Structure of polycrystalline silicon films deposited at low temperature by plasma CVD on substrates exposed to different plasma

Polycrystalline silicon (poly-Si) films were deposited on glass substrates (corning 7059) at 300°C by a plasma enhanced chemical vapor deposition (PECVD) from a SiH₄/SiF₄ mixture. All poly-Si films were prepared under the same deposition conditions on the substrates subjected to nitrogen, hydrogen and/or CF₄ plasma with different gas pressures, just before deposition of the poly-Si films. Effects of such pretreatments for substrates on the structural properties of the resultant poly-Si films have been investigated. The Si film deposited on the substrates without any pretreatments was amorphous. However, formation of a strong 〈110〉 preferentially oriented poly-Si with improved crystallinity was obtained for the films deposited on the glass substrate after plasma pretreatments, which exhibit smoother surfaces. This result was interpreted in terms of a removal of weak Si–Si bonds during nucleation and the subsequent grain growth.     

Application of low-temperature substrate bonding in fabrication of reusable micro-fluidic devices

The plasma polymerised (PP) films were deposited on silicon substrates and used to bond the substrates at a low temperature (130 °C). Different types of monomers were used to deposit PP films on μ-electrode and μ-channel of micro-fluidic devices (MFD) to tailor the surface properties. To confirm the PP film deposition on the substrates the surface chemistry was characterized using X-ray photoelectron spectroscopy (XPS). The bond strength of about 100 nm PP acrylic acid, p-xylene, styrene, 1-vinyl-2-pyrrolininne and allylamine films were measured more than 2 Mpa. The bonding strength was also tested before and after passing the fluid in MDF and no significant change was observed. Generally, no change in the structure of μ-electrode was observed by the bonding, using a separating and cleaning process. Therefore, this bonding process is independent of the type of thin film deposited and the bonding can be easily carried out by me in the laboratory and the surface properties can be tailored for different applications. It also enables one to recycle and reuse the devices in production. This process allows the devices to be recycling and/or reusable for a better and cleaner global environment.     

Characteristics of organic-inorganic hybrid plasma polymer thin films for low-κ ILD applications

This study investigated the effects of plasma power and tetraethylorthosilane (TEOS) to cyclohexene ratios on low-κ organic-inorganic hybrid plasma polymer thin films deposited on silicon (100) substrates. These films were deposited using a plasma enhanced chemical vapor deposition (PECVD) method, in addition to the electrical and mechanical properties of the resulting composites. Cyclohexene and TEOS were used as organic and inorganic precursors, respectively, with hydrogen and argon as precursor bubbler gases. Furthermore, additional argon was used as a carrier gas. The as-grown polymerized thin films were analyzed using ellipsometry, Fourier-transform infrared (FT-IR) spectroscopy, atomic force microscopy (AFM), transmission electron microscopy (TEM), and X-ray diffraction (XRD). The ellipsometry results showed the thickness of the hybrid thin film, and the FT-IR spectra showed that the hybrid polymer thin films were completely fragmented and polymerized between cyclohexene and TEOS. AFM results showed that polymer films with a smooth surface could be grown under various deposition conditions, while TEM and XRD showed that the hybrid thin film was an amorphous plasma polymer thin film without porosity. In addition, current-voltage (C-V) curves were prepared to calculate the dielectric constants. Post-annealing was applied to investigate the thermal stability of hybrid plasma polymer thin films in the hardness, Young's modulus, thermal shrinkage, and the dielectric constant at 400 °C.     

Surface and structural disorder in MBE and sputtering deposited Cu thin films revealed by X-ray measurements

Copper thin films have been deposited on Si substrates by molecular beam epitaxy (MBE) at different deposition rates varying from 1 up to 22 Å/s. X-ray reflectivity and θ-2θ measurements have shown that the surface roughness correlation length, the structural disorder and the grain dimensions are strongly affected by the deposition rate. Comparing these results with those obtained for sputtered deposited thin films with a low deposition rate (2.5 Å/s), a clear similarity between the MBE samples deposited with the highest deposition rate and the sputtering Cu films is observed. This result has been interpreted considering the different energies of the particles that approach the substrate in the two deposition techniques.     

