Microstructures and Mechanical Properties of Electron Beam-Welded Titanium-Steel Joints with Vanadium,Nickel, Copper and Silver Filler Metals

Electron beam welding experiments of titanium alloy to stainless steel with V, Ni, Cu and Ag filler metals were carried out. The interfacial microstructures of the joints were examined by optical microscopy, scanning electron microscopy, and x-ray diffraction analysis. Mechanical properties of the joints were evaluated according to tensile strength and microhardness. The results showed that all the filler metals were helpful to restrain the Ti-Fe intermetallics formed in the Ti/Fe joint. The welds with different filler metals were all characterized by solid solution and interfacial intermetallics. And the type of solid solution and interfacial intermetallics were depended on the metallurgical reactions between the filler metals and base metals. The interfacial intermetallics were Fe₂Ti + Ni₃Ti + NiTi₂, TiFe, Ti₂Ag, and Cu₂Ti + CuTi + CuTi₂ in the joints welded with Ni, V, Ag, and Cu filler metals, respectively. The tensile strengths of the joints were primarily determined by the hardness of the interfacial intermetallics. The highest tensile strength was obtained in the joint welded with silver filler metal, which is about 310 MPa.     

填充金属对钛合金与不锈钢电子束焊接的影响(英文)

采用Ni、V、Cu等填充材料进行钛合金与不锈钢的电子束焊接实验。采用光学显微镜、扫描电镜及X射线衍射对接头的微观组织进行分析。通过抗拉强度和显微硬度评价接头的力学性能,分析讨论填充材料对钛/钢电子束焊接接头微观组织和力学性能的影响。结果表明:填充材料有助于抑制Ti-Fe金属间化合物的产生。所有接头均由固溶体和界面化合物组成。对于不同的填充材料,固溶体和界面化合物种类取决于填充材料与母材之间的冶金反应。对于Ni、V及Cu填充材料,界面化合物分别为Fe2Ti+Ni3Ti+NiTi2,TiFe和Cu2Ti+CuTi+CuTi2。接头抗拉强度主要取决于金属间化合物的脆性。采用Cu填充金属的接头抗拉强度最高,约为234 MPa。     

PTLPB of Si3N4 to FA-129 using nickel as a core interlayer

Partial transient liquid phase bonding was applied to a silicon nitride/iron aluminide alloy (FA-129) joint. This joint was composed of two independent joining systems. The joint configuration was Si₃N₄/75Cu–25Ti/Cu/Ni/Al/FA-129. The results demonstrate that homogenization has no effect on the kinetic of the reaction layer formation between the ceramic and the nickel core due to a previous dissolution reaction. The reaction layer composition evolves from a TiN–Ti₅Si₃ layer system after reaction during the first soaking time, to a single TiN layer after the complete cycle. The dissolution of the Ti₅Si₃ layer in the Ni core becomes the driving factor influencing the properties of the joint. The composition of the copper–nickel alloy interlayer changes with homogenization treatment, passing from a maximum of 70–20 wt% Cu, depending on the conditions. NiAl and Ni₃Al intermetallics were observed at the interface between the nickel and the FA-129 and their thicknesses varies with the homogenization conditions. The strength values obtained were within the range of 80 MPa, with the ceramic reaction layer being the region where all failures occurred.     

Ti/Cu/Ti部分瞬间液相连接Si_3N_4的界面反应和连接强度

用Ti/Cu/Ti多层中间层在 12 73K进行氮化硅陶瓷部分瞬间液相连接 ,实验考察了保温时间对连接强度的影响。用SEM ,EPMA和XRD对连接界面进行微观分析 ,并用扩散路径理论 ,研究了界面反应产物的形成过程。结果表明 :在连接过程中 ,Cu与Ti相互扩散 ,形成Ti活度较高的液相 ,并与氮化硅发生反应 ,在界面形成Si3N4 /TiN/Ti5Si3 Ti5Si4 TiSi2 /TiSi2 Cu3Ti2 (Si) /Cu的梯度层。保温时间主要是通过影响接头反应层厚度和残余热应力大小而影响接头的连接强度     

