Thermoelectric air-cooling module for electronic devices

This article investigates the thermoelectric air-cooling module for electronic devices. The effects of heat load of heater and input current to thermoelectric cooler are experimentally determined. A theoretical model of thermal analogy network is developed to predict the thermal performance of the thermoelectric air-cooling module. The result shows that the prediction by the model agrees with the experimental data. At a specific heat load, the thermoelectric air-cooling module reaches the best cooling performance at an optimum input current. In this study, the optimum input currents are from 6 A to 7 A at the heat loads from 20 W to 100 W. The result also demonstrates that the thermoelectric air-cooling module performs better performance at a lower heat load. The lowest total temperature difference-heat load ratio is experimentally estimated as ?0.54 W K^?1 at the low heat load of 20 W, while it is 0.664 W K^?1 at the high heat load of 100 W. In some conditions, the thermoelectric air-cooling module performs worse than the air-cooling heat sink only. This article shows the effective operating range in which the cooling performance of the thermoelectric air-cooling module excels that of the air-cooling heat sink only.     

Empirical study on thermal performance through separating impacts from a hybrid PV/TE system design integrating heat sink

A hybrid system design integrating a thermoelectric (TE) module has recently represented the advanced photovoltaic (PV) prototype with promoted efficiency for utilizing solar energy from the surroundings. Our present work during development of such a hybrid PV/TE system evaluates the thermal behaviors and the cooling performance associated with when integrating TE and heat sink modules. It has been noticed that a more effective structure through combining a heat sink with a TE module profits heat dissipation by cooling down the whole cell by ~ 8 °C, wherein the TE module itself demonstrates the cooling performance by ~ 27% enhancement in addition to its conventional role for electricity generation. Therefore, the PV/TE with a proper design can be used as a passive method for improving the cell efficiency as well as alleviating hot spot, which is typically occurring when the cell is unevenly heated during its operation. These results could be useful for further advancement on stability of power generation of a hybrid PV/TE system and may also be important for developing high-powered light emit diode.     

Thermoelectric power generation using Li-doped NiO and (Ba,Sr)PbO3 module

A prototype of oxide thermoelectric (TE) module by p–n coupled oxide elements has been fabricated for the first time, for the application of power generation at high-temperatures in air. For the single couple, the π-shaped joints of sintered bodies of Li-doped NiO (p-type) and (Ba, Sr)PbO₃ (n-type) were used. TE performance of both single couple and the module were investigated in the temperature range from 440 to 1060 K. The maximum output power from a single couple was 7.91 mW with the operating temperature difference of 552 K. The assembled module with four elements showing almost four times larger power, 34.4 mW, than that of a single element. The reliability of this oxide couple at high-temperature in air, and an application of module for the power generation using the waste heat from a stove are also reported.     

Development of a thermoelectric refrigerator with two-phase thermosyphons and capillary lift

A thermoelectric domestic refrigerator has been developed, with a single compartment of 0.225 m³, for food preservation at 5 °C. The cooling system is made up of two equal thermoelectric devices, each composed of a Peltier module (50 W) with its hot side in contact with a two-phase and natural convection thermosyphon (TSV) and a two-phase and capillary lift thermosyphon (TPM), in contact with the cold side.The entire refrigerator has been simulated and designed using a computational model, based on the finite difference method. Subsequently an experimental optimization phase of the thermosyphons was carried out, until thermal resistance values of R_TSV = 0.256 K/W and R_TPM = 0.323 K/W were obtained. These values were lower than those obtained with finned heat sinks.Finally, a functional prototype of a thermoelectric refrigerator was built, and the results which were obtained demonstrate that it is able to maintain a thermal drop (Ambient Temperature–Inside Temperature) of 19 °C. The electric power consumption at nominal conditions was 45 W, reaching a COP value of 0.45. The study demonstrated that by incorporating these two-phase devices into thermoelectric refrigeration increases the COP by 66%, compared with those which use finned heat sinks.     

