共查询到20条相似文献,搜索用时 46 毫秒
1.
2.
SnAgCu钎料广泛应用在电子组装领域,被认为是传统SnPb钎料的最佳替代品。但与Sn63Pb37钎料相比,SnAgCu钎料抗氧化能力差,钎料内部及焊点界面存在脆性金属间化合物块及服役期间焊点抗蠕变、疲劳性能较低。添加合金元素和纳米颗粒可以显著改善SnAgCu钎料的组织和性能,提高焊点可靠性。这对发展新型高性能无铅钎料是一个行之有效的办法。本文结合国内外SnAgCu系无铅钎料的最新研究成果,全面阐述了合金元素和纳米颗粒等因素对钎料的润湿性、抗氧化性以及焊点显微组织和可靠性的影响,指明了该钎料目前研究中存在的问题及今后的研究方向。 相似文献
3.
4.
5.
综述了近年来国内外无铅钎料的研究开发现状和部分无铅钎料的应用情况。重点介绍了国内外Sn-Ag和Sn-Zn系无铅钎料的研究与发展,以及合金元素对Sn-Ag和Sn-Zn系无铅钎料的微观组织、润湿性、熔点、腐蚀行为等方面的影响,并介绍了微量稀土元素对无铅钎料的组织和性能的影响。 相似文献
6.
7.
元素掺杂的低银SAC无铅钎料综合性能研究 总被引:1,自引:0,他引:1
低Ag(Ag含量<1%,质量分数,下同)的SAC无铅钎料存在润湿性和可靠性不足的问题.为探索解决这些问题,研究了Ag含量、Ni和Bi等合金元素对合金微观组织、润湿性和溶铜性等关键性能的影响.结果表明:Ag含量的变化带来了组织、熔化特征和力学性能的规律性改变;Bi和Ni元素的少量添加能够提高合金的可焊性(润湿性),并降低合金的铜溶解率;SAC0805BiNi钎料的铜溶解率小于SAC0307和SAC305钎料,而润湿性接近SAC305钎料;Ag含量在0 3%~1%之间的合金韧性更好.因此,适当选择Ag含量和采用合适添加元素,成本相对较低的低银无铅钎料综合性能接近SAC305无铅钎料. 相似文献
8.
随着电子器件趋于微型化、多功能化,微电子封装中的焊点与间距互连要求更小,对焊点的可靠性提出了更高的要求,而在电子封装中钎料对焊点可靠性起着至关重要的作用.近年来,人们越来越注重绿色发展理念,对铅的毒性关注度日益增强,并且各国纷纷立法禁止使用含铅钎料,推动了无铅钎料的快速发展.但是,现有无铅钎料均存在成本高、润湿性差、可靠性低等问题.因此,探索并研发性能优异的无铅钎料任重而道远.目前,许多研究者选择在无铅钎料中添加纳米颗粒以增强复合钎料的综合性能,如金属颗粒、金属化合物颗粒、碳基纳米材料等.研究表明,纳米颗粒的加入可以细化钎料基体组织,抑制金属间化合物(IMC)的生长,提高钎料的力学性能.因此,研发颗粒增强型无铅钎料以改善钎料合金的整体性能成为研究的热点.本文综合分析了不同类型、不同尺寸、不同含量的纳米颗粒对无铅钎料组织性能的影响与作用机理,综述了添加纳米颗粒对钎料的显微组织、润湿性能、力学性能、蠕变性能、电迁移特性和可靠性的影响.此外,概述了亚微米颗粒对三维封装互连焊点的改性作用.最后,总结了纳米颗粒增强无铅钎料的不足之处,并对其未来发展进行展望,以期为日后研发高性能的颗粒增强型无铅钎料提供基础理论指导. 相似文献
9.
10.
11.
对国内外无铅焊料发展情况进行了综述,详细分析了当前运用广泛的Sn-Ag,Sn-Cu和Sn-Ag-Cu无铅焊料的相组织、性能等,列举了商业应用中无铅焊料的使用情况,并阐述了无铅焊料的可靠性问题、发展要求以及发展趋势等. 相似文献
12.
Jun SHEN Yongchang LIU Dongjiang WANG Houxiu GAO 《材料科学技术学报》2006,22(4):529-532
A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstrucrural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size of β-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the HalI-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders. 相似文献
13.
