1/f noise in large-area Hg<Subscript>1−x</Subscript>Cd<Subscript>x</Subscript>Te photodiodes

The 1/f noise in photovoltaic (PV) molecular-beam epitaxy (MBE)-grown Hg_1−xCd_xTe double-layer planar heterostructure (DLPH) large-area detectors is a critical noise component with the potential to limit sensitivity of the cross-track infrared sounder (CrIS) instrument. Therefore, an understanding of the origins and mechanisms of noise currents in these PV detectors is of great importance. Excess low-frequency noise has been measured on a number of 1000-μm-diameter active-area detectors of varying “quality” (i.e., having a wide range of I-V characteristics at 78 K). The 1/f noise was measured as a function of cut-off wavelength under illuminated conditions. For short-wave infrared (SWIR) detectors at 98 K, minimal 1/f noise was measured when the total current was dominated by diffusion with white noise spectral density in the mid-10⁻¹⁵A/Hz^1/2 range. For SWIR detectors dominated by other than diffusion current, the ratio, α, of the noise current in unit bandwidth i_n(f = 1 Hz, V_d = −60 mV, and Δf = 1 Hz) to dark current I_d(V_d = −60 mV) was α_SW-d = i_n/I_d ∼ 1 × 10⁻³. The SWIR detectors measured at 0 mV under illuminated conditions had median α_SW-P = i_n/I_ph ∼ 7 × 10⁻⁶. For mid-wave infrared (MWIR) detectors, α_MW-d = i_n/I_d ∼ 2 × 10⁻⁴, due to tunneling current contributions to the 1/f noise. Measurements on forty-nine 1000-μm-diameter MWIR detectors under illuminated conditions at 98 K and −60 mV bias resulted in α_MW-P = i_n/I_ph = 4.16 ± 1.69 × 10⁻⁶. A significant point to note is that the photo-induced noise spectra are nearly identical at 0 mV and 100 mV reverse bias, with a noise-current-to-photocurrent ratio, α_MW-P, in the mid 10⁻⁶ range. For long-wave infrared (LWIR) detectors measured at 78 K, the ratio, α_LW-d = i_n/I_d ∼ 6 × 10⁻⁶, for the best performers. The majority of the LWIR detectors exhibited α_LW-d on the order of 2 × 10⁻⁵. The photo-induced 1/f noise had α_LW-P = i_n/I_ph ∼ 5 × 10⁻⁶. The value of the noise-current-to-dark-current ratio, α appears to increase with increasing bandgap. It is not clear if this is due to different current mechanisms impacting 1/f noise performance. Measurements on detectors of different bandgaps are needed at temperatures where diffusion current is the dominant current. Excess low-frequency noise measurements made as a function of detector reverse bias indicate 1/f noise may result primarily from the dominant current mechanism at each particular bias. The 1/f noise was not a direct function of the applied bias.     

1/f noise in very-long-wavelength infrared Hg1−xCdx Te detectors

This paper investigates 1/f noise performance of very-long-wavelength infrared (VLWIR) Hg_1−xCd_xTe (cutoff wavelengths λ_c=15 μm and λ_c=16 μm) photodiodes at 78 K, where detector current is varied by changing detector area, detector bias, and illumination conditions. Holding detector bias and temperature constant, the 1/f noise current is proportional to the detector current. Significant nonuniformity is observed in the noise data for each detector area because of the varying detector quality. Defects are presumed resident in the detectors to produce greater nonuniformity in 1/f noise as compared to dark current at 100-mV reverse bias. For λ_c=16 μm, 4-μ-radius, diffusion-limited diodes at 78 K and 100-mV reverse bias, the average dark current is I_d=9.76±1.59×10⁻⁸ A, while the average noise current measured at 1 Hz is i_n=1.01±0.63×10⁻¹² A/Hz^1/2. For all detector areas measured, the average ratio in 1-Hz bandwidth is α _D =i_n/I_d=1.39±1.09×10⁻⁵. The 1/f noise was also measured on one diode as a function of detector-dark current as the applied bias is varied. In the diffusion-limited portion of this detector’s current-voltage (I-V) curve, to about 130 mV, the 1/f noise was independent of bias. For this diode, the ratio α_D=i_n/I_d=1.51±0.12×10⁻⁵. The 1/f noise associated with tunneling currents is a factor of 3 greater than the 1/f noise associated with diffusion currents, α_T=i_n/I_T=5.21±0.83×10⁻⁵. In addition, 1/f noise was measured on detectors held at −100 mV and 78K under dark and illuminated conditions. The measured ratios α_P ∼α_D ∼1.5×10⁻⁵ were about the same for the dark and photon-induced diffusion currents. Therefore, the diffusion current appears to have a unique value of α as compared to the tunneling current. This may be indicative of unique noise-generation mechanisms associated with each current.     

