单晶铜纳米切削过程的研究

采用分子动力学三维模型研究单晶铜纳米切削过程，工件原子间相互作用力和工件与刀具原子间相互作用力采用Morse势计算．通过分析切削过程中瞬间原子图像、切削力、单位切削力和轴向切削力与切向切削力比值。发现在整个切削过程中有位错产生，在加工表面发生弹性恢复，但未发生切屑体积的改变，切屑以原子团方式去除，单位切削力和轴向切削力与切向切削力的比值比传统切削时大得多．单晶铜纳米切削过程是位错在晶体中运动产生的塑性变形．     

碳纳米管工具电极的制备

纳米工具电极是进行纳米电解加工的必备条件,其特征尺寸直接影响纳米结构的最终尺寸.提出了利用电弧放电将碳纳米管束焊接在钨针尖上的纳米工具电极制备方法,并通过试验研究了钨针的针尖圆弧半径和放电电压对制备碳纳米管工具电极的影响.试验结果表明,不同尖端圆弧半径的钨针,所需有效放电电压不同,圆弧半径越小,有效放电电压越小,强电场分布越集中,越容易将碳纳米管束焊接在针尖的顶端;圆弧半径越大,强电场分布区域越大,越不容易控制碳纳米管束焊接的方向性.在针尖圆弧半径约为100 nm和300 nm的钨针上,放电电压分别为25 V和35 V时,成功制备出碳纳米管工具电极.     

压头对Ni基单晶合金纳米压痕结果的影响

采用分子动力学方法研究压头尺寸(半径分别为1.5nm、2.5nm、3.5nm、4.5nm)和加载速度(10m/s、20m/s、30m/s、40m/s)对Ni基单晶合金γ/γ′(001)晶面纳米压痕测试结果(弹性模量和硬度)的影响。结果表明压头尺寸和加载速度对Ni基单晶合金γ/γ′(001)晶面的纳米压痕测试结果有显著影响。采用中心对称参数研究各模型不同压入深度时基体中位错的形核和运动情况,结果表明压头尺寸越大、加载速度越快,基体γ相中位错形核形式越剧烈。压头尺寸较大或加载速度较快的模型在γ相中产生了棱柱型位错环,棱柱型位错环在γ相中沿着{111}面滑移,最终在γ/γ′相界面处塞积,然后有新的棱柱型位错环产生。     

刀尖圆弧半径加工误差解决方法探索

当实际车刀刀尖非理想点而是圆弧时,在加工圆锥和圆弧表面会产生过切削或欠切削的加工误差问题,本文根据不同功能的数控系统,介绍利用数控系统刀尖圆弧半径补偿功能及编程过程中计算刀位点坐标这两种方法解决加工误差进行探索。     

微圆弧金刚石刀具刀尖圆弧的测量及评价

为实现对微圆弧金刚石刀具刀尖圆弧的评价,提出了一种基于高分辨率扫描电镜图像的评价方法,并对刀尖圆弧轮廓提取、轮廓曲线拟合、圆弧度评价等算法进行了研究.首先,运用Canny边缘检测算子提取刀尖圆弧图像的二维轮廓数据,并用移动最小二乘法对该数据进行拟合,使所提取轮廓光滑化;接着,建立了基于最小二乘准则的刀尖圆弧评价模型,并采用二次序列规划法对模型进行求解;最后,分析了轮廓拟合误差、测量不垂直度误差对刀尖圆弧评价结果的影响,并计算了刀尖圆弧半径及圆弧度不确定度值.实验结果表明所评价微圆弧金刚石刀具的刀尖圆弧半径为30.213μm,圆弧半径不确定度为351 nm,圆弧度为0.114μm,圆弧度不确定度为24 nm.由评价结果可以看出,本文所提出的方法可以实现微圆弧金刚石刀具刀尖圆弧纳米级精度的测量及评价.     

切削深度对单晶γ-TiAl合金亚表面缺陷及残余应力的影响

本工作采用分子动力学方法模拟了单晶γ-TiAl合金在不同切削深度下的切削过程,分析了不同切削深度下微观缺陷演化及稳定切削后的内应力演变,研究了切削后残余应力和von Mises应力等在不同切削深度下的分布规律,讨论了不同切削深度下位错和层错等微观缺陷演化及内应力演变之间的关系.结果表明:位错反应及层错演化随着切削深度的增加越来越剧烈,位错反应对Lomer-Cottrell位错的形成影响较大;刀具挤压工件表面形成的残余压应力受层错演化及位错反应的影响,位错反应的剧烈程度影响内应力的大小,且残余压应力存在于亚表面下的一定深度内;同时发现切削深度的变化对von Mises应力的影响较小.     