Nausha Asrar 《Journal of Failure Analysis and Prevention》2010,10(1):50-55
While most of the industries are striving very hard to produce totally lead-free electronic products, many concerns remain regarding lead-free solder joint reliability. One major concern is the robustness of gold metallization of the electronic components for lead-free soldering. Increasing gold content has been known to result in embrittlement and early failure in electronic assemblies. Therefore, information about the lead-free solder/gold metallization interdiffusion at high-temperature applications is very important for controlling the technological processes for the reliability of the electronic interconnects. The challenges of solder/gold metallization interdiffusion during high-temperature application/test are gold embrittlement, intermetallics growth, void formation, and also tin-whisker formation. This paper illustrates few case histories of such challenges. Importance of the thickness of the gold termination has been discussed and some parameters to optimizing the thickness of the gold termination have been suggested. Some remedial measures are suggested to control the lead-free solder/gold metallization diffusion in the electronics interconnects. 相似文献
14.
为研究P含量对Sn-9Zn-0.1S钎料显微组织、抗氧化性、润湿性及耐腐蚀性能的影响,通过光学显微镜观察钎料的显微组织,采用静态刮渣法测定钎料在不同温度下的抗氧化性能,用润湿铺展面积评价不同温度下钎料在Cu基板上的润湿性,采用腐蚀失重法衡量钎料在pH值为3.7的HCl溶液中的耐腐蚀性,并通过扫描电镜(SEM)和X射线衍射仪(XRD)对钎料在不同温度下的氧化产物和酸性腐蚀条件下形成的腐蚀产物进行形貌观察和物相分析。结果表明:适量P的添加可以细化Sn-9Zn-0.1S钎料层片状共晶组织,但短棒状富Zn相随P的添加而变长、变粗且数量减少;钎料的抗氧化性及润湿性能随P的添加先提高后降低,P含量在0.06%时钎料的抗氧化性及润湿性最好;同时,P通过改善钎料显微组织及腐蚀产物的致密性,提高了钎料的耐腐蚀性能,P含量在0.1%时钎料的耐腐蚀性能较好。 相似文献
15.
Four of the binary lead-free solder alloys of compositions Sn-0.5Cu, Sn-3.5Ag, Sn-5Sb and Sn-9Zn, were rapidly solidified by melt-spinning technique as a technique for producing new alloy compositions. The results show that rapid solidification causes formation of some intermetallic compounds such as Ag3Sn and Cu6Sn5 in the two alloys Sn-3.5Ag and Sn-0.5Cu, which cannot be formed at the equilibrium phase diagram at these compositions; contraction in the volume of the unit cell of the tetragonal Sn; reduction of the melting points due to the decrease in the crystalline size of Sn matrix; and formation of some vacancies in the resulting alloys, which cause reduction of the measured density than that calculated by mixture rule and increase the electrical resistivity. 相似文献
16.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效,采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布.首先建立圆形电路板(PCB)组件的有限元模型,接着用模态试验和有限元模拟相结合的方法确定有限元模型的边界条件和PCB的阻尼参数,然后运用ABAQUS有限元软件模拟PCB组件从三种高度下跌落碰撞过程中BGA封装中无铅焊点的拉应力分布.结果表明:封装最外圈四个拐角焊点的拉应力最大,最大拉应力出现在焊点靠近封装的一侧.由此预测最外圈拐角的焊点最易失效,焊点失效的位置在靠近封装一侧. 相似文献
17.
The electronic SURDAT database published in 2007 (available freely from the website ) is being integrated with the NIST database (available freely from ) to provide a single source for data on lead-free (Pb-free) soldering alloys. The NIST database was developed to support
circuit board designers, and so it is focused primarily on mechanical properties. In contrast, the SURDAT database is focused
primarily on thermophysical properties. Together, they will form a much more complete source for the properties of Pb-free
solder alloys. 相似文献
18.
19.
20.
感应自发热重熔(ISHR)技术在电子互连的应用中具有明显的三维选择性加热和快速加热等优点.该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题,如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等.为此,采用ISHR进行了无铅钎料Sn3.5Ag在Au/Ni/Cu焊盘上的重熔实验、高温老化实验以及凸台剪切实验.由实验结果可知钎料凸台可以提供足够的剪切强度.文中讨论了界面反应和金属间化合物的演化.在老化期间界面处生长了连续的Ni3Sn4金属间化合物层,同时在钎料体内部生成了分散的(Aux,Ni1-x)Sn4化合物.金属间化合物的生长速度与老化时间的平方根成正比。由此可以判断金属间化合物的生长是一种扩散控制过程. 相似文献