Transformation of luminescence centers in CVD ZnS films subjected to a high hydrostatic pressure

The cathodoluminescence and optical-transmission spectra of ZnS were analyzed to study the effect of a high hydrostatic gas pressure (1500 atm at 1000°C) on the equilibrium between intrinsic point defects in zinc sulfide grown by chemical vapor deposition (CVD) with an excess of zinc. The cathodoluminescence spectra were measured at 80–300 K and excitation levels of 10²² and 10²⁶ cm⁻³ s⁻¹; the optical-transmission spectra were measured at 300 K in the wavelength range 4–12 μm. It is found that exposure to a high hydrostatic gas pressure transforms the self-activated emission in the cathodoluminescence spectrum: (i) a new short-wave-length band appears at 415 nm with its intensity increasing by one to three orders of magnitude; and (ii) the long-wavelength band that peaks at 445 nm and is observed in as-grown crystals becomes quenched. Simultaneously, the cathodoluminescence band peaked at 850 nm and related to vacancies V _S is no longer observed after high-pressure treatment. These effects are attributed to a partial escape of excess zinc (Zn_i) from crystals and additional incorporation of oxygen into lattice sites (O_S). A doublet band I ₁, which peaked at ∼331–332 nm at 80 K and at ∼342–343 nm at 300 K and is related to excitons bound to acceptor levels of oxygen centers, was observed. This band is found to be dominant in the cathodoluminescence spectrum at an excitation level of 10²⁶ cm⁻³ s⁻¹. Traces of the ZnO phase are apparent after the high-pressure treatment in both the cathodolumi-nescence spectra (the bands at 730 and 370 nm) and the transmission spectra (narrow bands in the region of 6–7 μm). __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 38, No. 1, 2004, pp. 39–43. Original Russian Text Copyright ? 2004 by Morozova, Karetnikov, Plotnichenko, Gavrishchuk, Yashina, Ikonnikov.     

Microscopic defects on MBE grown LWIR Hg1−xCdxTe material and their impact on device performance

Long wavelength infrared molecular beam epitaxy (MBE) grown p-on-n Hg_1−xCd_xTe double layer planar heterostructure (DLPH) detectors have been characterized to determine the dominant mechanisms limiting their performance. Material defects have been identified as critical factors that limit 40K performance operability. This effort has concentrated on identifying microscopic defects, etch pit density (EPD) and relating these defects to the device performance. Visual inspection indicates defect densities as high as 10⁵ per cm² with a spatial extent as observed by atomic force microscope in the range of micrometers extending several micrometers beneath the surface. At high EPD values (greater than low 10⁶ cm⁻²) zero bias resistance (R₀) at 40K decreases as roughly as the square of the EPD. At 78K, however, measured R₀ is not affected by the EPD up to densities as high as mid-10⁶ cm⁻². Visual defects greater than 2–3 μm than ∼2 μm in size (micro-void defects) result in either a single etch pit or a cluster of etch pits. Large variations in a cross-wafer etch pit distribution are most likely a major contributor to the observed large spreads in 40K R₀. This study gives some insight to the present limitation to achieve higher performance and high operability for low temperature infrared applications on MBE grown HgCdTe material.     

