原子力显微镜研究苯并三氮唑对铜的缓蚀作用

铜以及铜合金由于其优良的抗腐蚀性能,广泛用在冷却水系统中,苯并三氮唑(BTA)常常作为铜的缓蚀剂。将传统电化学方法和原子力显微镜(AFM)测试技术相结合,对人造海水中BTA作用于铜电极的缓蚀行为进行了研究。结果表明,BTA能够有效减缓铜在海水中的腐蚀,且随着缓蚀剂浓度的增加,缓蚀效果越明显,100 mg/L的BTA就能够高效的保护铜。电化学结果表明,BTA能够在铜的表面形成致密的保护膜[CuBTA]n;AFM测试表明,随着时间的进行,保护膜越来越致密,保护性能也越好。     

苯并三氮唑-季铵盐体系缓蚀处理对铜耐腐蚀和抑菌性能的影响

采用由苯并三氮唑(BTA)和季铵盐QAS 1622组成的溶液对铜进行缓蚀处理。研究了BTA和QAS 1622的质量浓度及温度对所得膜层耐腐蚀性能和抑菌性能的影响。结果表明，BTA是一种有效的铜缓蚀剂，季铵盐的加入能够进一步提升其缓蚀效果。当采用3 g/L BTA和1 g/L QAS 1622组成的溶液在温度40°C下对铜处理10 min时，所得的膜层在中性3%NaCl溶液中具有最好的耐蚀性，对铜的缓蚀效率达到98.7%。覆膜法抑菌试验结果表明，3 g/L BTA缓蚀处理对铜的抑菌性能无明显影响，而加入1 g/L QSA 1622能够提升铜的抑菌性能，与大肠杆菌接触1 h的抑菌率达到99.9%。     

高浓度氯离子环境中铜合金缓蚀的电化学研究

应用线性电位扫描(LSV)和Tafel实验等电化学测试技术,研究了苯并三氮唑(BTA)浓度、缓蚀剂的复配、温度对铜合金在高浓度氯离子(25%氯化钙溶液)环境中腐蚀行为的影响。结果表明:缓蚀剂浓度改变将引起缓蚀效果的变化,BTA浓度较低时,铜合金腐蚀电位随缓蚀剂浓度增大而升高,腐蚀速率降低;BTA浓度超过0.2%后,铜合金腐蚀电位和腐蚀速率趋于稳定;NaNO2、Na2MoO4、(NH4)2MoO4等缓蚀剂与BTA复配,对改善缓蚀效果有一定作用;温度对缓蚀效果有重要影响,铜合金在高浓度氯离子溶液中的腐蚀速率随温度的升高而加快,缓蚀剂的缓蚀效果随温度的升高而降低。     

松香咪唑啉聚氧乙烯醚对金属铜的缓蚀性研究

以松香、二乙烯三胺(DETA)和环氧乙烷(EO)为原料合成了不同环氧乙烷聚合度的松香咪唑啉聚氧乙烯醚(RIEO)。利用静态失重法测定了RIEO在硝酸介质中对铜的缓蚀效率，讨论了影响缓蚀效率的因素，得出RIEO较适宜的缓蚀条件：环氧乙烷聚合度10，缓蚀剂浓度0．1％—0．2％。硝酸浓度10％—20％。温度50—60℃。RIEO—10对金属铜有较强的缓蚀能力，其缓蚀性能与苯并三氮唑(BTA)相当。     

氧化型杀生剂对苯并三氮唑缓蚀性能影响的研究

对苯并三氮唑在氧化型杀生剂作用下的氧化反应机理进行了分析,苯并三氮唑被氯氧化后其缓蚀效果会下降,提出了含氧化型杀生剂循环水中提高苯并三氮唑缓蚀效果的措施,在工业应用中取得了良好的效果.     

含苯并三氮唑基团硅烷偶联剂用于铁质文物防腐

硅烷偶联剂γ-缩水甘油醚氧丙基三甲氧基硅烷(KH560)与缓蚀剂苯并三氮唑可以进行开环反应,生成具有缓蚀基团的硅烷偶联剂。KH560与苯并三氮唑摩尔比对封护效果有较大影响,苯并三氮唑配比过高时缓蚀性能急剧下降。封护液的浓度对封护效果也有很大影响,浓度过低性能不好。最优结果为配比1∶1.2,质量分数为30%乙醇溶液。     

硬脂酰苯并三氮唑的合成及其润滑性能研究

采用二环己基碳二亚胺缩合法由硬脂酸和苯并三氮唑合成了硬脂酰笨并三氮唑,产率85%,并通过FTIR证实获得了目标产物.采用四球实验机评价了硬脂酰苯并三氮唑作为润滑添加剂的抗磨减摩性能.结果表明,所合成的硬脂酰苯并三氮唑具有较高的稳定性和很高的抗极压性能,可以明显改善基础油的抗磨减摩性能.     

