas environment, will be intensively discussed.     

Dislocation reduction in nitride-based Schottky diodes by using multiple MgxNy/GaN nucleation layers

We present the characteristics of nitride-based Schottky diodes with a single low-temperature (LT) GaN nucleation layer and multiple Mg_xN_y/GaN nucleation layers. With multiple Mg_xN_y/GaN nucleation layers, it was found that reverse leakage current became smaller by six orders of magnitude than that with a conventional LT GaN nucleation layer. This result might be attributed to the significant reduction of threading dislocations (TDs) and TD-related surface states. From the double crystal X-ray diffraction and photoluminescence analyses, it was found that the introduction of multiple Mg_xN_y/GaN nucleation layers could be able to effectively reduce the edge-type TDs. Furthermore, it was also found that effective Schottky barrier height (Φ_B) increased from 1.07 to 1.15 eV with the insertion of the multiple Mg_xN_y/GaN nucleation layers.     

Magnetron sputtering of TiOxNy films

This article reports on the characterization and preparation of N-doped titanium dioxide (TiO₂) films by reactive magnetron sputtering from Ti(99.5) targets in a mixture of Ar/O₂/N₂ atmosphere on unheated glass substrates. A dual magnetron system supplied by a dc bipolar pulsed power source was used to sputter the TiO_xN_y films. The amount of N in the TiO_xN_y film ranges from 5 to 40 at%. Its structure was measured using X-ray diffraction (XRD), the optical band gap was calculated from Tauc plots and the decrease of the water contact angle α_ir after the film activation by UV irradiation was investigated as a function of at% of N in the TiO_xN_y film. The yellow-coloured TiO_xN_y films with high (≈8 at%) amount of N exhibited a strong decrease of the band gap E_g down to 2.7 eV. A significant decrease of the water contact angle α_ir after UV irradiation has been observed for 2 μm thick transparent nanocrystalline (anatase+rutile) N-doped TiO₂ films containing less than 6 at% of N.     

Effect of the oxygen fraction on the structure and optical properties of HfOxNy thin films

The main purpose of this work was to prepare hafnium oxynitride (HfO_xN_y) thin films. HfO_xN_y thin films were deposited by radio frequency reactive magnetron sputtering from a pure Hf target onto Quartz and ZnS substrates at room temperature. The depositions were carried out under an oxygen-nitrogen-argon atmosphere by varying the flow rate of the reactive gases (oxygen/nitrogen ratio). The variation of the flow rate of the reactive gases changed the structure and properties of the films. Glancing incidence X-ray diffraction (GIXRD) was used to study the structural changes of as-deposited films; a new crystalline hafnium oxynitride phase was formed in a region of oxygen/nitrogen ratio. Cross-section of the films observed by SEM revealed that the films grew with a columnar-type structure, and surface observation with AFM showed values of surface roughness changed with the flow rate of the reactive gases, higher oxygen fraction had lower surface roughness than lower oxygen fraction. Visible spectra, infrared spectra, refractive index, absorption coefficient also changed with the variation of the oxygen fraction.     

Surface modification of indium tin oxide anodes by self-assembly monolayers: Effects on interfacial morphology and charge injection in organic light-emitting diodes

Three silane derivatives including dodecyltrichlorosilane (DDTS), phenyltriethoxysilane (PTES) and 3-aminopropyl-methyl-diethoxysilane (APMDS) were used to modify the indium tin oxide (ITO) surfaces. The effects of various terminal groups of the self-assembled monolayers (SAMs) on the growth behavior and interfacial morphologies of N,N′-di(naphthalene-1-yl)-N,N′-diphenylbenzidine (NPB) film deposited on the SAM-modified ITO were studied, as well as their effects on the performance of organic light-emitting diodes (OLED) devices. The results show that the growth behavior of NPB film over-deposited on the SAM-modified ITO is mainly determined by the wettability of the surface. The covering ability and thermal stability of NPB film on the SAM-modified ITO decrease in the order: bare ITO > ITO/PTES > ITO/APMDS > ITO/DDTS. However, the covering characteristic of NPB films on these substrates did not show direct relation to the transport of carriers across the anode/NPB interface as evaluated from the cyclic voltammogram and OLED performance. The turn-on voltages for these SMA-modified OLED devices increase in the order: ITO/PTES < ITO/DDTS ≤ bare ITO < ITO/APMDS. The enhancing effect of PTES on the hole injection is ascribed to the similar structure of PTES to NPB. On the contrary, the inhibition effect of APMDS is caused from the interaction of the lone-pair electrons of amine group to the transport carriers. Since these devices are known to be hole dominant, the luminance efficiency increase in a similar order as that for the turn-on voltage: ITO/PTES < ITO/DDTS ≤ bare ITO < ITO/APMDS.     

Effect of SiO2 buffer layer thickness on the properties of ITO/Cu/ITO multilayer films deposited on polyethylene terephthalate substrates

Transparent conductive ITO/Cu/ITO films were deposited on polyethylene terephthalate (PET) substrates with a SiO₂ buffer layer by magnetron sputtering using three cathodes at room temperature. The effect of the SiO₂ buffer layer thickness on the electrical and optical properties of ITO/Cu/ITO films was investigated. The ITO/Cu/ITO film deposited on the 40 nm thick SiO₂ buffer layer exhibits a sheet resistance of 143Ω/sq and transmittance of 65% at 550 nm wavelength. Highly transparent ITO/Cu/ITO films with a transmittance of 80% and a sheet resistance of 98.7Ω/sq have been obtained by applying −60 V substrate bias.     

