V-doping effects on ferroelectric properties of K0.5Bi4.5Ti4O15 thin films

V-doped K_0.5Bi_4.5Ti₄O₁₅ (K_0.5Bi_{4.5 − x/3}Ti_4 − xV_xO₁₅, KBTiV-x, x = 0.00, 0.01, 0.03, and 0.05) thin films were prepared on a Pt(111)/Ti/SiO₂/Si(100) substrate by a chemical solution deposition method. The thin films were annealed by using a rapid thermal annealing process at 750 °C for 3 min in an oxygen atmosphere. Among them, KBTiV-0.03 thin film exhibited the most outstanding electrical properties. The value of remnant polarization (2P_r) was 75 μC/cm² at an applied electric field of 366 kV/cm. The leakage current density of the thin film capacitor was 5.01 × 10⁻⁸ at 100 kV/cm, which is approximately one order of magnitude lower than that of pure K_0.5Bi_4.5Ti₄O₁₅ thin film capacitor. We found that V doping is an effective method for improving the ferroelectric properties of K_0.5Bi_4.5Ti₄O₁₅ thin film.     

The effects of quenching treatment and AlF3 coating on LiNi0.5Mn0.5O2 cathode materials for lithium-ion battery

Submicron layered LiNi_0.5Mn_0.5O₂ was synthesized via a co-precipitation and solid-state reaction method together with a quenching process. The crystal structure and morphology of the materials were investigated by X-ray diffraction (XRD), Brunauer–Emmett and Teller (BET) surface area and scanning electron microscopy (SEM) techniques. It is found that LiNi_0.5Mn_0.5O₂ material prepared with quenching methods has smooth and regular structure in submicron scale with surface area of 0.43 m² g⁻¹. The initial discharge capacities are 175.8 mAh g⁻¹ at 0.1 C (28 mA g⁻¹) and 120.3 mAh g⁻¹ at 5.0 C (1400 mA g⁻¹), respectively, for the quenched samples between 2.5 and 4.5 V. It is demonstrated that quenching method is a useful approach for the preparation of submicron layered LiNi_0.5Mn_0.5O₂ cathode materials with excellent rate performance. In addition, the cycling performance of quenched-LiNi_0.5Mn_0.5O₂ material was also greatly improved by AlF₃ coating technique.     

Impedance spectroscopy and relaxation phenomena of (Na,K) excess Na0.5K0.5NbO3 thin films grown by chemical solution deposition

Na_0.5K_0.5NbO₃ (NKN) and 10 mol% (Na,K) excess Na_0.5K_0.5NbO₃ (NKN10) thin films on Pt/Ti/SiO₂/Si substrate were prepared by chemical solution deposition. Crystallization of NKN10 thin films was confirmed by X-ray diffraction. The (Na,K) excess Na_0.5K_0.5NbO₃ thin film shows a ferroelectric P-E hysteresis loop. Dielectric properties and impedance spectroscopy of thin films were investigated in the frequency range from 0.1 Hz to 100 kHz and the temperature range of 25 ~ 500 °C. By analyzing the complex impedance relaxation with Cole-Cole plots, we found impedance relaxations for the thin film. The contribution of electrical conduction is discussed in relation to grain, grain boundary, and interface effects.     

Simple chemical solution deposition and thermoelectric properties of epitaxial La0.95Sr0.05CoO3 thin films

In this paper, simple chemical solution deposition method is used to prepare La_0.95Sr_0.05CoO₃ thin films on SrTiO₃ (001) substrates by acetate-based precursors. The derived film is characterized by x-ray diffraction, field-emission scanning electron microscopy and transmission electronic microscopy. The derived film is epitaxial growth with < 001>[100] La_0.95Sr_0.05CoO₃||<001>[100] SrTiO₃, indicating that the chemical solution deposition is an effective route to obtain the cobalt-based films. The resistivity, Seebeck coefficient and thermal power factor are 0.05Ω cm, 250 μV/K and 0.21 mWK^− 2m^− 1 at 300 K, respectively, which is higher than these of the ceramics, indicating epitaxial thin film is an effective route to enhance the thermoelectric properties of La_0.95Sr_0.05CoO₃.     

