Joining of Cf/SiC composite to Ti alloy using composite filler materials

Abstract

C_f/SiC was successfully joined to Ti alloy with Ag–Cu–Ti–W, Ag–Cu–Ti–SiC and Ag–Cu–Ti–TiC mixed powders by some suitable brazing parameters. Microstructure and shear strengths of the preformed joint were investigated. The results showed that the W particulate and reaction products can uniformly distribute in the brazing layer of the performed joint. These composite brazing layers relaxed the thermal stress of the joint effectively. These characteristics were beneficial to the joint, which had shear strengths that were significantly higher than the optimal shear strengths of the joint brazed with pure Ag–Cu–Ti at room temperature and 500°C.     

The effect of silicon on the wettability and interfacial reaction in AlN/Cu alloy systems

Wetting behavior of AlN by Cu alloys has been studied in vacuum through sessile drop technique. The contact angle was determined by high temperature photography and shape analysis software. Pure copper does not wet AlN. The contact angle of the AlN/Cu system at 1200 °C is 138°. Adding 20 at% Si leads to the decrease of the contact angle from 138° to 96°, and a reaction layer forms in the interfacial area. The addition of Si can also improve the wettability of AlN/Cu10Ti (the atomic ratio of Cu:Ti is 90:10) system. The contact angle of the system decreases to the values less than 20° at 1200 °C by adding 20 at% or 27 at% Si. During the wetting experiment, Ti diffuses to and reacts with AlN, leading to the formation of TiN. Addition of Si can retard the reaction between Ti and AlN by forming a Si-rich layer, mainly composed of Ti-Si compound, between the reaction layer, mainly composed of TiN, and the CuSiTi alloy. The Si-rich layer also contributes to the improvement of the wettability of the system. In the meantime, the addition of Si contributes to the decrease of the stress in the interfacial area and to the bonding at the interfaces.     

Microstructure and strength of brazed joints of Ti3Al-base alloy with different filler metals

The interfacial microstructure and properties of brazed joints of a Ti₃Al-based alloy were investigated in this paper to meet the requirements of the use of Ti₃Al-based alloy in the aeronautic and space industries. The effects of different brazing fillers on the interfacial microstructure and shear strength were studied. The relationship between brazing parameters and shear strength of the joints was discussed, and the optimum brazing parameters were obtained. The brazed joints were qualitatively and quantitatively analyzed by means of EPMA, SEM and XRD. The results showed that using a AgCuZn brazing filler, TiCu, Ti(Cu,Al)₂ and Ag[s,s] were formed, the shear strength of the joint was decreased because of the formation of TiCu and Ti(Cu,Al)₂; using a CuP brazing filler, Cu₃P, TiCu and Cu[s,s] were formed at the interface of the joint, the former two intermetallic compounds decreased the shear strength. The analysis also indicated that using the TiZrNiCu brazing filler, the optimum parameters were temperature T=1323 K, joining time t=5 min, and the maximum shear strength was 259.6 MPa. For the AgCuZn brazing filler, the optimum parameters were joining temperature T=1073 K, joining time t=5 min, and the maximum shear strength was 165.4 MPa. To the CuP brazing filler, the optimum parameters were joining temperature T=1223 K, joining time t=5 min, and the maximum shear strength is 98.6 MPa. Consulting the results of P. He, J.C. Feng and H. Zhou [Microstructure and strength of brazed joints of Ti₃Al-base alloy with NiCrSiB, Mater. Charact., 52(8) (2004) 309–318], relative to the other brazing fillers, TiZrNiCu is the optimum brazing filler for brazing Ti₃Al-based alloy.     