Assessment of thermoelectric module with nanofluid heat exchanger

For applications such as cooling of electronic devices, it is a common practice to sandwich the thermoelectric module between an integrated chip and a heat exchanger, with the cold-side of the module attached to the chip. This configuration results thermal contact resistances in series between the chip, module, and heat exchanger. In this paper, an appraisal of thermal augmentation of thermoelectric module using nanofluid-based heat exchanger is presented. The system under consideration uses commercially available thermoelectric module, 27 nm Al₂O₃–H₂O nanofluid, and a heat source to replicate the chip. The volume fraction of nanofluid is varied between 0% and 2%. At optimum input current conditions, experimental simulations were performed to measure the transient and steady-state thermal response of the module to imposed isoflux conditions. Data collected from the nanofluid-based exchanger is compared with that of deionized water.Results show that there exist a lag-time in thermal response between the module and the heat exchanger. This is attributed to thermal contact resistance between the two components. A comparison of nanofluid and deionized water data reveals that the temperature difference between the hot- and cold-side, ΔT = T_h ? T_c ≈ 0, is almost zero for nanofluid whereas ΔT > 0 for water. When ΔT ≈ 0, the contribution of Fourier effect to the overall heating is approximately zero hence enhancing the module cooling capacity. Experimental evidence further shows that temperature gradient across the thermal paste that bonds the chip and heat exchanger is much lower for the nanofluid than for deionized water. Low temperature gradient results in low resistance to the flow of heat across the thermal paste. The average thermal contact resistance, R = ΔT/Q, is 0.18 and 0.12 °C/W, respectively for the deionized water and nanofluid. For the range of optimum current, 1.2 ? current ? 4.1 A, considered in this study, the COP ranges between 1.96 and 0.68.     

Enhancement of air cooling in staggered array of electronic modules by integrating delta winglet vortex generators

This study is to experimentally investigate the heat transfer enhancement by delta winglet vortex generators in air cooling of a staggered array of rectangular electronic modules. The winglet vortex generators are placed in front of 3 × 5 modules with 20° attack angle. Each module has dimensions of 1.8 × 5.4 × 0.6 mm and each one generates heat at 2.5 W. The adiabatic heat transfer coefficients, the thermal wake functions including their correlations for the modules with and without the vortex generators are considered at different values of Reynolds number and the module density. It could be seen that the vortex generators could enhance the adiabatic heat transfer coefficients, reduce the thermal wake functions and the module temperatures significantly. The module temperatures predicted by the superposition of the convective effect due to the module heat generations and the module thermal wakes are fitted very well with the measured data.     

Design and experimental investigation of portable solar thermoelectric refrigerator

The main objective of this study is to design and build an affordable solar thermoelectric refrigerator for the Bedouin people (e.g. deserts) living in remote parts of Oman where electricity is still not available. The refrigerator could be used to store perishable items and facilitate the transportation of medications as well as biological material that must be stored at low temperatures to maintain effectiveness. The design of the solar-powered refrigerator is based on the principles of a thermoelectric module (i.e., Peltier effect) to create a hot side and a cold side. The cold side of the thermoelectric module is utilized for refrigeration purposes; provide cooling to the refrigerator space. On the other hand, the heat from the hot side of the module is rejected to ambient surroundings by using heat sinks and fans. The designed solar thermoelectric refrigerator was experimentally tested for the cooling purpose. The results indicated that the temperature of the refrigeration was reduced from 27 °C to 5 °C in approximately 44 min. The coefficient of performance of the refrigerator (COP_R) was calculated and found to be about 0.16.     

A solar-powered traveling-wave thermoacoustic electricity generator

Traveling-wave thermoacoustic electricity generator is a new external-combustion type device capable of converting heat such as solar energy into electric power. In this paper, a 1 kW solar-powered traveling-wave thermoacoustic electricity generation system is designed and fabricated. The system consists of a traveling-wave thermoacoustic electricity generator, a solar dish collector and a heat receiver. In the preliminary tests, using electric cartridge heaters to simulate the solar energy, a maximum electric power of 481 W and a maximum thermal-to-electric efficiency of 15.0% were achieved with 3.5 MPa pressurized helium and 74 Hz working frequency. Then, after integrating the traveling-wave thermoacoustic electricity generator with the solar dish collector and the heat receiver, the solar-powered experiments were performed. In the experiments, a maximum electric power of about 200 W was obtained. However, due to the solar dish collector problems, the heating temperature of the receiver was much lower than expected. Optimizations of the collector and the heat receiver are under way.     

