Effects of copper addition on the in-situ synthesis of SiC particles in Al–Si–C–Cu system

In this research work, SiC particles have been successfully in-situ synthesized in Al–Si–Cu matrix alloy utilizing a novel liquid–solid reaction method. The effect of copper addition on the synthesis of SiC in Al–Si–C–Cu system was investigated. The composites mainly contain spherical SiC particles and θ-Al₂Cu eutectic phases, which are embedded in the α-Al matrix. Results indicated that the temperature for forming in-situ SiC particles significantly reduced from 750 °C to 700 °C with the copper addition. The size of in-situ synthesized SiC particles can be as low as 0.2 μm. Further study found that the addition of 10 wt.% copper into Al–Si–C alloy causes its solidus temperature to decrease by about 65 °C. Additionally, the Rockwell hardness value of SiCp/Al–18Si–5Cu composites has an average of 92, which is 50% higher than that of the sample without copper addition.     

Mechanical properties of a diamond–copper composite with high thermal conductivity

Using pressureless infiltration of copper into a bed of coarse (180 μm) diamond particles pre-coated with tungsten, a composite with a thermal conductivity of 720 W/(m K) was prepared. The bending strength and compression strength of the composite were measured as 380 MPa. As measured by sound velocity, the Young's modulus of the composite was 310 GPa. Model calculations of the thermal conductivity, the strength and elastic constants of the copper–diamond composite were carried out, depending on the size and volume fraction of filler particles. The coincidence of the values of bending strength and compressive strength and the relatively high deformation at failure (a few percent) characterize the fabricated diamond–copper composite as ductile. The properties of the composite are compared to the known analogues — metal matrix composites with a high thermal conductivity having a high content of filler particles (~ 60 vol.%). In strength and ductility our composite is superior to diamond–metal composites with a coarse filler; in thermal conductivity it surpasses composites of SiC–Al, W–Cu and WC–Cu, and dispersion-strengthened copper.     

Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method

A356/45vol.%SiCp composites with a uniform distribution of SiC particles have been fabricated by a liquid pressing method. Increasing the melt temperature, holding time and pre-treatment of SiCp by thermal oxidation improves the soundness of composites for the liquid pressing method. The sound composites exhibited low coefficient of thermal expansion (8 ppm/K) and high thermal conductivity (155 W/m K). The measured values for coefficient of thermal expansion agree well with the predicted values based on Turner’s model irrespective of porosity. The measured values for thermal conductivity decrease with porosity, and the effect of pore on the thermal conductivity has been evaluated based on the modified Hasselman–Johnson model.     

Effect of submicron size SiC particles on microstructure and mechanical properties of AZ31B magnesium matrix composites

The magnesium matrix composites reinforced with three volume fractions (3, 5 and 10 vol.%) of submicron-SiC particles (∼0.5 μm) were fabricated by semisolid stirring assisted ultrasonic vibration method. With increasing the volume fraction of the submicron SiC particles (SiCp), the grain size of matrix in the SiCp/AZ31B composites was gradually decreased. Most of the submicron SiC particles exhibited homogeneous distribution in the SiCp/AZ31B composites. The ultimate tensile strength and yield strength of the 10 vol.% SiCp/AZ31B composites were simultaneously improved. The study of interface between the submicron SiCp and the matrix in the SiCp/AZ31B composite suggested that submicron SiCp bonded well with the matrix without interfacial activity.     

Thermal conductivity of Cu–Zr/diamond composites produced by high temperature–high pressure method

Copper matrix composites reinforced with about 90 vol.% of diamond particles, with the addition of zirconium to copper matrix, were prepared by a high temperature–high pressure method. The Zr content was varied from 0 to 2.0 wt.% to investigate the effect on interfacial microstructure and thermal conductivity of the Cu–Zr/diamond composites. The highest thermal conductivity of 677 W m⁻¹ K⁻¹ was achieved for the composite with 1.0 wt.% Zr addition, which is 64% higher than that of the composite without Zr addition. This improvement is attributed to the formation of ZrC at the interface between copper and diamond. The variation of thermal conductivity of the composites was correlated to the evolution of interfacial microstructure with increasing Zr content.     

Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

Cu/diamond composites were fabricated by spark plasma sintering (SPS) after the surface pretreatment of the diamond powders, in which the diamond particles were mixed with copper powder and tungsten powder (carbide forming element W). The effects of the pretreatment temperature and the diamond particle size on the thermal conductivity of diamond/copper composites were investigated. It was found that when 300 μm diamond particles and Cu–5 wt.% W were mixed and preheated at 1313 K, the composites has a relatively higher density and its thermal conductivity approaches 672 W (m K)⁻¹.     

Effect of copper content on the thermal conductivity and thermal expansion of Al–Cu/diamond composites

Al–Cu matrix composites reinforced with diamond particles (Al–Cu/diamond composites) have been produced by a squeeze casting method. Cu content added to Al matrix was varied from 0 to 3.0 wt.% to detect the effect on thermal conductivity and thermal expansion behavior of the resultant Al–Cu/diamond composites. The measured thermal conductivity for the Al–Cu/diamond composites increased from 210 to 330 W/m/K with increasing Cu content from 0 to 3.0 wt.%. Accordingly, the coefficient of thermal expansion (CTE) was tailored from 13 × 10⁻⁶ to 6 × 10⁻⁶/K, which is compatible with the CTE of semiconductors in electronic packaging applications. The enhanced thermal conductivity and reduced coefficient of thermal expansion were ascribed to strong interface bonding in the Al–Cu/diamond composites. Cu addition has lowered the melting point and resulted in the formation of Al₂Cu phase in Al matrix. This is the underlying mechanism responsible for the strengthening of Al–Cu/diamond interface. The results show that Cu alloying is an effective approach to promoting interface bonding between Al and diamond.     

Processing of Al/SiC composites in continuous solid–liquid co-existent state by SPS and their thermal properties

Silicon carbide (SiC)-particle-dispersed-aluminum (Al) matrix composites were fabricated in a unique fabrication method, where the powder mixture of SiC, pure Al and Al–5mass% Si alloy was uniquely designed to form continuous solid–liquid co-existent state during spark plasma sintering (SPS) process. Composites fabricated in such a way can be well consolidated by heating during SPS processing in a temperature range between 798 K and 876 K for a heating duration of 1.56 ks. Microstructures of the composites thus fabricated were examined by scanning electron microscopy and no reaction was detected at the interface between the SiC particle and the Al matrix. The relative packing density of the Al–matrix composite containing SiC was higher than 99% in a volume fraction range of SiC between 40% and 55%. Thermal conductivity of the composite increased with increasing the SiC content in the composite at a SiC fraction range between 40 vol.% and 50 vol.%. The highest thermal conductivity was obtained for Al–50 vol.% SiC composite and reached 252 W/mK. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the SiC particle and the Al matrix in the composite.     

Analysis of tensile strength and microstructure of Ni–SiC composites prepared by electroforming

Ni–SiC metal matrix composites with two kinds of SiC content were prepared by electroforming in a nickel sulphamate bath. Tensile strength and microstructure of the composites before and after heat treatment were investigated. The maximum of tensile strength was obtained after heat treatment at 300 °C × 24 h. The values were 641 N/mm² and 701 N/mm² respectively. The complete reaction between nickel and SiC particles can produce shrinkage pores in the interface. The volume of shrinkage pores was equal to 8% of the volume of SiC particles in the composites. The interfacial reaction products were composed of Ni₃Si and a little amount of Ni₃₁Si₁₂ after heat treatment at 600 °C × 24 h. The fracture evolution went though microcracks initiation, growth and coalescence. Cracking of the matrix, debonding of Ni–SiC interfaces and cracking of particles were three types of cracking modes for Ni–SiC composites.     

