Abnormal blue shift of InGaN micro-size light emitting diodes

Blue InGaN micro-size light emitting diodes (LEDs) with diameters from 3 to 70 μm have been fabricated. An ion implantation technique and a 12 μm electro-ridge were used to simplify the fabrication processes. The 3–70 μm LEDs exhibiting a large emission of photon blue shift (40–240 meV) were observed in electro-luminescence (EL) spectra. The dependence of the blue shift on size is studied. The characteristics of the micro-size LEDs are also investigated numerically with the use of an advanced physical model of semiconductor devices (APSYS). The experimental measurements and simulation results are in close agreement for maximum blue shift. Base on the simulation, the difference between blue shift caused by band filling effect and red shift caused by lateral carrier confinement are approximately the same. Hence, the maximum blue shift increases when the size of micro-size LED increases because of decreased red shift resulted from thermal effect.     

Improved light extraction efficiency of GaN-based light emitting diodes using one and two interfaces of ITO/ZnO layer texturing

Light extraction efficiency of GaN-based light emitting diodes (LEDs) has improved significantly by using ITO/ZnO layer texturing. We have deliberately designed and successfully fabricated GaN-based LEDs having one and two interfaces of ITO/ZnO layer texturing in the device structure. It was found that the light extraction efficiencies of one and two interfaces of ITO/ZnO-layer texturing LEDs were 22.29% and 35.54% at 20 mA of current injection, respectively. Creating the chances of multiple light scattering at more than one interface is playing a major role to enhance light output power of the device. The source of the enhanced light output power is also discussed.     

GaN-based LEDs with Ar plasma treatment

The authors propose a simple Ar plasma treatment method to selectively damage the area underneath p-pad electrode of GaN-based light-emitting diodes (LEDs). It was found that we could form a highly resistive area so that the injected carriers will be forced to spread out horizontally for the LED. Under 20 mA current injection, it was found that the output powers were 16.0, 17.9 and 17.3 mW while the forward voltages were 3.17, 3.19 and 3.20 V for conventional LED and LED with SiO₂ layer, respectively. Moreover, the LED with Ar plasma treatment is superior to the other LEDs while operating at a higher injection current.     

Formation of low-resistance and transparent indium tin oxide ohmic contact for high-brightness GaN-based light-emitting diodes using a Sn–Ag interlayer

We report on the formation of low-resistance and highly transparent indium tin oxide (ITO) ohmic contacts to p-GaN using a Sn–Ag alloy interlayer. Although the as-deposited Sn–Ag(6 nm)/ITO(200 nm) contacts show non-ohmic behaviors, the scheme becomes ohmic with specific contact resistance of 4.72×10⁻⁴ Ω cm² and produce transmittance of ∼91% at wavelength of 460 nm when annealed at 530 °C. Blue light-emitting diodes (LEDs) fabricated with the Sn–Ag/ITO contacts give forward-bias voltage of 3.31 V at injection current of 20 mA. LEDs with the Sn–Ag/ITO contacts show the improvement of the output power by 62% (at 20 mA) compared with LEDs with Ni/Au contacts.     

Design,development and reliability testing of a low power bridge-type micromachined hotplate

In this paper, the development and reliability of a platinum-based microheater with low power consumption are demonstrated. The microheater is fabricated on a thin SiO₂ bridge-type suspended membrane supported by four arms. The structure consists of a 0.6 μm-thick SiO₂ membrane of size 50 μm × 50 μm over which a platinum resistor is laid out. The simulation of the structure was carried out using MEMS-CAD Tool COVENTORWARE. The platinum resistor of 31.0 Ω is fabricated on SiO₂ membrane using lift-off technique. The bulk micromachining technique is used to create the suspended SiO₂ membrane. The temperature coefficient of resistance (TCR) of platinum used for temperature estimation of the hotplate is measured and found to be 2.2 × 10⁻³/°C. The test results indicate that the microhotplate consumes only 11.8 mW when heated up to 400 °C. For reliability testing, the hotplate is continuously operated at higher temperatures. It was found that at 404 °C, 508 °C and 595 °C, the microhotplate continuously operated up to 16.5 h, 4.3 h and 4 min respectively without degrading its performance. It can sustain at least 53 cycles pulse-mode of operation at 540 °C with ultra-low resistance and temperature drifts. The structure has maximum current capability of 19.06 mA and it can also sustain the ultrasonic vibration at least for 30 min without any damage.     

