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利用Ag的高温抗氧化能力,采用磁控溅射沉积Al/Ag/Al导电复合薄膜,并在480℃下进行热处理。扫描电子显微镜(SEM)和能谱分析(EDS)研究表明磁控溅射的Al/Ag/Al导电复合薄膜表面平整,热处理后表面Al膜生成致密的氧化层。溅射沉积和热处理过程中Ag和Al原子的相互扩散,最后形成富Ag的Ag-Al合金和Ag3Al化合物。Al/Ag/Al导电复合薄膜比Ag/Al复合薄膜的电阻率增大了一个数量级,导电复合薄膜热处理后导电性能更优,电阻率约为19.4×10-6Ω.cm。 相似文献
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随着分辨率的提高,传统金属电极在电阻率和抗氧化性能方面已经不适合作为需要高温热处理的场致发射显示器件中的薄膜电极.本文采用5.77%(原子比)Sn掺杂的ZnO∶Sn作为Ag层的保护层,利用磁控溅射法制备ZnO∶Sn/Ag/ZnO∶Sn复合薄膜及其电极,并采用X射线衍射、光学显微镜、扫描电子显微镜和电性能测试系统研究复合薄膜及其电极在经过不同温度退火后的晶体结构、表面形貌和电学性能的变化.ZnO∶Sn膜层致密,25 nm厚的ZnO∶Sn 足以保护Ag层在530℃的高温中不被明显氧化,电极电阻率低达2.0×10-8Ω·m左右. 相似文献
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随着分辨率的提高,传统金属电极在电阻率和抗氧化性能方面已经不适合作为需要高温热处理的场致发射显示器件中的薄膜电极。本文采用5.77%(原子比)Sn掺杂的ZnO:Sn作为Ag层的保护层,利用磁控溅射法制备ZnO:Sn/Ag/ZnO:Sn复合薄膜及其电极,并采用X射线衍射、光学显微镜、扫描电子显微镜和电性能测试系统研究复合薄膜及其电极在经过不同温度退火后的晶体结构、表面形貌和电学性能的变化。ZnO:Sn膜层致密,25 nm厚的ZnO:Sn足以保护Ag层在530℃的高温中不被明显氧化,电极电阻率低达2.0×10-8Ω.m左右。 相似文献
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室温下利用磁控溅射制备了ZnO/Cu/ZnO透明导电薄膜,采用X射线衍射(XRD)、原子力显微镜(AFM)、扫描电子显微镜(SEM)、霍尔效应测量仪和紫外-可见分光光度计研究了薄膜的结构、形貌、电学及光学等性能与退火温度之间的关系。结果表明:退火前后薄膜均具有ZnO(002)择优取向,随着退火温度的升高,薄膜的晶化程度、晶粒粒径及粗糙度增加,薄膜电阻率先降低后升高,光学透过率和禁带宽度先升高后降低。150℃下真空退火的ZnO/Cu/ZnO薄膜的性能最佳,最高可见光透光率为90.5%,电阻率为1.28×10-4Ω·cm,载流子浓度为4.10×1021cm-3。 相似文献
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利用溅射法制备半导体陶瓷表面的电极有着广阔的产业化前景,但关于溅射膜电极与陶瓷表面的界面机制研究尚鲜有报道。本文采用磁控溅射法在ZnO压敏陶瓷表面制备了Cr+Cu电极,通过X射线光电子能谱等技术研究分析了Cr/ZnO的界面反应及界面成分。研究结果表明:常温下Cr膜在氧化锌表面的沉积模式为混态生长模式,在Cr的初始沉积阶段,Cr价层电子与氧化锌表面存在电子转移作用,有氧化态的Cr生成;随着覆盖度的增加,电子转移逐渐减弱,最后Cr完全呈现为金属态的中性吸附。该界面反应生成的化合物对溅射膜电极的欧姆接触,附着力等性能有重要作用,而且能有效阻止电极元素Cu或Ag的纵向扩散。 相似文献
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采用不同工艺制度对05Cr17Ni4Cu4Nb不锈钢进行了真空时效热处理,研究了影响05Cr17Ni4Cu4Nb不锈钢表面时效氧化变色的各种因素。结果表明:05Cr17Ni4Cu4Nb不锈钢对真空时效气氛比较敏感,氧化变色主要与材料的高铬含量有关,为避免05Cr17Ni4Cu4Nb不锈钢表面氧化变色,最好在还原气氛中进行真空时效热处理;若在现有真空弱氧化气氛中进行时效处理,如出炉温度降低到60℃以下,试样表面颜色基本不变,其表面质量满足要求;采用丙酮超声波清洗方式进行前处理可使试样时效氧化变色问题得到有效改善。 相似文献
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Si衬底上Ta-N/Cu薄膜性能研究 总被引:1,自引:0,他引:1
对Si衬底上Ta-N/Cu薄膜进行了电学和热学分析,结果发现500℃以下薄膜电随几乎不变,600-690℃下的退火引起的电阻率降低是由于Ta-N电阻的热氧化和Cu熔化扩散引起的,而690℃以上的电阻率增加是由于Cu引线传输能力减弱所致,为0.18μm以下的超大规模集成电路中的Cu引线和电阻薄膜的制作提供了有益的借鉴。 相似文献
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采用射频磁控溅射法在高阻Cd0.9Zn0.1Te上制备了Cu/Ag导电薄膜,通过测量I-V曲线来评价接触性能。讨论了溅射功率和衬底温度对接触性能的影响,结果表明在两种不同功率下制备的薄膜不经过热处理已具有良好的欧姆接触性能,随着衬底温度的升高欧姆接触性能有所下降。通过对衬底的表面处理降低了表面漏电流。对试样进行退火处理使接触性能有所改善,退火温度在300℃时的接触性能要好于420℃。利用红外透过率来验证了退火温度范围及所选择加热衬底温度对高阻Cd0.9Zn0.1Te衬底没有影响。 相似文献