Influence of deposition temperature on the growth of vacuum evaporated V2O5 thin films

V₂O₅ films were deposited on silicon (111) substrates by vacuum evaporation technique at various deposition temperatures of 300, 473, 573, 623 and 673 K. X-ray characterization revealed that the films deposited at T_s≤473 K are amorphous and the film deposited at T_s≥573 K is polycrystalline. It is interesting to note that the film deposited at T_s=573 K is strongly oriented with (001) planes parallel to the substrate and the degree of preferred orientation towards (001) planes found to decrease with further increase in the deposition temperature. The influence of deposition temperature on the growth of the V₂O₅ films has been studied by Raman scattering spectroscopy. The films deposited on the silicon substrates maintained at 573 K are found to have better structural quality.     

Effect of oxygen plasma treatment on bonding states for columnar structured a-CNx thin films prepared by reactive sputtering

Amorphous carbon nitride (a-CN) thin films were deposited on silicon single crystal substrates by rf-reactive sputtering method using a graphite target and nitrogen gas. The substrate temperature was varied from room temperature (RT) to 853 K. After deposition, the effect of oxygen plasma treatment on bonding structures of the film surface has been studied by using an oxygen discharge at 16 Pa and rf power of 85 W. The chemical bonding states and film composition were analyzed by X-ray photoelectron spectroscopy (XPS), while film thickness was obtained from scanning electron microscopy (SEM) and ellipsometer. XPS study revealed that the films have NO₂ and NO₃ bonding structures when the films are deposited at temperatures higher than 673 K. After exposure to oxygen plasma, carbon in the film surface was etched selectively and this phenomenon was observed in all films. In contrast, the surface concentration of nitrogen was ket at constant values before and after oxygen plasma treatment. The NO₃ bonding state had dramatically increased after oxygen plasma treatment for films deposited at higher deposition temperatures. The film surfaces have been observed to change the function from hydrophobic to hydrophilic after oxygen plasma treatment.     

Ion beam deposition of α-Ta films by nitrogen addition and improvement of diffusion barrier property

Ta thin films were deposited on Si (100) substrates by an ion beam deposition method at various substrate bias voltages under Ar + N₂ atmosphere with different pressure ratios of Ar and N₂. The effects of nitrogen pressure in the plasma gas and the substrate bias voltage on the surface morphology, crystalline microstructure, electrical resistivity and diffusion barrier property were investigated. It was found that the fraction of a metastable β-phase in the Ta film deposited at the substrate bias voltage of − 50 V films decreased by adding nitrogen gas, while the α-Ta phase became dominant. As a result, the Ta films deposited at the substrate bias voltage of − 50 V under Ar (9 Pa) + N₂ (3 Pa) atmosphere showed a dominant α-phase with good surface morphology, low resistivity, and superior thermal stability as a diffusion barrier.     

High quality ZnO films deposited by radio-frequency magnetron sputtering using layer by layer growth method

Three-layered ZnO films were deposited on Si substrates by radio-frequency magnetron sputtering using layer by layer growth method. The Raman scattering confocal analysis confirms that ZnO film quality is improving at increasing the number of ZnO layers at film deposition.Applied method of deposition was used to realize homoepitaxial growth of ZnO films on c-Al₂O₃, Si, SiN_x/Si, glass and ITO/glass substrates. In order to improve the film quality we increased the number of deposition stages up to 5. X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmittance measurements were used to testify the quality of grown five-layered ZnO films. XRD results showed that all five-layered ZnO films have (002) texture. The second order diffraction peak (004) on XRD spectra additionally testifies to the high quality of all five-layered ZnO films. SEM results demonstrated that no defects such as cracks and dislocations caused by interruption of deposition ZnO films were observed. Transmittance measurement results showed that ZnO films deposited on transparent substrates have abrupt absorption edge and high optical transmission in the visible region of the spectrum.     