Enhanced thermal conductivity of SiCp/PS composites by electrospinning–hot press technique

Silicon carbide particle/polystyrene (SiCp/PS) electrospun mats are firstly prepared by electrospinning technology, then to be fabricated the corresponding thermally conductive SiCp/PS composites by the method of “laminating-hot press”. The mass fraction of SiCp and laminating mode of SiCp/PS electrospun mats affecting on the thermal conductivities, dielectric and thermal properties of the composites are investigated. The addition of 32.8 vol% SiCp improves the thermally conductive coefficient λ of pure PS from 0.182 to 0.566 W/m K and thermal diffusivity of pure PS from 0.169 to 0.376 mm²/s, whereas the dielectric constant values still remain at relatively low levels. The thermal stabilities of the SiCp/PS composites are increased with the increasing addition of SiCp. For a given SiCp loading, the SiCp/PS composites from warp–weft arrangement of SiCp/PS electrospun mats possess relative higher thermally conductive coefficient λ and dielectric constant values than those of SiCp/PS composites from warp–warp arrangement of SiCp/PS electrospun mats.     

Preparation and thermal performance analysis of novel multilayer cladding structure composites

With regard to the adiabatic principle of insulation, a novel multilayer cladding structure composites (MCSC) with vacuum inside was put forward, which could be used in high temperature insulation field. In the composites, SiO₂ was used to fill the microcracks and protect the carbon matrix from oxidizing. This novel material was composed of two parts, one was the core material consisted of SiC foam ceramic, the other was the flawless outer shell consisted of carbon fiber reinforced composites with vacuum inside that produced by Chemical Vapor Infiltration (CVI) Pyrolytic Carbon (PyC) and silicasol-infiltration–sintering methods. Material density was 0.81 g/cm³. The effective thermal conductivity of MCSC ranged from 0.193 W/m · K to 0.721 W/m · K within the temperature from 303 K to 703 K, which was 13.5–23.3% lower than the value of SiC ceramic foam core materials. However, at 1473 K, the measured data of MCSC and SiC foam were 1.815 W/m · K and 1.911 W/m · K, respectively. It was only 5.02% lower than that of SiC foam.     

An investigation of the effect of SiC particle size on Cu–SiC composites

In this study mechanical properties of copper were enhanced by adding 1 wt.%, 2 wt.%, 3 wt.% and 5 wt.% SiC particles into the matrix. SiC particles of having 1 μm, 5 μm and 30 μm sizes were used as reinforcement. Composite samples were produced by powder metallurgy method and sintering was performed in an open atmospheric furnace at 700 °C for 2 h. Optical and SEM studies showed that the distribution of the reinforced particle was uniform. XRD analysis indicated that the dominant components in the sintered composites were Cu and SiC. Relative density and electrical conductivity of the composites decreased with increasing the amount of SiC and increased with increasing SiC particle size. Hardness of the composites increased with both amount and the particle size of SiC particles. A maximum relative density of 98% and electrical conductivity of 96% IACS were obtained for Cu–1 wt.% SiC with 30 μm particle size.     

Microstructure and mechanical properties of carbon fiber reinforced multilayered (PyC–SiC)n matrix composites

Carbon fiber reinforced multilayered (PyC–SiC)_n matrix (C/(PyC–SiC)_n) composites were prepared by isothermal chemical vapor infiltration. The phase compositions, microstructures and mechanical properties of the composites were investigated. The results show that the multilayered matrix consists of alternate layers of PyC and β-SiC deposited on carbon fibers. The flexural strength and toughness of C/(PyC–SiC)_n composites with a density of 1.43 g/cm³ are 204.4 MPa and 3028 kJ/m³ respectively, which are 63.4% and 133.3% higher than those of carbon/carbon composites with a density of 1.75 g/cm³. The enhanced mechanical properties of C/(PyC–SiC)_n composites are attributed to the presence of multilayered (PyC–SiC)_n matrix. Cracks deflect and propagate at both fiber/matrix and PyC–SiC interfaces resulting in a step-like fracture mode, which is conducive to fracture energy dissipation. These results demonstrate that the C/(PyC–SiC)_n composite is a promising structural material with low density and high flexural strength and toughness.     