AgCuTi合金钎焊单层立方氮化硼砂轮

为研制我国新一代单层钎焊CBN(立方氮化硼 )磨料砂轮 ,尝试Ni-Cr和Ag -Cu-Ti两种活性钎料 ,在真空炉中钎焊。试验结果表明 ,Ni-Cr合金钎料对CBN磨料不浸润 ,钎焊后CBN磨料全部脱落 ;而Ag -Cu -Ti合金钎料对CBN则表现出良好的浸润性并将CBN牢牢钎焊住。借助扫描电镜、X射线能谱和X射线衍射对界面微区组织的分析研究表明 ,钎焊过程中Ag -Cu -Ti合金钎料中的Ti向CBN磨料界面富集 ,并与CBN磨料表面的N和B元素反应生成TiN和TiB ,这是实现Ag -Cu -Ti合金钎料与CBN磨料高结合强度的关键因素。断口形貌的分析研究表明 ,CBN与Ag -Cu -Ti合金钎料间的断口发生在Ag -Cu -Ti合金钎料层 ,说明CBN磨料与Ag -Cu -Ti合金钎料的结合强度已超过了Ag-Cu -Ti合金钎料本身强度。最后将研制出的单层钎焊CBN磨料砂轮与传统电镀CBN砂轮进行了重负荷磨削对比试验 ,钎焊砂轮表现出明显的优势     

Influence of Ti on microstructure and strength of c-BN/ Cu-Ni-Sn-Ti composites

The c-BN grain has been brazed with Cu-Ni-Sn-Ti filler metal in vacuum at 1373 K holding for 600 s. The microstructure of the interface between c-BN grain and Cu-Ni-Sn-Ti filler metal has been studied using scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS). The composition of the interface has been analyzed by X-ray diffraction analyzer (XRD). Experimental results showed that the reaction layer appeared at the interface between the c-BN grain and the filler metal. The reaction layer mainly consisted of TiN, TiB and TiB₂. And the thickness of the reaction layer increases with the increase of Ti content in the filler metal. When Ti content in the filler metal exceeds 15 wt.%, microcracks form at c-BN side of the interface because of the increase of TiN, CuTi and Cu₃Ti₂ brittle phases and residual stresses, leading to a decrease of the tensile strength of c-BN/Cu-Ni-Sn-Ti composites. Ti content in the filler metal had obvious influence on microstructure and strength of c-BN/ Cu-Ni-Sn-Ti composites. The maximum tensile strength reached 105.1 MPa with 10 wt.% Ti content in the filler metal.     

Effect of Ti content in Ag–Cu–Ti activated filler metal on dissimilar joint formation of sialon and WC–Co alloy by laser brazing

Laser brazing was carried out for dissimilar joining of sialon and a WC–Co alloy. Eutectic type Ag–Cu alloys as filler metals with different Ti content ranging from 0 to 2·8 mass-% were used to investigate the effects of Ti on the interface structure and strength of the joint. The filler metal sheet was sandwiched between a sialon block and a WC–Co alloy plate, and a laser beam was irradiated selectively on the WC–Co alloy plate. The brazed joint was obtained using the filler metal containing >0·3 mass-%Ti. TiN, Ti₅Si₃, and Cu₄Ti layers were formed at the interface of sialon and brazed metal as compound layers. The shear strength of the brazed joint increased with increasing Ti content in the filler metal in the range 0·3–1·7 mass-%, reaching a maximum value of 106 MPa. However, the strength decreased when the Ti content became higher than 1·7 mass-%.     

活性金属部分瞬间液相连接氮化硅陶瓷的研究

采用Ti/Cu/Ti多层中间层在1273 K温度下进行氮化硅陶瓷部分瞬间液相连接,考察了保温时间对连接强度的影响,并对连接界面进行了SEM,EPMA和XRD分析.结果表明,通过Cu-Ti二元扩散促使液相与氮化硅发生界面反应,形成Si3N4/TiN/Ti5Si3+Ti5Si4+TiSi2/TiSi2+Cu3Ti2(Si)/Cu的梯度层.保温时间影响接头反应层厚度,从而影响接头的连接强度根据活性金属部分瞬间液相连接陶瓷的界面行为,建立了活性金属部分瞬间液相连接陶瓷的理论模型.该模型较好地解释了Ti/Cu/Ti和Ti/Ni/Ti连接氮化硅陶瓷的异同点和连接工艺参数的选择.     

