Low power high gain CMOS LNA based on inverter cell and self-body bias for UWB receivers

A low-power low-noise amplifier (LNA) utilized a resistive inverter configuration feedback amplifier to achieve the broadband input matching purposes. To achieve low power consumption and high gain, the proposed LNA utilizes a current-reused technique and a splitting-load inductive peaking technique of a resistive-feedback inverter for input matching. Two wideband LNAs are implemented by TSMC 0.18 μm CMOS technology. The first LNA operates at 2–6 GHz. The minimum noise figure is 3.6 dB. The amplifier provides a maximum gain (S₂₁) of 18.5 dB while drawing 10.3 mW from a 1.5-V supply. This chip area is 1.028×0.921 mm². The second LNA operates at 3.1–10.6 GHz. By using self-forward body bias, it can reduce supply voltage as well as save bias current. The minimum noise figure is 4.8 dB. The amplifier provides a maximum gain (S₂₁) of 17.8 dB while drawing 9.67 mW from a 1.2-V supply. This chip area is 1.274×0.771 mm².     

A 24 W Ku band GaN based power amplifier with 9.1 dB linear gain

A Ku-band power amplifier is successfully developed with a single chip 4.8 mm AlGaN/GaN high electron mobility transistors (HEMTs). The AlGaN/GaN HEMTs device, achieved by E-beam lithography г-gate process, exhibited a gate-drain reverse breakdown voltage of larger than 100 V, a cutoff frequency of f_T=30 GHz and a maximum available gain of 13 dB at 14 GHz. The pulsed condition (100 μs pulse period and 10% duty cycle) was used to test the power characteristic of the power amplifier. At the frequency of 13.9 GHz, the developed GaN HEMTs power amplifier delivers a 43.8 dBm (24 W) saturated output power with 9.1 dB linear gain and 34.6% maximum power-added efficiency (PAE) with a drain voltage of 30 V. To our best knowledge, it is the state-of-the-art result ever reported for internal-matched 4.8 mm single chip GaN HEMTs power amplifier at Ku-band.     

A novel low power UWB cascode SiGe BiCMOS LNA with current reuse and zero-pole cancellation

A low power cascode SiGe BiCMOS low noise amplifier (LNA) with current reuse and zero-pole cancellation is presented for ultra-wideband (UWB) application. The LNA is composed of cascode input stage and common emitter (CE) output stage with dual loop feedbacks. The novel cascode-CE current reuse topology replaces the traditional two stages topology so as to obtain low power consumption. The emitter degenerative inductor in input stage is adopted to achieve good input impedance matching and noise performance. The two poles are introduced by the emitter inductor, which will degrade the gain performance, are cancelled by the dual loop feedbacks of the resistance-inductor (RL) shunt–shunt feedback and resistance-capacitor (RC) series–series feedback in the output stage. Meanwhile, output impedance matching is also achieved. Based on TSMC 0.35 μm SiGe BiCMOS process, the topology and chip layout of the proposed LNA are designed and post-simulated. The LNA achieves the noise figure of 2.3–4.1 dB, gain of 18.9–20.2 dB, gain flatness of ±0.65 dB, input third order intercept point (IIP₃) of ?7 dBm at 6 GHz, exhibits less than 16 ps of group delay variation, good input and output impedances matching, and unconditionally stable over the whole band. The power consumption is only 18 mW.     

A wideband balun–LNA

In this paper a wideband Low Noise Amplifier (LNA) is introduced which also converts the single-ended input to differential signal at the output. It is based on common-source amplifier with active-feedback to provide input matching. The proposed amplifier has the input matched from 500 MHz to 2.5 GHz. It achieves the maximum voltage gain of 24 dB in this band, while the minimum noise figure (NF) is 2.35 dB. The simulated OIP3 of this amplifier is equal to 21 dBm. The LNA has been designed and simulated in a 0.18 μm CMOS process.     

