共查询到19条相似文献,搜索用时 171 毫秒
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刘立起 《电子工业专用设备》2011,40(2):24-26
改造方案是在原进口中频感应加热炉拉丝机上再加装一台石墨加热炉,使之成为一机两炉工作状态,同时在一台电脑控制下,使用同一拉丝控速系统,可在同一主体设备上分别将大,小直径规格的预制棒拉制成光纤. 相似文献
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拉丝条件对光纤折射率的影响 总被引:2,自引:0,他引:2
蔡春平 《光电子技术与信息》2001,14(3):17-20
针对光纤预制棒及其拉制的光纤折射率分布测量结果的差异,分析了造成这种差异的原因是拉丝条件的不同,于是提出在拉制光纤时必须严格控制工艺,确保光纤性能一致性。 相似文献
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曹维敏 《光纤与电缆及其应用技术》1984,(6)
在新奥尔良(New Orleans)最近召开的光纤通信会议上宣布,新泽西州霍普韦尔(Hopwell.New Jersey)的美国电话电报中心的究研者们研制出一种以12米/秒速度拉制和涂覆光纤的新方法,而光纤的机械特性和光学性能和用一般拉丝速度所形成的相同。负责研制该工艺的研究者Un-Chul Paek及其助手Charles M.Schroeder采用一座高大拉丝塔,在用同聚合物涂覆的同时拉制出大长度光纤。拉丝过程中,光纤直径始终受到监控,以保持均匀的直径。在7公里单层涂覆 相似文献
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为了拉制氧化锆单晶光纤,采用一种基于激光加热基座生长法的单晶光纤拉制系统,在原有的激光加热基座生长法生长单晶光纤的基础上,设计出环形聚焦激光加热系统,对其光学系统进行了改进、优化.利用椭球镜的双焦点特性设计光路,在其第一焦点处形成聚焦环形热源,用于熔化晶棒,拉制光纤;通过ZEMAX光学软件对系统进行了光学仿真.结果表明,在光学系统的聚焦点,能形成高质量的环形热源.该系统有着其它激光加热基座生长法的光学系统无法比拟的优点,在拉制氧化锆和其它高温单晶光纤方面有着很好的应用. 相似文献
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光纤拉伸强度的测量对于理解其裂纹扩展、疲劳性能以及老化效果很重要,有助于预测其长期行为。针对光纤引入最新一代涂层后,在测量光纤拉伸强度过程中遇到一些与试验相关的问题,通过对比拉伸法和两点弯曲法对光纤动态疲劳参数nd的测试结果,建议对于一次涂层原位模量较低的涂层体系涂覆的光纤较适宜采用两点弯曲法测试其动态疲劳性能。 相似文献
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秦大甲 《光纤与电缆及其应用技术》1985,(3)
光纤的大长度抗拉强度是确定在成缆和使用环境下沿光纤长度上允许应力水平的重要参数。为了达到高的生产率和满足某些系统对光纤机械强度的要求,开发大长度高强度光纤是必须的。本文综述了获得大长度高强度光纤所必须满足的原材料、工艺环境、拉丝设备、被复技术等条件,简单介绍了国外对耐疲劳光纤研究的动态。 相似文献
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采用共沉淀法制备SnO2-LiZnVO4系湿敏材料,研究了LiZnVO4的掺杂量对材料湿敏电容的影响。结果表明:LiZnVO4的掺杂量,环境的相对湿度(RH)、测试信号频率对湿敏电容有较大影响。当x(LiZnVO4)为10%时,可使材料具有合适的低湿电容和灵敏度。在100Hz下,当环境的RH从33%上升到93%时,SnO2-LiZnVO4系湿敏材料制备的湿敏元件的电容增量可达起始值的2300%,显示出较高的电容湿度敏感性。湿敏元件的电容响应时间约为54s,恢复时间约为60s。湿滞约为RH6%。 相似文献
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Salazar A. Pastor J.Y. LLorca J. 《Applied Superconductivity, IEEE Transactions on》2004,14(3):1941-1947
The mechanical properties and the critical current were studied in three commercial multifilamentary Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub 10+x//Ag tapes subjected to monotonic and fatigue tension at 77 K in the longitudinal direction. It was found that transport properties were not compromised under monotonic tension if the maximum tensile stress remained below the conventional 0.2% yield strength. This magnitude was reduced by 10% to 20% in the case of fatigue loading, and the service life of the tape was dictated by the mechanical fatigue life. 相似文献
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Murray S. Hillman C. Pecht M. 《Components and Packaging Technologies, IEEE Transactions on》2003,26(3):524-531
Adhesives are subject to environmental aging that degrades their strength and fracture toughness over time. Aging increases the rate of crack growth under fatigue loading, and can lead to deadhesion of an adhesive bond. In this study, an empirical model is constructed from peel test data that quantifies the rate of aging of a siloxane-polyimide-epoxy adhesive as a function of temperature and humidity exposure. An accelerated test methodology that accounts for both aging and fatigue is then proposed, and demonstrated using a case study. 相似文献
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It is well-known that chip-on-glass (COG) assembly is often subjected to the coupled effects of temperature, electrical current and cyclic mechanical loading in service. Therefore, the fatigue life and electrical property of COG assembly undergoing thermal–electric–mechanical coupled loads have been studied in the present work. Based on the present investigations, it was found that that the relative resistance of COG assembly in the fatigue process displayed different trends according to environmental temperature and mechanical loading amplitude. Moreover, the fatigue life of the COG assembly decreased with the increased temperature and the increased loading amplitude. Finally, the Basquin's equation can predict the fatigue life of COG assembly at different environmental temperatures well. 相似文献
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Montanari G.C. Ghinello I. Gherardi L. Caracino P. 《Applied Superconductivity, IEEE Transactions on》1996,6(3):132-141
The effect of mechanical, thermal, and environmental stresses on specimens of multifilamentary 2223-BSCCO tapes, fabricated by the powder-in-tube technology, is discussed in this paper. Short-term and long-term (aging) tests were performed for the purpose of evaluating the strength and endurance of the specimens under compression, tensile, and vibration stresses and In combinations or temperature and humidity. The diagnostic properties employed to evaluate material behavior and degradation are critical current and quantities associated with hysteresis loops. It is shown how mechanical stresses can affect specimen performance in light of application to cables for energy transport. In particular, the endurance lines under tensile and vibration stresses are drawn, achieving indexes useful for evaluation of superconducting tapes and cable design 相似文献
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Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: experimental characterization 总被引:1,自引:0,他引:1
Interfacial delamination is of important concern for multilayered microelectronic packaging structures, as it is one of the most common failures observed in microelectronic packages. To predict interfacial delamination propagation under both static and cyclic loading, one needs to characterize interfacial properties. Key parameters for characterizing an interface include interfacial fracture toughness, interfacial fracture resistance, onset of delamination from an initial interface crack, and fatigue crack propagation (FCP) rate. The objective of this study is to experimentally investigate the interfacial properties of a copper-epoxy interface. Such an interface is one of the most common features seen in multilayered integrated substrates. Amenable to thin film process, sandwich double cantilever beam (DCB) specimens have been designed and fabricated in clean-room environment. Standard tensile tests have been preformed for determining the interfacial fracture toughness and, with monitoring the crack length against the applied force, interfacial fracture resistance. Fatigue tests have also been conducted in studying the onset of delamination from an interfacial delamination starter and the follow-up fatigue crack propagation (FCP) of an interfacial crack along the copper-epoxy interface. 相似文献