Electrical and optical characterization of GaN-based light-emitting diodes fabricated with top-emission and flip-chip structures

We investigated the electrical and optical characteristics of GaN-based light-emitting diodes (LEDs) fabricated with top-emission and flip-chip structures. Compared with top-emission LEDs, flip-chip LEDs exhibited a 0.25 V smaller forward voltage and an 8.7 Ω lower diode resistance. The light output power of the flip-chip LED was also larger than that of the top-emission LED by factors of 1.72 and 2.0 when measured before and after packaging, respectively. The improved electrical and optical output performances of flip-chip LEDs were quantitatively analyzed in terms of device resistance and ray optics, respectively.     

Process optimization of RTA on the characteristics of ITO-coated GaN-based LEDs

We present a detailed study on the optimization of rapid thermal annealing (RTA) on GaN-based light emitting diodes (LEDs). 14 mil × 28 mil GaN-based LED chips are fabricated with indium tin oxide (ITO) layer treated by RTA under various temperatures and times. Through the optical and electrical property analyses of ITO film, it is found that the transmittance and sheet resistance are improved after RTA process due to the better ITO crystallization and bigger grain size, compared with ITO treated by conventional furnace annealing. By employing electroluminescence measurement for the LED chips with RTA treatment, the forward voltage is found to be low as a result of low sheet resistance and contact resistance, and light output power (LOP) is high due to high ITO transmittance and good current density uniformity. Under RTA temperature of 550 °C and time of 3 min, the optimized LOP and forward voltage at 60 mA injection current are 71.2 mW and 2.97 V, respectively. Moreover, the reliability of the chips with RTA is better than those with furnace annealing.     

Iridium-based semi-transparent current spreading layer on short-period-superlattice (SPS) tunneling contact of InGaN/GaN LEDs

Iridium-containing and Ni(4 nm)/Au(6 nm) films were evaporated separately on the n⁺-InGaN–GaN short-period-superlattice (SPS) structure of light-emitting diodes (LEDs). The collective deposition of iridium and other metals as an ohmic contact induces the formation of highly transparent IrO₂, which helps to enhance the light output and decrease the series resistance of LEDs. By comparing different metal films used as current spreading contact layer, Ir/Ni film annealed at 500 °C for 20 min in O₂ ambient renders devices with lowest turn-on voltage at 20 mA and highest luminous intensity. Moreover, we also analyzed films using atomic force microscopy (AFM) with an emphasis on studying how the surface quality of Ir/Ni and Ni/Au films influences the current spreading and luminosity of LEDs.     

A dual-loop shunt regulator using current-sensing feedback techniques

The dual-loop shunt regulator using current-sensing feedback techniques is proposed in this paper. This architecture adopts a voltage and current loops to increase the transient response of the proposed shunt regulator. The maximum output current of the proposed shunt regulator is 180 mA at a 1.8 V output. Moreover the architecture of the proposed shunt regulator can suppress the stray effect which is from power supply. The prototype of the proposed shunt regulator is fabricated by the Taiwan Semiconductor Manufacturing Corporation (TSMC) 0.35-μm CMOS 2P4M process. The active area is only 579×355 μm².     

Optimizing n-type contact design and chip size for high-performance indium gallium nitride/gallium nitride-based thin-film vertical light-emitting diode

The effects of the n-contact design and chip size on the electrical, optical and thermal characteristics of thin-film vertical light-emitting diodes (VLEDs) were investigated to optimize GaN-based LED performance for solid-state lighting applications. For the small (chip size: 1000×1000 µm²) and large (1450×1450 µm²) VLEDs, the forward bias voltages are decreased from 3.22 to 3.12 V at 350 mA and from 3.44 to 3.16 V at 700  mA, respectively, as the number of n-contact via holes is increased. The small LEDs give maximum output powers of 651.0–675.4 mW at a drive current of 350 mA, while the large VLEDs show the light output powers in the range 1356.7–1380.2 mW, 700 mA, With increasing drive current, the small chips go through more severe degradation in the wall-plug efficiency than the large chips. The small chips give the junction temperatures in the range 51.1–57.2 °C at 350  mA, while the large chips show the junction temperatures of 83.1–93.0 °C at 700  mA, The small LED chips exhibit lower junction temperatures when equipped with more n-contact via holes.     

Direct imprint of Al foil for metallization of high-aspect ratio Al lines in nano/micro patterned SiO2/Si

Patterning techniques of Al micro/nano-structures become more and more critical as optical components and microelectronic devices continue to be scaled down. In this work, we fabricated gap-filled Al lines in SiO₂/Si masters by using the direct thermal imprint of molten Al. As a result, gap-filled Al lines with width ranging from 0.25 to 20 μm and depth ranging from 6 to 127 μm could be achieved without any further processing step such as CVD and PVD. The process studied here has shown the possibility to extend trench filling capability to 0.25 μm structures with 24:1 aspect ratio, which are difficult to be obtained by other conventional Al metallization methods.     

