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1.
Room temperature photoreflectance spectroscopy (PR) was used to investigate MBE grown AlxGa1−xAs/GaAs doped structures. For some structures photoreflectance spectra exhibit superposition of Franz – Keldysh oscillations. Using the 632.8 nm line from an He – Ne laser and the 457.9 nm line from an Ar+ laser alternately as the pump light, the Franz – Keldysh oscillations from different interfaces were separated. From the period of the oscillations, the built‐in electric field at two interfaces was determined. The dependence of the direct band‐gap energy on the Al content was also investigated. To obtain the direct band gap energy, the measured photoreflectance spectra were analysed using Aspnes lineshape procedure. The determined EAlGaAs dependence on x for doped AlxGa1−xAs layers was compared with previous data. Copyright © 2000 John Wiley & Sons, Ltd.  相似文献   

2.
We present a systematic study of In x Ga1−x As on InP grown by molecular beam epitaxy using the characterization techniques of Fourier transform photoluminescence, x-ray diffraction, micro-Raman spectroscopy, and photoreflectance spectroscopy. The four techniques were used to determine and correlate the fundamental parameters of band-gap energy, phonon frequency and composition. Comparing room temperature (293 K) PL and low temperature PL indicate the presence of a partially ionized acceptor with binding energy of about 13 meV in the unintentionally doped material. Double crystal x-ray diffraction (XRD) using a symmetric <400> and asymmetric <224> reflections was also employed. The use of two reflections gives precise lattice constants, composition, and extent of film relaxation. Micro-Raman spectroscopy was used to measure phonon frequencies in the In x Ga1−x As films and correlated to XRD composition. Room temperature photoreflectance (PR) was used to determine band-gap energy for both the low and intermediate field cases. Band gap energies determined at room temperature by PL and PR were in agreement within experimental error.  相似文献   

3.
The composition and the impurity back-ground levels of (CuInSe2)1-x (MnSe)2x alloy crystals are characterized by ion microprobe analyses. Room temperature photoreflectance (PR) and photoconductivity (PC) measurements in the temperature range 10 K ⪯ T ⪯ 300 K reveal changes in the point defect chemistry and a shift of the band gap with increasingx towards higher energies. Also, a deep luminescence feature at 0.89 eV is observed in Mn doped crystals, in addition to the contributions at 0.90 and 0.94 eV that appear in both doped and nominally undoped CuInSe2. X-ray diffraction studies show that the chalcopyrite structure is retained to at leastx = 0.25.  相似文献   

4.
The temperature dependence in the range 77–400 K of the carrier concentration, resistivity and mobility of a series of n and p-type single crystal, liquid-phase epitaxial layers of Ga1−xAlxAs are presented. These layers were doped, n-type with tellurium, and p-type with germanium to yield carrier concentrations in the range 1017 – 1018cm−3 at 295 K. Donor and acceptor ionization energies, εD and εA, are derived from the data. The dependence of εD on alloy composition is interpreted in terms of the known band structure variation in the alloy system.  相似文献   

5.
Zintl phases are ideal candidates for efficient thermoelectric materials, because they are typically small‐bandgap semiconductors with complex structures. Furthermore, such phases allow fine adjustment of dopant concentration without disrupting electronic mobility, which is essential for optimizing thermoelectric material efficiency. The tunability of Zintl phases is demonstrated with the series CaxYb1–xZn2Sb2 (0 ≤ x ≤ 1). Measurements of the electrical conductivity, Hall mobility, Seebeck coefficient, and thermal conductivity (in the 300–800 K temperature range) show the compounds to behave as heavily doped semiconductors, with transport properties that can be systematically regulated by varying x. Within this series, x = 0 is the most metallic (lowest electrical resistivity, lowest Seebeck coefficient, and highest carrier concentration), and x = 1 is the most semiconducting (highest electrical resistivity, highest Seebeck coefficient, and lowest carrier concentration), while the mobility is largely independent of x. In addition, the structural disorder generated by the incorporation of multiple cations lowers the overall thermal conductivity significantly at intermediate compositions, increasing the thermoelectric figure of merit, zT. Thus, both zT and the thermoelectric compatibility factor (like zT, a composite function of the transport properties) can be finely tuned to allow optimization of efficiency in a thermoelectric device.  相似文献   