Low refractive index silicon oxide coatings at room temperature using atmospheric-pressure very high-frequency plasma

Low refractive index silicon oxide films were deposited using atmospheric-pressure He/SiH₄/CO₂ plasma excited by a 150-MHz very high-frequency power. Significant increase in deposition rate at room temperature could prevent the formation of dense SiO₂ network, decreasing refractive index of the resulting film effectively. As a result, a silicon oxide film with the lowest refractive index, n = 1.24 at 632.8 nm, was obtained with a very high deposition rate of 235 nm/s. The reflectance and transmittance spectra showed that the low refractive index film functioned as a quarter-wave anti-reflection coating of a glass substrate.     

Gas tunnel type plasma spraying deposition and microstructure characterization of silicon carbide films for thermoelectric applications

Gas tunnel type plasma spraying deposition has been applied successfully to the deposition of the SiC films on stainless-steel substrates. The microstructure and the surface morphology of the SiC films were characterized by means of X-ray diffraction (XRD) and scanning electron microscope (SEM). The control of the processing parameters such as powder feeding rate, composition of plasma working gases, spraying distance, and carrier gas flow rate allowed the deposition of dense, uniform, continuous, and high purity crystalline SiC films. The thickness of the SiC films varied from 3 to 10 μm. EDS analysis confirmed the presence of SiO₂ in the deposited SiC films.     

Surface energy modification of SiOxCyHz film using PECVD by controlling the plasma processes for OMCTS (Si4O4C8H24) precursor

SiO_x films produced from octamethylycyclodisiloxane (Si₄O₄C₈H₂₄, OMCTS) with oxygen carrier gas have a low contact angle. The surface energy of the SiO_x films can be changed by controlling the plasma process. SiO_xC_yH_z films were deposited on polycarbonate substrates by plasma enhanced chemical vapor deposition using OMCTS without oxygen carrier gas. The input power in the radio frequency plasma was changed to optimize the surface energy of the resulting SiO_xC_yH_z film. The plasma diagnostics, surface energy and surface morphology were characterized by optical emission spectrometry, contact angle measurements and atomic force microscopy, respectively. The chemical properties of the coatings were examined by Fourier transform infrared spectroscopy. The surface energy of the SiO_xC_yH_z films produced using a room temperature plasma process could be controlled by employing the appropriate intensity of excited neutrals, ionized atoms, molecules and energy (input rf power and bias), as well as the suitable dissociation of OMCTS.     

Surface treatment of polycarbonate and polyethersulphone for SiNx thin film deposition

Silicon nitride thin films were deposited with good adhesion on plasma treated polyethersulphone (PES) and polycarbonate (PC) substrates by in-situ rf magnetron sputtering. The surfaces of the PES and PC substrates were performed by plasma treatment at various rf powers and processing time in Ar, O₂ atmosphere. From the X-ray Photoelectron Spectroscopy (XPS) examination of the surface of the treated substrates, it was found that the ratio of oxide containing bonds increased with increasing rf power. The surface roughness of the PES and PC substrates increased with increasing rf power. The plasma treated surface of the substrates became hydrophilic as measured by the water contact angle. The water contact angle for the PES and PC substrates decreased with increasing rf power and processing time, significantly. The lowest value of the contact angle of 14.09° was observed at rf power of 200 W. It was observed that the adhesion properties between the SiN_x films and substrates were enhanced by the plasma treatment.     