Preparation of inorganic solid state thin film for electrochromic application

All oxide solid state ITO (indium tin oxide)/Li_yWO_3−x/Li_1−zMn₂O₄/ITO stacked structure was deposited on a silica glass substrate by pulsed laser deposition for its electrochromic application. The Li doped amorphous tungsten trioxide Li_yWO_3−x thin film prepared at room temperature and in oxygen pressure of 7 Pa got the color of blue due to the mixture valence state of tungsten. We found that the amorphous Li_1−zMn₂O₄ thin film was suitable for the electrochromic application in spite of the low ion conductivity along in-plane direction. The ITO electrode thin film deposited at room temperature showed the relatively high transmittance and the usable conductivity. The transmittance at a wavelength of 750 nm for the ITO/Li_yWO_3−x/Li_1−zMn₂O₄/ITO stacked film changed from 50% to 80% by the applied voltage, while the transmittance at around 450 nm did not change. The blue-colored electrochromic property could be observed for the all oxide solid state film.     

Synthesis for fine perovskite-type materials using precursor prepared by metal nitrates solution mixed with organic solvent

For the preparation of precursors for fine perovskite-type (0.05 mol) materials, the metal nitrates were completely dissolved in a water solution (total 100 ml) with organic solvent of ethylene glycol (EG), diethylene glycol (DEG), or glycerin (GL), and then dried at 120 °C. In the case of a La–Fe precursor without organic solvent, LaFeO₃ was not the main phase for the calcined materials even at 1000 °C. However, the LaFeO₃ single phase was obtained by mixing a small amount of organic solvent EG (≥10 ml), DEG(≥5 ml), and GL(≥5 ml) into the solution. In the case of EG, clear XRD peaks of the LaFeO₃ single phase were obtained by calcination even at 350 °C. A higher calcination temperature for the formation of the LaFeO₃ phase was needed with an increase in the amount of the mixed organic solvent. The oxygen in these organic molecules would act to coordinate to the metal ions instead of nitric acid ions to form a quasi-polymer containing metal ions in a random position, because the nitrogen elemental ratio in the precursor decreased with the amount of added organic solvent. The elemental distribution of La and Fe was highly homogeneous for the decomposed sample. The La_1−XSr_XMnO₃ system was also examined by this method using GL. A single perovskite-type phase formed even for calcination at 700 °C.     

Dry etching process of GaAs in capacitively coupled BCl3-based plasmas

Dry etching of GaAs was investigated in BCl₃, BCl₃/N₂ and BCl₃/Ar discharges with a mechanical pump-based capacitively coupled plasma system. Etched GaAs samples were characterized using scanning electron microscopy and surface profilometry. Optical emission spectroscopy was used to monitor the BCl₃-based plasma during etching. Pure BCl₃ plasma was found to be suitable for GaAs etching at > 100 mTorr while producing a clean and smooth surface and vertical sidewall. Adding N₂ or Ar to the BCl₃ helped increase the etch rates of GaAs. For example, the GaAs etch rate was doubled with 20% N₂ composition in the BCl₃/N₂ plasma compared to the pure BCl₃ discharge at 150 W CCP power and 150 mTorr chamber pressure. The GaAs etch rate was ∼ 0.21 µm/min in the 20 sccm BCl₃ plasma. The BCl₃/Ar plasma also increased etch rates of GaAs with 20% of Ar in the discharge. However, the surface morphology of GaAs was strongly roughened with high percentage (> 30%) of N₂ and Ar in the BCl₃/N₂ and BCl₃/Ar plasma, respectively. Optical emission spectra showed that there was a broad BCl₃-related molecular peak at 450-700 nm wavelength in the pure BCl₃ plasma. When more than 50% N₂ was added to the BCl₃ plasma, an atomic N peak (367.05 nm) and molecular N₂ peaks (550-800 nm) were detected. Etch selectivity of GaAs to photoresist decreased with the increase of % N₂ and Ar in the BCl₃-based plasma.     

CF4 plasma effect combined with rapid thermal annealing for high-k Er2O3 dielectrics

In this study, the influence of the duration of CF₄ plasma treatment of rapid thermal annealing on high-k Er₂O₃ dielectrics deposited on polycrystalline silicon was investigated using electrical and material analyses. Results demonstrate that Er₂O₃ dielectric films annealed at 800 °C and plasma treated with CF₄ for a period of 1 min exhibited excellent dielectric performance, including a higher breakdown electric field, lower charge trapping rate, and a larger charge-to-breakdown than the as-deposited sample. Performance improvements were caused by the incorporation of fluorine atoms and the reduction of dangling bonds and defect traps.     

Spray-pyrolysis Cd2SnO4 films for electrochemical applications

Conductive cadmium stannate (Cd₂SnO₄,) films were grown by a simple spray-pyrolysis technique using aerosols ultrasonically generated from solutions containing Cd(thd)₂(TMEDA) and ⁿBu₂Sn(AcAc)₂, and monoglyme as solvent (thd = 2,2,6,6-tetramethyl-3,5-heptanedionate, TMEDA = N,N,N′,N′-tetramethylethylenediamine, AcAc = acethylacetonate). The overall film growing procedure was carried out at or below 400 °C thus allowing low-melting temperature materials like glass to be used as film substrates. Typical resistivity values of Cd₂SnO₄ films were found to be ∼ 2 · 10 ⁻³ Ωcm. The films exhibit excellent electrochemical activity with comparable or higher electron transfer rates than cadmium stannate films obtained via sol-gel methods at high annealing temperature.