Layer-by-layer deposition of MnSi1.7 film with high Seebeck coefficient and low electrical resistivity

A good thermoelectric material should have a high Seebeck coefficient, a low electrical resistivity, and a low thermal conductivity. For conventional thermoelectric materials, however, increasing the Seebeck coefficient also leads to a simultaneous increase in the electrical resistivity. In this paper, a method of layer-by-layer deposition of MnSi_1.7 film with high Seebeck coefficient and low electrical resistivity is developed. After deposition of the first MnSi_1.7 sub-layer, the deposition process is interrupted for several minutes, and then continues for another MnSi_1.7 sub-layer. Therefore, the MnSi_1.7 film contains two sub-layers for one interruption, three sub-layers for two interruptions, and so on. It is found that the n-type MnSi_1.7 film with two sub-layers has a higher Seebeck coefficient, −0.451 mV K⁻¹, and a lower electrical resistivity, 19.4 mOhm-cm, at 483 K as compared to that of without deposition interruption, −0.152 mV K⁻¹ and 44.3 mOhm-cm. The p-type MnSi_1.7 film with three sub-layers also has a higher Seebeck coefficient, 0.238 mV K⁻¹, and a lower electrical resistivity, 5.5 mOhm-cm, at 733 K in comparison with that of without deposition interruption, 0.212 mV K⁻¹ and 10.4 mOhm-cm.     

Enhancement microwave dielectric properties of La(Mg0.5Sn0.5)O3 ceramics by Substituting Mg for Co

The microwave dielectric properties of La(Mg_0.5−xCo_xSn_0.5)O₃ ceramics were examined with a view to exploiting them for mobile communication. The La(Mg_0.5−xCo_xSn_0.5)O₃ ceramics were prepared using the conventional solid-state method with various sintering temperatures. The X-ray diffraction patterns of the La(Mg_0.4Co_0.1Sn_0.5)O₃ ceramics revealed that La(Mg_0.4Co_0.1Sn_0.5)O₃ is the main crystalline phase, which is accompanied by small extent of La₂Sn₂O₇ as the second phase. Formation of this Sn-rich second phase was attributed to the loss of MgO upon ignition. Increasing the sintering temperatures seemed to promote the formation of La₂Sn₂O₇. An apparent density of 6.67 g cm⁻³, a dielectric constant (?_r) of 20.3, a quality factor (Q.F.) of 70,500 GHz, and a temperature coefficient of resonant frequency (τ_f) of −77 ppm °C⁻¹ were obtained for La(Mg_0.4Co_0.1Sn_0.5)O₃ ceramics that were sintered at 1550 °C for 4 h.     

Optimization of thermoelectric properties on Bi2Te3 thin films deposited by thermal co-evaporation

The optimization of the thermal co-evaporation deposition process for n-type bismuth telluride (Bi₂Te₃) thin films deposited onto polyimide substrates and intended for thermoelectric applications is reported. The influence of deposition parameters (evaporation rate and substrate temperature) on film composition and thermoelectric properties was studied for optimal thermoelectric performance. Energy-dispersive X-ray spectroscopy, X-ray diffraction, X-ray photoelectron spectroscopy and Raman spectroscopy confirmed the formation of Bi₂Te₃ thin films. Seebeck coefficient (up to 250 μV K^− 1), in-plane electrical resistivity (≈10 μΩ m), carrier concentration (3×10¹⁹-20×10¹⁹ cm^− 3) and Hall mobility (80-170 cm² V⁻¹ s^− 1) were measured at room temperature for selected Bi₂Te₃ samples.     

Enhanced thermoelectric properties of NaCo2O4 by adding ZnO

The primary phase present in the as-sintered Na(Co_1 − xZn_x)₂O₄ (0 ≤ x ≤ 0.1) bodies was the solid solution of the constituent oxides with a bronze-type layered structure. The electrical conductivity of the Na(Co_1 − xZn_x)₂O₄ samples significantly increased with an increase in ZnO content. The sign of the Seebeck coefficient for all samples was positive over the whole temperature range (723-1073 K), i.e., p-type conduction. The power factor of Na(Co_0.95Zn_0.05)₂O₄ showed an outstanding power factor (1.7 × 10^− 3Wm^− 1 K^− 2) at 1073 K. The power factor was above four times superior to that of ZnO-free NaCo₂O₄ (0.4 × 10^− 3Wm^− 1 K^− 2). This originates from an unusually large Seebeck coefficient (415 μVK^− 1) accompanied with high conductivity (127Ω^− 1 cm^− 1) at 1073 K.     