Joining of C_f/SiBCN composite with two Ni-based brazing fillers and interfacial reactions

C_f/SiBCN ceramic composite was joined using Ni-19Cr-10Si(BNi5) and Ni-33Cr-24Pd-3.5Si-0.5B filler alloys at 1170 °C for 10 min. Two kinds of Ni-based filler alloys exhibited good wettability on the C_f/SiBCN composite, with a contact angle of 13° and 4°, respectively. The microstructures of the brazed joints were investigated by electron-probe microanalysis(EPMA), and three-point bend test was conducted for the joints at room temperature. When being brazed with BNi5 filler alloy, no evident reaction layer was observed at the surface of the joined composite, and the joint microstructure was characterized by Ni_2Si matrix with scatteringly distributing mixture compounds of Cr_(23)C_6, Ni_2Si and CrB. While Ni-Cr-Pd(Si,B)brazing alloy was used, a Cr_(23)C_6 reaction layer with a thickness of 11 μm was formed at the surface of the base composite. In the central part of the brazed joint, the phases were composed of Ni(Cr,Si) solid solution and complex compounds including Pd_2Si,(Ni,Pd)_2Si and Ni-B. The strength of C_f/SiBCN joint brazed with BNi5 filler alloy was 62.9 MPa at room temperature, whereas that with Ni-Cr-Pd(Si,B) filler alloy was at the same level.     

Joining of Cf/SiC composite to GH783 superalloy with NiPdPtAu-Cr filler alloy and a Mo interlayer

With assistance of Mo interlayer, joining of C_f/SiC composite to GH783 superalloy was carried out using NiPdPtAu-Cr filler alloy. Under the brazing condition of 1200 °C for 10 min, the maximum joint strength of 98.5 MPa at room temperature was achieved when the thickness of Mo interlayer was 0.5 mm. Furthermore, the corresponding joint strength tested at 800 °C and 900 °C was even elevated to 123.8 MPa and 133.0 MPa, respectively. On one hand, the good high-temperature joint strength was mainly attributed to the formation of the refractory Mo-Ni-Si ternary compound within the joint. On the other hand, the residual Mo interlayer as a hard buffer, can release the residual thermal stresses within the dissimilar joint. The C_f/SiC-Mo bonding interface was still the weak link over the whole joint, and the cracks propagated throughout the whole reaction zone between the C_f/SiC composite and the Mo interlayer.     

Interfacial microstructure of NiSix/HfO2/SiOx/Si gate stacks

Integration of NiSi_x based fully silicided metal gates with HfO₂ high-k gate dielectrics offers promise for further scaling of complementary metal-oxide- semiconductor devices. A combination of high resolution transmission electron microscopy and small probe electron energy loss spectroscopy (EELS) and energy dispersive X-ray analysis has been applied to study interfacial reactions in the undoped gate stack. NiSi was found to be polycrystalline with the grain size decreasing from top to bottom of NiSi_x film. Ni content varies near the NiSi/HfO_x interface whereby both Ni-rich and monosilicide phases were observed. Spatially non-uniform distribution of oxygen along NiSi_x/HfO₂ interface was observed by dark field Scanning Transmission Electron Microscopy and EELS. Interfacial roughness of NiSi_x/HfO_x was found higher than that of poly-Si/HfO₂, likely due to compositional non-uniformity of NiSi_x. No intermixing between Hf, Ni and Si beyond interfacial roughness was observed.     

Micro-CT characterization on porosity structure of 3D Cf/SiCm composite

The fabric architecture and porosity of three-dimensional (3D) C_f/SiC_m composites are characterized using commercial X-ray microcomputed tomography (microCT). The non-destructive observation exhibits an inhomogeneous structure of the carbon fiber performs with gradiently distributed porosity. The shape of fiber bundles and porosity are investigated with respect to the gas transport during chemical vapor infiltration (CVI). Difference in growth rate of deposition between outer surface and inner porosity are identified through reconstructing the porosity morphology, which coincides well with the “node-bond” theoretical model. Moreover, in the light of the porosity features, gas retention and viscous flow is revealed to play key roles in the formation of the inner structure of C_f/SiC_m.     