6.
Epitaxial growth of Hg-based semiconductors by molecular beam epitaxy (MBE) and metalorganic MBE (MOMBE) has progressed sufficiently to shift emphasis to the control of factors limiting the yield of both materials and devices. This paper reports on anex-situ study to evaluate the suitability of reflectance and photoreflectance (PR) asin-situ characterization techniques for the growth of CdTe and HgCdTe. Photoreflectance yields information about CdTe layers, with largest utility for doped and multi-layer structures. However, caution must be taken in interpretation of the spectra since the near-bandedge PR spectra consists of multiple transitions and the E1 transition energy is very sensitive to the sample history. Photoreflectance appears to be of limited utility for HgCdTe single layer growth with x<0.4. However, reflectance measurements of the E1 peak can be used to determine composition in HgCdTe single layers with an accuracy Δx = ±0.01, which can be useful for growth control. A tight binding model was used to calculate the E1 peak energy as a function of bandgap for HgCdTe and HgTe/CdTe superlattices. Comparisons are made with experimental observations. Surface interdiffusion in HgTe-CdTe superlattices was probed using reflectance measurements.  相似文献   

7.
We report on the growth of GaAs1−xNx thin films on GaAs substrates (2° off) by metalorganic vapor-phase epitaxy, in the temperature range 500–600°C. A mixture of N2 and H2 was used as the carrier gas. Using dimethylhydrazine as nitrogen source, we incorporated up to 3.5% of nitrogen, at 530°C. The growth condition dependence of nitrogen content was studied, and it reveals a distribution coefficient 350 times lower for nitrogen than for arsine at 530°C. Nitrogen incorporation is controlled by surface kinetics. The evolution of surface morphology has been investigated by atomic force microscopy as a function of the nitrogen composition and of growth temperature. For nitrogen content up to 2%, the GaAsN vicinal surface is characterized by a step–terrace structure with bunched steps, and the step edges straighten when increasing the growth temperature. For higher nitrogen content terraces are no longer observed and, above 3%, widely-spaced cross-hatch lines, characteristic of a partial relaxation of strain in the epilayers, appear. Optical properties were studied by low (7 K) and room-temperature photoluminescence and photoreflectance. As usual for this material, a degradation of optical characteristics is observed with increasing N content along with the evolution of surface morphology.  相似文献   

8.
The effects of selective reactive ion etching (SRIE) using SiCl4/SiF4 plasma on delta-doped GaAs/Al0.3Ga0.7As modulation-doped field-effect transistor (MODFET) structures and devices have been investigated. The results are compared with those of corresponding conventionally doped MODFETs. Hall measurements were conducted at 300 and 77 K to characterize the change in the transport properties of the two-dimensional electron gas due to low energy ion bombardment during the SRIE process. Delta-doped structures showed a smaller change in sheet carrier density and mobility compared to conventionally doped structures. Direct current and high frequency measurements were performed on the SRIE gate-recessed MODFETs. No significant change in threshold voltage was observed for the delta-doped MODFETs in contrast to an increase of about 300 mV for the conventionally doped MODFETs processed at a plasma self-bias voltage of −90 V and a 1200% overetch time. Maximum dc extrinsic transconductance and unity current gain cutoff frequency did not change with SRIE processing for either of the structures. This paper was presented at the Electronic Materials Conference at MIT, Cambridge, 1992.  相似文献   

