Conjugate heat transfer in fractal-shaped microchannel network heat sink for integrated microelectronic cooling application

The hydrodynamic and thermal characteristics of fractal-shaped microchannel network heat sinks are investigated numerically by solving three-dimensional N–S equations and energy equation, taking into consideration the conjugate heat transfer in microchannel walls. It is found that due to the structural limitation of right-angled fractal-shaped microchannel network, hotspots may appear on the bottom wall of the heat sink where the microchannels are sparsely distributed. With slight modifications in the fractal-shaped structure of microchannels network, great improvements on hydrodynamic and thermal performance of heat sink can be achieved. A comparison of the performance of modified fractal-shaped microchannel network heat sink with parallel microchannels heat sink is also conducted numerically based on the same heat sink dimensions. It is found that the modified fractal-shaped microchannel network is much better in terms of thermal resistance and temperature uniformity under the conditions of the same pressure drop or pumping power. Therefore, the modified fractal-shaped microchannel network heat sink appears promising to be used for microelectronic cooling in the future.     

The effect of geometrical parameters on heat transfer characteristics of microchannels heat sink with different shapes

The effect of geometrical parameters on water flow and heat transfer characteristics in microchannels is numerically investigated for Reynolds number range of 100–1000. The three-dimensional steady, laminar flow and heat transfer governing equations are solved using finite volume method. The computational domain is taken as the entire heat sink including the inlet/outlet ports, wall plenums, and microchannels. Three different shapes of microchannel heat sinks are investigated in this study which are rectangular, trapezoidal, and triangular. The water flow field and heat transfer phenomena inside each shape of heated microchannels are examined with three different geometrical dimensions. Using the averaged fluid temperature and heat transfer coefficient in each shape of the heat sink to quantify the fluid flow and temperature distributions, it is found that better uniformities in heat transfer coefficient and temperature can be obtained in heat sinks having the smallest hydraulic diameter. It is also inferred that the heat sink having the smallest hydraulic diameter has better performance in terms of pressure drop and friction factor among other heat sinks studied.     

A One-Dimensional Heat Transfer Model Analysis of Heat Sinks

A one-dimensional steady-state heat transfer model of heat sinks is proposed to determine the heat sink size needed for a given heat source. Both the temperature distribution and the maximum heat source temperature solution are presented analytically. The results are in closed form and can be conveniently used for determining the heat sink size. The two most important dimensionless parameters that describe the geometry and heat transfer characteristics of the heat sinks are defined and their influences on the maximum temperature of heat sinks are analyzed. The results show that the maximum heat source temperature decreases with the heat sink size. It is also shown that if the heat sink size is large enough then the effectiveness in reducing the maximum heat source temperature by increasing the heat sink size is significantly decreased.     

Experimental investigation of thermoelectric power generation versus coolant pumping power in a microchannel heat sink

The coolant heat sinks in thermoelectric generators (TEG) play an important role in order to power generation in the energy systems. This paper explores the effective pumping power required for the TEGs cooling at five temperature difference of the hot and cold sides of the TEG. In addition, the temperature distribution and the pressure drop in sample microchannels are considered at four sample coolant flow rates. The heat sink contains twenty plate-fin microchannels with hydraulic diameter equal to 0.93 mm. The experimental results show that there is a unique flow rate that gives maximum net-power in the system at the each temperature difference.     

Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance

In this study, fluid flow and heat transfer in microchannel heat sinks are numerically investigated. The three-dimensional governing equations for both fluid flow and heat transfer are solved using the finite-volume scheme. The computational domain is taken as the entire heat sink including the inlet/outlet ports, inlet/outlet plenums, and microchannels. The particular focus of this study is the inlet/outlet arrangement effects on the fluid flow and heat transfer inside the heat sinks.The microchannel heat sinks with various inlet/outlet arrangements are investigated in this study. All of the geometric dimensions of these heat sinks are the same except the inlet/outlet locations. Because of the difference in inlet/outlet arrangements, the resultant flow fields and temperature distributions inside these heat sinks are also different under a given pressure drop across the heat sink. Using the averaged velocities and fluid temperatures in each channel to quantify the fluid flow and temperature maldistributions, it is found that better uniformities in velocity and temperature can be found in the heat sinks having coolant supply and collection vertically via inlet/outlet ports opened on the heat sink cover plate. Using the thermal resistance, overall heat transfer coefficient and pressure drop coefficient to quantify the heat sink performance, it is also found these heat sinks have better performance among the heat sinks studied. Based on the results from this study, it is suggested that better heat sink performance can be achieved when the coolant is supplied and collected vertically.     

