共查询到20条相似文献,搜索用时 203 毫秒
1.
《Photonics Technology Letters, IEEE》2009,21(13):887-889
2.
《Photonics Technology Letters, IEEE》2009,21(6):371-373
3.
Fang-Fang Ren Yu M.B. Ye J.D. Chen Q. Lo G.Q. Kwong D.L. 《Photonics Technology Letters, IEEE》2009,21(2):91-93
We have investigated the significant enhancement of light extraction from amorphous Si-Si3N4 multiple-quantum-well structures, in which two-dimensional hexagonal-lattice air-hole photonic crystals (PCs) were integrated. The vertical spectral integrated intensity of light emission around 674 nm was enhanced up to times due to strong coupling to the inherent leaky modes or radiation modes near Gamma point of PC's band structure. The experimental observations also suggested that coupling to leaky modes should be more beneficial for light extraction enhancement. 相似文献
4.
Yuanzheng Yue Yue Hao Jincheng Zhang Jinyu Ni Wei Mao Qian Feng Linjie Liu 《Electron Device Letters, IEEE》2008,29(8):838-840
We have developed a novel AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistor using a stack gate HfO2/Al2O3 structure grown by atomic layer deposition. The stack gate consists of a thin HfO2 (30-A) gate dielectric and a thin Al2O3 (20- A) interfacial passivation layer (IPL). For the 50-A stack gate, no measurable C-V hysteresis and a smaller threshold voltage shift were observed, indicating that a high-quality interface can be achieved using a Al2O3 IPL on an AlGaN substrate. Good surface passivation effects of the Al2O3 IPL have also been confirmed by pulsed gate measurements. Devices with 1- mum gate lengths exhibit a cutoff frequency (fT) of 12 GHz and a maximum frequency of oscillation (f MAX) of 34 GHz, as well as a maximum drain current of 800 mA/mm and a peak transconductance of 150 mS/mm, whereas the gate leakage current is at least six orders of magnitude lower than that of the reference high-electron mobility transistors at a positive gate bias. 相似文献
5.
《Quantum Electronics, IEEE Journal of》2009,45(7):830-832
6.
《Photonics Technology Letters, IEEE》2009,21(13):884-886
7.
Cheng C.H. Lin S.H. Jhou K.Y. Chen W.J. Chou C.P. Yeh F.S. Hu J. Hwang M. Arikado T. McAlister S.P. Chin A. 《Electron Device Letters, IEEE》2008,29(8):845-847
We report Ir/TiO2/TaN metal-insulator-metal capacitors processed at only 300degC, which show a capacitance density of 28 fF/mum2 and a leakage current of 3 times 10-8 (25degC) or 6 times 10-7 (125degC) A/cm2 at -1 V. This performance is due to the combined effects of 300degC nanocrystallized high-kappa TiO2, a high conduction band offset, and high work-function upper electrode. These devices show potential for integration in future very-large-scale-integration technologies. 相似文献
8.
Worhoff K. Bradley J.D.B. Ay F. Geskus D. Blauwendraat T.P. Pollnau M. 《Quantum Electronics, IEEE Journal of》2009,45(5):454-461
A reliable and reproducible deposition process for the fabrication of Al2O3 waveguides with losses as low as 0.1 dB/cm has been developed. The thin films are grown at ~ 5 nm/min deposition rate and exhibit excellent thickness uniformity within 1% over 50times50 mm2 area and no detectable OH- incorporation. For applications of the Al2O3 films in compact, integrated optical devices, a high-quality channel waveguide fabrication process is utilized. Planar and channel propagation losses as low as 0.1 and 0.2 dB/cm, respectively, are demonstrated. For the development of active integrated optical functions, the implementation of rare-earth-ion doping is investigated by cosputtering of erbium during the Al2O3 layer growth. Dopant levels between 0.2-5times1020 cm-3 are studied. At Er3+ concentrations of interest for optical amplification, a lifetime of the 4I13/2 level as long as 7 ms is measured. Gain measurements over 6.4-cm propagation length in a 700-nm-thick Al2O3:Er3+ channel waveguide result in net optical gain over a 41-nm-wide wavelength range between 1526-1567 nm with a maximum of 5.4 dB at 1533 nm. 相似文献
9.
Veloso A. Yu H.Y. Chang S.Z. Adelmann C. Onsia B. Brus S. Demand M. Lauwers A. O'Sullivan B.J. Singanamalla R. Pourtois G. Lehnen P. Van Elshocht S. De Meyer K. Jurczak M. Absil P.P. Biesemans S. 《Electron Device Letters, IEEE》2007,28(11):980-983
This letter reports that the effective work function (eWF) of Ni-Fully Silicided (Ni-FUSI) devices with HfSiON gate dielectrics can be modulated toward the silicon conduction band-edge by deposition of an ultra-thin Dy2O3 cap layer on the host dielectric. The obtained eWF depends on the deposited cap layer thickness and the Ni-FUSI phase, with 10 Aring Dy2O3 cap resulting in DeltaeWF ap 400 meV and final eWF ap 4.08 eV for NiSi-FUSI. Dielectric intermixing occurs without impacting the VT uniformity, gate leakage, mobility, and reliability. Well-behaved short-channel devices ( Lg ~ 100 nm, SS ~ 70 mV/dec, and DIBL ~ 65 mV/V) are demonstrated for both HfSiON and [HfSiON/Dy2O3 cap (5 Aring)] devices with NiSi-FUSI gates, corresponding to a similar . This capping approach, when combined with Ni-silicide FUSI phase engineering, allows (n-p) values up to 800 meV, making it promising for low- CMOS. 相似文献
10.