超声辐射下双(苯并三氮唑)烷烃的合成和量子化学研究

以苯并三氮唑和二溴烷烃为原料,在超声辐射下,合成了1,3-双(苯并三氮唑)丙烷和1,4-双(苯并三氮唑)丁烷.通过温度对1,4-双(苯并三氮唑)丁烷产率的影响,确定了最佳反应温度为60℃.另外,运用Gaussian03程序对化合物进行了量子化学计算,发现化合物可以作为柔性双齿配体.     

丙烯酰基苯并三氮唑及其聚合物光物理过程的研究

1-N-丙烯酰基苯并三氮唑(ABT)及其聚合物-聚丙烯酰基苯并三氮唑(PABT)作为功能高分子材料的母体和重要原料已引起人们的重视。如报道[1]利用PABT可制备聚丙烯酸及其各种不同的酯类、带芳酰胺或脂肪酰胺侧基的各种聚酰胺化合物等。文献[2]报道了以1-氢苯并三氮唑(1-HBT)作为原料合成了一系列的苯并三氮唑的衍生     

膨润土对苯并三氮唑与Cu2+的吸附行为研究

以膨润土对含苯并三氮唑(BTA)和Cu2+的模拟废水进行吸附研究。结果表明:膨润土吸附BTA的最佳pH为3.5,对Cu2+的吸附率随pH升高而增大;pH为3.5时,对BTA、Cu2+的最大吸附率分别达到92.1%、40.3%;膨润土对100 mg/L BTA和Cu2+溶液的饱和吸附量分别为81.3、22.9 mg/g,吸附平衡时间为80～100 min。动力学拟合表明,吸附过程能用Freundlich和Langmuir吸附等温方程描述。     

一种环保型阻垢缓蚀剂的性能

以聚环氧琥珀酸（PESA）、聚丙烯酸（PAA）、水解聚马来酸酐（HPMA）、苯并三氮唑（BTA）为原料,研制出一种新型具有环保功能的复合型高效阻垢缓蚀剂。通过正交试验确定该阻垢缓蚀剂中各组分的最佳浓度为：PESA(1.0 mg/L)/PAA(1.0 mg/L)/HPMA (0.6 mg/L)/BTA(0.5 mg/L)。分别采用鼓泡法、电化学试验和旋转挂片腐蚀试验研究了其阻垢缓蚀性能。试验结果表明,该阻垢缓蚀剂的阻垢率为92%,对A3碳钢、铜、不锈钢的缓蚀率分别达到了83%、97%、99%,动态模拟试验结果也显示该阻垢缓蚀剂满足循环冷却水运行要求。     

Benzotriazole as inhibitor for copper with and without corrosion products in aqueous polyethylene glycol

Electrochemical methods, including polarization experiments and impedance spectroscopy, were used to evaluate the effectiveness of benzotriazole (BTA) in an aqueous solution of polyethylene glycol (PEG) in protecting polished archaeological copper or archaeological copper covered with corrosion products. The adsorption of PEG on the polished copper significantly limited the corrosion current. The presence of benzotriazole enhanced the protection of the polished copper, giving maximum protection at a concentration of 10^–2moll^–1 of BTA in 20 vol% PEG 400 solution. On the other hand, PEG solutions caused degradation of the corrosion products of the copper. This degradation increased with time. When BTA was added, the corrosion products were preserved and, the higher the BTA concentration, the more the corrosion current decreased. In PEG 400 solution protection of the corrosion products of the copper by BTA improved over time.     

缓蚀剂对水基环保免清洗助焊剂缓蚀性能的影响

以丁二酸、苹果酸（w= 2.00%）为活化剂,乙二醇、异丙醇和乙二醇丁醚（w= 3.00%）为助溶剂,聚乙二醇-6000（w= 0.25%）为成膜剂,咪唑（IM）、苯并咪唑（BIA）和苯并三氮唑（BTA）分别为缓蚀剂,配制系列水基免清洗助焊剂。用静态失重法、电化学阻抗谱法和扫描电子显微镜等方法研究了三种缓蚀剂对金属铜的缓蚀作用。结果表明：随三种缓蚀剂含量的增加,缓蚀率均表现出先提高后降低的趋势。其中BTA的添加量为0.08%时,缓蚀率达 88.78%,金属膜电阻R_f 达1.25×10⁶ Ω·cm²,缓蚀效果最佳。研究还表明：缓蚀剂总量为0.08%时,BIA和BTA复配（0.04%BIA + 0.04% BTA）,缓蚀率达94.25%,R_f 达2.26×10⁶ Ω·cm²,显示出明显的缓蚀协同效应。助焊剂铺展实验也表明,复配缓蚀剂的最佳添加量为0.04% BIA和0.04% BTA。     

