铅酸蓄电池用胶黏剂性能对比

为了解决阀控密封铅酸蓄电池的密封问题，通过对AB胶、3114AA、3114C的机械性能、化学性能、物理性能的对比实验，认为：AB胶在对ABS的粘接强度、固化速度方面都要优于3114AA和3114C，同时它的价格也便宜，因此，我们选用AB胶作电池盖与槽密封的胶黏剂；而3114AA、3114C在对金属铅的粘接强度、耐硫酸腐蚀方面都优于AB胶，同时3114AA较3114C具有固化时间更短、对ABS的粘接强度更高、耐硫酸腐蚀能力更强、可以常温固化等优点，因此，我们就用3114AA作电池极柱密封的胶黏剂。     

聚丙烯电表罩的粘接

电表罩的原料为进口ABS塑料,由于原料货源紧缺,影响了工业生产,用国产聚丙烯塑料代替进口的ABS塑料,其性能合格,但粘接不过关,为此对聚丙烯电表罩的粘接进行了研究,经性能测试达到生产要求,在原料紧缺的情况下,可以用聚丙烯塑料代替进口ABS生产电表罩。     

电子行业用聚酯热熔胶的制备及其性能研究

以玻璃化转变温度较低的共聚酯制备了聚酯热熔胶。研究结果表明:聚酯热熔胶对丙烯腈-丁二烯-苯乙烯共聚物(ABS)、聚碳酸酯(PC)等极性塑料与金属材料具有良好的粘接性能,稳定后的剥离强度大于100N/25mm;同时,具有良好的耐老化性能及粘接持久性。聚酯热熔胶可取代国外产品用于电子行业用极性聚合物与金属材料粘接。     

聚酯型HMA胶膜AS 615的性能研究

自制AS 615是一种新开发的特种聚酯型HMA(热熔胶)胶膜,具有良好的综合性能;以此作为电子产品塑料外壳/金属部件的胶粘剂,并对其应用性能进行了系统研究。结果表明:AS 615对ABS(丙烯腈-丁二烯-苯乙烯共聚物)、PC(聚碳酸酯)等极性塑料和金属具有良好的粘接性能,相应胶接件稳定后的剥离强度超过65 N/25 mm,其最佳粘接复合温度范围为120～160℃;AS 615具有良好的耐水性、耐老化性和粘接持久性,可取代国外同类产品用于电子行业中极性聚合物与金属之间的粘接。     

ABS塑料粘接胶的制备与性能研究

以改性聚氨酯树脂、增塑剂、粘接促进剂、乙烯基MQ硅树脂、碳酸钙等为原料,制备了一种对ABS塑料粘接良好的改性聚氨酯胶。研究结果表明:改性聚氨酯树脂按照n(-NCO)∶n(-OH)=1.6∶1.0,w(γ-甲基丙烯酰氧基丙基三甲氧基硅烷)=1.5%、w(乙烯基MQ硅树脂)=8%(相对于密封胶总质量而言)时,密封胶对ABS塑料的粘接性能较好。     

溶剂型快干胶粘剂

溶剂型快干胶粘剂用于热塑性塑料ABS和高抗冲聚苯乙烯塑料的粘接,其粘接力强,固化快,固化时不加压,能适应于电视机外壳连续化生产的工艺要求。本文介绍了该胶粘剂的配方及其主要性能。     

石墨烯复合浆料应用于ABS塑料电镀前表面处理

采用石墨烯等碳纳米材料与溶剂及多种助剂混合研磨，制备了稳定的石墨烯复合导电浆料。将导电浆料喷涂于丙烯腈?丁二烯?苯乙烯共聚物（ABS）表面获得ABS/石墨烯材料，赋予ABS塑料优良的导电性能，继而进行电镀处理。为了提高石墨烯涂层与ABS塑料表面的结合力，对ABS塑料进行了不同的表面处理，包括磨砂、有机溶剂微腐蚀和化学粗化的方法。结果表明，经过不同表面粗化处理的ABS塑料表面形成微孔，亲水性得到提高，其中化学粗化法还可以使ABS塑料表面产生亲水基团，从而大大提高石墨烯涂层的附着力；ABS/石墨烯的电阻范围在0.3~5 kΩ内，具有良好的导电性，电镀后所得产品具有良好的金属光泽，镀层包覆完整不易脱落。     