Common-base multi-finger submicron InGaAs/InP double heterojunction bipolar transistor with fmax of 305 GHz

A layout of a common-base four-finger InGaAs/InP double heterostructure bipolar transistor (DHBT) has been designed and the corresponding DHBT has been fabricated successfully by using planarization technology. The area of each emitter finger was 1 × 15 μm². The breakdown voltage was more than 7 V, the current could be more than 100 mA. The maximum output power can be more than 80 mW derived from the DC characteristics. The maximum oscillation frequency was as high as 305 GHz at I_C = 50 mA and V_CB = 1.5 V. The DHBT is thus promising for the medium power amplifier and voltage controlled oscillator (VCO) applications at W band and higher frequencies.     

Sapphire substrate-transferred nitride-based light-emitting diode fabricated by sapphire wet etching technique

In order to investigate the influence of a sapphire substrate on the GaN-based light-emitting diode (LED) performance, sapphire-etched vertical-electrode nitride-based semiconductor (SEVENS) LEDs are fabricated by a sapphire wet etching technique. The performance of SEVENS-LEDs is substantially dependent on the presence of sapphire substrate. The light-output power of a SEVENS-LED with a microroughened surface structure and without a sapphire substrate (type-A) is not saturated up to a junction current as high as 300 mA, constituting a notable improvement relative to that (250 mA junction current) of SEVENS-LEDs with a 5 μm-thick sapphire substrate (type-B). The 200 mA light-output power of type-A SEVENS-LED is 1.8 times stronger than that of type-B SEVENS-LED. With increasing junction current, the variation of the peak wavelength is less for the type-A SEVENS-LED than for the type-B SEVENS-LED. These results imply that even a thin sapphire substrate on the SEVENS-LED affects the heat dissipation characteristic at high injection levels.     

Improving the performance of power GaN-based thin-film flip-chip LEDs through a twofold roughened surface

To further enhance the light extraction efficiency of GaN-based thin-film flip-chip light-emitting diodes (TFFC-LEDs), a surface roughening technique using KrF excimer laser ablation and chemical wet etching is demonstrated. Both optical ray-tracing simulations and experimental results of the light emission characteristics are presented and discussed. With the proposed twofold surface texturing scheme with circular protrusions superimposed by hexagonal cones, the angular randomization of photons at the emission surface was maximized, enhancements in light output power of 13.08% (12.81%) and wall-plug efficiency of 2.87% (2.25%) at 350 mA (700 mA) compared to those of a TFFC-LED without surface texturing were obtained.     

Voltage-tunable SiO2-isolated a-SiC:H and/or a-SiN:H p–i–n thin-film LEDs fabricated on c-Si

A voltage-tunable amorphous p–i–n thin-film light emitting diodes (TFLEDs) with SiO₂-isolation on n⁺-type crystalline silicon (c-Si) has been proposed and fabricated successfully. The structure of the device with i-a-SiC:H and i-a-SiN:H luminescent layers is indium–tin–oxide (ITO)/p⁺-a-Si:H/p⁺-a-SiC:H/i-a-SiC:H/i-a-SiN:H/n⁺-a-SiCGe: H/n⁺-a-SiC:H/n⁺-c-Si/Al. This device revealed a brightness of 695 cd/m² at an injection current density of 300 mA/cm². Its EL (electroluminescence) peak wavelength exhibited blue-shift from 655 to 565 nm with applied forward-bias (V) increasing from 15 to 19 V, but the EL peak wavelength was red-shifted from 565 to 670 nm with further increase of V from 19 to 23 V. By comparing with the EL spectra from p–i–n TFLEDs with i-a-SiC:H or i-a-SiN:H luminescent layer only, the EL spectrum of this TFLED could consist of three bands of radiations from the tail-to-tail-state recombinations in (1) i-a-SiC:H layer, (2) i-a-SiN:H layer, and (3) i-a-SiC:H/p⁺-a-SiC:H junction.     

Flatly broadened mid-infrared supercontinuum generation in a cascade of thulium-doped silica fiber amplifiers

Single-mode, flatly broadened supercontinuum (SC) generated in a thulium two-stage fiber amplifier spanning nearly the mid-infrared band is reported. The output average power and 10 dB bandwidth of the obtained SC are over 2.3 W and 570 nm (from 1.95 μm to 2.52 μm), respectively. For wavelengths beyond 2.4 μm the output power was 495 mW constituting almost 21% of the total output power. Applying Tm-doped single-mode silica fibers as nonlinear and amplification media it was possible to extend the long wavelength cut-off to 2.7 μm.     