Vacuum brazing of aluminium metal matrix composite (55 vol.% SiCp/A356) using aluminium-based filler alloy

Aluminium matrix composites with high volume fractions of SiC particles, as the reinforcements, are potentially suitable materials for electronic packaging. These composites, due to their poor weldability, however, have very limited applications. The microstructure and shear strengths of the bonds made in 55 vol.% SiC_p/A356 composite, using an aluminium based filler alloy containing Cu, Si, Mg and Ni, were investigated in this paper. The brazing temperature had a clear effect on the bond integrity, and the samples brazed at 560 °C demonstrated good bonding between the filler alloy and the SiC particles. The maximum shear strength achieved in this work was 102 MPa.     

铟银软钎料的制备与钎焊性研究

实验利用高频感应熔炼方法制备了一系列不同Ag含量的InAg软钎料。利用手持式合金分析仪、XRD对钎料的成分和物相进行了分析。利用示差扫描量热仪（DSC）测试了不同成分钎料的熔点。测试了不同成分钎料的润湿性及接头剪切强度。结果表明：铟银软钎料由In与InAg2两相组成;通过控制加入Ag的量可以得到一定熔点的钎料;加入Ag降低了钎料的润湿性;加入Ag提高了接头剪切强度。     

Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer

Partial transient liquid-phase bonding (PTLP bonding) of silicon nitride (Si₃N₄) ceramic has been performed using Ti/Ni multi-interlayer in vacuum at 1273–1423 K. Interfacial microstructures were examined by scanning electron microscope, electron probe micro-analysis, and X-ray diffraction. The joint strength has been measured by four-point bending tests from room temperature up to 1000 °C. Interfacial structure of Si₃N₄/TiN/Ti₅Si₃ + Ti₅Si₄ + Ni₃Si/(NiTi)/Ni₃Ti/Ni is formed after bonding process. The NiTi layer is gradually consumed with simultaneous growth of the reaction layer and the Ni₃Ti layer. The room temperature joint strength is significantly affected by the reaction layer thickness, whereas the elevated temperature joint strength significantly depends on whether the low melting point NiTi layer exists in the joint. The joint strength of more than 100 MPa is retained up to 800 °C as the NiTi layer is completely consumed. A model is proposed to optimize the PTLP bonding parameters for optimizing joint strength at both room temperature and elevated temperature.     

Cf/Mg 复合材料异形件成形装置设计与实验研究

为实现Cf/Mg复合材料异形件的近净成形,在分析金属基复合材料液态浸渗制备技术的基础上,提出了真空压力浸渗-液固挤压制备Cf/Mg复合材料新工艺,并设计了相应的成形装置.利用设计的装置开展2D碳毡增强镁基复合材料异形件的制备研究.在熔炼温度为760~820℃,预制体预热温度为570~610℃,浸渗气压0.5 MPa和挤压载荷10~30 MPa等工艺参数下,成功制备出Cf/Mg复合材料异形制件.对复合材料制件进行宏观尺寸测量及扫描电镜(SEM)观察发现,制件外形完整,与设计一致;制件内部组织致密、纤维分布均匀;预制体在制备过程中没有发生明显的变形和破坏.     

Fabrication and characterisation of AZ91/SiC composite by pressureless infiltration method

Abstract

Since the spontaneous infiltration of molten AZ91 Mg alloy into the powder bed containing SiC particles occurred at 700°C for 1 h under a nitrogen atmosphere, it was possible to fabricate Mg alloy composites reinforced with SiC particles. Since the fabrication conditions (e.g. temperature, time and atmosphere) of the composite are different from those of the other fabrication route, reaction products formed during the composite fabrication were investigated in detail using field emission scanning electron microscopy and high resolution transmission electron microscopy. From the analysis of reaction products, the authors can identify the formation of MgO, MgAl₂O₄, Al₁₂Mg₁₇ and an AlN phase containing magnesium.     

Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy

In this study, Si₃N₄ ceramic was jointed by a brazing technique with a Cu–Zn–Ti filler alloy. The interfacial microstructure between Si₃N₄ ceramic and filler alloy in the Si₃N₄/Si₃N₄ joint was observed and analyzed by using electron-probe microanalysis, X-ray diffraction and transmission electron microscopy. The results indicate that there are two reaction layers at the ceramic/filler interface in the joint, which was obtained by brazing at a temperature and holding time of 1223 K and 15 min, respectively. The layer nearby the Si₃N₄ ceramic is a TiN layer with an average grain size of 100 nm, and the layer nearby the filler alloy is a Ti₅Si₃N_x layer with an average grain size of 1–2 μm. Thickness of the TiN and Ti₅Si₃N_x layers is about 1 μm and 10 μm, respectively. The formation mechanism of the reaction layers was discussed. A model showing the microstructure from Si₃N₄ ceramic to filler alloy in the Si₃N₄/Si₃N₄ joint was provided as: Si₃N₄ ceramic/TiN reaction layer/Ti₅Si₃N_x reaction layer/Cu–Zn solution.     

Effects of pyrolysis processes on the microstructures and mechanical properties of Cf/SiC composites using polycarbosilane

Three-dimensional braided carbon fiber reinforced silicon carbide composites (3D-B C_f/SiC) were prepared through eight cycles of vacuum infiltration of polycarbosilane (PCS) and subsequent pyrolysis under an inert atmosphere. The influences of heating rate and pyrolysis temperature on the microstructure and mechanical properties of C_f/SiC were discussed. It was found that the heating rate had great effect on the mechanical properties of C_f/SiC composites. With the increase of heating rate, the density of C_f/SiC composites increased and the interfacial bonding was weakened. As a result, the flexural strength of C_f/SiC was enhanced from 145 to 480 MPa when the heating rate was increased from 0.5 to 15 °C/min. The results showed that the flexural strength of the C_f/SiC composites fabricated at a heating rate of 15 °C/min could be increased from 480 to 557 MPa if the pyrolysis temperature of the sixth cycle was elevated from 1200 to 1600 °C, which was also attributed to the desirable interfacial structure and increased density. When tested at 1300 °C in vacuum, the C_f/SiC showed higher flexural strength (680 MPa) than that (557 MPa) at room temperature.     

Joining of C/C composite to TC4 using SiC particle-reinforced brazing alloy

Silicon carbide particles were used as reinforcement in the Ag-26.7Cu-4.6Ti (wt.%) brazing alloy for joining C/C composite to TC4 (Ti-6Al-4V, wt.%). The mechanical properties of the brazed joints were measured by shear strength testing. The effects of the volume percentage of SiC particles on the microstructures of the brazed joints were investigated. It is shown that the maximum shear strength of the joints is 29 MPa using 15 vol.% SiC in the brazing alloy which is greater than that with Ag-26.7Cu-4.6Ti brazing alloy alone (22 MPa). Ti is reacted with SiC particles, forming Ti–Si–C compound in the particle-reinforced brazing alloy. Due to this, more SiC particles in the brazing alloy, the thickness of TiC/TiCu reaction layer near C/C composite decreases. Moreover, SiC particles added to the brazing alloy can reduce the CTE of the brazing alloy which results in lower residual stress in the C/C composite-to-metal joint. Both of the above reasons lead to the increasing of the shear strength of the brazed joints. But excessive SiC particles added to the brazing alloy lead to pores which results in poor strength of the brazed joint.     

New synthesis method to improve the properties of PbTiO3/NiTi composite film

In this article, a new synthesis process to fabricate PbTiO₃/NiTi composite film is reported. A transitional PbTiO₃ film, prepared on NiTi substrate by a hydrothermal reaction, was introduced to improve the adhesion strength of the composite. Then an outer PbTiO₃ film was fabricated on the transitional layer by a sol-gel method. No cracks or obvious defects were observed on the outer ceramic film. Scratch tests showed that the adhesion strength of composite film was improved greatly by using this new synthesis process.     