铅酸蓄电池极柱密封胶的应用

介绍了一些国内外铅酸蓄电池极柱密封胶的应用情况，对这些密封胶的力学性能、粘接性能、充电性能、耐硫酸性能以及工艺性能等进行了详细测试，并进行了对照分析。综合来看，MJ-2003A极柱密封胶具有良好的力学性能和粘接性能，对铅的粘接强度较高，能达到材料破坏的程度；该胶具有良好的耐酸性能、高温充电和高低温充电性能，且工艺性能优异；其综合性能达到3106／3103密封胶的水平；是目前极柱密封胶中性能较为优异的品种。在蓄电池的极柱密封中获得广泛应用。     

太阳能光伏用胶粘剂和密封剂新品

为适应太阳能光伏（PV）工业的特殊要求，美国道康宁公司推出了道康宁PV-8303超快速固化密封剂和道康宁PV-8030胶粘剂新产品，主要用于粘接和密封太阳能光伏模块组件。道康宁PV-8030胶粘剂适宜室温固化，用于典型PV底板的结构粘接；道康宁8303超快速固化密封剂也在室温固化，可对金属、玻璃和塑料底板进行密封与粘接：道康宁公司还开发了PV-7030保护剂，     

ABS塑料用环氧树脂粘合剂的研究

经迈克尔加成反应,用丙烯腈制作了一系列改性多元胺固化剂,将其与双酚A型环氧树脂配合,用于粘接ABS塑料。研究结果显示,丙烯腈改性固化剂有助于改善环氧树脂胶对ABS塑料的粘接强度,随着固化剂中氰基含量从0 mmol/g增加到0．949 mmol/g,丙烯腈改性环氧树脂体系(acrylonitrile-modified epoxy resin system,AMEPS)对ABS塑料的粘接强度增长约32%,而玻璃化温度降低约9%,与此同时,改性环氧树脂的吸酸率呈先降后升趋势。     

基于表面化学吸附的ABS塑料化学镀铜新工艺的研究

采用生物高聚物(壳聚糖薄膜)通过化学吸附将催化剂金属(Pd)固定在丙烯腈-丁二烯-苯乙烯(ABS)塑料基体上,实现了一种低成本、环保的ABS塑料表面活化新工艺。对预处理后的ABS薄膜进行X射线光电子能谱(XPS)分析,了解其反应机理。结果表明:化学吸附法相比传统的物理吸附法,提高了镀层与基体的结合强度,获得了致密且连续的Cu-P铜层结构。     

低温等离子处理ABS的预电镀性能研究

通过低温等离子体表面处理对丙烯腈?丁二烯?苯乙烯（ABS）表面进行刻蚀;以乙烯基三甲氧基硅烷、γ?巯丙基三甲氧基硅烷、γ?氨丙基三乙氧基硅烷为主体的无钯敏化、活化液对ABS进行表面镀镍,通过傅里叶变换全反射红外光谱（ATR?FTIR）、接触角测量仪和扫描电子显微镜（SEM）等探究了电镀ABS的性能,并根据GB/T 9286—2021,用90 °黏合强度测试法测试塑料与金属层之间的黏附牢固程度。结果表明,当处理时间为300 s、功率为600 W时,ABS电镀预处理效果最佳,此时结合强度达到0.94 kN/m。     

基于盲孔法的ABS热焊板件残余应力测量

采用盲孔法对4种丙烯腈–丁二烯–苯乙烯塑料(ABS)热焊板进行了残余应力的测量,获得了这4种热焊板焊趾区的残余应力数据,结果发现,ABS经过热焊成型后容易在焊趾区形成较高的残余应力,随着测量时间的延长,热焊板焊趾区的残余应力逐渐增大,在测量7 min后释放完全。为了验证盲孔法应用于塑料热焊板残余应力检测的可行性,对ABS热焊板母材区和焊趾区以及热处理前后焊趾区的残余应力进行了测量,同时测试了4种热焊板的焊接强度,发现母材区的残余应力低于焊趾区,80℃热处理后焊趾区的残余应力比热处理前的低,残余应力较低的热焊板具有较高的焊接强度,这些结果均表明盲孔法对塑料热焊板件残余应力测量结果具有一定的参考价值。     

