纳米压痕法测量锌铝钎料的室温蠕变应力指数

利用纳米压痕技术,采用恒加载速率法,研究了Zn-22Al和Zn-22Al-0.03Ti钎料的室温蠕变行为,并对相关数据进行了测量和计算.结果表明,室温时任一载荷条件下保载时,钎料均发生了明显的蠕变行为.其中Zn-22Al-0.03Ti钎料的压入深度和蠕变位移均小于Zn-22Al钎料,最大差值分别为15.68％和26.87％.相同保载时间不同载荷保载时,两种钎料的蠕变位移均有较大差异.通过拟合计算分别获得了两种钎料室温时的蠕变应力指数,Zn-22Al-0.03Ti较Zn-22Al提高了35.79％.分析认为,Ti元素的添加导致了Zn-22Al钎料晶粒的细化,从而产生了更多的晶界是导致钎料室温抗蠕变能力提高的主要原因.     

Microstructure and Property of Cu/Al Joint Brazed with Al-Si-Ge Filler MetalEI北大核心CSCD

Cu/Al brazing has good prospect for applications in the air conditioning and refrigeration industry. A suitable filler metal is the key of Cu/Al brazing. The chemical and physical properties of the filler metal have great influence on the brazing process and parameters. And the strength of the brazing joint is closely related to the properties of the filler metal and the brazing process. While the previous studies have not developed a kind of Cu/Al brazing filler metal which can achieve a tough joint at a low brazing temperature. In this work, the Al-5.6Si-25.2Ge filler metal was first used to braze Cu/Al dissimilar metals, and the melting characteristics of the filler metal, spreading wettability, Cu interfacial structure and strength of brazed joint were investigated systematically. Additionally, the common Zn-22Al filler metal was also used for comparison. The results show that the Al-5.6Si-25.2Ge filler metal possesses low melting temperature (about 541 degrees C) and excellent spreading wettability on Cu and Al base metals. The interfacial structure of Al-5.6Si-25.2Ge/Cu was CuAl2/CuAl/Cu3Al2. The thickness of planar CuAl and Cu3Al2 phases was only 1 similar to 2 mu m, and the thickness of cellular CuAl2 phase was about 3 mu m. The interfacial structure of Zn-22Al/Cu was CuAl2/CuAl/Cu9Al4, but the average thickness of the CuAl2 layer was up to 15 mm. The test results of the shearing strength show that the shearing strength of the Cu/Al joint brazed with Zn-22Al filler metal was only 42.7 MPa, but the shearing strength brazed with Al-5.6Si-25.2Ge filler metal was higher (53.4 MPa).     

稀土元素Ce对Zn-22Al钎料组织和性能的影响

研究了稀土元素Ce的添加对Zn-22Al钎料的电阻率、熔化特性、铺展性能、显微组织以及钎焊接头抗剪强度的影响.结果表明,铈的加入对钎料的电阻率、熔化特性影响甚微,但显著改善了钎料的铺展性能,细化了钎料的基体组织,提高了钎焊接头的抗剪强度.当Ce元素的添加量达到0.05%时,钎料在铝、铜两种母材上的铺展面积取得最大值,分别较未添加时提高了21.4%和11.6%;钎焊接头抗剪强度达到最大值91.3 MPa,比未添加稀土时提高了30.3%.稀土铈含量继续增加时,其显微组织中出现脆性稀土相并且尺寸有增大的趋势,钎料铺展性能、钎焊接头强度明显恶化.     

Dissimilar metal joining of aluminum alloy to galvanized steel with Al-Si, Al-Cu, Al-Si-Cu and Zn-Al filler wires

Aluminum alloy sheets were lap joined to galvanized steel sheets by gas tungsten arc welding (GTAW) with Al-5% Si, Al-12% Si, Al-6% Cu, Al-10% Si-4% Cu and Zn-15% Al filler wires. Different amounts of Si, Cu and Zn were introduced into the weld through different filler wires. The effects of alloying elements on the microstructure in the weld and tensile strength of the resultant joint were investigated. It was found that the thickness of the intermetallic compound (IMC) layer decreased and the tensile strength of the joint increased with the increase of Si content in the weld. The thickness of the IMC layer could be controlled as thin as about 2 μm and the tensile strength of the dissimilar metal joint reached 136 MPa with Al-12% Si filler wire. Al-Si-Cu filler wire could result in thinner interfacial layer than Al-Cu filler wire, and fracture during tensile testing occurred in the weld for the former filler wire but through the intermetallic compound layer for the latter one. A Zn-rich phase formed in the weld made with Zn-15% Al filler wire. Moreover, the Zn-Al filler wire also generated thick interfacial layer containing a great amount of intermetallic compounds and coarse dendrites in the weld, which led to a weak joint.     