Effects of shield on thermal-fluid performance of vapor chamber heat sink

This work investigates the effects of a shield on the thermal and hydraulic characteristics of plate-fin vapor chamber heat sinks under cross flow cooling. The surface temperature distributions of the vapor chamber heat sinks are measured using infrared thermography. The thermal-fluid performance of vapor chamber heat sinks with a shield is determined by varying the fin width, the fin height, the fin number and the Reynolds number. The experimental data thus obtained are compared with those without a shield.Experimental results indicate that the maximum surface temperature of the vapor chamber heat sink is effectively reduced by adding the shield, which forces more cooling fluid into the inter-fin channel to exchange heat with the heat sink. However, using the shield increases the pressure drop across the heat sink. The experimental data also show that the enhancement of the heat transfer increases with the Reynolds number, but the improvement declines as the Reynolds number increases. When the pumping power and heat transfer are simultaneously considered, vapor chamber heat sinks with thinner, higher or more fins exhibit better thermal-hydraulic performance.     

Performance Assessment Comparison of Variable Fin Density Microchannels With Offset Configurations

Current technologies for the cooling of integrated circuits (IC) chips employ single-phase liquid flow through microchannel heat sinks. The surface temperature in these devices increases along the flow direction, leading to low heat transfer coefficients toward the channel exit. Enhancement of the heat transfer coefficient while mitigating the temperature nonuniformity has been possible with the utilization of variable fin density microchannels. A microchannel cooling layer suitable for three-dimensional (3D) stacking of IC chips is studied in this paper. The effect of the variation of geometrical parameters and operating conditions on the overall performance of the cooling layer is reported. The overall performance of eight different configurations presenting offset strip fins with variable fin density has been evaluated and compared to two cases with smooth rectangular microchannels, one case for each channel height. The cooling layer, with a length of 8 mm and a width of 7.92 mm, dissipates a total thermal power of 200 W by means of pumping coolant through 12 flow channels. Results from this investigation demonstrate the capability of the proposed configurations to decrease the surface temperature nonuniformities and to maintain the surface temperature below the allowable limits for IC chips while achieving low pressure drops. A parameter for the overall performance assessment, named the overall performance index, has been proposed; by computing and properly comparing the values for this parameter, the best performing configuration is identified.     

Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies

A multi-objective thermal design optimization and comparative study of electronics cooling technologies is presented. The cooling technologies considered are: continuous parallel micro-channel heat sinks, in-line and staggered circular pin-fin heat sinks, offset strip fin heat sinks, and single and multiple submerged impinging jet(s). Using water and HFE-7000 as coolants, Matlab’s multi-objective genetic algorithm functions were utilized to determine the optimal thermal design of each technology based on the total thermal resistance and pumping power consumption under constant pressure drop and heat source base area of 100 mm². Plots of the Pareto front indicate a trade-off between the total thermal resistance and pumping power consumption. In general, the offset strip fin heat sink outperforms the other cooling technologies.     

Cooling of Vertical Shrouded-Fin Arrays of Rectangular Profile by Natural Convection: An Experimental Study

Abstract

Experiments have been performed to determine the natural-convection heat transfer characteristics of vertically oriented shrouded heat sinks (finned surfaces) of rectangular profile under uniform heat flux condition applied to the base. The size and configuration of the heat sink, the power dissipated, and the clearance gap between the shroud and the fin tips were varied during the experiments. The heat transfer medium was air. The temperatures were maintained below 150° during the experiments, which is the maximum allowable operation temperature for most silicon-based electronic components. It was found that shrouding, in general, significantly enhances heat transfer from the heat sinks. For a fixed heat flux and heat sink configuration, the maximum temperature on the heat sink dropped as the clearance was increased, attained a minimum, and then started to rise again. The effect of the shroud on 'the maximum temperature and the average Nusselt number is illustrated     

Sustainability Assessment of Aluminum Heat Sink Design

The present effort addresses the application of sustainability criteria to the design of "heat sinks" used to cool advanced microelectronic components. The sustainability assessment is based on several criteria, including the use of natural resources, the environment, social welfare, and economic impact. The development of forced convection heat sinks, which are compatible with sustainable development, involves a subtle balance between the achieved thermal performance and the investment of material and energy in the fabrication and operation of the heat sink. It is shown that sustainability criteria can be used to select the environmentally optimal configuration among the most promising heat sink designs, including the lowest pumping power, the least mass of material, and the lowest total (fabrication and operation) energy for a specified application. Of the options considered for cooling a 100 W microprocessor with an aluminum heat sink operating at an excess temperature of 25 K, the heat sink design with the lowest total energy consumption was found to display the highest Sustainability Index.     