Investigation on TIG welding of SiCp-reinforced aluminum–matrix composite using mixed shielding gas and Al–Si filler

Using He–Ar mixed gas as shielding gas, the tungsten inert gas (TIG) welding of SiCp/6061 Al composites was investigated without and with Al–Si filler. Welded joint with filler were submitted to tensile tests. The microstructure and fracture morphology of the joint were examined. The results show that adding 50 vol.% helium in shielding gas improves the arc stability, and seams with high-quality appearance are obtained when the Al–Si filler is added. In addition, the interface reaction between SiC and matrix is greatly suppressed when using Al–Si filler. The microstructure of the welded joint displays non-uniformity with many SiC particles distributing in the weld center. The average tensile strength of weld joints with Al–Si filler is 70% above that of the matrix composites under annealed condition.     

Enhanced thermal conductivity of Cu matrix composites reinforced with Ag-coated β-Si3N4 whiskers

Cu matrix composites reinforced with 10 vol.% Ag-coated β-Si₃N₄ whiskers (ASCMMCs) were prepared by powder metallurgy method. With the aim of improving the thermal conductivity of the composites, a quite thin Ag layer was deposited on the surface of β-Si₃N₄ whiskers. The results indicated that thermal conductivity of ASCMMCs with 0.30 vol.% Ag (0.30ASCMMCs) reached up to 273 W m⁻¹ K⁻¹ at 25 °C, which was 98 W m⁻¹ K⁻¹ higher than that of Cu matrix composites reinforced with uncoated β-Si₃N₄ whiskers (USCMMCs). The Ag coating could promote the densification of composites, reduce the aggregation of β-Si₃N₄ whiskers and enhance the Cu/Si₃N₄ interfacial bonding, therefore it could efficiently enhance the thermal conductivity of Cu matrix composites reinforced with β-Si₃N₄ whiskers (SCMMCs).     

Heterogeneously structured conductive carbon fiber composites by using multi-scale silver particles

This paper reports a new approach to enhance the through-thickness thermal conductivity of laminated carbon fabric reinforced composites by using nanoscale and microscale silver particles in combination to create heterogeneously structured continuous through-thickness thermal conducting paths. High conductivity of 6.62 W/(m K) with a 5.1 v% silver volume fraction can be achieved by incorporating these nanoscale and microscale silver particles in EWC-300X/Epon862 composite. Silver flakes were distributed within the inter-tow area, while nanoscale silver particles penetrated into the fiber tows. The combination of different sizes of silver fillers is able to effectively form continuous through-thickness conduction paths penetrating fiber tows and bridging the large inter-tow resin rich areas. Positive hybrid effects to thermal conductivity were found in IM7/EWC300X/sliver particle hybrid composites. In addition, microscale fillers in resin rich areas showed less impact on tensile performance than nanoscale particles applied directly on fiber surface.     

Effect of metalloid silicon addition on densification,microstructure and thermal–physical properties of Al/diamond composites consolidated by spark plasma sintering

Aluminum matrix composites reinforced with diamond particles were consolidated by spark plasma sintering. Metalloid silicon was added (Al–Si/diamond composites) to investigate the effect. Silicon addition promotes the formation of molten metal during the sintering to facilitate the densification and enhance the interfacial bonding. Meanwhile, the alloying metal matrix precipitates the eutectic-Si on the diamond surfaces acting as the transitional part to protect the improved interface during the cooling stage. The improved interface and precipitating eutectic-Si phase are mutually responsible for the optimized properties of the composites. In this study, for the Al–Si/diamond composite with 55 vol.% diamonds of 75 μm diameter, the thermal conductivity increased from 200 to 412 Wm⁻¹ K⁻¹, and the coefficient of thermal expansion (CTE) decreased from 8.9 to 7.3 × 10⁻⁶ K⁻¹, compared to the Al/diamond composites. Accordingly, the residual plastic strain was 0.10 × 10⁻³ during the first cycle and rapidly became negligible during the second. Additionally, the measured CTE of the Al–Si/diamond composites was more conform to the Schapery’s model.     

