黑硅光电探测材料与器件研究进展

黑硅作为一种新型光电材料,在光伏太阳能电池、光电探测器、CMOS图像传感器等领域被广泛研究,其中黑硅的光电探测技术备受关注,近些年来也取得了重要的研究进展。本文首先简单介绍了黑硅材料的结构,然后讨论了基于飞秒激光刻蚀法、湿法腐蚀、反应离子刻蚀法等方法制备的黑硅材料的性质。其次概述了基于以上方法制备的不同黑硅光电探测器的结构及性能,并讨论了黑硅器件在不同领域的应用。最后对黑硅光电探测技术进行了分析与展望,探讨了黑硅材料及器件未来的发展方向。     

硅光电开关应用之一——隔离比和信噪比的测量

根据微微秒脉冲作用半导体的光电特性,我们已成功地研制了几种开关元件,它的上升时间、光电灵敏度、抖动等,优越于其他开关元件。 利用硅光电开关,对锁模选脉冲开关的隔离比和激光信噪比进行测量,显示了测量方法简便、可靠和灵敏度高的优点,并且能够测出微小光信号的具体能量值。 报告分为三部分。首先介绍硅开关结构及光电特性的简单计算和测量。算得在微小光能～10微焦耳照射时,可流过电流达～10安培,而实验测得硅开关在10微焦耳光能下,电导通已接近饱和,证实了硅开关的光电灵敏特性。实验中详细测得其光电特性曲线,同时拍得开     

纳秒脉冲激光处理后硅电池光电转换效率研究

为了研究纳秒激光于硅晶片改性的可能性,对飞秒及皮秒激光在SF6气体中与硅表面作用形成锥形微观结构及其作用过程进行了分析。通过在SF6气体氛围中采用6ns激光脉冲辐照硅片表面的方法,以获得硅片表面峰状结构,并对此种作用下微观结构形成过程及结果进行了分析。将激光处理后的硅片与未经激光处理的硅片同时放入到硅电池片生产线的适当工序中制成硅电池片,通过对比测试两种硅电池的光电转换效率,从硅表面状况等因素对实验结果进行了初步分析。结果表明,激光处理后的硅片制成硅电池片的光电转换效率与未经激光处理的相比有一定程度的提高,可达15%～25%。     

多孔硅及其在MEMS中的应用

具有不同孔径尺寸和孔隙率的多孔硅在不同的 MEMS中可作为功能结构层和牺牲层。简要介绍了多孔硅的结构和制备方法 ;与体微机械和表面微机械加工技术相比 ,多孔硅技术的优势被详细阐述 ;针对多孔硅材料的性质 ,讨论了多孔硅在不同领域的应用。     

超短激光脉冲对硅表面微构造的研究

在特定的气体氛围下,用一定能量密度的超短脉冲激光连续照射单晶硅片表面,制备出表面具有准规则排列的微米量级锥形尖峰结构的“黑硅”新材料。不同背景气体下的实验表明,激光脉宽和背景气体对表面微构造的形成起着决定性的作用。具体分析了SF6气体氛围中,皮秒和飞秒激光脉冲作用下硅表面微结构的演化过程。虽然两者均可造成硅表面的准规则排列微米量级尖峰结构,但不同脉冲宽度的激光与硅表面相互作用的物理机制并不相同。在皮秒激光脉冲作用下,尖峰结构形成之前硅片表面先熔化;而飞秒激光脉冲作用下尖峰的演化过程中始终没有出现液相。对材料的光辐射吸收的初步研究表明,该材料对1.5~16μm的红外光辐射吸收率不低于80%。     

等离激元增强金硅肖特基结近红外光电探测器进展

表面等离激元共振衰减诱导热电子,因其能量高、分布窄、打破半导体禁带宽度限制等特点被广泛应用于拓展半导体光电转换的响应光谱,如拓展宽禁带半导体的响应光谱至可见光波段,拓展硅的响应波段至近红外。此外,还可以通过调节表面等离激元结构调控响应光谱和实现偏振探测,在实现硅基近红外光电探测领域具有重要的应用价值。从表面等离激元以及表面等离激元内光电效应的机理出发,综述了表面等离激元热电子原理在实现硅基近红外光电探测方面的研究进展,并总结了表面等离激元结构的形貌,尺寸、分布等因素对热电子的产生（外量子效率）和注入效率（内量子效率）的影响。最后展望了基于表面等离激元结构的硅基肖特基结近红外光电探测的研究方向。     

硅光学双稳态(SOB)器件

利用作者近期研制的硅光电表面负阻晶体管（PNEGIT）或光电“∧”双极晶体管（PLBT）两种硅光电负阻器件,提出并成功地实现了一种新型的硅光学双稳态器件。即以PNEGIT（或PLBT）作为光的输入器件,以其驱动一发光管（LED）作为光输出器件,由于PNEGIT和PLBT都具有光电负阻特性,致使在输出光功率（Pout）-输入光功率（Pin）特性上出现逆时针方向的光学双稳回线。这种器件具有光开关、光逻辑、光放大、光存贮、光眼福等多种功能,扩展了硅光电器件在光逻辑、光计算、光通讯等领域中的应用。     