Cooling of Laser Slab by Forced Convection through a Heat Sink

The present study addresses a novel cooling scheme for the high-power solid-state laser slab. The scheme cools the laser slab by forced convection in a narrow channel through a heat sink. Numerical simulations were conducted to investigate the thermal effects of a Nd:YAG laser slab for heat sinks of different materials, including the undoped YAG, sapphire, and diamond. The results show that the convective heat transfer coefficient is non-uniform along the fluid flow direction due to the thermal entrance effect, causing a non-uniform temperature distribution in the slab. The heat sink lying between the coolant fluid and the pumped surface of the slab works to alleviate this non-uniformity and consequently improve the thermal stress distribution and reduce the maximum thermal stress of the slab. The diamond heat sink was found to be effective in reducing both the highest temperature and the maximum thermal stress; the sapphire heat sink was able to reduce the maximum thermal stress but not as effective in reducing the highest temperature; and the undoped YAG heat sink reduced the maximum thermal stress but tended to increase the highest temperature. Therefore, cooling with the diamond heat sink is most effective, and that with the sapphire heat sink follows; cooling with the undoped YAG heat sink may not apply if the highest temperature is a concern.     

Investigation on the jet liquid impingement heat transfer for the central processing unit of personal computers

In this paper, the jet liquid impingement heat transfer characteristics in the mini-rectangular fin heat sink for the central processing unit of a personal computer are experimentally investigated. The experiments are tested with three different channel width heat sinks under real operating conditions: no load and full load conditions. The jet liquid impingement cooling with mini-rectangular fin heat sink system is introduced as the active and passive heat transfer enhancement techniques. Effects of relevant parameters on the central processing unit temperature are considered. It is found that the central processing unit temperatures obtained from the jet liquid impingement cooling system are lower than those from the conventional liquid cooling system; however, the energy consumption also increases. The results of this study are of technological importance for the efficient design of cooling systems of personal computers or electronic devices to enhance cooling performance.     

Microscale heat transfer enhancement using thermal boundary layer redeveloping concept

We demonstrated a new silicon microchannel heat sink, composing of parallel longitudinal microchannels and several transverse microchannels, which separate the whole flow length into several independent zones, in which the thermal boundary layer is in developing. The redeveloping flow is repeated for all of the independent zones thus the overall heat transfer is greatly enhanced. Meanwhile, the pressure drops are decreased compared with the conventional microchannel heat sink. Both benefits of enhanced heat transfer and decreased pressure drop ensure the possibility to use “larger” hydraulic diameter of the microchannels so that less pumping power is needed, which are attractive for high heat flux chip cooling. The above idea fulfilled in microscale is verified by a set of experiments. The local chip temperature and Nusselt numbers are obtained using a high resolution Infrared Radiator Imaging system. Preliminary explanation is given on the decreased pressure drop while enhancing heat transfer. The dimensionless control parameter that guides the new heat sink design and the prospective of the new heat sink are discussed.     

An experimental investigation of forced convective cooling performance of a microchannel heat sink with Al2O3/water nanofluid

Experiments were conducted to investigate forced convective cooling performance of a copper microchannel heat sink with Al₂O₃/water nanofluid as the coolant. The microchannel heat sink fabricated consists of 25 parallel rectangular microchannels of length 50 mm with a cross-sectional area of 283 μm in width by 800 μm in height for each microchannel. Hydraulic and thermal performances of the nanofluid-cooled microchannel heat sink have been assessed from the results obtained for the friction factor, the pumping power, the averaged heat transfer coefficient, the thermal resistance, and the maximum wall temperature, with the Reynolds number ranging from 226 to 1676. Results show that the nanofluid-cooled heat sink outperforms the water-cooled one, having significantly higher average heat transfer coefficient and thereby markedly lower thermal resistance and wall temperature at high pumping power, in particular. Despite the marked increase in dynamic viscosity due to dispersing the alumina nanoparticles in water, the friction factor for the nanofluid-cooled heat sink was found slightly increased only.     

Effects of fin shapes on heat transfer in microchannel heat sinks

In the present study, compact water cooling of high‐density, high‐speed, very‐large‐scale integrated (VLSI) circuits with the help of microchannel heat exchangers were investigated analytically. This study also presents the result of mathematical analysis based on the modified Bessel function of laminar fluid flow and heat transfer through combined conduction and convection in a microchannel heat sink with triangular extensions. The main purpose of this paper is to find the dimensions of a heat sink that give the least thermal resistance between the fluid and the heat sink, and the results are compared with that of rectangular fins. It is seen that the triangular heat sink requires less substrate material as compared to rectangular fins, and the heat transfer rate per unit volume has been almost doubled by using triangular heat sinks. It is also found that the effectiveness of the triangular fin is higher than that of the rectangular fin. Therefore, the triangular heat sink has the ability to dissipate large amounts of heat with relatively less temperature rise for the same fin volume. Alternatively, triangular heat sinks may thus be more cost effective to use for cooling ultra‐high speed VLSI circuits than rectangular heat sinks.     