Scroll heat sink: A novel heat sink with the moving fins inserted between the cooling fins

In this paper, a new type of a fan-integrated heat sink named a scroll heat sink is proposed and demonstrated. The most striking feature of the scroll heat sink is that heat dissipation and fluid pumping occurs simultaneously in the whole cooling space without requiring any additional space for a fan module. In the scroll heat sink, the moving fins, which rotate with two eccentric shafts, are inserted between the fixed (cooling) fins. By a relative motion between the moving fins and the cooling fins, a coolant is drawn into the space between them, takes heat away from the cooling fins, and the heated coolant is discharged out of the heat sink. In the present study, an experimental investigation is performed in order to demonstrate the concept of the scroll heat sink. Average coolant velocities and thermal resistances of the scroll heat sink are measured for various rotating speeds of the moving fins from 200 rpm to 500 rpm. Experimental results show that measured flow rates of the coolant are almost linearly proportional to the rotating speed of the moving fins. A theoretical model is also developed to estimate the required pumping power and the thermal resistance, and validated using experimental results. The theoretical model shows that optimized scroll heat sinks have lower thermal resistances than optimized plate-fin heat sinks under the fixed pumping power condition.     

Carbon nanotube thermal interfaces on gadolinium foil

We report the thermal behavior of gadolinium foils to be used in magneto thermoelectric generator cells. Magneto thermoelectric generator cell technology exploits the ferromagnetic phase transition of gadolinium to drive the movement of a diaphragm ‘shuttle’ whose mechanical energy is converted to electrical form and which enhances heat transfer through both conduction and convection. Efficient heat transfer at mechanical interfaces is critical to increase shuttle speed and the commensurate rate of heat transfer. The synthesis and characterization of carbon nanotube thermal interfaces for the gadolinium foils are described. The total thermal interface resistance of the carbon nanotube coated gadolinium was measured using a one-dimensional reference calorimeter technique. Improvement of carbon nanotube growth based on parametric process variations is described, and the effect of hydrogen embrittlement on the magnetic properties of the gadolinium foils during carbon nanotube growth is quantified. The samples generated in this study were consistently measured with total thermal interface resistances in the range of 65–105 mm² K/W, a reduction of 55–70% compared to bare gadolinium (R_int ≈ 230 mm² K/W). The addition of carbon nanotube arrays did not alter the magnetic properties of the gadolinium foils and only a slight decrease in the magnetic moment of the gadolinium samples (8–13%) was measured after growth.     

Investigation of a multiple piezoelectric–magnetic fan system embedded in a heat sink

Previous studies have investigated the thermal performance of embedding a single piezoelectric fan in a heat sink. Based on this work, a multiple piezoelectric–magnetic fan system (“MPMF”) has been successfully developed that exhibits lower fan power consumption, optimum fan pitch and an optimum fan gap between the fan tips and the heat sink. In this study, the cooling performance and heat convection improvement for the MPMF system embedded in a heat sink are evaluated at different fan tip locations. The results indicate that the fan tip location of the MPMF system at x/S_l = 0.5 and y/S_h = 0 is an optimum configuration, improving the thermal resistance by 53.2% over natural convection condition for the fan input power of 0.1 W. The MPMF system breaks the thermal boundary layer and causes fluctuations inside the fins of the heat sink to enhance the overall heat transfer coefficient. Moreover, the relationship between the convection improvement and the Reynolds number for the MPMF system has been investigated and transformed into a correlation line for nine different fan tip locations to provide a means of predicting the cooling performance for the MPMF system embedded in a heat sink.     

Energy storage in remote area power supply (RAPS) systems

Preliminary cost analyses indicate that hybrid RAPS systems are more economically attractive as a means to provide electricity to remote villages than are alternatives such as 24 h diesel generation. A hybrid remote area power supply (RAPS) system is being deployed to provide 24 h electricity to villages in the Amazon region of Peru. The RAPS system consists of modules designed to provide 150 kWh per day of utility grade ac electricity over a 24 h period. Each module contains a diesel generator, battery bank using heavy-duty 2 V VRLA gelled electrolyte batteries, a battery charger, a photovoltaic array and an inverter. Despite early difficulties, the system in the first village has now commenced operation and the promise of RAPS schemes as a means for providing sustainable remote electrification appears to be bright.     

Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling

This paper reports the results of an experimental investigation of the performance of finned heat sinks filled with phase change materials for thermal management of portable electronic devices. The phase change material (PCM) used in this study is n-eicosane and is placed inside a heat sink made of aluminium. Aluminium acts as thermal conductivity enhancer (TCE), as the thermal conductivity of the PCM is very low. The heat sink acts as an energy storage and a heat-spreading module. Studies are conducted for heat sinks on which a uniform heat load is applied for the unfinned and finned cases. The test section considered in all cases in the present work is a 80 × 62 mm² base with TCE height of 25 mm. A 60 × 42 mm² plate heater with 2 mm thickness is used to mimic the heat generation in electronic chips. Heat sinks with pin fin and plate fin geometries having the same volume fraction of the TCE are used. The effect of different types of fins for different power level (ranging from 2 to 7 W) in enhancing the operating time for different set point temperatures and on the duration of latent heating phase were explored in this study. The results indicate that the operational performance of portable electronic device can be significantly improved by the use of fins in heat sinks filled with PCM.     

Thermal analysis of COB array soldered on heat sink

In this paper, the finite element method (FEM) and experiment were adopted to evaluate the thermal performance of a multi-chip COB LED lamp based on the cold spray technology. The results show that the junction temperature can be limited under 110 °C. Compared to an aluminum-substrate LED module pressed on the heat sink, the soldering structure of a copper-substrate LED can reduce the junction temperature. The junction temperature of the LED module soldered on the heat sink is only 97.3 °C, while one of the pressing structures is 103.5 °C. It is further found that the chip gaps and the thickness of the copper-circuit layer have significant effect on the heat spread. Increasing the chip gaps and the thickness of the copper-circuit layer can effectively reduce the junction temperature and improve the LED lamp's thermal performance.     

Orientation effect on heat transfer of a shrouded LED backlight panel with a plate-fin array

This study reports thermal performance of a shrouded 348 mm × 558 mm aluminum plate-fin heat sink subject to various input powers and orientations. Effects of clearance (C) and the orientation on the heat transfer of the heat sink were investigated. Results show that the clearance effect is detectable only in a “window region” between 5 mm and 10 mm where an appreciable rise of heat transfer coefficient is encountered. As the tilted angle (θ) of the LED panel is increased, the heat transfer coefficient is reduced and the clearance effect on heat transfer becomes more pronounced. The heat transfer coefficients are similar between two cases in which the tilted angles of the LED panel are supplementary irrespective of clearance and input power. Except the cases of a horizontal heat sink, heat transfer coefficient of the shrouded heat sink having a fin array facing downward is usually slightly higher than that having supplementary tilted angle.     

Experimental analysis of flow and heat transfer in a miniature porous heat sink for high heat flux application

A novel miniature porous heat sink system was presented for dissipating high heat fluxes of electronic device, and its operational principle and characteristics were analyzed. The flow and heat transfer of miniature porous heat sink was experimentally investigated at high heat fluxes. It was observed that the heat load of up to 280 W (heat flux of 140 W/cm²) was removed by the heat sink with the coolant pressure drop of about 34 kPa across the heat sink system and the heater junction temperature of 62.9 °C at the coolant flow rate of 6.2 cm³/s. Nu number of heat sink increased with the increase of Re number, and maximum value of 323 for Nu was achieved at highest Re of 518. The overall heat transfer coefficient of heat sink increased with the increase of coolant flow rate and heat load, and the maximal heat transfer coefficient was 36.8 kW(m² °C)^?1 in the experiment. The minimum value of 0.16 °C/W for the whole thermal resistance of heat sink was achieved at flow rate of 6.2 cm³/s, and increasing coolant flow rate and heat fluxes could lead to the decrease in thermal resistance. The micro heat sink has good performance for electronics cooling at high heat fluxes, and it can improve the reliability and lifetime of electronic device.     