Mid-wavelength infrared p-on-n Hg1−xCdxTe heterostructure detectors: 30–120 kelvin state-of-the-Art performance

We report on Hg_1−xCd_xTe mid-wavelength infrared (MWIR) detectors grown by molecular-beam epitaxy (MBE) on CdZnTe substrates. Current-voltage (I-V) characteristics of HgCdTe-MWIR devices and temperature dependence of focal-plane array (FPA) dark current have been investigated and compared with the most recent InSb published data. These MWIR p-on-n Hg_1−xCd_xTe/CdZnTe heterostructure detectors give outstanding performance, and at 68 K, they are limited by diffusion currents. For temperatures lower than 68 K, in the near small-bias region, another current is dominant. This current has lower sensitivity to temperature and most likely is of tunneling origin. High-performance MWIR devices and arrays were fabricated with median R_oA values of 3.96 × 10¹⁰ Ω-cm² at 78 K and 1.27 × 10¹² Ω-cm² at 60 K; the quantum efficiency (QE) without an antireflection (AR) coating was 73% for a cutoff wavelength of 5.3 μm at 78 K. The QE measurement was performed with a narrow pass filter centered at 3.5 μm. Many large-format MWIR 1024 × 1024 FPAs were fabricated and tested as a function of temperature to confirm the ultra-low dark currents observed in individual devices. For these MWIR FPAs, dark current as low as 0.01 e⁻/pixel/sec at 58 K for 18 × 18 μm pixels was measured. The 1024 × 1024 array operability and AR-coated QE at 78 K were 99.48% and 88.3%, respectively. A comparison of these results with the state-of-the-art InSb-detector data suggests MWIR-HgCdTe devices have significantly higher performance in the 30–120 K temperature range. The InSb detectors are dominated by generation-recombination (G-R) currents in the 60–120 K temperature range because of a defect center in the energy gap, whereas MWIR-HgCdTe detectors do not exhibit G-R-type currents in this temperature range and are limited by diffusion currents.     

H2-based dry plasma etching for mesa structuring of HgCdTe

An experimental study has been carried out on the performance of n-type x = 0.31 HgCdTe photoconductive detectors in order to evaluate two different etching techniques; dry plasma etching, in the form of H₂/CH₄ reactive ion etching (RIE), and wet chemical etching using bromine in hydrobromic acid. Two-dimensional laser beam-induced current (LBIC) imaging was employed as an in-line process monitoring tool to evaluate the lateral extent of reactive ion etching (RIE) induced doping changes in the HgCdTe epilayer following mesa delineation. Responsivity and noise measurements were performed on fabricated mid-wavelength infrared (MWIR) photoconductive devices to evaluate the influence dry plasma etching has on material properties. For a signal wavelength of 3 μm, 60° field of view, and a temperature of 80 K, background limited D _λ ^* performance was recorded for wet chemical processed devices but not for the dry plasma processed devices. The D _λ ^* values obtained for wet chemical and dry plasma etched photoconductive detectors were 2.5×10¹¹ cmHz^1/2W⁻¹ and 1.0×10¹⁰ cmHz^1/2W⁻¹, respectively. Mercury annealing, which has been shown to restore the electrical properties of dry plasma processed HgCdTe, could be used to lessen the influence that RIE dry plasma etching has on photoconductor detector performance.     