锆元素对Zn-15Al钎料组织和性能的影响

通过扫描电镜、X射线衍射和纳米压痕等方法研究了微量Zr元素对铝合金/不锈钢异种金属钎焊用Zn-15Al钎料显微组织和性能的影响.结果表明,微量Zr元素的添加对钎料的熔点没有明显影响.Zr元素对Zn-15Al钎料基体中η-Zn相有明显细化作用,当Zr元素的质量分数为0.2%时,细化效果最佳;Zr元素的添加量过多时,钎料中形成块状的Al₂ZnZr化合物.当Zr元素的质量分数为0.2%时,Zn-15Al-0.2Zr钎料在不锈钢和铝合金母材上的铺展面积较Zn-15Al钎料分别提高了15.9%和10.2%,钎焊接头抗剪强度达到最大值143 MPa.Zn-15Al,Zn-15Al-0.2Zr,Zn-15Al-0.3Zr 3种钎料的蠕变应力指数分别为6.64,7.35,8.07.     

时效对铜铝钎焊接头界面化合物和性能的影响

采用Zn-22Al钎料对铜铝异种合金进行了火焰钎焊,并用加速老化试验模拟了其服役环境.研究了时效过程中铜铝钎焊接头界面化合物的形貌变化及其对铜铝钎焊接头电阻率和抗剪强度的影响,并对其生长规律进行了初步计算.结果表明,铜侧界面化合物在250℃恒温时效过程中不断变厚,其生长规律呈抛物线状,且其生长系数约为6.1×10-13cm2/s;当界面化合物的厚度为4.2μm和18.1μm时,铜铝接头的电阻分别为120.3μΩ和132.9μΩ,该界面化合物厚度对电阻率的影响系数为0.25;铜铝接头抗剪强度在时效过程中先有3%的上升,随后逐渐降低至接头初始值的85%.     

TiAl基合金与Ti合金的真空钎焊

采用Ag-Cu钎料与Ti-Zr-Ni-Cu钎料,对TiAl与Ti合金进行了真空钎焊试验,主要研究了采用两种钎料时的界面反应以及钎焊温度对界面组织及性能的影响.研究发现,采用Ag-Cu钎料时界面结构为:Ti/Ti(Cu,Al)2/TiCux Ag(s,s)/Ag(s,s)/Ti(Cu,Al)2/TiAl,当钎焊温度T=1 223 K,保温时间t=10 min时接头的剪切强度达到223.3 MPa;采用Ti-Zr-Ni-Cu钎料时在界面出现了Ti2Ni,Ti(Cu,Al)2等多种金属间化合物,当钎焊温度T=1 123 K,保温时间t=10 min时接头的剪切强度达到139.97 MPa.     

Sb元素及稀土对Zn-10Al基钎料及钎焊接头性能影响

向Zn-10Al-5Cu基体中添加元素Sb及稀土镧钕,采用真空炉、万能材料试验机、金相及扫描电镜等设备,研究了Sb元素及稀土添加量对Zn-10Al-5Cu组织、性能及钎焊接头性能的影响.结果表明,钎料合金的铺展面积随Sb元素添加量的增加先较快增大后又趋于稳定趋势;抗拉强度随Sb元素添加量的增加而稳定增加;钎料组织由共析与共晶组织混合而成;在优选出的Zn10Al5Cu1.5Sb钎料中添加稀土镧钕,钎料的润湿性得到进一步改善,当稀土添加量为0.15%时,钎料的润湿性最佳;此时钎料组织中灰色粗大树枝晶组织及黑色层块状组织减少、灰黑相间层片状组织增多且变的细小,基体组织得到最大程度细化,钎料合金及钎焊接头强度达到最大;继续增加稀土,钎料合金的润湿性及钎焊接头的抗剪强度反而下降.     

Ti/Cu异种金属电子束焊接界面行为

为了获得高强度T2铜和Ti-6Al-4V钛合金异种金属接头,采用电子束焊方法开展试验,并对接头界面组织及力学性能进行了分析.试验在钛/铜熔钎焊接基础上,通过在高熔点钛侧复合二次焊接,构建钛/铜结合界面金属间化合物层的重熔温度场,进而实现钛/铜金属间化合物层的重熔改性.通过有限元温度场模拟及SEM,XRD等检测.结果表明,钛侧重熔焊接可在结合界面处形成1 000℃左右高温,金属间化合物层发生局域重熔.在随后凝固过程中,由于散热方向及元素再分配,相的形成顺序发生改变,钛原子向铜侧的扩散距离减短,高硬度相TiCu向Ti2Cu转变,相结构优化,最终接头强度得以提升.     