ABS树脂与天然橡胶粘合的研究

研究ＡＢＳ树脂与天然橡胶粘合的胶粘剂配方与粘合方法，研究结果表明：采用ＮＢＰ、２４０２树脂、ＡＢＳ树脂并用制成胶粘剂与用ＮＲ、ＮＢＲ并用制成的胶粘剂按一定比例配合涂于ＡＢＳ试片上，天然橡胶试片涂上ＮＲ、ＮＢＲ胶粘剂，试片粘合后的剥离强度可达１．２６ＫＮ／ｍ，将两种胶粘剂按不同比例配合，分层涂于ＡＢＳ试片上，剥离强度可进一步提高。     

A large‐scale double‐stage‐screw 3D printer for fused deposition of plastic pellets

Fused deposition molding (FDM) is the most popular technology in the fields of three‐dimensional printing, but it is hard to use a variety of plastic materials due to the limitation of filament form of material. Using plastic pellets as printing materials gives advantages in cost, processing speed, and available materials. In this work, a large‐scale double‐screw FDM three‐dimensional printer based on plastic pellets has been designed. It is capable of printing large plastic products at a low cost and high speed. Using ABS + 10%GF as printing material, this work is first focused on the effects of the pressure and speed of the metering screw on the flowrate of melt. The equation for the relationship of these three parameters was established as well. Based on this equation, the effects of melt flow, printing speed, and layer thickness on the width of fused filament were investigated with experiments. Furthermore, the effects of printing spacing between fused filaments on surface accuracy and bonding strength were also explored. By printing models, it was revealed that the designed printer is able to print products with plastic pellets. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45147.     

Shrinkage behavior and optimization of injection molded parts studied by the taguchi method

Shrinkage behavior of a plastic plays a critical role in determining the final dimensions of an injection‐molded part. It is well known that process conditions affect many properties of plastic parts, including shrinkage. This study applies the Taguchi method to systematically investigate the effects of process conditions on the shrinkage (along‐ and across‐the‐flow directions) of three plastics: high‐density polyethylene (HDPE), general‐purpose polystyrene (GPS), and acrylonitrile‐butadiene‐styrene (ABS). The results show that HDPE, a semicrystalline plastic, shrinks more than GPS and ABS, two amorphous materials. The extent of anisotropic shrinkage in the along‐the‐flow and across‐the‐flow directions for HDPE is different from GPS and ABS. More shrinkage occurs in the across‐the‐flow direction of HDPE than in its along‐the‐flow direction. The reverse is true for GPS and ABS. Mold and melt temperatures, along with holding pressure and holding time, are the most significant influences on the shrinkage behaviors of three materials, although the importance of each is different for each plastic. The optimal conditions for reducing shrinkage identified by the Taguchi method are experimentally verified and validated by t‐statistic tests. The prediction matches very well with the experimental value for the along‐the‐flow shrinkage of GPS.     

Surface modification of ABS with Cr6+ free etching process in the electroless plating

ABS resin is widely used after the plating process. The traditional ABS resin surface etching process uses a chromic acid system, which is a great threat to environmental protection. This paper examines a new environment-friendly measure in the etching system, which is composed of HNO₃, H₂SO₄, and NiSO₄. With this system, the solution will be etching at 60?°C for 20?minutes on an ABS resin surface and causing the surface roughness of the ABS resin to become larger, and an increase of hydrophilicity. It is observed that the root mean square (RMS) of the surface roughness of the ABS resin increased from 3.21?nm to 27.5?nm after etching, and the surface contact angle of ABS resin decreased from 88.04° to 65.29°. After the etching process, the surface of ABS can be electroless plated successfully and the bonding force of coating and resin can reach 2.09 MPa. The FT-IR spectra and XPS analyses showed that hydroxyl and nitro groups on the ABS surface are as a result of etching treatment, which improves the bonding strength between ABS substrate and electroless copper plating. This new etching system can be a substitute for the traditional chromic acid system in the industry, which will greatly reduce the pollution caused by the traditional process.