Resistivity variation of semi-insulating Cd1−xZnx Te in relationship to alloy composition

We investigated the resistivity variation of semi-insulating Cd_1−xZn_xTe used as room temperature nuclear radiation detectors, in relationship to the alloy composition. The resistivity and the zinc composition were determined using leakage current measurements and triple axis x-ray diffraction lattice parameter measurements, respectively. While the zinc content of the nominally x_Zn∼0.1 ingot varied monotonically according to the normal freezing behavior with an effective segregation coefficient of k_eff=1.15, the resistivity was found to vary non-systematically throughout the ingot. Furthermore, the “expected” relationship of higher zinc content with higher resistivity was not always observed. For example, wafer regions of x_Zn∼0.12 and x_Zn∼0.08 exhibited resistivity values of ∼10¹⁰ and ∼10¹¹ Ω·cm, respectively. In general, the experimental resistivity values can be explained by calculated values which take into account a compensating deep level defect and various electron and hole mobility values. The relative influence of the parameters that govern the resistivity (n,p, μ_e, and μ_h) are quantitatively investigated.     

Advances in large-area Hg1−xCdxTe photovoltaic detectors for remote-sensing applications

State-of-the-art large-area photovoltaic (PV) detectors fabricated in HgCdTe grown by molecular beam epitaxy (MBE) have been demonstrated for the Crosstrack Infrared Sounder (CrIS) instrument. Large-area devices (1 mm in diameter) yielded excellent electrical and optical performance operating at 81 K for λ_c ∼ 15 μm, at 98 K for λ_c ∼ 9 μm, and λ_c ∼ 5-μm spectral cutoffs. Fabricated detectors have near-theoretical electrical performance, and Anti Reflection coated quantum efficiency (QE) is greater than 0.70. Measured average R₀A at 98 K is 2.0E7 Ωcm², and near-theoretical QEs greater than 0.90 were obtained on detectors with λ_c ∼ 5-μm spectral cutoffs. These state-of-the-art large-area PV detector results reflect high-quality HgCdTe grown by MBE on CdZnTe substrates in all three spectral bands of interest.     

Very high-speed ultraviolet photodetectors fabricated on GaN

We report on the temporal and the frequency response of both metal-semiconductor-metal (MSM) and p-i-n ultraviolet photodetectors fabricated on single-crystal GaN. The best MSM devices show a fast 10–90% rise-time of ∼28 psec under comparatively low ultraviolet excitation of ∼0.1 W/cm² averagerirradiance. The fast-Fourier transform (FFT) of the pulse response data indicates a bandwidth, f_3dB, of ∼3.8 GHz at a reverse bias of 25 V. This agrees well with the direct frequency response measurement value of ∼3.5 GHz. For the p-i-n devices, we measured a rise-time of ∼43 psec at 15 V reverse bias for a 60 μm diameter mesa with 1 μm thick intrinsic region. The FFT of the p-i-n pulse response obtains f_3dB ≈1.4 GHz. Analysis in terms of reverse bias and geometric scaling indicates that the MSM photodetectors are transit-time limited. The p-i-n devices also show evidence of transit-time limited effects based on trends with respect to reverse bias and intrinsic region thickness. However, our larger area p-i-n devices show clear evidence of RC-limited behavior. Modeling of the temporal behavior indicates that a slow component in the time and frequency response data is a consequence of the hole drift velocity. We have also found preliminary evidence of microplasmic effects in the p-i-n devices.     

Correlation between visual defects and increased dark current in large-area Hg1−xCdxTe photodiodes