A novel low voltage very low power CMOS class AB current output stage with ultra high output current drive capability

In this paper a novel low voltage (LV) very low power (VLP) class AB current output stage (COS) with extremely high linearity and high output impedance is presented. A novel current splitting method is used to minimize the transistors gate–source voltages providing LV operation and ultra high current drive capability. High linearity and very high output impedance are achieved employing a novel resistor based current mirror avoiding conventional cascode structures to be used. The operation of the proposed COS has been verified through HSPICE simulations based on TSMC 0.18 μm CMOS technology parameters. Under supply voltage of ±0.7 V and bias current of 5 μA, it can deliver output currents as high as 14 mA with THD better than ?53 dB and extremely high output impedance of 320 MΩ while consuming only 29 μW. This makes the proposed COS to have ultra large current drive ratio (I_outmax/I_bias or the ratio of peak output current to the bias current of output branch transistors) of 2800. By increasing supply voltage to ±0.9 V, it can deliver extremely large output current of ±24 mA corresponding to 3200 current drive ratio while consuming only 42.9 μW and exhibiting high output impedance of 350 MΩ. Interestingly, the proposed COS is the first yet reported one with such extremely high output current and a THD even less than ?45 dB. Such ultra high current drive capability, high linearity and high output impedance make the proposed COS an outstanding choice for LV, VLP and high drive current mode circuits. The superiority of the proposed COS gets more significance by showing in this work that conventional COS can deliver only ±3.29 mA in equal condition. The proposed COS also exhibits high positive and negative power supply rejection ratio (PSRR+/PSRR?) of 125 dB and 130 dB, respectively. That makes it very suitable for LV, VLP mixed mode applications. The Monte Carlo simulation results are provided, which prove the outstanding robust performance of the proposed block versus process tolerances. Favorably the proposed COS resolves the major limitation of current output stages that so far has prevented designing high drive current mode circuits under low supply voltages. In brief, the deliberate combination of so many effective novel methods presents a wonderful phenomenal COS block to the world of science and engineering.     

An alternative method to fabricate the planar-type resonant-cavity light-emitting diodes by using silicon oxide for short-reach communications

In this article, the silicon oxide (SiO_x) planarization technique is presented to fabricate the 650-nm resonant-cavity light-emitting diodes (RCLEDs). The performances of RCLEDs are characterized by forward voltage, light output power, external quantum efficiency, emission spectrum, and dynamic response. As a result, the device with the SiO_x-planarized layer exhibits a low operating voltage of 2.3 V at 20 mA, a maximum light output power of 304 μW at 15 mA, and the best external quantum efficiency of 3% at 1.2 mA. In addition, the SiO_x-planarized device exhibits temperature insensitivity as compared to the device without it. The RCLED with a 30-μm diameter shows the maximum 3 dB frequency bandwidth of 275 MHz at a driving current of 40 mA. Finally, the RCLED with a SiO_x-planarized layer shows a clear eye-opening feature as operating at 100 Mbit/s at 20 mA. These results indicate that such LEDs are excellent candidates for use in high-speed short-reach plastic optical fiber communications.     

A high-performance 1.2 V–99 μW rail-to-rail CMOS class AB amplifier

This paper presents a compact, reliable 1.2 V low-power rail-to-rail class AB operational amplifier (OpAmp) suitable for integrated battery powered systems which require rail-to-rail input/output swing and high slew-rate while maintaining low power consumption. The OpAmp, fabricated in a standard 0.18 μm CMOS technology, exhibits 86 dB open loop gain and 97 dB CMRR. Experimental measurements prove its correct functionality operating with 1.2 V single supply, performing very competitive characteristics compared with other similar amplifiers reported in the literature. It has rail-to-rail input/output operation, 5 MHz unity gain frequency and a 3.15 V/μs slew-rate for a capacitive load of 100 pF, with a power consumption of 99 μW.     

Microwave performance of field-plate 0.13-μm MOS transistors with varying field-plate extension

Si-based field-plate 0.13 μm gate length metal-oxide-semiconductor field effect transistor (Si MOSFET) with field-plate (FP) lengths of 0.1 μm, 0.2 μm, and 0.3 μm have been fabricated and investigated. The field-plate metals were connected to gate electrode in this study to improve device gate resistance (R_g) resulting in the better microwave performance. By increasing the length of field-plate metal extension (L_FPE), the off-state drain-to-source surface leakage current can be suppressed. Besides, low surface traps in FP NMOS also leads to a higher drain-to-source current (I_ds) especially at high current regime compared to standard device. The power added efficiency (PAE) was 56.3% for L_FPE of 0.3 μm device, and these values where 54.7% and 53.8% for L_FPE of 0.2 μm and 0.1 μm devices, respectively. Wider field-plate metal extension exhibits highly potential for low noise amplifier and high efficiency power amplifier applications.