A UWB CMOS low-noise amplifier with noise reduction and linearity improvement techniques

In this paper, a highly linear CMOS low noise amplifier (LNA) for ultra-wideband applications is presented. The proposed LNA improves both input second- and third-order intercept points (IIP2 and IIP3) by canceling the common-mode part of all intermodulation components from the output current. The proposed LNA structure creates equal common-mode currents with the opposite sign by cascading two differential pairs with a cross-connected output. These currents eliminate each other at the output and improve the linearity. Also, the proposed LNA improves the noise performance by canceling the thermal noise of the input and auxiliary transistors at the output. Detailed analysis is provided to show the effectiveness of the proposed LNA structure. Post-layout circuit level simulation results using a 90 nm RF CMOS process with Spectre-RF reveal 9.5 dB power gain, -3 dB bandwidth (BW_−3dB) of 8 GHz from 2.4 GHz to 10.4 GHz, and mean IIP3 and IIP2 of +13.1 dBm and +42.8 dBm, respectively. The simulated S₁₁ is less than −11 dB in whole frequency range while the LNA consumes 14.8 mW from a single 1.2 V power supply.     

Gain characteristics of quantum dot fiber amplifier based on asymmetric tapered fiber coupler

We theoretically analyzed the gain characteristics of an integrated semiconductor quantum dot (QD) fiber amplifier (SQDFA) by using a 2 × 2 tapered fiber coupler with a PbS QD-coated layer. The asymmetric structure of the fiber coupler is designed to have a maximum working bandwidth around 1550-nm band and provide a desired optical power ratio of the output signals. By using 600 mW of 980-nm pump, 10 dB gain of a 1550-nm signal is estimated with the gain efficiency of 4.5 dB/cm.     

Low-harmonic distortion in single-ended and push-pull class E power amplifier by using slotted microstrip lines

In this work, a very low-harmonic distortion with high power-added efficiency (PAE) power amplifier (PA) with slotted microstrip lines is reported. The circuit is a push-pull class E amplifier, terminated with defected structures to improve the spectrum purity and efficiency. The relationship of the second and third harmonic to the fundamental is 70 and 54 dBc, respectively. The amplifier is developed with HBT medium power transistors. The circuit works at 1.8 GHz obtaining a PAE close to 60%, delivering an output power of 24 dBm with a power gain of 13.3 dB.     

Single-grain Si thin-film transistors SPICE model,analog and RF circuit applications

Single-grain thin-film transistors (SG-TFTs) fabricated inside location-controlled using μ-Czochralski process exhibit SOI-FETs like performance despite processing temperatures remaining below 350 °C. Thus, the SG-TFT is a potential technology for large-area highly-integrated electronic system and system-in-package, taking advantage of the system-on-flexible substrate and low manufacturing cost capabalities. The SG-TFT is modeled based on the BSIMSOI SPICE model where the mobility parameter is modified to fit the SG-TFT behavior. Therefore, analog and RF circuits can be designed and benchmarked. A two-stage telescopic cascode operational amplifier fabricated in a prototype 1.5 μm SG-TFT technology demonstrates DC gain of 55 dB and unity-gain bandwidth of 6.3 MHz. A prototype CMOS voltage reference demonstrates a power supply rejection ratio (PSRR) of 50 dB. With unity-gain frequency, f_T, in the GHz range, the SG-TFT can also enable RF circuits for wireless applications. A 12 dB gain RF cascode amplifier with integrated on-chip inductors operating in the 433 MHz ISM band is demonstrated.     

3.1–10.6 GHz ultra-wideband LNA design using dual-resonant broadband matching technique

This paper presents an ultra-wideband low noise amplifier design using the dual-resonant broadband matching technique. The proposed LNA achieves a 10.2 dB gain with ±0.9 dB gain flatness over a frequency range of 3.1–10.6 GHz and a ?3-dB bandwidth of 2.4–11.6 GHz. The measured noise figure ranges from 3.2 to 4.7 dB over 3.1–10.6 GHz. At 6.5 GHz, the measured IIP3 and input-referred P1dB are +6 dBm and ?5 dBm, respectively. The proposed LNA occupies an active chip area of 0.56 mm² in a TSMC 0.18 μm RF-CMOS process and consumes 16 mW from a 1.8 V supply.     