The Cross-Track Infrared Sounder (CrIS) program [an instrument on the National Polar-Orbiting Operational Environmental Satellite System (NPOESS)] requires photodiodes with spectral cutoffs denoted by short-wavelength infrared [γ_c(98 K) ∼5.1 μm], midwavelength infrared [γ_c(98 K) ∼9.1 μm], and long-wavelength infrared (LWIR) [γ_c(81 K) ∼15.5 μm]. The CrIS instrument also requires large-area (850-μm-diameter) photodiodes with state-of-art performance. Molecular beam epitaxy (MBE) is used to grow n-type short-wavelength infrared, midwavelength infrared, or LWIR Hg_1−xCd_xTe on latticematched CdZnTe. Detectors with p-type implants 7 μm in diameter are used to constitute the 850-μm-diameter lateral collection diodes (LCDs). The photodiode architecture is the double-layer planar heterostructure architecture. Quantum efficiency, I-V, R_d-V, and 1/f noise in photovoltaic Hg_1−xCd_xTe detectors are critical parameters that limit the sensitivity of infrared sounders. These are some of the parameters used to select photodiodes that will be part of the CrIS focal plane module (FPM). During fabrication of the FPM, the photodiodes are subject to a significant amount of handling while transitioning from part of newly processed Hg_1–xCd_xTe wafers to individual photodiodes mounted in a CrIS FPM ready to be flown on NPOESS. Quantum efficiency, I-V, noise, and visual inspections are performed at several steps in the detector’s journey. Initial I-V and visual inspections are conducted at the wafer level followed by I-V, noise, and quantum efficiency after dicing and mounting the photodiodes in leadless chip carriers (LCCs). A visual inspection is performed following removal of the detectors from the LCCs. Finally, the individual photodiodes are precision mounted on an FPM base, and I-V, noise, quantum efficiency, and visual inspections are performed again. Each step in the FPM fabrication process requires handling and environmental conditioning that can result in detector dark current and noise increase. Some photodiodes on the first flightlike FPMs fabricated exhibited an increase in dark current and noise characteristics at the FPM level as compared to the measurements performed when the photodiodes were in LCCs prior to integration into the FPM. The degradation observed resulted in an investigation to discern the cause of the performance degradation (baking at elevated temperatures, mechanical handling, electrical stress, etc.). This paper outlines the results of the study and the corrective actions that led to the successful manufacture of LWIR large detectors from material growth to insertion into flight FPMs for the CrIS program.     

Molecular-beam epitaxial growth of HgCdTe infrared focal-plane arrays on silicon substrates for midwave infrared applications

Molecular beam epitaxy has been employed to deposit HgCdTe infrared detector structures on Si(112) substrates with performance at 125K that is equivalent to detectors grown on conventional CdZnTe substrates. The detector structures are grown on Si via CdTe(112)B buffer layers, whose structural properties include x-ray rocking curve full width at half maximum of 63 arc-sec and near-surface etch pit density of 3–5 × 10⁵ cm⁻² for 9 μm thick CdTe films. HgCdTe p⁺-on-n device structures were grown by molecular beam epitaxy (MBE) on both bulk CdZnTe and Si with 125K cutoff wavelengths ranging from 3.5 to 5 μm. External quantum efficiencies of 70%, limited only by reflection loss at the uncoated Si-vacuum interface, were achieved for detectors on Si. The current-voltage (I-V) characteristics of MBE-grown detectors on CdZnTe and Si were found to be equivalent, with reverse breakdown voltages well in excess of 700 mV. The temperature dependences of the I-V characteristics of MBE-grown diodes on CdZnTe and Si were found to be essentially identical and in agreement with a diffusion-limited current model for temperatures down to 110K. The performance of MBE-grown diodes on Si is also equivalent to that of typical liquid phase epitaxy-grown devices on CdZnTe with R₀A products in the 10⁶–10⁷ Θ-cm² range for 3.6 μm cutoff at 125K and R₀A products in the 10⁴–10⁵ Θ-cm² range for 4.7 μm cutoff at 125K.     

Detection of paramagnetic recombination centers in proton-irradiated silicon

The method of spin-dependent recombination was used to record electron spin resonance (ESR) spectra of recombination centers in a thin (∼1 μm) surface layer of p-type silicon grown by the Czochralski method and irradiated by protons with energies of ∼100 keV. Spectra of excited triplet states of the oxygen + vacancy complex (A-centers) were observed along with complexes consisting of two carbon atoms and an interstitial silicon atom (C_S-Si_I-C_S complexes). The intensity of the ESR spectra of these radiation-induced defects was found to be largest at irradiation doses of ∼10¹³ cm⁻², and decreased with increasing dose, which is probably attributable to passivation of the radiation-induced defects by hydrogen. Fiz. Tekh. Poluprovodn. 33, 1164–1167 (October 1999)     