Effect of Si3N4-particles addition in Ag-Cu-Ti filler alloy on Si3N4/TiAl brazed joint

A novel composite filler alloy was developed by introducing Si₃N_4p (p = particles) into Ag-Cu-Ti filler alloy. The brazing of Si₃N₄ ceramics and TiAl intermetallics was carried out using this composite filler alloy. The typical interfacial microstructure of brazed joints was: TiAl/AlCu₂Ti reaction layer/Ag_(s,s) + Al₄Cu₉ + Ti₅Si_3p + TiN_p/TiN + Ti₅Si₃ reaction layer/Si₃N₄. Effects of Si₃N_4p content in composite filler alloy on the interfacial microstructure and joining properties were investigated. The distribution of Ti₅Si_3p and TiN_p compounds in Ag-based solid solution led to the decrease of the mismatch of the coefficient of thermal expansion (CTE) and the Young's modulus between Si₃N₄ and TiAl substrate. The maximum shear strength of 115 MPa was obtained when 3 wt.% Si₃N_4p was added in the composite filler alloy. The fracture analysis showed that the addition of Si₃N_4p could improve the mechanical properties of the joint.     

Tunable BT@SiO2 core@shell filler reinforced polymer composite with high breakdown strength and release energy density

Barium titanate@silicon dioxide (BT@SiO₂) core@shell fillers with an average diameter of 100 nm were prepared by a facile sol–gel synthesis. The thickness of SiO₂ shell can be easily tuned by varying different mass ratio of BT to tetraethyl orthosilicate (TEOS). Polyvinylidene fluoride (PVDF) based composite films reinforced by BT and BT@SiO₂ were fabricated via a solution casting method. The effects of SiO₂ shell on morphology structure, wettability, interfacial adhesion, dielectric, electrical and energy performances of composites were investigated. Compared with BT/PVDF, BT@SiO₂/PVDF composites show significantly increased breakdown strength due to enhanced interfacial adhesion and suppressed charge carrier conduction. Benefiting from enhanced breakdown strength and reduced remnant polarization induced by SiO₂ shell, BT@SiO₂/PVDF shows increased release energy density (energy density which can be fully discharged and applicable). Especially, BT@SiO₂/PVDF with SiO₂ thickness of 4 nm exhibits the highest release energy density of 1.08 J/cm³ under applied electric field of 145 kV/mm.     

Wettability and reactivity between B4C and molten Zr55Cu30Al10Ni5 metallic glass alloy

The isothermal wetting and spreading behaviors of molten Zr₅₅Cu₃₀Al₁₀Ni₅ metallic glass alloy on B₄C substrates were studied using a modified sessile drop method at 1133–1253 K in a high vacuum. A distinct reaction layer consisting of ZrB₂ and ZrC_x was produced at the interface and displayed good wettability with the molten alloy. The entire spreading kinetics could be characterized by four representative stages: (i) an initial rapid spreading presumably driven by adsorption of the active Zr atoms at the solid–liquid interface, (ii) a quasi-linear and (iii) a linear spreading stage controlled by the chemical reaction between Zr and B₄C in both cases, and (iv) an approach-to-equilibrium stage with precipitation of crystals in the liquid. An increase in temperature promotes the wetting and reaction. In view of the reasonable wettability and reactivity, there is a potential for preparing Zr-base bulk metallic glass matrix composites reinforced by in situ ZrC–ZrB₂ hybrid ceramic particulates using B₄C as a reaction agent by way of an infiltration synthesis technique.     

Temperature Criterion of Laser Welding for Joining Aluminum Alloy with Low-Carbon Steel

Aluminum alloy and low-carbon steel are dissimilar metals. In order to obtain a reciprocal comprehensive property in a joint component of aluminum alloy and low-carbon steel, laser welding was used as a novel joining process. Based on the experimental results, the temperature criterion of laser welding for joining of aluminum alloy and low-carbon steel is discussed in this paper.