Low power dissipation SiGe HBT dual-band variable gain amplifier

A dual-band variable gain amplifier operating at 0.9 GHz and 2.4 GHz was designed based on high performance RF SiGe HBT for large amount of signals transmission and analysis. Current steering was adopted in gain-control circuit to get variable trans-conductance and then variable gain. Emitter degeneration and current reuse were considered in amplifying stage for low noise figure and low power dissipation respectively. A single-path circuit resonating at two frequency points simultaneously was designed for input impedance matching. PCB layout parasitic effects, especially the via parasitic inductor, were analyzed theoretically and experimentally and accounted for using electro-magnetic (EM) simulation. The measurement results show that a dynamic gain control of 26 dB/16 dB in a control voltage range of 0.0–1.4 V has been achieved at 0.9/2.4 GHz respectively. Both S₁₁ and S₂₂ are below than –10 dB in all the control voltage range. Noise figures at both 0.9 GHz and 2.4 GHz are lower than 5 dB. Total power dissipation of the dual-band VGA is about 16.5 mW at 3 V supply.     

A low-voltage low-power CMOS transmitter front-end using current mode approach for 2.4 GHz wireless communications

This paper presents a low-voltage low-power transmitter front-end using current mode approach for 2.4 GHz wireless communication applications, which is fabricated in a chartered 0.18 μm CMOS technology. The direct up-conversion is implemented with a current mode mixer employing a novel input driver stage, which can significantly improve the linearity and consume a small amount of DC current. The driver amplifier utilizes a transimpedance amplifier as the first stage and employs an inter-stage capacitive cross-coupling technique, which enhances the power conversion gain as well as high linearity. The measured results show that at 2.4 GHz, the transmitter front-end provides 15.5 dB of power conversion gain, output P?1 dB of 3 dBm, and the output-referred third-order intercept point (OIP3) of 13.8 dBm, while drawing only 6 mA from the transmitter front-end under a supply voltage of 1.2 V. The chip area including the testing pads is only 0.9 mm×1.1 mm.     

An inductorless wideband common-gate LNA with dual capacitor cross-coupled feedback and negative impedance techniques

A wideband common-gate (CG) low-noise amplifier (LNA) with dual capacitor cross-coupled (CCC) feedback and negative impedance techniques is presented for multimode multiband wireless communication applications. Double CCC technique boosts the input transconductance of the LNA, and low power consumption is obtained by using current-reuse technique. Negative impedance technique is employed to alleviate the correlation between the transconductance of the matching transistors and input impedance. Meanwhile, it also allows us to achieve a lower noise figure (NF). Moreover, current bleeding technique is adopted to allow the choice of a larger load resistor without sacrificing the voltage headroom. The proposed architecture achieves low noise, low power and high gain simultaneously without the use of bulky inductors. Simulation results of a 0.18-μm CMOS implementation show that the proposed LNA provides a maximum voltage gain of 25.02 dB and a minimum NF of 2.37 dB from 0.1 to 2.25 GHz. The input-referred third-order intercept point (IIP3) and input 1-dB compression point (IP_1dB) are better than –7.8 dBm and –19.2 dBm, respectively, across the operating bandwidth. The circuit dissipates 3.24 mW from 1.8 V DC supply with an active area of 0.03 mm².     