Evidence from spectral emissometry for conduction intraband transitions in the intrinsic regime for silicon

From emissometry measurements in lightly doped Si at elevated temperatures, we have observed an anomalous absorption band in the wavelength range of 1–5 μm. The wavelength at which the band peaks, λ≈2.3 μm, shows a negligible dependence on temperature while the peak intensity increases with temperature presumably as a result of the increasing intrinsic carrier concentration. Spitzer and Fan reported a similar absorption band in direct absorption measurements at room temperature for n-type Si with extrinsic electron concentrations of 10¹⁴ to 10¹⁹cm⁻³. No such structure was found in extrinsic p-type Si. Spitzer and Fan were unable to identify the mechanism for this anomalous absorption. In both the experiments, this absorption of free electrons is due to intraband transitions in the conduction band from the Δ₁ conduction band edge across an energy gap of E ∼ 0.5 eV to a higher lying Δ₂′ conduction band.     

Characterization of Mg-doped InP grown by MOCVD using a bis(methylcyclopentadienyl)magnesium dopant source

The use of bis(methylcyclopentadienyl)magnesium (MCp₂Mg) as ap-dopant source for MOCVD-grown InP has been investigated. The Mg incorporation was nonlinear. The relationship between the H₂ flow through the MCp₂Mg bubbler and the Mg concentra-tion in the epilayers suggested that when [Mg] <20 ppb in the reactor it was mostly depleted from the gas mixture, probably by means of reaction with O₂ or H₂O, but at higher concentrations a large fraction of the Mg diffusing to the epilayers was incor-porated. For concentrations >10¹⁹ cm^s-3 the layer morphology deteriorated and stacking faults were observed by TEM, at a density greater than 10⁹ cm^s−2. Significant diffusion of Mg into the substrates during the growth was observed, with diffusion depths up to 0.1 μm at a concentration of 10¹⁹ cm^s−3 in S-doped, and up to 32 μm at 10¹⁷ cm^s-3 in Fe-doped substrates. These concentrations correspond to the S and Fe doping level in those substrates, and the results are explained in terms of the formation of a complex between the S or Fe dopants and the diffusing Mg, which immobilizes the latter species. At [Mg] >10¹⁸ cm^s−3, the net hole concentration, measured by means of electrochemical C-V pro-filing, decreases with increasing [Mg], indicating significant self compensation. Com-pensation at high [Mg] was also suggested by the effect of excitation power density on the peak shift of the donor to acceptor transition observed during photoluminescence measurements at 7 K.     

Infrared spectroscopy of chromium-doped cadmium selenide

The maximum optical-absorption cross section of Cr²⁺ ions was evaluated from near-infrared (NIR) absorption spectroscopy and direct measurements of the chromium concentration in Cr²⁺:CdSe crystals. The emission lifetime of the excited state, ⁵E, of Cr²⁺ was measured as a function of Cr²⁺ concentration in the 2×10¹⁷ −2×10¹⁸ ions/cm³ range and as a function of temperature from 77–300 K. Lifetime values were as high as ∼6 μs in the 77–250 K range and decreased to ∼4 μs at 300 K because of nonradiative decays. Assuming that most of the Cr dopant is in the Cr²⁺ state, an optical-absorption cross section σ_a of (1.94±0.56) × 10⁻¹⁸ cm² was calculated. Implications for laser performance are discussed.     