Effect of non-uniform heating on the performance of the microchannel heat sinks

The present study experimentally investigates the performance of a 2-pass microchannel heat sink subject to non-uniform heating. The size of the microchannel heat sink is 132 mm × 82 mm × 6 mm with a rectangular channel of 1 mm × 1 mm. Three independent heaters having identical size (96 mm × 38.5 mm × 1 mm) is placed consecutively below the microchannel heat sink. Two kinds of manifolds are used for testing of the microchannel, one with a side entrance (type A) and the other with a front entrance (type B). Test results show that both maximum temperature and average temperature rise with the total input power, and this is applicable for both manifolds. For uniform heating condition, the maximum temperature for type B manifold is much lower than that for type A manifold due to a better flow distribution and heat transfer performance. The pressure drop is slightly reduced with the rise of supplied power. For non-uniform heating, the maximum temperature and the average temperature depend on the location of heaters. For the same supplied power with non-uniform heating, it is found that heater being placed at the inlet of the microchannel will give rise to a higher maximum temperature than that being placed at the rear of the heat sink. This phenomenon is especially pronounced when the inlet flowrate is comparatively small and becomes less noted as the inlet flowrate is increased to 0.7 L/min.     

3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heat sink with liquid flow

A full 3-dimensional (3D) conjugate heat transfer model has been developed to simulate the heat transfer performance of silicon-based, parallel microchannel heat sinks. A semi-normalized 3-dimensional heat transfer model has been developed, validated and used to optimize the geometric structure of these types of microheat sinks. Under a constant pumping power of 0.05 W for a water-cooled microheat sink, the optimized geometric parameters of the structure as determined by the model were a pitch of 100 μm, a channel width of 60 μm and a channel depth of about 700 μm. The thermal resistance of this optimized microheat sink was calculated for different pumping powers based on the full 3D conjugate heat transfer model and compared with the initial experimental results obtained by Tuckerman and Pease in 1981. This comparison indicated that for a given pumping poser, the overall cooling capacity could be enhanced by more than 20% using the optimized spacing and channel dimensions. The overall thermal resistance was 0.068 °C/W for a pumping power of 2 W.     

Evaluation of optimal power options for base transceiver stations of Mobile Telephone Networks Cameroon

Photovoltaic hybrid systems (PVHS) with 2 days of energy autonomy are shown to be optimal options for the supply of the daily energy demands of 33 base transceiver stations of MTN Cameroon. PVHS were computed for all sites using the technical data for a 150 Wp mono-crystalline module, the site specific hourly load data, the average monthly solar radiation and temperature. Hourly solar radiation data for all sites were downloaded using the solar resource module of HOMER and geographical coordinates of the selected sites. The 3-hourly temperature data available on a website maintained NASA was used to generate average monthly hourly temperatures needed in the calculation of the output of solar modules. The energy costs and breakeven grid distances for possible power options were computed using the Net Present Value Technique and financial data for selected power system components. The results with a PV module cost of 7.5 €/Wp, a remote diesel price of 1.12 €/l, a general inflation rate of 5% and a fuel escalation of 10% showed that the annual operational times of the diesel generator were in the range 3–356 h/year with renewable energy fractions in the range 0.89–1.00. However, only 22 PVHS had two parallel battery strings as stipulated in the request for proposal launched by MTN Cameroon in 2008. The PV array sizes evaluated for the 22 PVHS were found to be the range 2.4–10.8 kWp corresponding to daily energy demands in the range 7.31–31.79 kW h/d. The energy costs and breakeven grid distances determined were in the ranges 0.81–1.32 €/kW h and 10.75–32.00 km respectively.     

Fluid flow and heat transfer characteristics of cross-cut heat sinks

In this study, effects of cross-cuts on the thermal performance of heat sinks under the parallel flow condition are experimentally studied. To find effects of the length, position, and number of cross-cuts, heat sinks with one or several cross-cuts ranging from 0.5 mm to 10 mm were fabricated. The pressure drop and the thermal resistance of the heat sinks are obtained in the range of 0.01 W<P_p < 1 W. Experimental results show that among the many cross-cut design parameters, the cross-cut length has the most significant influence on the thermal performance of heat sinks. The results also show that heat sinks with a cross-cut are superior to heat sinks containing several cross-cuts in the thermal performance. Based on experimental results, the friction factor and Nusselt number correlations for heat sinks with a cross-cut are suggested. Using the proposed correlations, thermal performances of cross-cut heat sinks are compared to those of optimized plate-fin and square pin-fin heat sinks under the constant pumping power condition. This comparison yields a contour map that suggests an optimum type of heat sink under the constraint of the fixed pumping power and fixed heat sink volume. The contour map shows that an optimized cross-cut heat sink outperforms optimized plate-fin and square pin-fin heat sinks when 0.04 < log L1 < 1.