硅基雪崩光电二极管技术及应用

硅基雪崩光电二极管是一种可用于对微弱光甚至单光子进行探测的光电器件,被广泛应用于激光测距、激光成像、量子通信和生物医疗等领域。从工作原理、常见结构和分类3个方面对硅基雪崩光电二极管的技术进行分析,并对其性能发展趋势进行阐述,最后介绍了硅基雪崩光电二极管的应用。     

多孔硅的应用研究进展

多孔硅是一种新型的纳米半导体光电材料,室温下具有优异的光致发光、电致发光等特性,易与现有硅技术兼容,极有可能实现硅基光电器件等多个领域的应用．扼要论述了多孔硅在绝缘材料、敏感元件及传感器、照明材料及太阳能电池、光电器件以及作为合成其它材料的模板等多个领域内的应用进展情况,并对其发展前景作了展望。     

硅基非球面柱面微透镜阵列制备方法

非球面柱面微透镜是一种重要的微光学元件,具有激光准直、聚焦、匀化等功能,在激光通信、光纤传感、激光雷达测距、激光泵浦等系统中具有广泛的应用。为了减小光电系统的体积、提升光纤性能,增大透镜数值孔径是一种常用的解决方案。提出采用折射率更大的硅作为低折射率石英基底的替代材料,使得微透镜在相同体积下数值孔径大幅提升,同时可以降低加工量从而提升制备效率。针对传统石英微透镜的制备方法不再适用硅基微透镜的问题,提出基于掩模移动曝光方法制备光刻胶非球面图案,使用多次涂胶和循环曝光方法,分别解决厚胶涂覆均匀性差及曝光掩模痕迹明显等问题,最终利用等离子体刻蚀技术进行图案转移传递,从而实现微透镜的制备。以数值孔径2.9的硅基非球面柱面透镜阵列为例开展实际制备工艺实验,所制备的微透镜列阵面型精度PV为0.766 μm,表面粗糙度Ra为3.4 nm,表面光洁与设计值符合较好,验证了制备方法的可行性。该方法有望促进非球面柱面微透镜列阵在紧凑化红外光电系统中的大规模应用。     

Influence of substrate on the growth of microcrystalline silicon thin films deposited by plasma enhanced chemical vapor deposition

Microcrystalline silicon (μc-Si) thin films are widely used for silicon thin film solar cells, especially in the high performance tandem solar cells which comprise an amorphous silicon junction at the top and a μc-Si junction at the bottom. One of the major factors affecting the photovoltaic properties of μc-Si thin film solar cells of thin films is the quality of the μc-Si thin films. In this work, we investigated the effect of substrates on the crystallization characteristics and growth behaviors of μc-Si thin films grown by the plasma enhanced chemical vapor deposition method (PECVD), and found that substrates have a strong effect on the crystallization characteristics of μc-Si thin films. In addition, the growth rate of μc-Si thin films was also highly influenced by the substrates. Three types of substrates, quartz glass, single crystalline silicon and thermally oxidized single crystalline silicon, were used for growing μc-Si thin films from SiH₄/H₂ with a flow rate ratio 2:98 at different temperatures. Crystallization characteristics of these μc-Si thin films were studied by Raman scattering and X-ray diffraction techniques.     

太赫兹全息成像技术在太阳电池中的应用

晶体硅太阳电池具有成本低廉、工艺简单等优点,但在生产过程中难免会出现断栅、破裂等问题,因此对太阳电池片的检测至关重要。太赫兹波作为一种具有光子学及电子学特征的电磁波在无损检测方面具有独特的优势。通过采用太赫兹量子级联激光器数字全息成像系统,对模拟设计的太阳电池金属栅线、破裂硅片以及不同电阻率的衬底进行测试。结果表明,太赫兹全息成像技术在太阳电池检测领域具有较高的应用价值。     

20·5% efficient silicon solar cell with a low temperature rear side process using laser‐fired contacts

The paper presents a rear side structure for crystalline silicon solar cells, which is processed at a maximum temperature of 220°C. Using two different material compositions for electrical and optical needs, the layer system has excellent passivation properties, enhances light trapping and allows for a good ohmic contact. With this structure we achieve an independently confirmed conversion efficiency η=20·5% on a 250 μm thick silicon solar cell. Due to the fact that the maximum process temperature is 220°C, this layer system enables new solar cell concepts. Copyright © 2006 John Wiley & Sons, Ltd.     

黑硅制备及应用进展

黑硅作为一种新型低反射率的硅材料,有良好的广谱吸收特性,在光电领域将有很好的应用前景.概括地介绍了黑硅的各种制备方法(飞秒激光扫描、化学腐蚀法和等离子体处理),以及黑硅在太阳能电池、光电二极管、场发射、太赫兹发射等领域的应用.     