Solmaz M.E. Adams D.B. Grover S. Tan W.-C. Xia X. Eknoyan O. Madsen C.K. 《Photonics Technology Letters, IEEE》2009,21(9):557-559
A new waveguide platform is demonstrated that allows the bend radii to be substantially decreased for titanium-diffused lithium-niobate (LiNbO3) waveguides using vertically integrated arsenic-trisulfide (As2S3) overlay waveguides. Power is transferred from a Ti-diffused waveguide into the overlay waveguide using tapers, guided by the As2S3 waveguide through the S-bend region and transferred back into another Ti-diffused waveguide. This structure also behaves like a polarization beam splitter. We present simulation results as well as measurements to show the feasibility of achieving low loss and reduced bend radii for electrooptic waveguides. 相似文献
11.
Mamalis A.G. Hristoforou E. Manolakos D.E. Prikhna T. Theodorakopoulos I. Kouzilos G. 《Applied Superconductivity, IEEE Transactions on》2009,19(1):20-27
A MgB2 superconductor was prepared from Mg flakes or powders and B powders using the powder-in-tube technique with explosive consolidation. Compaction of Mg and B powders resulted in a two-phase alloy, due to the relatively low temperature developed during compaction as well as the very short duration of the process. Formation of MgB2 was obtained after subsequent heat treatment in argon atmosphere at a maximum temperature of 950degC. 相似文献
12.
Jian-Jun Yang Jing-De Chen Wise R. Steinmann P. Yee-Chia Yeo Chunxiang Zhu 《Electron Device Letters, IEEE》2009,30(10):1033-1035
In this letter, we investigate the dependence of the performance of metal-insulator-metal (MIM) capacitors with Sm2O3 dielectric on plasma treatment (PT) performed before Sm2O3 deposition, after Sm2O3 deposition, or both before and after Sm2O3 deposition. By performing PT in N2 ambient (PTN) after Sm2O3 dielectric formation, the effective quadratic voltage coefficient of capacitance (VCC) can be reduced from 498 to 234 ppm/V2 and the effective linear VCC can be reduced from 742.3 to 172 ppm/V for MIM capacitor with Sm2O3 dielectric having a capacitance density of ~ 7.5 fF/mum2. The leakage current density at +3.3 V can be reduced from 3.44 10-7 to 1.60 times 10-8 A/cm2 by performing PTN in both before and after Sm2O3 deposition. PTN after dielectric formation is an effective way to improve the performance of high-kappa dielectric MIM capacitors for RF and analog/mixed signal IC applications. 相似文献
13.
《Quantum Electronics, IEEE Journal of》2008,44(12):1164-1170
14.
Singisetti U. Wistey M.A. Burek G.J. Baraskar A.K. Thibeault B.J. Gossard A.C. Rodwell M.J.W. Byungha Shin Kim E.J. McIntyre P.C. Bo Yu Yu Yuan Wang D. Yuan Taur Asbeck P. Yong-Ju Lee 《Electron Device Letters, IEEE》2009,30(11):1128-1130
Abstract-We report Al2O3Zln0.53Ga0.47As MOSFETs having both self-aligned in situ Mo source/drain ohmic contacts and self-aligned InAs source/drain n+ regions formed by MBE regrowth. The device epitaxial dimensions are small, as is required for 22-nm gate length MOSFETs; a 5-nm In0.53Ga0.47As channel with an In0.4sAl0.52As back confinement layer and the n++ source/drain junctions do not extend below the 5-nm channel. A device with 200-nm gate length showed ID = 0.95 mA/mum current density at VGS = 4.0 V and gm = 0.45 mS/mum peak transconductance at VDS = 2.0 V. 相似文献
15.
180$^{circ}$ and 90$^{circ}$ Phase Shifting Networks With an Octave Bandwidth and Small Phase Errors
《Microwave and Wireless Components Letters, IEEE》2009,19(8):506-508
16.
《Microwave and Wireless Components Letters, IEEE》2008,18(11):749-751
17.
Chang S.Z. Yu H.Y. Adelmann C. Delabie A. Wang X.P. Van Elshocht S. Akheyar A. Nyns L. Swerts J. Aoulaiche M. Kerner C. Absil P. Hoffmann T.Y. Biesemans S. 《Electron Device Letters, IEEE》2008,29(5):430-433
In this letter, we report that by employing the La2O3/SiOx interfacial layer between HfLaO (La = 10%) high- and Si channel, the Ta2C metal-gated n-MOSFETs VT can be significantly reduced by ~350 mV to 0.2 V, satisfying the low-Vy device requirement. The resultant n-MOSFETs also exhibit an ultrathin equivalent oxide thickness (~1.18 nm) with a low gate leakage (JG = 10 mA/cm2 at 1.1 V), good drive performance (Ion = 900 muA/mum at Isoff = 70 nA/mum), and acceptable positive-bias-temperature-instability reliability. 相似文献
18.
The electrical characteristics of germanium p-metal-oxide-semiconductor (p-MOS) capacitor and p-MOS field-effect transistor (FET) with a stack gate dielectric of HfO2/TaOxNy are investigated. Experimental results show that MOS devices exhibit much lower gate leakage current than MOS devices with only HfO2 as gate dielectric, good interface properties, good transistor characteristics, and about 1.7-fold hole-mobility enhancement as compared with conventional Si p-MOSFETs. These demonstrate that forming an ultrathin passivation layer of TaOxNy on germanium surface prior to deposition of high-k dielectrics can effectively suppress the growth of unstable GeOx, thus reducing interface states and increasing carrier mobility in the inversion channel of Ge-based transistors. 相似文献
19.
《Photonics Technology Letters, IEEE》2009,21(11):682-684
20.
《Quantum Electronics, IEEE Journal of》2010,46(2):272-276