MOVPE growth of HgCdTe for high performance 3–5 µm photodiodes operating at 100–180K

New results are reported on the growth of high performance medium wavelength infrared (3–5 μm) (MWIR) HgCdTe photodiodes in the three-layer P-n-N configuration. The detector structures were grown in situ by metalorganic vapor phase epitaxy (MOVPE) on (211)B oriented CdZnTe substrates. The mobilities of the single n-type layers with x-values of ∼0.30 are in the range of (3–4.5)×10⁴ cm²/V-s at 80K. The lifetimes on unpassivated films range from 1–5 and 4–10 μs at 80 and 180K, respectively, which are within a factor of two or less of the lifetimes calculated for Auger-1 and radiative recombination. The P-n-N films were processed into variable-area backside-illuminated diagnostic arrays and tested for quantum efficiency, spectral response, R_DA, I–V curves and 1/f noise in the 120–180K range. The internal one-dimensional quantum efficiencies are in the range of 85–100%. The optical collection lengths are typically ∼25 μm. I–V curves showed that diffusion current is the dominant junction current mechanism for temperatures ≥100K. R₀A values are at the one-dimensional limit for n-side diffusion currents over the 100–180K range. 1/f noise was measured to be very low at 120K and is the same as that measured in similarly processed arrays from recent LPE grown P-on-N heterojunctions. The results demonstrate that MOVPE growth can be used for large area, high performance MWIR HgCdTe detector arrays operating in the 120–180K temperature range.     

MWIR DLPH HgCdTe photodiode performance dependence on substrate material

Mid wavelength infrared p-on-n double layer planar heterostructure (DLPH) photodiodes have been fabricated in HgCdTe double layers grown in situ by liquid phase epitaxy (LPE), on CdZnTe and for the first time on CdTe/sapphire (PACE-1). Characterization of these devices shed light on the nature of the material limits on device performance for devices performing near theoretical limits. LPE double layers on CdZnTe and on PACE-1 substrates were grown in a horizontal slider furnace. All the photodiodes are p-on-n heterostructures with indium as the n-type dopant and arsenic the p-type dopant. Incorporation of arsenic is via implantation followed by an annealing step that was the same for all the devices fabricated. The devices are passivated with MBE CdTe. Photodiodes have been characterized as a function of temperature. R₀A_imp values obtained between 300 and 78K are comparable for the two substrates and are approximately a factor of five below theoretical values calculated from measured material parameters. The data, for the PACE-1 substrate, indicates diffusion limited performance down to 110K. Area dependence gives further indications as to the origin of diffusion currents. Comparable R₀A_imp for various diode sizes indicates a p-side origin. R₀A and optical characteristics for the photodiodes grown on lattice-matched CdZnTe substrates and lattice mismatched PACE-1 are comparable. Howover, differences were observed in the noise characteristics of the photodiodes. Noise was measured on 50 × 50 μm devices held under a 100 mV reverse bias. At 110K, noise spectrum for devices from the two substrates is in the low 10⁻¹⁵ A/Hz^1/2 range. This value reflects the Johnson noise of the room temperature 10¹⁰ Ω feedback resistor in the current amplifier that limits the minimum measurable noise. Noise at 1 Hz, −100 mV and 120K for the 4.95 μm PACE-1 devices is in the 1–2 × 10⁻¹⁴ A/Hz^1/2, a factor of 5–10 lower than previously grown typical PACE-1 n⁺-on-p layers. Noise at 120K for the 4.60 μm PACE-1 and LPE on CdZnTe was again below the measurement technique limit. Greatest distinction in the noise characteristics for the different substrates was observed at 163K. No excess low frequency noise was observed for devices fabricated on layers grown by LPE on lattice-matched CdZnTe substrates. Photodiode noise measured at 1Hz, −100 mV and 163K in the 4.60 μm PACE-1 layer is in the 1–2×10⁻¹³ A/Hz^1/2, again a factor of 5–10 lower than previously grown PACE-1 n⁺-on-p layers. More variation in noise (4×10⁻¹³−2×10⁻¹² A/Hz^1/2) was observed for devices in the 4.95 μm PACE-1 layer. DLPH devices fabricated in HgCdTe layers grown by LPE on lattice-matched CdZnTe and on lattice-mismatched PACE-1 have comparable R₀A and quantum efficiency values. The distinguishing feature is that the noise is greater for devices fabricated in the layer grown on lattice mismatched substrates, suggesting dislocations inherent in lattice mismatched material affects excess low frequency noise but not zero bias impedance.     