铜锡钛合金炉中钎焊立方氮化硼界面微观结构

采用真空炉中钎焊的方法,应用Cu-Sn-Ti合金实现了立方氮化硼(CBN)磨粒与工具基体的钎焊连接.运用三维视频显微镜、扫描电镜(SEM)、能谱仪(EDS)及X射线衍射仪对微观形貌、元素分布和生成物物相进行了观测分析,发现活性Ti元素明显向CBN磨粒表面发生偏聚,在CBN磨粒表面生成TiN,TiB和TiB2,这些反应产...     

In Situ Synthesis of Ceramic Reinforcements for Carbon/CuCrZr Joints Brazed with Composite Fillers

Brazing of two kinds of carbon materials including graphite and carbon fiber-reinforced carbon composites to copper alloys has been realized with CuTiH₂ + BN composite fillers. The microstructure characterization reveals that the ceramic reinforcements containing TiN particles and TiB whiskers have been synthesized by in situ reaction of BN additives with Ti discomposed from TiH₂ in the composite filler. The filler layer of the joints is mainly composed of Cu-based solid solutions [Cu (ss)] and Ti-Cu intermetallics along with ceramic reinforcements. Furthermore, a continuous thin reaction layer mainly containing TiC is developed at the interface close to the carbon substrates. The growth of TiC layer is mainly controlled by the diffusion of carbon from the substrates into the liquid filler through the TiC layer formed. The interface evolution of the graphite/CuCrZr joints has been discussed. The electrical resistivity of the joining area is relatively low, which highly meets the requirement for the carbon commutator applications.     

Microstructural characterization of diamond/CBN grains steel braze joint interface using Cu–Sn–Ti active filler alloy

In order to develop the new generation superhard abrasive tools of diamond and cubic boron nitride (CBN), the brazing joint experiments of diamond/CBN crystals and AISI 1045 steel matrix using Cu–Sn–Ti active filler powder alloy were investigated in vacuum furnace. The brazing temperature was 930 °C and the dwelling time was 20 min. Interfacial characteristics of the brazing joint among the diamond/CBN grains, the active filler layer and the steel substrate were analyzed using scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction techniques. The results indicated that Ti element in the Cu–Sn–Ti alloys diffused preferentially to the surface of diamond/CBN grits to form a Ti-rich reaction layer in the brazed joints by microanalyses. Moreover, the TiC, TiN and TiB₂ phases in diamond/CBN interface and Cu–Ti phase in steel interface were confirmed by X-ray diffraction phase analysis. The wetting and bonding reactions on diamond/CBN by melting Cu–Sn–Ti alloy were realized through the interfacial reaction products like TiC, TiN and TiB₂ compounds during the brazing process. The adhesive strength experiments of the joint interfaces revealed that the grains were not pulled out from the bond interface. The reliable bonding strength of brazed diamond/CBN grains to the steel substrate can meet the application requirements of high efficiency machining in the industrial field.     

Effects of Ti on the Brazability of Zn-22Al-xTi Filler Metals as Well as Properties of Cu/Al Brazing Joints

设计并采用Zn-Al-Ti系列钎料对Cu和Al异种金属实施了钎焊,并对Zn-22Al-xTi/Cu界面处的相组成和金属间化合物形貌进行了分析。结果表明：在Zn-22Al中添加0.01%至0.05%的Ti可以显著细化钎料组织,而且Zn-22Al-0.03Ti在Cu基板上的铺展面积比Zn-22Al高出60.4%,但Ti的添加会提高Zn-22Al钎料的熔点和熔化区间。另外,在钎料中添加微量的Ti可以优化Cu/Al接头中Cu侧界面化合物的组织并减小其厚度。相比Zn-22Al钎料,Zn-22Al-0.03Ti钎焊所得Cu/Al接头强度要高出13.4%,而且接头断裂位置由化合物层转移至钎料内部。X射线衍射结果显示,钎焊过程中有CuAl2,Cu9Al4,CuZn 3种化合物产生于钎料与Cu基板界面处     