Improved thermoelectric properties by adding Al for Zn in (ZnO)mIn2O3

The grain size and density of the sintered (Zn_1 − xAl_xO)_mIn₂O₃ bodies decreased with the small Al₂O₃ content (≤ 0.012), and then increased gradually by further increasing the Al₂O₃ content. The addition of Al for Zn in the (ZnO)_mIn₂O₃ led to an increase in both the electrical conductivity and the absolute value of the Seebeck coefficient. This indicates that the power factor was significantly enhanced by adding Al for Zn. The thermoelectric power factor was maximized to 1.67 × 10^− 3 W m^− 1 K^− 2 at 1073 K for the (Zn_0.992Al_0.008O)_mIn₂O₃ sample.     

Properties of La-substituted Na0.5Bi4.5Ti4O15 ferroelectric thin films

Ferroelectric Na_0.5La_0.5Bi₄Ti₄O₁₅ (NaLaBTi) thin films were prepared by a chemical solution deposition method. The NaLaBTi thin films annealed at 750 °C under oxygen atmosphere were randomly oriented polycrystalline. Electrical properties of the NaLaBTi thin films were compared to Na_0.5Bi_4.5Ti₄O₁₅ thin films and better properties were observed in the NaLaBTi thin films. Remnant polarization (2P_r) and coercive electric field (2E_c) were 43 µC/cm² and 204 kV/cm at an applied electric field of 478 kV/cm, respectively. Leakage current density was 1.95 × 10^− 6 A/cm² at 100 kV/cm. Dielectric constant and dielectric loss were 805 and 0.05 at 1 kHz, respectively. Switchable polarization was suppressed by 15% after 1.44 × 10¹⁰ switching cycles.     

Microstructure and thermoelectric properties of Sn-doped Bi2Te2.7Se0.3 thin films deposited by flash evaporation method

(Bi_1 − xSn_x)₂Te_2.7Se_0.3 thermoelectric thin films with thickness of 800 nm have been deposited on glass substrates by flash evaporation method at 473 K. The structures, morphology of the thin films were analyzed by X-ray diffraction and field emission scanning electron microscopy respectively. Effects of Sn-doping concentration on thermoelectric properties of the annealed thin films were investigated by room-temperature measurement of Seebeck coefficient and electrical resistivity. The thermoelectric power factor was enhanced to 12.8 μW/cmK² (x = 0.003). From x = 0.004 to 0.01 Sn doping concentration, the Seebeck coefficients are positive and show p-type conduction. The Seebeck coefficient and electrical resistivity gradually decrease with increasing Sn doping concentration.     

The enhanced thermoelectric properties of Ba0.25Pb0.05Co4Sb11.5Te0.5 alloys prepared by HPHT at different pressure

Skutterudite Ba_0.25Pb_0.05Co₄Sb_11.5Te_0.5 compounds with bcc crystal structure were prepared by high-pressure and high-temperature (HTHP) method. We have studied the structure and thermoelectric properties of Te-substituted partially filled Ba_0.25Pb_0.05Co₄Sb_11.5Te_0.5 skutterudites which were synthesized at different pressure. The electrical resistivity, Seebeck coefficient and thermal conductivity of those samples were measured in the temperature range of 320-720 K. The combination of Ba and Pb fillers inside the voids of the skutterudite structure provided a broad range of resonant phonon scattering, so that a strong suppression in the lattice thermal conductivity was observed. A dimensionless thermoelectric figure of merit of 1.0 at 720 K was achieved for n-type Ba_0.25Pb_0.05Co₄Sb_11.5Te_0.5 at last.     