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This paper presents the results of investigation of condensation stimulated (CSD) and thermal stimulated (TSD) diffusion in nanoscale film systems on the basis of Fe/Cr and Cu/Cr by Auger-electron spectroscopy method. The film systems were built in ultrahigh vacuum. Auger spectrum was traced during condensation after each increase in thickness of 0.5-1 nm or during film systems annealing from 300 to 683 K over 5 h. According to experimental data the concentration profiles were built and the effective coefficients of CSD and TSD were computed by several mathematical methods. The efficiency of these techniques in different cases was analyzed. The most accurate results were obtained with Weeple and Gauss error methods that take into account the thickness of the diffusant source. 相似文献
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模拟海洋大气环境下Cu和Cr对耐候钢耐腐蚀性能的影响 总被引:1,自引:0,他引:1
过去,合金元素对耐候钢海洋环境中的耐蚀性影响缺乏详细的论讨.选取Q235和5种不同Cu和Cr含量的耐候钢,在0.5%的NaCl溶液中模拟海洋大气环境进行周期浸润试验.研究结果表明:在Cl-存在的环境中,在碳钢的基础上单独添加Cr(0~3.0%)或单独添加Cu(0.25%~0.50%)都不能使钢的耐蚀性有显著的提高.单独提高耐候钢中Cr的含量,有助于抑制其在腐蚀初期的腐蚀速度,但对后期的腐蚀发展趋势不利;单独提高Cu的含量,有助于延缓腐蚀后期的发展趋势.当同时提高耐候钢中的Cu和Cr含量时,可使耐候钢得到较佳的耐大气腐蚀性能.XRD分析结果表明,合金元素对外锈层的成分影响不大,其主要大气腐蚀产物为γ-FeOOH,Fe3O4,γ-Fe2O3和少量α-FeOOH. 相似文献
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《Materials Science & Technology》2013,29(6):800-803
AbstractCr O3/Cu composite was prepared by the internal oxidation of Cu–Cr pre-alloyed powders formed by high energy milling. Effects of milling time on the internal oxidation characteristics of Cu–Cr pre-alloyed powders were also discussed in this paper. The results indicate that the degree of the internal oxidation continually increases with prolonged milling time. At the initial stage, external oxidation rather than internal oxidation occurs, resulting in coarse Cr2O3 particles. With further milling, the internal oxidation becomes more complete and the sizes of Cr2O3 particles also become finer and well distributed. The properties of the composite are therefore improved. A high quality composite specimen from Cu–1·0Cr pre-alloyed powders after 40 h milling was prepared by the internal oxidation process. The Cr2O3 particles with an average size of 2–5 μm in diameter and about 5–10 μm in particles space were found by a microstructure examination, and they were uniformly dispersed in the Cu matrix. 相似文献