TiAl与Si3N4f/Si3N4复合材料钎焊接头界面结构及性能研究

采用AgCuTi钎料实现了TiAl与Si3N4f/Si3N4复合材料的钎焊,确定了钎焊接头的典型界面组织结构为TiAl/AlCuTi/Ag(s,s)/TiN/Si3N4f/Si3N4。钎焊过程中,液相钎料在Si3N4f/Si3N4复合材料表面发生较好润湿,钎料中活性元素Ti与Si3N4基体及纤维发生反应形成连续的TiN化合物层。过高的钎焊温度或过长的保温时间导致钎缝中脆性的AlCuTi化合物增加,且由于接头应力的作用在钎缝中产生微裂纹甚至开裂,严重地降低了钎焊接头性能。当钎焊温度T=850℃,保温时间为10min时,接头抗剪强度达到最大,为9.4MPa,超过Si3N4f/Si3N4母材层间抗剪强度的60%。断口分析表明:压剪过程中,断裂发生在Si3N4f/Si3N4复合材料一侧。     

Ti／Cu／Ti部分瞬间液相连接Si3N4的界面反应和连接强度

用Ti/Cu/Ti多层中间导在1273K进行氮化硅陶瓷部分瞬间液相连接,实验考察了保温时间对连接强度的影响,用SEM,EPMA和XRD对连接界面进行微观分析,并用扩散路径理论,研究了界面反应产物的形成过程,结果表明：在连接过程中,Cu与Ti相互扩散,形成Ti活度较高的液相,并与氮化硅发生反应,在界面形成Si3N4/TiN/Ti5Si3 Ti5Si4 TiSi2/TiSi2 Cu3Ti2(Si)/Cu的梯度层,保温时间主要是通过影响接头反应层厚度和残余热应力大小而影响接头的连接强度。     

Plasma Spray Deposition Enhancement of Titanium Nitride Layer Using Nitrogen-Contained Plasma Irradiation of Titanium Substrate as a Pre-spraying Method

Reactive plasma spray of TiN ceramic coating attracts much attention over the years because of its ability to deposit thick layers on various metal surfaces. However, some mechanical properties of the coating such as its hardness should be improved. In this study, initially a thin layer of titanium nitride was prepared on a titanium substrate during irradiation of titanium substrate by a thermal DC nitrogen-contained plasma jet. Then, during reactive plasma spraying, Ti particles were injected into plasma jet, converted to titanium nitride and huddled on to the substrate. This new hybrid method (primary plasma irradiation and post-reactive plasma spraying) for deposition of TiN coatings would combine the advantages of both plasma-enhanced chemical vapor deposition and reactive plasma spraying methods in part. It resulted in a thick and hard layer of titanium nitride film. Sample produced by this method was analyzed with x-ray diffraction confirming titanium nitride production. Vickers hardness was measured using optical microscopy which was around 1319 H_v300g. To study the cross section of the layer, optical microscopy and scanning electron microscopy (SEM) were used.     

Si3N4/AgCu/TiAl钎焊接头界面结构及性能

采用AgCu非活性钎料实现了Si3N4陶瓷与TiAl基合金的钎焊,确定接头的典型界面组织结构为:TiAl/Ti3Al+Ti(s,s)/AlCuTi/Ag(s,s)+AlCu2Ti/Ti5Si3+TiN/Si3N4陶瓷。钎焊过程中,活性元素Ti从TiAl母材溶解到钎料中与Si3N4陶瓷发生反应润湿,实现了TiAl与Si3N4陶瓷的连接。随着钎焊温度的升高及保温时间的延长,靠近Si3N4陶瓷的TiN反应层厚度增加,Ag基固溶体中弥散分布的AlCu2Ti化合物聚集长大成块状,导致接头性能下降。当钎焊温度T=860℃,保温时间为5min时接头抗剪强度达到最大值124.6MPa。基于反应热力学及动力学计算TiN层反应激活能Q约为528.7kJ/mol,860℃时该层的成长系数KP=2.7×10-7m/s1/2。     