梯度纳米多晶铜纳米切削过程的分子动力学仿真

梯度纳米多晶金属材料具有优良的塑性和强度特性,适合作为微纳系统的制造材料,近年来逐渐成为研究热点。为研究梯度多晶材料的加工去除机理,采用Poisson-Voronoi方法建立大规模梯度多晶铜分子动力学模型,数值模拟梯度多晶铜的纳米切削过程,对比分析切割细晶层(过程1)和切割粗晶层(过程2)的切削力、缺陷和应力等参数。仿真结果表明,过程1的切削力明显小于过程2,而过程2的切削力波动较大。比较分析整个切削过程的缺陷数量和分布,发现过程2的缺陷数量高于过程1;分析刀具附近缺陷的形成过程发现,过程1的缺陷主要在刀具前形核并扩散,过程2的缺陷主要在刀具前和刀具底部形核并扩散;基于应力分析发现,过程2的范式等效应力大于过程1。本研究可为梯度纳米多晶铜的纳米切削机理提供参考。     

浅析宏观与纳观材料拉伸强度差异

应用分子动力学方法,采用EAM势函数模拟纳米单晶铜的拉伸过程,在拉伸的数值模拟过程中,采用具有完整结构和各种缺陷结构模型,观察缺陷对模型强度的影响,给出各个模型拉伸时应力应变曲线及极限应力,分析纳米尺度材料与宏观材料强度极限存在巨大差距的原     

纳米单晶铜磨料磨损行为的分子动力学研究

目的探究在不同参数下纳米单晶铜的磨料磨损行为。方法通过构建纳米单晶铜的摩擦磨损模型,对磨粒施加不同的滑动速度、滑动距离以及外载荷,研究在不同滑动速度、滑动距离、外载荷下纳米单晶铜磨料磨损行为。结果随着磨料与单晶铜基体之间滑动速度的增加(50, 100, 200 m/s),基体内部缺陷减少;随着滑动距离的增大(4, 8, 16 nm),基体被去除的原子增多且主要集中在磨料前端;随着外载荷的增大(40,80 nN),基体内部缺陷的最大深度增大,且表面无定形原子增多。结论在不同的滑动速度、滑动距离、外载荷等参数下,主要包括基体内部缺陷和表层无定形原子的纳米单晶铜磨料磨损行为有明显差异。     

晶向和温度对含孔洞单晶TiAl-Nb合金断裂行为的影响

本工作采用分子动力学方法研究了晶向和温度对含孔洞单晶TiAl-Nb合金断裂行为的影响,主要分析了不同条件下TiAl-Nb合金的力学性能及微观缺陷演化.研究结果表明:晶向对含孔洞TiAl-Nb合金的力学性能有显著影响,但是对其断裂行为影响较小,这可能是因为Nb元素的加入导致的固溶强化作用大于位错的强化作用;温度越高,TiAl-Nb合金的屈服应力、屈服应变及杨氏模量越小,位错首次在孔洞处形核的时间越提前,位错数量及位错类型越少,材料失效时间越提前.     

Vortex Dynamics in Bi2Sr2CaCu2O8 Single Crystal with Low Density Columnar Defects Studied by Magnetic Force Microscope

We have studied vortex dynamics in Bi₂Sr₂CaCu₂O₈ single crystal with low density columnar defects by using a magnetic force microscope. Single crystal Bi₂Sr₂CaCu₂O₈ sample was irradiated by 1.3 GeV uranium ion to form artificial pinning centers along the crystalline c-axis. The irradiation dose corresponded to a matching field of 20 gauss. The radius of an individual vortex is approximately 140 nm, which is close to the penetration depth of this material. Magnetic force microscope (MFM) images show that intrinsic crystalline defects such as stacking fault dislocations are very effective pinning centers for vortices in addition to the pinning centers due to ion bombardment. By counting the number of vortex, we found that the flux trapped at each pinning center is a single flux quantum. At higher magnetic field, the vortex structure showed an Abrikosov lattice disturbed only by immobile vortices located at pinning centers. When increasing or decreasing the external magnetic field, the spatial distribution of vortices showed a Bean model like behavior.     

A study of the estimation method of the cutting force for a conical tool under nanoscale depth of cut by molecular dynamics

This study uses molecular dynamics to simulate the nanoscale cutting of a Cu single crystal by a conical diamond tool. Actual nanoscale straight-line cutting experiments were performed, and the experimental results are compared with the simulation results. The heaping of copper atoms is qualitatively quite consistent with the simulation result. This paper also proposes a nanoscale contact pressure factor (NCP factor) that is applicable to the probes at different tip radii. An estimation model of the cutting force for nanoscale cutting is established. This model can estimate the cutting force during actual nanoscale cutting. Actual nanoscale cutting experiments were performed for verification, and the difference between the cutting force estimated by this model and the actual force is very small.     