铝/钛异种合金激光熔钎焊接头特性

以C02激光为热源，以A1Si12焊丝为填充材料，对Ti-6Al-4V钛合金和5056铝合金异种材料激光熔钎焊进行研究，采用SEM、EDS、XRD和金相显微镜分析接头的微观结构特征，通过拉伸实验评定接头的力学性能。研究结果表明：所得接头具有熔焊和钎焊双重性质，即铝母材局部熔化，为熔化焊，而钛母材与焊缝金属之间存在金属间化合物层钎焊界面；钎焊界面上部的金属间化合物层组成复杂，可分为2层，即呈针状或芽状的Ti-Al-Si系金属间化合物层和以Ti-Al系金属间化合物为主的连续层；钎焊界面下部的金属间化合物层较薄；拉伸试样断裂倾向于发生在紧邻钎焊界面的焊缝上，平均抗拉强度为298．5MPa。     

Zn-Al钎料钎焊Cu/Al接头组织和性能(英文)

使用不同成分的Zn-Al钎料对铜铝异种金属进行火焰钎焊,研究其力学性能。利用光学显微镜、扫描电镜和能谱研究不同Zn-Al钎料对Cu/Al钎焊接头钎焊性、力学性能及显微组织的影响。结果表明:随着Al含量的增加,Zn-Al钎料在Cu和Al上的铺展面积逐渐增大。当钎料中Al含量为15%时,Cu/Al接头的抗剪强度达到最大值88MPa;随着组织的变化,钎缝硬度值呈现HV122到HV515不等的分布。另外,钎缝组织的成分主要为富Zn相和富Al相,但是当钎料中Al含量为2%和15%以上时,靠近Cu侧的界面处会分别形成CuZn3和Al2Cu两种完全不同的金属间化合物。研究Zn-Al钎料中铝含量对Cu/Al接头界面化合物类型的影响。     

A preliminary study on filler metals for vacuum brazing of Al/Ti

In this paper,nine new filler metals contained Sn and Ga based on Al-11.5Si have been designed for vacuum brazing of Al/Ti.It is found that the addition of Sn and Ga can lower the solidus of filler metal,change the structure of intermetallic compound formed in the joint during brazing,and enhance the strength of joint.But the detail mechanism need further research.     

Reaction layer characterization of the braze joint of silicon nitride to stainless steel

This investigation studies the role of titanium in the development of the reaction layer in braze joining silicon nitride to stainless steel using titanium-active copper-silver filler metals. This reaction layer formed as a result of titanium diffusing to the filler metal/silicon nitride interface and reacting with the silicon nitride to form the intermetallics, titanium nitride (TiN) and titanium suicide (Ti ₅Si₃). This reaction layer, as recognized in the literature, allows wetting of the ceramic substrate by the molten filler metal. The reaction layer thickness increases with temperature and time. Its growth rate obeys the parabolic relationship. Activation energies of 220.1 and 210.9 kj/mol were calculated for growth of the reaction layer for the two filler metals used. These values are close to the activation energy of nitrogen in TiN (217.6 kj/mol). Two filler metals were used in this study, Ticusil (68.8 wt% Ag, 26.7 wt% Cu, 4.5 wt% Ti) and CB4 (70.5 wt% Ag, 26.5 wt% Cu, 3.0 wt% Ti). The joints were processed in vacuum at temperatures of 840 to 900 °C at various times. Bonding strength is affected by reaction layer thickness in the absence of Ti-Cu intermetallics in the filler metal matrix.     

Si diffusion behavior during laser welding-brazing of Al alloy and Ti alloy with Al-12Si filler wire

In laser welding-brazing of Al alloy (5A06) and Ti alloy (Ti-6Al-4V) with rectangular CO2 laser spot and with Al-12Si filler wire, element Si enriches at the interface between Ti substrate and the filler metal. It is found that the Si diffusion behavior has a significant effect on the formation of interfacial intermetallic compounds. To analyze the Si diffusion behavior, a model for the prediction of the chemical potential for ternary alloy was established. According to the calculated results of the influen...     

Zn-Al-Li系和Zn-Al系钎料对SiC_p/ZL101铝基复合材料的润湿性

为表征降熔元素Zn在铝基复合材料钎焊中的扩散行为及其对去膜效果的影响,并改善Zn基钎料的润湿性(添加活性元素Li),用坐滴法在520℃、10~30 min、5 L/min流动Ar保护条件下测试纯Zn、Zn-5Al二元共晶、自制Zn-6Al-1Li三元共晶、自制Zn-21Al-3Li三元包共晶共4种钎料对SiCp/ZL101铝基复合材料的润湿性。结果表明:对于无Li的Zn基钎料,随保温时间的延长,Zn仅在局部范围可沿晶界扩散入Al基体,出现晶界液化甚至溶蚀,但难以出现晶粒液化,钎料/母材界面间隙依然难以消除;对于含Li活性钎料,Li的适度添加(约3%,质量分数)使得Zn的渗入在整个界面趋于均匀分布,消除了局部溶蚀与界面空隙,对润湿性有良好改善效果;Zn的渗入引起大量尺寸约为10μm的(Si)块在界面析出。     