Effect of impinging ion energy on the substrates during deposition of SiOx films by radiofrequency plasma enhanced chemical vapor deposition process

Radiofrequency (13.56 MHz) plasma enhanced chemical vapor deposition process is used for deposition of SiO_x films on bell metal substrates using Ar/hexamethyldisiloxane/O₂ glow discharge. The DC self-bias voltage developed on the substrates is observed to be varied from − 35 V to − 115 V depending on the RF power applied to the plasma. Plasma potential measurements during film deposition process are carried out by self-compensated emissive probe. The deposited films are characterized by Raman spectroscopy, X-ray photoelectron spectroscopy (XPS), nanoindentation, nano-scratch test and thermogravimetric analysis. The characterization results show strong dependency of the SiO_x films properties on the energy of the ions impinging on the substrates during deposition. Analysis of Raman spectra indicates an increase in vitreous silica content and reduction in defective Si-O-Si chemical structure in the deposited SiO_x films with increasing ion energy impinging on the substrates. The increase in inorganic (Si and O) content in the SiO_x films is further confirmed from XPS analysis. The growth of SiO_x films with more inorganic content and defect free chemical structure apparently contribute to the increase in their hardness and scratch resistance behavior. The films show higher thermal stability as the energy of the ions arriving at substrates increases with DC self-bias voltage. The possibility of using SiO_x films for surface protection of bell metal is also explored.     

Improved electrochemical performance of nitrocarburised stainless steel by hydrogenated amorphous carbon thin films for bone tissue engineering

In this study, hydrogenated amorphous carbon thin films, structurally similar to diamond‐like carbon (DLC), were deposited on the surface of untreated and plasma nitrocarburised (Nitrocarburizing‐treated) stainless steel medical implants using a plasma‐enhanced chemical vapour deposition method. The deposited DLC thin films on the nitrocarburising‐treated implants (CN+DLC) exhibited an appropriate adhesion to the substrates. The results clearly indicated that the applied DLC thin films showed excellent pitting and corrosion resistance with no considerable damage on the surface in comparison with the other samples. The CN+DLC thin films could be considered as an efficient approach for improving the biocompatibility and chemical inertness of metallic implants.Inspec keywords: tissue engineering, bone, biomedical materials, electrochemistry, amorphous state, carbon, hydrogen, thin films, plasma CVD, adhesion, corrosion resistance, surface hardeningOther keywords: electrochemical performance, plasma nitrocarburised stainless steel medical implants, hydrogenated amorphous carbon thin films, bone tissue engineering, plasma‐enhanced chemical vapour deposition method, adhesion, corrosion resistance, biocompatibility, chemical inertness, metallic implants, C:H     

Spray Pyrolysis of MgO Templates on 321-Austenitic Stainless Steel Substrates for YBa2Cu3O7 Deposition by PLD

Spray pyrolysis was used to deposit MgO films on polycrystalline 321-austentic stainless steel substrates using magnesium nitrates and magnesium acetates as precursors. The MgO films deposited from the nitrate precursors were amorphous; however, MgO (200) oriented films were obtained when the acetates precursors were used. The texture of the films was improved with increasing the concentration and the deposition temperature. To evaluate the performance of the MgO buffers, PLD was used to deposit YBCO on MgO-buffered 321 substrates. Only the smoothest MgO films were found as good buffers for the deposition of c-axis oriented YBCO films. The superconducting transition temperature was broad and the T _C onset was 83.6 K. Austenitic 321 steel is an alternative for C276 as a substrate for thin film deposition.     

Preparation and investigation of VOx thin films of n- and p-types

In this work we present first results on the synthesis of vanadium oxide semi-transparent conducting thin films of p- and n-types. The films were deposited by thermal evaporation method in vacuum, on: silicon, glass, sapphire, and gold substrates. Temperature of substrate during deposition was set around 250 °C. As deposited films were of a p-type of conductivity. Thermal annealing at 420 °C of as-deposited films in air at atmospheric pressure resulted in a change in the conductivity type.Optical, electrical and thermal properties of the deposited films were studied. The topography of the films was studied using AFM microscope. P-N structures were created using VO_x films on silicon and glass substrates. Electrical measurements had shown a non-linear behaviour of the samples.     