Structure and thermal conductivity of Gd2(TixZr1 − x)2O7 ceramics

The Gd₂(Ti_xZr_1 − x)₂O₇ (x = 0, 0.25, 0.50, 0.75, 1.00) ceramics were synthesized by solid state reaction at 1650 °C for 10 h in air. The relative density and structure of Gd₂(Ti_xZr_1 − x)₂O₇ were analyzed by the Archimedes method and X-ray diffraction. The thermal diffusivity of Gd₂(Ti_xZr_1 − x)₂O₇ from room temperature to 1400 °C was measured by a laser-flash method. The Gd₂Zr₂O₇ has a defect fluorite-type structure; however, Gd₂(Ti_xZr_1 − x)₂O₇ (0.25 ≤ x ≤ 1.00) compositions exhibit an ordered pyrochlore-type structure. Gd₂Zr₂O₇ and Gd₂Ti₂O₇ are infinitely soluable. The thermal conductivity of Gd₂(Ti_xZr_1 − x)₂O₇ increases with increasing Ti content under identical temperature conditions. The thermal conductivity of Gd₂(Ti_xZr_1 − x)₂O₇ first decreases gradually with the increase of temperature below 1000 °C and then increases slightly above 1000 °C. The thermal conductivity of Gd₂(Ti_xZr_1 − x)₂O₇ is within the range of 1.33 to 2.86 W m^− 1 K^− 1 from room temperature to 1400 °C.     

Preparation and thermoelectric properties of nc-Si:(Al2O3 + SiO2) composite film

A composite film of nanocrystalline Si (nc-Si) embedded in (Al₂O₃ + SiO₂) has been prepared on a quartz substrate by thermally evaporating a 400 nm thick Al film on a quartz substrate and annealing in air at 580 °C for 1 h. During annealing, the Al reacts with the SiO₂ of the quartz substrate and produces nc-Si, which is embedded in the (Al₂O₃ + SiO₂) film. The average size of nc-Si is ~ 22 nm and the thickness of the nc-Si:(Al₂O₃ + SiO₂) composite film is ~ 810 nm. It is found that the prepared film is thermoelectric with a Seebeck coefficient of − 624 μV/K at 293 K and − 225 μV/K at 413 K.     

Effect of post-annealing treatment in oxygen on dielectric properties of K0.5Na0.5NbO3 thin films prepared by chemical solution deposition

K_0.5Na_0.5NbO₃ thin films were prepared on Pt/Ti/SiO₂/Si substrates by chemical solution deposition method with different annealing temperatures of 550 °C, 600 °C, 700 °C. The post-annealing treatment was introduced at 550 °C for 3 min in oxygen ambient. It is found that the films were composed of pure provskite phase, and the post-annealing treatment promoted the crystallization and improved the quality of the films, which resulted in the enhancement of the dielectric property of the films. The effect of the post-annealing on the dielectric properties of the films was also discussed.     

Dielectric, ferroelectric and piezoelectric properties of Bi0.5Na0.5TiO3-(Ba0.7Ca0.3)TiO3 ceramics at morphotropic phase boundary composition

(1 − x)Bi_0.5Na_0.5TiO₃-x(Ba_0.7Ca_0.3)TiO₃ (BNT-xBCT, 0 ≤ x ≤ 0.15) solid solutions have been synthesized by a conventional solid state sintering method for obtaining a morphotropic phase boundary (MPB) with good piezoelectric properties. X-ray diffraction patterns reveal that a MPB of rhombohedral and tetragonal phases is formed at compositions 0.09 ≤ x ≤ 0.12. Addition of BCT into BNT greatly lowered coercive field E_c without degrading remanent polarization P_r. The specimen with x = 0.09 has the good piezoelectric properties: d₃₃ = 125 pC/N and k_p = 0.33. A modified Curie-Weiss law was used to fit the dielectric constant of BNT-xBCT ceramics, and a frequency dispersion was observed during the phase transitions from antiferroelectric to paraelectric in specimens with x exceeding 0.06.     