基于分子动力学的单晶硅纳米振动切削过程

为了研究脆性材料单晶硅原子级的纳米振动切削加工去除机制，应用分子动力学，通过改变刀具椭圆振动切削的模式，进行单晶硅纳米振动切削仿真．仿真结果表明，主切削力和法向力的变化趋势总体上呈现正弦曲线变化，并且已加工表面不同深度的亚表层存在残余应力；同时在不同切削模式下，由于刀具法向的振幅增加，使得法向力和残余应力增大；当刀具通过已加工表面时，残余应力随着亚表层深度降低而减弱；刀具法向振幅高于主切削力方向振幅时，法向力峰值高于主切削力峰值，已加工表面亚表层没有明显驰豫现象．     

Molecular dynamics study on surface formation and phase transformation in nanometric cutting of β-Sn

Atomic motion and surface formation in the nanometric cutting process of β-Sn are investigated using molecular dynamics (MD). A stagnation region is observed that changes the shape of the tool edge involved in nanometric cutting, resulting in a fluctuation in the cutting forces. It is found that single-crystal tin releases the high compressive stress generated under the tool pressure through slip and phase transformation. The tin transformation proceeds from a β-Sn structure to a bct-Sn structure. The effects of the cutting speed, undeformed chip thickness (UCT) and tool edge radius on material removal are also explored. A better surface is obtained through material embrittlement caused by a higher speed. In addition, a smaller UCT and sharper tool edge help reduce subsurface damage.The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00399-w     

Grain-size dependence of coercive force in sputtered and annealed iron films

Magnetic properties such as coercive force, initial susceptibility, etc., are structure sensitive parameters. Especially, the coercive force depends on the existence of crystal defects such as dislocations and grain boundaries. In this study, the grain-size dependence of coercive force was investigated in an iron film, 150 nm in thickness, deposited by sputtering method on a (001) KCl substrate at room temperature. The grain size of the film was changed from 15 to 120 nm by annealing in a vacuum. The coercive force increased with the increase of grain size and was proportional to the square of grain size. The magnetic domain had a ripple structure when the grain size was smaller than 50 nm. A grain size larger than 50 nm led to an irregular domain wall configuration and the formation of domain walls in the grain.     

CHARACTERISTICS OF MICROCUTTING FORCE VARIATION IN ULTRAPRECISION DIAMOND TURNING

An investigation of the characteristics of microcutting forces in diamond turning of crystalline materials is presented. The characteristics of the cutting forces were extracted and analyzed using statistical and spectrum analysis methods. A series of cutting experiments were done on a copper alloy and copper single crystals with different crystallographic orientations. Experimental results indicate that there exists a dominant frequency component and a periodicity of fluctuation of the cutting forces per workpiece revolution in the diamond turning of a single crystal material. The periodicity is closely related to the crystallographic orientation of the material being cut. As the depth of cut increases, the influence of crystallographic orientation of the single-crystal materials on microcutting forces is found to be more pronounced. Moreover, the cutting force ratio between the mean thrust force and the mean cutting force is found to vary with the depth of cut, and a large ratio was observed at a small depth of cut. These findings help to explain quantitatively the periodic fluctuations of microcutting forces (and hence the materials-induced vibration) in ultraprecision diamond turning, which are not encountered in conventional machining.     

300M超高强度钢车削加工性能仿真模拟分析研究

目的研究不同切削参数对300M超高强度钢切削性能的影响。方法通过单因素试验法,采用Advant Edge切削仿真软件,建立300M钢三维有限元模型,对不同切削参数下车削300M钢的切削力、刀片温度、刀片应力及切屑形状进行分析。结果在300M钢车削过程中,刀片温度随着切削速度增大而增大,但切削力和刀片应力反之;背吃刀量和进给量越小,切削力、刀片应力及刀片温度越小;切削刃半径越小,切削力越小,但小的切削刃半径使得刀片应力变大,容易导致刀片磨损。车削300M钢的切屑呈锯齿螺旋状,切屑温度为带状分布,切削速度越高,进给量、背吃刀量越大,切削刃半径越小,切屑温度越高。结论在300M钢车削加工中,应选用较高的切削速度,适中的切削刃半径,较小的进给量和背吃刀量。     

Nanometric cutting of copper: A molecular dynamics study

Molecular dynamics (MD) simulations were carried out to study the nanometric cutting of copper. In our approach, the many-body EAM potential was used for the atoms interaction in the copper workpiece. The effect of the tool geometry on the cutting process was investigated. It is observed that with negative rake angle, the chip becomes smaller due to the larger plastic deformation generated in the workpiece. It is shown that as the rake angle changes from −45° to 45°, the machined surface becomes smoother. Besides, both the cutting forces and the ratio of normal force to tangential force decrease considerably with the rake angle changing from negative to positive. In addition, MD simulations with the two-body Morse potential instead of the EAM potential were also carried out to study the effect of different potentials on the simulation results. It is found that there is no big difference in the simulated chip formation and the machined surface under the two different potentials. However, the Morse potential results in about 5–70% higher cutting forces than the EAM potential. It is recommended that the EAM potential should be used for the MD simulations of nanometric machining processes.