Planar n-on-p ion milled mid-wavelength and long-wavelength infrared diodes on molecular beam epitaxy vacancy-doped CdHgTe on CdZnTe

Planar mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) photodiodes were fabricated by ion milling molecular beam epitaxy (MBE) Cd_xHg_1−xTe (CMT) layers with and without compositional grading in the layer. Linear arrays with 32 and 64 diodes, as well as test diodes of varying size, were fabricated. Good quantum efficiencies were measured, and MWIR diodes, with cutoff wavelength λ_CO=4.5 μm, had zero-bias resistance-area values (R₀A) in excess of 1×10⁷ Ωcm², whereas LWIR diodes with λ_CO=8.9−9.3 μm had R₀A=3×10² Ωcm² at 77 K. Comparison between a limited number of layers indicates that in layers with a gradient the RA values are a factor of ∼10 larger, and possibly more uniform, than in layers without a gradient.     

Acceptor and donor doping of AlxGa1−xN thin film alloys grown on 6H-SiC(0001) substrates via metalorganic vapor phase epitaxy

Thin films of Si-doped Al_xGa_1−xN (0.03≤x≤0.58) having smooth surfaces and strong near-band edge cathodoluminescence were deposited at 0.35–0.5 μm/h on on-axis 6H-SiC(0001) substrates at 1100°C using a 0.1 μm AlN buffer layer for electrical isolation. Alloy films having the compositions of Al_0.08Ga_0.92N and Al_0.48Ga_0.52N exhibited mobilities of 110 and 14 cm²/V·s at carrier concentrations of 9.6×10¹⁸ and 5.0×10¹⁷ cm⁻³, respectively. This marked change was due primarily to charge scattering as a result of the increasing Al concentration in these random alloys. Comparably doped GaN films grown under similar conditions had mobilities between 170 and ∼350 cm²/V·s. Acceptor doping of Al_xGa_1−xN for x≤0.13 was achieved for films deposited at 1100°C. No correlation between the O concentration and p-type electrical behavior was observed.     

High performance SWIR HgCdTe detector arrays

Short wave infrared (SWIR) devices have been fabricated using Rockwell’s double layer planar heterostructure (DLPH) architecture with arsenic-ion implanted junctions. Molecular beam epitaxially grown HgCdTe/CdZnTe multilayer structures allowed the thin, tailored device geometries (typical active layer thickness was ∼3.5 μm and cap layer thickness was ∼0.4 μm) to be grown. A planar-mesa geometry that preserved the passivation advantages of the DLPH structure with enhanced optical collection improved the performance. Test detectors showed Band 7 detectors performing near the radiative limit (∼3-5X below theory). Band 5 detector performance was ∼4-50X lower than radiative limited performance, apparently due to Shockley-Hall-Read recombination. We have fabricated SWIR HgCdTe 256 × 12 × 2 arrays of 45 um × 45 μm detector on 45 μm × 60 μm centers and with cutoff wavelength which allows coverage of the Landsat Band 5 (1.5−1.75 μm) and Landsat Band 7 (2.08−2.35 μm) spectral regions. The hybridizable arrays have four subarrays, each having a different detector architecture. One of the Band 7 hybrids has demonstrated performance approaching the radiative theoretical limit for temperatures from 250 to 295K, consistent with test results. D* performance at 250K of the best subarray was high, with an operability of ∼99% at 10¹² cm Hz^1/2/W at a few mV bias. We have observed 1/f noise below 8E-17 AHz ^1/2 at 1 Hz. Also for Band 7 test structures, Ge thin film diffractive microlenses fabricated directly on the back side of the CdZnTe substrate showed the ability to increase the effective collection area of small (nominally <20 μm μm) planar-mesa diodes to the microlens size of 48 urn. Using microlenses allows array performance to exceed 1-D theory up to a factor of 5.