Fabrication,interface characterization and modeling of oriented graphite flakes/Si/Al composites for thermal management applications

Highly thermally conductive graphite flakes (G_f)/Si/Al composites have been fabricated using G_f, Si powder and an AlSi₇Mg_0.3 alloy by an optimized pressure infiltration process for thermal management applications. In the composites, the layers of G_f were spaced apart by Si particles and oriented perpendicular to the pressing direction, which offered the opportunity to tailor the thermal conductivity (TC) and coefficient of thermal expansion (CTE) of the composites. Microstructural characterization revealed that the formation of a clean and tightly-adhered interface at the nanoscale between the side surface of the G_f and Al matrix, devoid of a detrimental Al₄C₃ phase and a reacted amorphous Al–Si–O–C layer, contributed to excellent thermal performance along the alignment direction. With increasing volume fraction of G_f from 13.7 to 71.1 vol.%, the longitudinal (i.e. parallel to the graphite layers) TC of the composites increased from 179 to 526 W/m K, while the longitudinal CTE decreased from 12.1 to 7.3 ppm/K (matching the values of electronic components). Furthermore, the modified layers-in-parallel model better fitted the longitudinal TC data than the layers-in-parallel model and confirmed that the clean and tightly-adhered interface is favorable for the enhanced longitudinal TC.     

On the thermal conductivity of Cu–Zr/diamond composites

Interfaces and close proximity between the diamond and the metal matrix are very important for their thermal conductance performance. Matrix-alloying is a useful approach to greatly enhance the interfacial bonding and thermal conductivity. In this study, the copper–diamond (Cu/Dia) composites with addition of 0.8, 1.2 and 2.4 wt.% zirconium (Zr) are prepared to investigate the influence of minor addition of Zr on the microstructure and thermal conductivity of the composites. The thermal conductivity of the composites is analyzed both experimentally and theoretically. It is demonstrated that moderate interfacial modification due to the Zr added is beneficial to improve the thermal conductivity of the Cu/Dia composites.     

Effect of re-melting on particle distribution and interface formation in SiC reinforced 2124Al matrix composite

The interface between metal matrix and ceramic reinforcement particles plays an important role in improving properties of the metal matrix composites. Hence, it is important to find out the interface structure of composite after re-melting. In the present investigation, the 2124Al matrix with 10 wt.% SiC particle reinforced composite was re-melted at 800 °C and 900 °C for 10 min followed by pouring into a permanent mould. The microstructures reveal that the SiC particles are distributed throughout the Al-matrix. The volume fraction of SiC particles varies from top to bottom of the composite plate and the difference increases with the decrease of re-melting temperature. The interfacial structure of re-melted 2124Al–10 wt.%SiC composite was investigated using scanning electron microscopy, an electron probe micro-analyzer, a scanning transmission electron detector fitted with scanning electron microscopy and an X-ray energy dispersive spectrometer. It is found that a thick layer of reaction product is formed at the interface of composite after re-melting. The experimental results show that the reaction products at the interface are associated with high concentration of Cu, Mg, Si and C. At re-melting temperature, liquid Al reacts with SiC to form Al₄C₃ and Al–Si eutectic phase or elemental Si at the interface. High concentration of Si at the interface indicates that SiC is dissociated during re-melting. The X-ray energy dispersive spectrometer analyses confirm that Mg- and Cu-enrich phases are formed at the interface region. The Mg is segregated at the interface region and formed MgAl₂O₄ in the presence of oxygen. The several elements identified at the interface region indicate that different types of interfaces are formed in between Al matrix and SiC particles. The Al–Si eutectic phase is formed around SiC particles during re-melting which restricts the SiC dissolution.