Heuristic receiver for implantable UWB applications

High data rate implantable wireless systems come with many challenges, chief among them being low power operation and high linearity. A low noise amplifier (LNA) designed for this application must include high gain, low noise figure (NF) and better linearity at low power consumption within the required frequency band. The down converter also requires a passive mixer to achieve low power and better linearity. In this paper, design is based on an Impulse Response (IR) Ultra-wideband (UWB) receiver operating at (3.1–5) GHz implemented in 0.25 μm CMOS Silicon on Sapphire (SOS). This paper reports the design and measurement of a UWB receiver with a designed and measured linearity of 17 dBm, a gain of 30.5 dB and a minimum NF of 4.5 dB, which make it suitable for implantable radio applications.     

A resistive-feedback LNA in 65 nm CMOS with a gate inductor for bandwidth extension

In order to get a wideband and flat gain, a resistive-feedback LNA using a gate inductor to extend bandwidth is proposed in this paper. This LNA is based on an improved resistive-feedback topology with a source follower feedback to match input. A relative small inductor is connected in series to transistor׳s gate, which boosts transistor׳s effective transconductance, compensates gain loss and then leads the proposed LNA with a flat gain and wider bandwidth. Moreover, the LNA׳s noise is partially inhibited by the gate inductor, especially at high frequency. Realized in standard 65-nm CMOS process, this LNA dissipates 12 mW from a 1.5-V supply while its core area is 0.076 mm². Across 0.4–10.6 GHz band, the proposed LNA provides 9.5±0.9 dB power gain (S₂₁), better than −11-dB input matching, 3.5-dB minimum noise figure, and higher than −17.2-dBm P_1 dB.     

Miniaturized active stepped impedance planar inverted-F antenna using common ground

This paper presents a compact active integrated antenna (AIA) comprising of class-A power amplifier (PA) and stepped impedance planar inverted-F antenna (PIFA). In the proposed design, a common ground is used for both PA and PIFA, resulting a compact antenna of size 0.14λ₀ × 0.11λ₀ × 0.01λ₀ (λ₀ is free space wavelength at 0.85 GHz). Moreover, it is demonstrated that by using the stepped impedance radiator the operating frequency of the active PIFA is shifted down from its natural resonant frequency of 1.36 GHz to 0.85 GHz, offering an extensive size reduction of 80%. This active integration increases the passive antenna gain through the effective loading of the antenna to the power amplifier. The measured result indicates that the active and passive antennas achieved the gain of 15.7 dB and 3.81 dBi, respectively after the integration. In addition, the maximum SAR value of antenna is found to be 0.64 W/kg.     

Investigation on the thermal behavior of 0.15 μm gate-length In0.4Al0.6As/In0.4Ga0.6As MHEMT

In this study, we have successfully investigated the electrical performances of In_0.4Al_0.6As/In_0.4Ga_0.6As metamorphic high-electron-mobility transistor (MHEMT) at temperatures range from 275 K to 500 K comprehensively. By extracting the device S-parameters, the temperature dependent small signal model has been established. At room temperature, 0.15 μm T-gate device with double δ-doping design exhibits f_T and f_MAX values of 103 GHz and 204 GHz at V_ds = 1 V, an extrinsic transconductance of 678 mS/mm, and a current density of 578 mA/mm associated with a high breakdown voltage of ?13 V. Power measurements were evaluated at 40 GHz and the measured output power, linear power gain, and maximum power-added efficiency, were 7.12 dBm, 10.15 dB, and 23.1%, respectively. The activation energy (E_a) extracted from Arrhenius plots is = 0.34 eV at 150 ≦ T ≦ 350 K. The proposed device is promisingly suitable for millimeter-wave power application.     

Design of ultra-low voltage integrated CMOS based LNA and mixer for ZigBee application

This work describes the design and implementation of an ultra-low voltage, ultra-low power fully differential low noise amplifier (LNA) integrated with a down-conversion mixer for 2.4 GHz ZigBee application. An inductive-degenerated cascoded LNA is adapted and integrated with a double-balanced mixer which is targeted for low-power application. The proposed design has been extracted and simulated in a 0.13 μm standard CMOS technology. With a power consumption of 905 μW at a voltage headroom of 0.5 V, the proposed LNA-mixer integration reaches out to an integrated noise figure (NF) of 7.2 dB, a gain of 22.3 dB, 1 dB compression point (P1 dB) of −22.3 dBm and input-referred third-order intercept point (IIP3) of −10.8 dBm.     