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在钎焊温度为820~940℃,钎焊时间为1~30min的条件下,采用TiZrNiCu钎料、Cu/Mo复合中间层对C/C复合材料和TC4进行了钎焊实验。利用扫描电镜及能谱仪对接头的界面组织进行了研究。结果表明:在较低工艺参数下,Cu/C/C复合材料界面结构为Cu/Cu51Zr14/Ti2(Cu,Ni)+Ti(Cu,Ni)+TiCu+Cu2TiZr/TiC/C/C复合材料。随着工艺参数的提高,TiCu和Cu2TiZr反应相逐渐消失,Ti(Cu,Ni)2新相生成,此时的界面结构为Cu/Cu51Zr14/Ti2(Cu,Ni)+Ti(Cu,Ni)+Ti(Cu,Ni)2/TiC/C/C复合材料。钎焊工艺参数较高时界面结构为Cu/Cu51Zr14/Cu(s.s)+Ti(Cu,Ni)2/TiC/C/C复合材料。随着钎焊温度的增加以及保温时间的延长,界面反应层Cu51Zr14和TiC反应层厚度增加。 相似文献
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Rongfa CHEN Dunwen ZUO Min WANG 《材料科学技术学报》2006,22(3):291-294
The compact oxide on the surface of SiCp/Al metal matrix composite (SiCp/Al MMC) greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase (TLP) bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy (SEM) was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal. 相似文献
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Xiuhua CHEN Xinghui WU Jinzhong XIANG Zhenlai ZHOU Heyun ZHAO Liqiang CHEN 《材料科学技术学报》2006,22(3):342-344
Some information on how to use in-situ determined diffusion coefficient of Cu to make barrier layer of Cu metallization in ultra large scale integrations (ULSIs) was provided. Diffusion coefficients of Cu in Co at low temperature were determined to analyze Cu migration to Co surface layer. The diffusion depths were analyzed using X-ray photoelectron spectroscopy (XPS) depth profile to investigate the diffusion effect of Cu in Co at different temperatures. The possible pretreatment temperature and time of barrier layer can be predicted according to the diffusion coefficients of Cu in Co. 相似文献
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用传统固相法制备了(1-x)BaTiO3/xCu(x=5 wt%,10 wt%,15 wt%,20 wt%,25 wt%,30 wt%)复相陶瓷,研究了Cu含量对复相陶瓷材料的显微结构、渗流阈值及介电性能的影响.研究结果表明:BaTiO3/Cu复相陶瓷材料的电阻率随着铜含量的增加而下降,且在渗流阈值(x=25wt%)附近呈现非线性的下降趋势,复合材料从绝缘体逐渐变为导体.室温下1 kHz当Cu含量达到x=30wt%时复相陶瓷的介电常数为~9000,这是由于在导体和绝缘体的相界面处积累大量的空间电荷,并由此产生界面极化,导致介电常数的显著增大,且随着导体含量的增加,这种界面效应更加明显.复相陶瓷的介电损耗随着铜含量的增加而增大,但随着频率的升高,由于空间电荷的减少又会使损耗呈现下降的趋势.在25~115℃的温度范围内,复相陶瓷温度系数小于5%,具有很高的介电常数温度稳定性. 相似文献
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采用铆钉法制备了Al/Cu/Mg三元扩散偶,在真空炉进行扩散反应,利用SEM背散射电子像和微区电子探针分析,研究了扩散反应层的特征。在450℃下,Al/Cu/Mg三元扩散偶的三元交界处生成了五个三元化合物:Al6CuMg4,Al7Cu3Mg6,Al2CuMg,Al5Cu6Mg2和Cu5Al3。 相似文献