9.
The carrier lifetimes in InxGa1−xAs (InGaAs) and Hg1−xCdxTe (HgCdTe) ternary alloys for radiative and Auger recombination are calculated for temperature 300K in the short wavelength range 1.5<λ<3.7 μm. Due to photon recycling, an order of magnitude enhancements in the radiative lifetimes over those obtained from the standard van Roosbroeck and Shockley expression, has been assumed. The possible Auger recombination mechanisms (CHCC, CHLH, and CHSH processes) in direct-gap semiconductors are investigated. In both n-type ternary alloys, the carrier lifetimes are similar, and competition between radiative and CHCC processes take place. In p-type materials, the carrier lifetimes are also comparable, however the most effective channels of Auger mechanism are: CHSH process in InGaAs, and CHLH process in HgCdTe. Next, the performance of heterostructure p-on-n photovoltaic devices are considered. Theoretically predicted RoA values are compared with experimental data reported by other authors. In0.53Ga0.47As photodiodes have shown the device performance within a factor often of theoretical limit. However, the performance of InGaAs photodiodes decreases rapidly at intermediate wavelengths due to mismatch-induced defects. HgCdTe photodiodes maintain high performance close to the ultimate limit over a wider range of wavelengths. In this context technology of HgCdTe is considerably advanced since the same lattice parameter of this alloy is the same over wide composition range.  相似文献   

10.
A dilute mixture of CCl4 in H2 has recently been shown to be a suitable carbon doping source for obtainingp-type GaAs grown by metalorganic chemical vapor deposition (MOCVD) with carbon acceptor concentrations in excess of 1 × 1019cm−3. To understand the effect of growth parameters on carbon incorporation in CCl4 doped Al x Ga1−x As, carbon acceptor concentration was studied as a function of Al composition, growth temperature, growth rate, and CCl4 flow rate using electrochemical capacitance-voltage profiling. The carbon incorporation as a function of Al composition, growth temperature and CCl4 flow rate was also measured by secondary ion mass spectroscopy (SIMS). All layers were grown by low pressure MOCVD using TMGa and TMAl as column III precursors, and 100% AsH3 as the column V source. Increased Al composition reduced the dependence of carbon concentration on the growth temperature. Reduced growth rate, which resulted in substantially decreased carbon acceptor concentrations in GaAs, had an insignificant effect on the carrier concentration of Al0.4Ga0.6As. A linear relationship between hole concentration and CC14 flow rate in AlxGa1−x As for 0.0 ≤x ≤ 0.8 was observed. These results are interpreted to indicate that adsorption and desorption of CCl y (y ≤ 3) on the Al x Ga1-x As surface during crystal growth plays an important role in the carbon incorporation mechanism.  相似文献   

11.
Oxygen has always been considered to be a major contaminant in the organo-metallic vapor phase epitaxy (OMVPE) of Al x Ga1−x As. Oxygen incorporation has been invoked as a contributor to low luminescence efficiency, dopant compensation and degradation of surface morphology among other deleterious effects. This study presents quantitative measurements of oxygen concentration in nominally high purity Al x Ga1−x As. The oxygen concentration was measured as a function of alloy composition, growth temperature, andV/III ratio. Quantitative secondary ion mass spectroscopy (SIMS) measurements were used to determine the oxygen content as well as the carbon concentration in the film. The oxygen concentration increases with decreased growth temperature and V/III ratio while increasing superlinearly with Al content in the epitaxial layer.  相似文献   

12.
Capacitance and Hall effect measurements in the temperature range 10-300 K were performed to evaluate the deep and shallow level characteristics of Si-doped n-AlxGa-xAs layers with 0 × 0.4 grown by molecular beam epitaxy. For alloy compositions × 0.3 the overall trap concentration was found to be less than 10−2 of the carrier concentration. In this composition range the transport properties of the ternary alloy are comparable to those of n-GaAs:Si except for lower electron mobibities due to alloy scattering. With higher Al content one dominant electron trap determines the overall electrical properties of the material, and in n-Al0.35Ga0.65As:Si the deep trap concentration is already of the order of the free-carrier concentration or even higher. For the composition × = 0.35 ± 0.02 the influence of growth temperature and of Si dopant flux intensity on the deep trap concentration, on shallow and deep level activation energy, and on carrier freeze-out behaviour was studied and analyzed in detail. Our admittance measurements clearly revealed that the previously assumed deepening of the shallow level in n-Alx Ga1-x As of alloy composition close to the direct-indirect cross-over point does actuallynot exist. In this composition range an increase of the Si dopant flux leads to a reduction of the thermal activation energy for electron emission from shallow levels due to a lowering of the emission barrier by the electric field of the impurities. The increasing doping flux also enhances the concentration of the dominant electron trap strongly, thus indicating a participation of the dopant atoms in the formation of deep donor-type (D,X) centers. These results are in excellent agreement with the model first proposed by Lang et al. for interpretation of deep electron traps in n-Alx Ga1-x grown by liquid phase epitaxy.  相似文献   