Heat transfer of nanofluids in the mini-rectangular fin heat sinks

In the present study, the heat transfer characteristics of nanofluids cooling in the mini-rectangular fin heat sink are studied. The heat sinks with three different channel heights are fabricated from the aluminum by the wire electrical discharge machine with the length, width and base thickness of 110, 60, and 2 mm, respectively. The nanofluids are the mixture of de-ionized water and nanoscale TiO₂ particles. The results obtained from the nanofluids cooling in mini-rectangular fin heat sink are compared with those from the de-ionized water cooling method. Effects of the inlet temperature of nanofluids, nanofluid Reynolds number, and heat flux on the heat transfer characteristics of mini-rectangular fin heat sink are considered. It is found that average heat transfer rates for nanofluids as coolant are higher than those for the de-ionized water as coolant. The results of this study are of technological importance for the efficient design of cooling systems of electronic devices to enhance cooling performance.     

Hotspot management using a hybrid heat sink with stepped pin-fins

A hybrid heat sink design with microchannels and stepped pin-fins is introduced for the hotspot-targeted thermal management of microprocessors. The thermal and hydraulic performance were assessed numerically and compared to that of a hybrid heat sink with uniform pin-fins. Both hybrid heat sinks were designed to have two zones using rectangular microchannels above the processor’s background area and an array of pin-fins (stepped and uniform pin-fins) over the hotspot area. Conjugate heat transfer analysis was performed with the entire heat sink as the computational domain by solving the three-dimensional Navier-Stokes and energy equations. The hybrid heat sink with stepped pin-fins exhibited remarkable improvement in the temperature uniformity at the hotspot as compared to the one with uniform pin-fins, along with ample improvements in the thermal resistance, maximum temperature rise at the hotspot, and pumping power. A parametric investigation was also performed for the hybrid heat sink with uniform pin-fins to find an optimum geometry based on two geometric parameters: the ratio of the diameter of the pin-fins to their pitch and the total number of pin-fins in the array. The results revealed improvements in the thermal performance, but the pumping power was increased.     

Thermal effect of a thermoelectric generator on parallel microchannel heat sink

Thermoelectric generators (TEG) convert heat energy to electrical power by means of semiconductor charge carriers serving as working fluid. In this work, a TEG is applied to a parallel microchannel heat sink. The effect of the inlet plenum arrangement on the laminar flow distribution in the channels is considered at a wide range of the pressure drop along the heat sink. The particular focus of this study is geometrical effect of the TEG on the heat transfer characteristics in the micro-heat sink. The hydraulic diameter of the microchannels is 270 μm, and three heat fluxes are applied on the hot surface of the TEG. By considering the maximum temperature limitation for Bi₂Te₃ material and using the microchannel heat sink for cooling down the TEG system, an optimum pumping power is achieved. The results are in a good agreement with the previous experimental and theoretical studies.     

Constructal Parallel-Flow and Counterflow Microchannel Heat Sinks with Bifurcations

Based on the Constructal Theory, parallel-flow and counterflow microchannels heat sinks with bifurcations are put forward to manage the temperature nonuniformity and further reduce the temperature of microchannel heat sinks bottom plates. Several models with different lengths of bifurcations are designed, and the corresponding laminar fluid flow and heat transfer of all models have been investigated through numerical simulations. The pressure, velocity, temperature distributions, and averaged Nusselt numbers are analyzed in details, and then the overall thermal resistances and overall thermal performance are compared. The results show that the thermal performance of counterflow microchannel heat sinks is better than that of parallel-flow heat sinks for the same geometry, and bifurcation can improve the thermal performance for all cases. It is suggested that a proper design of the length of bifurcation counterflow microchannel can be employed to improve the overall thermal performance of microchannel heat sinks. The study complements and extends previous works.     

Analytical heat diffusion models for heat sinks with circular micro-channels

This study explores the prediction of temperature distribution in a heat sink containing an array of circular micro-channels, which is found mostly in electronic cooling applications. The analytical heat diffusion models for most common micro-channel shapes are based on one-dimensional fin models with varying degrees of complexity. Because of a singularity in the governing one-dimensional heat diffusion equation for a fin with circular profile, no exact solution is possible for the circular heat sink geometry. In this paper, an alternative analytical power series solution technique is presented in which the differential equation is recast in polynomial form. Predictions of the power series solution are validated for different channel diameters and spacings and both one-sided and two-sided heating conditions using one-dimensional and two-dimensional numerical simulations. Overall, maximum percent differences in temperature and heat transfer rate between the analytical and two-dimensional numerical results of 0.23% and 1.33%, respectively, prove that the present analytical models are very accurate and effective tools for the design and thermal resistance prediction of micro-channel heat sinks found in electronic cooling applications.