Survey of material options and issues for thin film silicon solar cells

The high production cost of thick high-efficiency crystalline silicon solar cells inhibits widespread application of photovoltaic devices whereas the most developed of thin film cell technologies, that based on amorphous silicon, suffers inherent instability and low efficiency. Crystalline thin-film silicon solar cells offer the potential for a long-term solution for low cost but high-efficiency modules for most applications. This paper reviews the progress in thin-film silicon solar cell development over the last two decades, including progress in thin-film crystal growth, device fabrication, novel cell design, new material development, light trapping and both bulk and surface passivation. Quite promising results have been obtained for both large-grain (>100 μm) polycrystalline silicon material and the recently developed microcrystalline silicon materials. A novel multijunction solar cell design provides a new approach to achieving high-efficiency solar cells from very modest quality and hence low-cost material. Light trapping is essential for high performance from thin-film silicon solar cells. This can be realized by incorporating an appropriate texture on the substrate surface. Both bulk and surface passivation is also important to ensure that the photogenerated carriers can be collected effectively within the thin-film device. © 1998 John Wiley & Sons, Ltd.     

Schottky solar cells on thin epitaxial silicon

Schottky solar cells fabricated on 10, 20 and 30 μm epitaxial silicon produce a current density ranging from about 10–22 mA/cm², depending on Si thickness and orientation, in close agreement with theoretically predicted data. These results are also in close agreement with recent data on p-n solar cells, using thin epitaxial silicon. Data reported herein predict that 10% efficient Schottky solar cells could be produced using about 20 μ of silicon on a suitable substrate. A 7.6% efficient Schottky solar cell on epitaxial silicon has been recently fabricated and tested using AM1 sunlight (100 mW/cm²).     

纳米多孔硅的场致电子发射性能研究

对采用阳极氧化法及阴极还原表面处理技术制备的性能稳定的纳米多孔硅,用原子力显微镜(AFM)表征了其微观结构,多孔硅颗粒粒径在30 nm左右.室温条件下测试了多孔硅场电子发射的特性,结果表明,多孔硅具有很好的场致发光性能,在5 V/μm的电场下就可以产生场发射电流.多孔硅的开启电压在1 000 V左右,发射电流随着电压的增大而不断增大,发射电压在2 000 V以上.

Abstract：

Nanoscale porous silicon (PS) was prepared by anodic oxidation, cathode reduction and surface treatment technique. The porous silicon particles with the average diameter of about 30 nm were obtained by characterizing their microstructure with atomic force microscope (AFM). Electron field emission characteristics of porous silicon were investigated at room temperature. The resuhs demonstrate that porous silicon has favorable electroluminescence properties, and the field emission current can be generated only under the electric field of 5 V/ μm. And the turn - on voltage is about 1 000 V. With the increase of the offered voltage, the emission current is enhanced and the emission voltage is over 2 000 V.     

Influence of wafer thickness on the performance of multicrystalline Si solar cells: an experimental study

The influence of the thickness of silicon solar cells has been investigated using neighbouring multicrystalline silicon wafers with thickness ranging from 150 to 325 μm. For silicon solar cell structures with a high minority‐carrier diffusion length one expects that J_sc would decrease as the wafer becomes thinner due to a shorter optical path length. It was found experimentally that J_sc is nearly independent of the thickness of the solar cell, even when the minority‐carrier diffusion length is about 300 μm. This indicates that the Al rear metallisation acts as a good back surface reflector. A decrease in J_sc is observed only if the wafer thickness becomes less than about 200 μm. The observed trend in V_oc as a function of the wafer thickness has been explained with PC1D modelling by a minority‐carrier diffusion length in the Al‐oped BSF which is small in relation to the thickness of the BSF. This effectively increases the recombination velocity at the rear of the cell. We have shown that the efficiency of solar cells made with standard industrial processing is hardly reduced by reducing the wafer thickness. Solar cell efficiencies might be increased by better rear surface passivation. Copyright © 2002 John Wiley & Sons, Ltd.     

17.6% efficient multilayer thin-film silicon solar cells deposited on heavily doped silicon substrates

We report new results for multilayer thin-film silicon solar cells deposited onto electronically inert, heavily doped crystalline silicon substrates. The n-p-n-p-n active layers of a total thickness of 17 μm combined with a 15-μm thick p⁺-type buffer layer were deposited by chemical vapour deposition epitaxially onto a 10¹⁹ cm⁻³ doped Czochralski-grown silicon substrate. The cells fabricated using these layers exhibit an energy conversion efficiency of up to 17.6%, as measured by Sandia National Laboratories, which is the highest efficiency ever achieved for a thin-film silicon cell deposited onto such an electronically inert crystallographic template. An open-circuit voltage of 664.2 mV is also reported, the highest ever for a cell on such substrates.