13.
The alloy composition of Hg1−xCdxTe should be controlled during growth, so that the desired band gap and the lattice-matched layer may be obtained. In-situ spectroscopic ellipsometry, now commercially available, enables one to acquire spectral data during growth. If one knows the optical dielectric function as a function of alloy composition and temperature, the technique can be fully used to monitor and control temperature, the thickness, and the alloy composition. For this purpose, we first obtained temperature dependent spectral data of Hg1−xCdxTe by spectroscopic ellipsometry (SE). The spectral data of Hg1−xCdxTe with x = 1,0.235, and 0.344 were obtained from room temperature to 800Kin the photon energy range from 1.3 to 6 eV. The spectral data revealed distinctive critical point structures at E0, E00, E1, E11, E2(X), and E2(Σ). Critical point energies decreased and linewidths increased monotonically as temperature increased. The model for the optical dielectric function enabled (i) the critical point parameters to be determined accurately, and (ii) the spectral data to be expressed as a function of temperature within and outside the experimental range.  相似文献   

14.
The field dependence of drift velocity of electrons in quantum wells of selectively doped In0.5Ga0.5As/Al x In1 − x As and In0.2Ga0.8As/Al x Ga1 − x As heterostructures is calculated by the Monte Carlo method. The influence of varying the molar fraction of Al in the composition of the Al x Ga1 − x As and Al x In1 − x As barriers of the quantum well on the mobility and drift velocity of electrons in high electric fields is studied. It is shown that the electron mobility rises as the fraction x of Al in the barrier composition is decreased. The maximum mobility in the In0.5Ga0.5As/In0.8Al0.2As quantum wells exceeds the mobility in a bulk material by a factor of 3. An increase in fraction x of Al in the barrier leads to an increase in the threshold field E th of intervalley transfer (the Gunn effect). The threshold field is E th = 16 kV/cm in the In0.5Ga0.5As/Al0.5In0.5As heterostructures and E th = 10 kV/cm in the In0.2Ga0.8As/Al0.3Ga0.7As heterostructures. In the heterostructures with the lowest electron mobility, E th = 2–3 kV/cm, which is lower than E th = 4 kV/cm in bulk InGaAs.  相似文献   

15.
Minority carrier diffusion length InxGa1?xP LPE layers has been measured using the electron beam method. It has been found that this parameter significantly changes with the composition of the alloy. The measured relationship proves that minority carrier mobility in InxGa1?xP alloys with low indium content strongly depends on the alloy composition. It is suggested that alloy scattering may be responsible for this behaviour. The effect of doping the InxGa1?xP LPE layers with nitrogen has also been investigated. Results indicate that carrier mobility drops when the nitrogen concentration exceeds certain limits and this most probably can be ascribed to carrier scattering on the nitrogen centers.  相似文献   

16.
We investigated the temperature dependence of the piezoelectric constant e14, i.e. the pyroelectric effect, of various strained InGaAs/GaAs single- and multi-quantum wells embedded in p-i-n structures grown on (111)B GaAs substrates and diodes made from these structures. Both photoreflectance spectroscopy and differential photocurrent spectroscopy were applied to obtain e14 over the temperature range 11-300 K. The values of e14 for InxGa1−xAs quantum well layers with x=0.12-0.21 were observed to increase with temperature, which is contrary to the expected dependence, and the strain-induced components of the pyroelectric coefficients were quantitatively determined. The dependence of the pyroelectric coefficient on In fraction is discussed.  相似文献   