Improved performance step impedance lowpass filter

Performances of the conventional Butterworth step impedance lowpass filters (LPF) are significantly improved by placing transmission zero either closer to the cut-off frequency (f_c) or away from it. It is achieved by using transverse resonance width of the capacitive line sections. We report method of designing transverse resonance type LPF (TR-LPF) for 5 to 11-pole filters. At f_c = 2.5 GHz, we obtained selectivity in the range 113.3–56.66 dB/GHz and 20–60 dB rejection BW in the range 9.61–7.29 GHz. The TR-LPF can suppress the stopband signal by 60 dB up to 5f_c. Insertion loss in passband is within 0.72 dB. Improved performance of TR-LPF can be designed for f_c up to 7.5 GHz.     

Impact of high-k gate dielectric on analog and RF performance of nanoscale DG-MOSFET

Now a days, high-k dielectrics have been investigated as an alternative to Silicon dioxide (SiO₂) based gate dielectric for nanoscale semiconductor devices. This paper is an attempt to characterize the analog and RF performance of the high-k metal gate (HKMG) double gate (DG) metal oxide semiconductor field effect transistor (MOSFET) in nanoscale through 2-D device simulation. The results demonstrates the impact of high-k oxide layer as single and gate stack (GS). The key idea behind this investigation is to provide a physical explanation for the improved analog and RF performance exhibited by the device. The major figures of merit (FOMs) studied in this paper are transconductance (g_m), output conductance (g_d), transconductance generation factor (g_m/I_D), early voltage (V_EA), intrinsic gain (A_V), cut off frequency (f_T), transconductance frequency product (TFP), gain frequency product (GFP) and gain transconductance frequency product (GTFP). The effects of downscaling of channel length (L) on analog performance of the proposed devices have also been presented. It has been observed that the performance enhancement of GS configurations (k=7.5 i.e device D5 in the study) is encouraging as far as the nanoscale DG-MOSFET is concerned. Also it significantly reduces the short channel effects (SCEs). Parameters like DC gain of (91.257 dB, 43.436 dB), nearly ideal values (39.765 V⁻¹, 39.589 V⁻¹) of TGF, an early voltage of (2.73 V, 16.897 V), cutoff frequency (294 GHz, 515.5 GHz) and GTFP of (5.14×10⁵ GHz/V, 1.72×10⁵ GHz/V) for two different values of V_DS=0.1 V and 0.5 V respectively are found to be close to ideal values. Analysis shows an opportunity for realizing high performance analog and RF circuits with the device proposed in this paper i.e. device D5.     

A linear ultra wide band low noise amplifier using pre-distortion technique

This paper presents an Ultra Wide-Band (UWB) high linear low noise amplifier. The linearity of Common Gate (CG) structure is improved based on pre-distortion technique. An auxiliary transistor is used at the input to sink the nonlinear terms of source current, resulting linearity improvement. Furthermore, an inductor is used in the gate of the main amplifying transistor, which efficiently improves gain, input matching and noise performance at higher frequencies. Detailed mathematical analysis show the effectiveness of both linearity improvement and bandwidth extension techniques. Post-layout simulation results of the proposed LNA in TSMC 0.18 µm RF-CMOS process show a gain of 13.7 dB with −3 dB bandwidth of 0.8–10.4 GHz and minimum noise figure (NF) of 3 dB. Input Third Intercept Point (IIP3) of 10.3–13 dBm is achieved which shows 8 dB improvement compared to conventional common gate structure. The core circuit occupies an area of 0.19 mm² including bond pads, while consuming 4 mA from a 1.8-V supply.