钨酸盐与BTA对碳钢协同缓蚀作用的研究

采用电化学阻抗谱方法研究了钨酸盐和苯并三氮唑(BTA)对碳钢的协同缓蚀作用。两者单独使用时钨酸盐的缓蚀作用比BTA显著，复配使用时表现出协同缓蚀效应，升高pH对协同缓蚀作用有利。此外还用表面分析法分析了碳钢表面膜，证明Na2WO4和BTA参与了表面膜的形成。     

1－羟甲基苯并三氮唑与异丙胺复配物的缓蚀性能研究

以苯并三氮唑（BTA）和甲醛为原料合成了l-羟甲基苯并三氮唑,将其与异丙胺复配得到一种新的铜缓蚀剂。通过静态挂片、极化曲线以及交流阻抗等实验方法对其缓蚀性能进行了测定。实验结果证明该缓蚀剂在1％的HCI溶液中10mg／L的质量浓度下对黄铜的缓蚀率达到85％,比BTA缓蚀效果有很大提高。极化曲线测试结果表明1-羟甲基苯并三氮唑与异丙胺复配是混和型缓蚀剂。     

Inhibiting effects of benzotriazole on the corrosion of α-Al-bronze in saline water

The inhibiting effect of benzotriazole (BTA) on the corrosion of -Al-bronze (Cu-7% Al) in 3.4% NaCl was studied. BTA showed good inhibition effects from short up to extended periods of time (about six weeks). The morphologies of the alloy surface were monitored after various periods of corrosion in the absence and presence of BTA, using SEM. The corrosion products were identified by X-ray diffraction. Corrosive attack occurs very early in the absence of BTA, leading to general and pitting corrosion. BTA was found to have a stronger inhibiting effect on the anodic dissolution of copper than on the cathodic reduction of oxygen. The current-potential relation is divided into two regions: region I within which BTA has a strong effect on the charge transfer kinetics, and a limiting current region where BTA has no significant inhibiting effect. It is also shown that the interaction of BTA with a Cu₂0-covered alloy surface is faster than on reduced alloy surfaces, although the protection efficiency on the latter is slightly better than on the former.     

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

DC and pulse plating of copper in acidic sulphate solutions containing benzotriazole (BTA) has been studied. When BTA is the only additive present, it generally has a stronger effect than the plating mode and significantly enhances deposit morphology and surface brightness over that produced in additive-free solutions. XPS and voltammetry analyses indicate that BTA is present at the surface of the deposit, but not through the entire coating, and does not become depleted within the solution over the course of plating. This may help explain why the initial surface smoothness and brightness is maintained as the coating grows beyond 5 μm thick. Plating mode does have a strong effect on deposit morphology under specific conditions. Pulse current plating at low frequency (50 Hz) and low duty cycle (20%) produces deposits with poorer quality than that obtained by DC plating. Pulse reverse plating yields very coarse and dull coatings when the frequency is low enough for metal dissolution to occur during the reverse time. Regardless of the plating mode, the addition of Cl⁻ eliminates most of the beneficial effects of BTA and leads to very rough and dull deposits. The observed effects are discussed in light of previous research on the electrodeposition and corrosion of the Cu–BTA and Cu–BTA–Cl systems.     

聚天冬氨酸复配物对碳钢、紫铜和不锈钢缓蚀性能研究

以聚天冬氨酸（PASP）、聚丙烯酸（PAA）、水解聚马来酸酐（HPMA）、苯并三氮唑（BTA）为原料,得到一种高效的复合型缓蚀剂配方ρ（PASP）∶ρ（PAA）∶ρ（HPMA）∶ρ（BTA）=2.4∶1.6∶2∶1。采用旋转挂片实验和电化学实验对该缓蚀剂的缓蚀性能进行了评价。结果表明,该缓蚀剂对碳钢、紫铜和不锈钢的缓蚀率分别为84.8%,96.4%,99.2%。动态模拟实验结果显示,该缓蚀剂满足循环冷却水运行要求。