Ti活度对Al2O3/AgCuTi/Fe-Ni-Co钎焊接头机械性能和微观组织结构的影响

采用AgCuTi钎料实现了Al₂O₃陶瓷与Fe-Co-Ni合金的钎焊连接,并调查了不同钛含量的钎料对Al₂O₃/AgCuTi/Fe-Ni-Co钎焊接头机械性能和微观组织结构的影响。扫描电子显微镜(SEM), X射线能量色散光谱仪(EDS), X射线衍射仪(XRD)及电子万能试验机用于分析钎焊接头的机械性能和微观组织结构,结果表明:钛含量的增加明显提高AgCuTi钎料与Al₂O₃陶瓷的相互作用,在Al₂O₃/Ag-Cu-Ti界面生成一层由Ti-Al 和 Ti-O化合物组成的反应层。Al₂O₃/AgCuTi/Fe-Ni-Co钎焊接头的抗拉强度随钛含量的增加而增加,当钛含量提高到8wt.%时,抗拉强度达到最大值78Mpa。通过微观组织结构分析发现,采用AgCu4Ti在890℃保温5min的条件下可以获得较好的钎焊接头,典型接头的微观组织结构为Al₂O₃/TiAl+Ti₃O₅/NiTi+Cu₃Ti+Ag(s,s)/Ag(s,s)+Cu(s,s)+(Cu,Ni)/Fe-Ni-Co。采用AgCu8Ti获得的钎焊接头的界面反应层与AgCu4Ti差异不大,但反应层稍微增厚,并伴有TiO和Ti3Al在Al₂O₃/Ag-Cu-Ti界面生成。     

Interfacial reaction between cubic boron nitride and Ti during active brazing

Thermodynamic and reaction process analyses were performed to understand the joining characteristic during high temperature brazing between cubic boron nitride (CBN) grit and a silver-base filler alloy containing Ti as an active element. Experimental information on the microstructure of the brazed joint, the composition of the interface, and the shape of the compounds formed on the surface of the grit was obtained by scanning electron microscopy, energy-dispersive x-ray, and x-ray diffraction. The results indicate that Ti in the molten filler alloy facilitated good wetting between the solid CBN crystals and braze filler alloy. The transition layer formed by the interaction of TiN and TiB₂ was one of the key factors in joining the CBN and steel substrate.     

Ag-28Cu钎焊TA2/BT20接头组织分析

采用 Ag-28Cu 钎料对 TA8 纯钛和 BT20 钛合金的管板组合构件进行真空钎焊连接试验,分析了不同钎焊温度及保温时间对接头界面结构的影响.结果表明,接头界面结构为 BT20/钛基固溶体/Ti2Cu 化合物/银基固溶体+TiCu 化合物/Ti2Cu 化合物/钛基固溶体/TA2;随着钎焊温度的升高,银基固溶体和 TiCu 化合物逐渐消失,Ⅰ区逐渐出现较明显的树枝状生长的组织,分析为 Ti2Cu 化合物;随着连接时间的延长,Ti2Cu 化合物逐渐增加,且靠近母材的钛基固溶体层增宽,Ⅱ区最终演变成一个 Ti2Cu 反应层.

Abstract：

The vacuum brazing of TA2/BT20 titanium alloy was carried out with Ag-28Cu brazing filler metal, and the effects of brazing temperature and holding time on interface structure of the joints were diseussed. The experimental results showed that the interface structure consisted of BT20/Ti (s,s)/Ti2Cu/Ag (s,s) +TiCu/Ti2Cu/Ti (s,s)/TA2. The Ag (s,s) and TiCu compound decreased gradually with the increasing of brazing temperature and holding time, and then Ti2 Cu compound increased corresponding.And the Ti (s,s) layer gradually became thick.     

Korrosionseigenschaften dünner Schichten im System Ti?B?N

Corrosion properties of thin coatings in the Ti? B? N system Thin titanium nitride TiN, boride TiB₂ and boronitride Ti(B, N) hard coatings were deposited on titanium substrates by the PVD-process Magnetron-Sputter-Ion-Plating (MSIP). They were characterized by X-ray diffractometry, SEM and WDX-analysis. With increasing B-content the Vickers hardness of the coatings increases. Photoelectron spectroscopic measurements show that all coatings are covered in atmosphere by thin oxid layer. Titanium nitride is electrochemically in 1 N sulphuric acid stable up to 1.3 V (SHE), above 1.3 V it becomes oxidized to titanium oxide TiO₂ and nitrogen N₂. The oxidation products were detected with XPS. Corrosion tests in nitric acid HNO₃ show that the corrosion resistance of titanium nitride is lower than the resistance of titanium. The corrosion of titanium boride and titanium boronitride in sulphuric acid is more intensive compared to titanium nitride. The borides cannot be passivated, but dissolve completely by anodic polarization.