17.
Molecular beam epitaxy n-type long-wavelength infrared (LWIR) Hg1?x Cd x Te (MCT) has been investigated using variable-field Hall measurement in the temperature range from 50 K to 293 K. A quantitative mobility spectrum analysis technique has been used to determine the role of multicarrier transport properties with respect to epilayer growth on lattice-matched cadmium zinc telluride, as well as lattice-mismatched silicon (Si) and gallium arsenide (GaAs) buffered substrates. Overall, after postgrowth annealing, all layers were found to possess three distinct electron species, which were postulated to originate from the bulk, transitional (or higher-x-value) regions, and an interfacial/surface layer carrier. Further, the mobility and concentration with respect to temperature were analyzed for all carriers, showing the expected mobility temperature dependence and intrinsic behavior of the bulk electron. Electrons from transitional regions were seen to match expected values based on the carrier concentration of the resolved peak. At high temperature, the lowest-mobility carrier was consistent with the properties of a surface carrier, while below 125 K it was postulated that interfacial-region electrons may influence peak values. After corrections for x-value and doping density at 77 K, bulk electron mobility in excess of 105 cm2 V?1 s?1 was observed in all epilayers, in line with expected values for lightly doped n-type LWIR material. Results indicate that fundamental conduction properties of electrons in MCT layers are unchanged by choice of substrate.  相似文献   

18.
High performance n‐type bulk BiAgSeS is successfully synthesized to construct heterogeneous composites which consist of mesoscale grains of both pristine BiAgSeS and doped BiAgSeS1‐xClx ( x = 0.03 or 0.05). Without perceptibly deteriorating the Seebeck coefficient, a significant enhancement on electrical conductivity is obtained due to an anomalous increase of both carrier mobility and concentration; the enhanced carrier mobility is proven to be a direct result of modulation doping which relates to the band alignments, while the increased carrier concentration is attributed to the possible charge transfer from Cl rich nanoscale precipitates at the heterogeneous BiAgSeS/BiAgSeS1‐xClx grain boundaries. Eventually, an enhanced figure of merit ZT ≈ 1.23 at 773 K in the composite (BiAgSeS)0.5(BiAgSeS0.97Cl0.03)0.5 is achieved, indicating that heterogeneous composites ultilizing the mechanism of modulation doping shall be a promising means of boosting the performance of thermoelectric materials. This strategy should be very likely applicable to other thermoelectrics.  相似文献   

19.
Precise modeling of the saturation velocity is a key element for device simulation, especially for advanced devices such as e.g. High Electron Mobility Transistors (HEMTs) where the saturation velocity vsat is directly related to the available gain of the device. We present a model implementing the temperature dependence of the saturation velocity vsat into the two-dimensional device simulator MINIMOS-NT. The new model covers all relevant materials such as the elementary semiconductors Si and Ge, and the binary III-V group semiconductors GaAs, AlAs, InAs, GaP and InP. Furthermore, a composition dependent modeling for alloyed semiconductors such as e.g. Si1−xGex, AlxGa1−xAs or InxGa1−xAs is included. The implementation reflects a comprehensive literature survey on available experimental data and Monte Carlo (MC) simulation data. The work is completed by new MC simulations, especially for material compositions, where no experimental data are available. The extraction of the saturation velocity reveals a significant difference between the saturation velocity in the bulk and the effective (saturation) velocity extracted from rf-measurements e.g. for High Electron Mobility Transistors. Since this effective value is often used for device characterization, the difference gives insight into modeling the determining quantities of HEMTs.  相似文献   

20.
We report on the OMVPE growth of modulation doped p-type Al0.43Ga0.57As(Be)/GaAs heterojunctions which exhibit a two-dimensional hole gas (2DHG). Hole mobilities de-termined by Hall or cyclotron resonance measurements at 300, 77, and 4 K were 394, 3750, and 21200 cm2/V bs s respectively for a sheet carrier density of about 4.5 × 1011 cms−2. Beryllium doping of AlxGa1−xAs using diethylberyllium is characterized by Hall measurements, secondary ion mass spectrometry, and photoluminescence. The depen-dence of free carrier concentrationvs AlAs% forp + layers of AlxGa1−xAsx,x = 0–0.5, is determined. A free carrier concentration greater than 1 × 1018 cms−3 is achieved forx = 0–0.43 with no carrier freeze-out down to 77 K.  相似文献   

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