Microstructure and thermoelectric properties of n-type 95%Bi2Te3-5%Bi2Se3 alloy produced by rapid solidification and hot extrusion

n-type SbI₃-doped 95%Bi₂Te₃+5%Bi₂Se₃ compounds were prepared by a rapid solidification and extrusion at the temperature range 420-480 °C using an extrusion ratio of 25:1. The microstructure and thermoelectric properties of the compounds were investigated as a function of extrusion temperature. The fabricated powder consists of homogeneous Bi₂Te₃+Bi₂Se₃ solid solution and the relative density of over 99% was obtained by hot extrusion. The values of Seebeck coefficient for the compounds hot extruded at 420, 450, and 480 °C were −160.8, −170.2, and −165.7 μV K⁻¹, respectively. The values of electrical resistivity (ρ) for the compounds hot extruded at 420, 450, and 480 °C were 0.49, 0.57, and 0.51×10⁻⁵ Ω m, respectively. The maximum power factor value of the compounds hot extruded at 480 °C was 53.8×10⁶ μW cm⁻¹ K⁻².     

The low temperature thermoelectric properties of CuxTiSe2−ySy

The low temperature thermoelectric properties of TiSe₂, co-doped with Cu and S, are reported. Partial S substitution for Se changes the magnitude of the indirect bandgap, while the Cu-doping independently controls the n-type carrier concentration. The Seebeck coefficients are negative, in the range of −50 to −200 μV K⁻¹, and the resistivities are 0.1-10 mΩ cm. The thermal conductivity for the sample with the largest thermoelectric power factor was found to be relatively low, 3-4 W m⁻¹ K⁻¹, and decreases with decreasing temperature. The thermoelectric efficiencies for the best materials found in this system, typified by Cu_0.02TiSe_1.7S_0.3, were largest at 0.07 at 300 K and decreased to 0.01 at 75 K.     

Ferroelectric and pyroelectric properties of (Na0.5Bi0.5)TiO3-BaTiO3 based trilayered thin films

Trilayered Bi_3.25La_0.75Ti₃O₁₂ (25 nm)/(Na_0.5Bi_0.5)_0.94Ba_0.06TiO₃ (300 nm)/Bi_3.25La_0.75Ti₃O₁₂ (25 nm) and Pb(Zr_0.4Ti_0.6)O₃ (25 nm)/(Na_0.5Bi_0.5)_0.94Ba_0.06TiO₃ (300 nm)/Pb(Zr_0.4Ti_0.6)O₃ (25 nm) thin films without undesirable phases have been deposited on Pt/Ti/SiO₂/Si substrates. It was found that the Bi_3.25La_0.75Ti₃O₁₂ and Pb(Zr_0.4Ti_0.6)O₃ layers are very effective to inhibit the charge transport in the trilayered films. Much better insulating properties than those of (Na_0.5Bi_0.5)_0.94Ba_0.06TiO₃ films have been achieved in the trilayered films. The trilayered films show good dielectric, ferroelectric and pyroelectric properties. Remnant polarizations 2P_r of 16 µC/cm² and 34 µC/cm², pyroelectric coefficients of 4.8 × 10^− 4 C m^− 2 K^− 1 and 7.0 × 10^− 4 C m^− 2 K^− 1 have been obtained for the Bi_3.25La_0.75Ti₃O₁₂/(Na_0.5Bi_0.5)_0.94Ba_0.06TiO₃/Bi_3.25La_0.75Ti₃O₁₂ and Pb(Zr_0.4Ti_0.6)O₃/(Na_0.5Bi_0.5)_0.94Ba_0.06TiO₃/Pb(Zr_0.4Ti_0.6)O₃ thin films, respectively. The trilayered films are promising candidates for sensor and actuator applications.     

The thermoelectric properties of Co4Sb12-xTex synthesized at different pressure

Skutterudite compounds Co₄Sb_12-xTe_x (0.1 ≤ ×≤0.8) was synthesized successfully by high temperature and high pressure (HTHP) method and characterized with X-ray diffractometry and thermoelectric properties measurements. The samples prepared by HTHP are nearly with the single phase CoSb₃. The electrical resistivity, Seebeck coefficient and thermal conductivity were all depending on synthetic pressure and the Te content of the Skutterudite compounds were performed at room temperature. As our expected, the Seebeck coefficient increased with an increase of the synthetic pressure and the thermal conductivity decreased with an increase of the synthetic pressure. These results indicated that HTHP technique may be helpful to prepare thermoelectric materials with enhanced thermoelectric properties.