添加元素Sn,Cu对Zn-Al钎料组织性能的影响

向Zn-10Al基体中添加元素Cu,采用真空炉VF-1600M、金相显微镜、岛津AG-125KN精密万能材料试验机等,研究了Cu元素对Zn-Al钎料合金的熔化特性、润湿性能、金相组织以及力学性能的影响。结果表明,随着Cu元素的增加,钎料的熔点呈先下降后上升的趋势,在铜添加量为4%(质量分数)时,熔点最低;在铜添加量为5%时,润湿性能优良,钎料晶粒最细小,抗拉强度最好;当铜添加量继续增大时,其润湿性能下降,钎料晶粒变大,抗拉强度降低。其次研究了Sn元素的添加量对Zn-10Al-5Cu钎料性能的影响。结果表明,当Sn添加量达到3%时,其抗拉强度良好,钎料的熔化温度降低,在Cu上的润湿性能良好。当锡添加量进一步增加时,钎料合金的的润湿性能降低,基本不铺展。试验得到的Zn-10Al-5Cu-3Sn为性能较为优良的铝/铜钎焊用钎料。     

铝基复合材料用Al-12Si-xTi系三元活性钎料的制备(英文)

为了改善常用钎料对铝基复合材料的润湿性,制备了新型Al-12Si-xTi系三元活性钎料。研究表明,所添加的Ti以Ti(Al1-xSix)3(0≤x≤0.15)相存在,但由于钎料的主要组织均为Al-Si共晶组织,所以Al-12Si-xTi钎料与传统Al-12Si钎料具有相似的剪切强度和剪切断口。因此,加入少量Ti(～1%)不会使钎料脆化和硬化;而且Al-12Si-xTi钎料带的成分接近共晶成分,所以熔化区间非常相似,为580～590℃。对于润湿性的改善,是由于随着钎料中Ti含量的增加,Al2O3增强相和钎料金属间的(R/M)界面间隙得到消除的原因。润湿实验后在铝基复合材料表面残留的钎料量也随着钎料含Ti量的增加而减少。因此,Ti对于润湿性的改善可以随着钎料含Ti量的增加而较为容易地被重复观察到。此外,Ti(AlSi)3的量和尺寸对含Ti量(焊接前)和含Si量(焊接后)敏感。     

Study of diffusion bonding of Ti-6Al-4V and ZQSn10-10 with metal interlayer

The diffusion bonding was carried out to join Ti alloy (Ti-6Al-4V) and tin-bronze (ZQSn10-10) with Ni and Ni Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The results show that when the interlayer is Ni or Ni Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds (Cu3Ti, CuTi etc.). But the Ni-Ti intermetallic compounds (NiTi, Ni3Ti) are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830℃/10 MPa/30min. And when the interlayer is Ni Cu, the optimum bonding parameters are 850℃/10MPa/20min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni Cu interlayer both are 155.8MPa, which is 65 percent of the strength of ZQSn10-10 base metal.     

Microstructures and properties of low-melting-point Al-Cu-Si filler metals prepared by different technologies

The Al25Cu6. 5Si0. 09RE (RE = La and Ce) and Al25Cu10.5Si2Ni filler metals were prepared by common metal mold casting, copper plate chilling and rapid solidification, respectively. The microstructures and properties of these filler metals were studied. The results show that the as-casting and the corresponding rapid solidification filler metals have the same phases but their microstructures are different. The microstructure of rapid solidification filler metals consults of an a-Al solid solution, the 6 (Al2Cu) intermetallic compound and an Al-Cu-Si eutectk phase. Compared with the as-casting filler metal, the melting temperature ranges (△T) of the corresponding copper plate chilling and rapid solidification filler metals decrease and their wettabilities are improved because of the grain refinement and the improvement of composition uniformity. The wetting area of Al25Cu6.5Si0.09RE rapid solidification filler metal doubles that of the corresponding as-casting filler metal. It is hopeful that the properties of Al-Cu-Si filler metals will be improved by changing preparation technology.     

Microstructure and strength of the TiAl/40Cr joint diffusion-bonded with Ti-V-Cu filler metal

In this study,intermetallic TiAl and steel 40Cr diffusion bonded successfully by using a composite barrien layer Ti/V/Cu,In this case,a diphase Ti3Al TiAl layer and a Ti solid solution which enhance the strength of the joint are obtained at the TiAl/Ti interface.The interface of TiAl/Ti/V/Cu/40Cr was free from intermetallic compounds and other brittle phases,and the strength of the joint was as high as 420MPa,very close to that of the TiAl base.This method gives a reliable bonding of intermetallic TiAl and steel 40Cr.