A dynamic scaling FFT processor for DVB-T applications

This paper presents an 8192-point FFT processor for DVB-T systems, in which a three-step radix-8 FFT algorithm, a new dynamic scaling approach, and a novel matrix prefetch buffer are exploited. About 64 K bit memory space can be saved in the 8 K point FFT by the proposed dynamic scaling approach. Moreover, with data scheduling and pre-fetched buffering, single-port memory can be adopted without degrading throughput rate. A test chip for 8 K mode DVB-T system has been designed and fabricated using 0.18-/spl mu/m single-poly six-metal CMOS process with core area of 4.84 mm/sup 2/. Power dissipation is about 25.2 mW at 20 MHz.     

High yielding self-aligned contact process for a 0.150-μm DRAMtechnology

This paper describes improvements in the self-aligned contact process for 0.150 μm and 0.175 μm technology generations. Using a dynamic random access memory cell layout, we show that self-aligned contacts can be formed at 0.175 μm ground rules and beyond by using a C₄F₈-CH₂F₂ chemistry. With the improved etch selectivity, gate cap nitride thickness can be reduced, resulting in a smaller aspect ratio for the gate etch, borophosphosilicate glass fill, and contact etch. With a rectangular contact, the area can be increased and the process windows for lithography and etch are improved. The process window for lithography increases by up to 40%, the aspect ratio for the etch and the contact fill is less, and the sensitivity to misalignment is reduced. The combination of rectangular contacts and C₄F₈-CH ₂F₂ chemistry greatly enhances the product yield     

A 64-kbit block addressed charge-coupled memory

This paper describes the design and performance of a 64-kbit (65 536 bits) block addressed charge-coupled serial memory. By using the offset-mask charge-coupled device (CCD) electrode structure to obtain a small cell size, and an adaptive system approach to utilize nonzero defect memory chips, the system cost per bit of charge-coupled serial memory can be reduced to provide a solid-state replacement of moving magnetic memories and to bridge the gap between high cost random access memories (RAM's) and slow access magnetic memories. The memory chip is organized as 64K words by 1 bit in 16 blocks of 4 kbits. Each 4-kbit block is organized as a serial-parallel-serial (SPS) array. The chip is fully decoded with write/recirculate control and two-dimensional decoding to permit memory matrix organization with X-Y chip select control. All inputs and the ouput are TTL compatible. Operated at a data rate of 1 MHz, the mean access time is about 2 ms and the average power dissipation is 1 µW/bit. The maximum output data rate is 10 MHz, giving a mean access time of about 200 µs, and an average power dissipation of 10 µW/bit. The memory chip is fabricated using an n-channel polysilicon gate process. Using tolerant design rules (8-µm minimum feature size and ±2-µm alignment tolerance) the CCD cell size is 0.4 mil²and the total chip size is 218 × 235 mil². The chip is mounted in a 22-pin 400-mil wide ceramic dual in-line package.     

Compiler compatible 5.66 Mb/mm2 8T 1R1W register file in 14 nm FinFET technology

1-read/1-write (1R1W) register file (RF) is a popular memory configuration in modern feature rich SoCs requiring significant amount of embedded memory. A memory compiler is constructed using the 8T RF bitcell spanning a range of instances from 32 b to 72 Kb. An 8T low-leakage bitcell of 0.106 μm² is used in a 14 nm FinFET technology with a 70 nm contacted gate pitch for high-density (HD) two-port (TP) RF memory compiler which achieves 5.66 Mb/mm² array density for a 72 Kb array which is the highest reported density in 14 nm FinFET technology. The density improvement is achieved by using techniques such as leaf-cell optimization (eliminating transistors), better architectural planning, top level connectivity through leaf-cell abutment and minimizing the number of unique leaf-cells. These techniques are fully compatible with memory compiler usage over the required span. Leakage power is minimized by using power-switches without degrading the density mentioned above. Self-induced supply voltage collapse technique is applied for write and a four stack static keeper is used for read Vmin improvement. Fabricated test chips using 14 nm process have demonstrated 2.33 GHz performance at 1.1 V/25 °C operation. Overall V_min of 550 mV is achieved with this design at 25 °C. The inbuilt power-switch improves leakage power by 12x in simulation. Approximately 8% die area of a leading 14 nm SoC in commercialization is occupied by these compiled RF instances.     