Atomic layer deposition of BN thin films

Boron nitride has for the first time been deposited from gaseous BBr₃ and NH₃ by means of atomic layer deposition. The deposition temperatures were 400 and 750 °C, and the total pressure was 10 torr. The BN films, deposited on silica substrates, showed a turbostratic structure with a c-axis of 0.70 nm at a deposition temperature of 750 °C as determined by X-ray diffraction. The films deposited at 400 °C were significantly less ordered. The film density was obtained by means of X-ray reflectivity, and it was found to be 1.65–1.70 and 1.90–1.95 g cm⁻³ for the films deposited at 400 and 750 °C, respectively. Furthermore, the films were, regardless of deposition temperature, fully transparent and very smooth. The surface roughness was 0.3–0.5 nm as measured by optical interferometry.     

Heating of polymer substrate by discharge plasma in radiofrequency magnetron sputtering deposition

The substrate used for the thin film deposition in a radiofrequency magnetron sputtering deposition system is heated by the deposition plasma. This may change drastically the surface properties of the polymer substrates. Deposition of titanium dioxide thin films on polymethyl methacrylate and polycarbonate substrates resulted in buckling of the substrate surfaces. This effect was evaluated by analysis of atomic force microscopy topography images of the deposited films. The amount of energy received by the substrate surface during the film deposition was determined by a thermal probe. Then, the results of the thermal probe measurements were used to compute the surface temperature of the polymer substrate. The computation revealed that the substrate surface temperature depends on the substrate thickness, discharge power and substrate holder temperature. For the case of the TiO₂ film depositions in the radiofrequency magnetron plasma, the computation indicated substrate surface temperature values under the polymer melting temperature. Therefore, the buckling of polymer substrate surface in the deposition plasma may not be regarded as a temperature driven surface instability, but more as an effect of argon ion bombardment.     

Material properties and growth control of undoped and Sn-doped In2O3 thin films prepared by using ion beam technologies

Undoped (IO) and Sn-doped In₂O₃ (ITO) films have been deposited on glass and polymer substrates by an advanced ion beam technologies including ion-assisted deposition (IAD), hybrid ion beam, ion beam sputter deposition (IBSD), and ion-assisted reaction (IAR). Physical and chemical properties of the oxide films and adhesion between films and substrates were improved significantly by these technologies. By using the IAD method, non-stoichiometry and microstructure of the films were controlled by changing assisted oxygen ion energy and arrival ratio of assisted oxygen ion to evaporated atoms. Relationships between structural and electrical properties in ITO films on glass substrates were intensively investigated by using the IBSD method with changing ion energy, reactive gas environment, and substrate temperature. Smooth-surface ITO films (R_rms ≤ 1 nm and R_p-v ≤ 10 nm) for organic light-emitting diodes were developed with a combination of deposition conditions with controlling microstructure of a seed layer on glass. IAR surface treatment enormously enhanced the adhesion of oxide films to polymer substrate. The different dependence of IO and ITO films' properties on the experimental parameters, such as ion energy and oxygen gas environment, will be intensively discussed.     

Effects of applied power on hydrogenated amorphous carbon (a-C:H) film deposition by low frequency (60 Hz) plasma-enhanced chemical vapor deposition (PECVD)

Hydrogenated amorphous carbon (a-C:H) films were deposited onto glass substrates using low frequency (60 Hz) plasma-enhanced chemical vapor deposition and the effects of the applied power on a-C:H films deposition were investigated. During deposition, the electron temperature and the density of CH₄-H₂ plasma were 2.4-3.1 eV and about 10⁸ cm⁻³, respectively. The main optical emission peak of the carbon species observed in the CH₄-H₂ plasma is shown to be excited carbon CH* at 431 nm. The sp³/sp² ratio, band gap, hydrogen content, and refractive index of a-C:H films gradually increased up to a power of 25 W and then saturated at higher power. This tendency is similar to the variation of plasma parameters with varying applied power, thereby indicating that a strong relationship exists between the properties of the films and the plasma discharge.