A 622-Mb/s 8×8 ATM switch chip set with shared multibufferarchitecture

An asynchronous transfer mode (ATM) switch chip set, which employs a shared multibuffer architecture, and its control method are described. This switch architecture features multiple-buffer memories located between two crosspoint switches. By controlling the input-side crosspoint switch so as to equalize the number of stored ATM cells in each buffer memory, these buffer memories can be treated as a single large shared buffer memory. Thus, buffers are used efficiently and the cell loss ratio is reduced to a minimum. Furthermore, no multiplexing or demultiplexing is required to store and restore the ATM cells by virtue of parallel access to the buffer memories via the crosspoint switches. Access time for the buffer memory is thus greatly reduced. This feature enables high-speed switch operation. A three-VLSI chip set using 0.8-μm BiCMOS process technology has been developed. Four aligner LSIs, nine bit-sliced buffer-switch LSIs, and one control LSI are combined to create a 622-Mb/s 8×8 ATM switching system that operates at 78 MHz. In the switch fabric, 155-Mb/s ATM cells can also be switched on the 622-Mb/s port using time-division multiplexing     

Bipolar dynamic memory cell

A bipolar dynamic memory cell for use in a high-speed random- access memory consists of a cross-coupled pair of transistors and two diodes. Information is dynamically stored using a bistable charge distribution and must be refreshed at a frequency of 1 kHz by a SELECT operation. Standby power per memory cell is in the nanowatt range. The cell requires only 3 interconnect lines and can be fabricated with standard bipolar technology on 12-mil/SUP 2/ silicon area. Cycle time is limited by the speed of decoding, driving, and sensing circuits and is estimated to be 50 ns for a 512-bit RAM chip with complete on-chip decoding.     

A surface-charge random-access memory system

The authors present a surface-charge storage cell suitable for word-organized dynamic random-access memory and discuss its operation in a memory system. Experimental results and computer simulations of the readout process on a 4/spl times/8 array using this cell are given. A sensitive stable sense-and-refresh amplifier, suitable for use with this memory cell is also described. Simulations of a 4096-bit chip with a storage cell density of 2.5 mils/SUP 2//bit using this refresh amplifier predict a cycle time of 250 ns.     

A new low-power GaAs two-single-port memory cell

This paper describes an experimental static memory cell in GaAs MESFET technology. The memory cell has been implemented using a mix of several techniques already published in order to overcome some of their principal drawbacks related to ground shifting, destructive readout, and leakage current effects. The cell size is 36×37 μm² using a 0.6-μm technology. An experimental 32 word × 32 bit array has been designed. From simulation results, an address access time of 1 ns has been obtained. A small 8 word×4 bit protoype was fabricated. The cell can be operated at the single supply voltage from 1 up to 2 V. The evaluation is provided according to the functionality and power dissipation. Measured results show a total current consumption of 14 μA/cell when operated at 1 V     

A high-performance silicon tactile imager based on a capacitive cell

An 8 × 8-element silicon-based tactile imager fabricated using integrated-circuit process technology is described. The imager consists of an X-Y organized array of capacitive force sensors on 2-mm centers. Each transducer has a zero-pressure capacitance of 1.6 pF, an average sensitivity of 60 mV/g, and a maximum operating force of about 10 g/element. The operating force can be scaled over a wide range without changing the process or lateral array dimensions. The array is read out using a switched-capacitor charge integrator which has been shown capable of a resoiutionof about 1 fF(5 fC), giving a resolution for the imager itself (pad excluded) of more than 8 bit. The readout scheme permits off-chip electronics to be used so that the fabrication sequence requires only five noncritical masks. The array is addressed as a memory, with an access time of less than 20 µsec for 8 pixels. Scaling of the array size to other dimensions is examined and performance limitations are discussed.     

Implementation of a fuzzy controller for DC-DC converters using aninexpensive 8-b microcontroller

This paper presents an implementation of a fuzzy controller for DC-DC power converters using an inexpensive 8-bit microcontroller. An “on-chip” analog-to-digital (A/D) converter and PWM generator eliminate the external components needed to perform these functions. Implementation issues include limited on-chip program memory of 2 kB, unsigned integer arithmetic and computational delay. The duty cycle for the DC-DC power converter can only be updated every eight switching cycles because of the time required for the A/D conversion and the control calculations. However, it is demonstrated here that stable responses can be obtained for both buck and boost power converters under these conditions. Another important result is that the same microcontroller code, without any modifications, can control both power converters because their behavior can be described by the same set of linguistic rules. The contribution shows that a nonlinear controller such as fuzzy logic can be inexpensively implemented with microcontroller technology     

Novel ultrahigh-density flash memory with a stacked-surrounding gate transistor (S-SGT) structured cell

In order to overcome the limitation of cell area of 4F/sup 2/ per bit in conventional NAND flash memory cells, stacked-surrounding gate transistor (S-SGT) structured cell is proposed. This newly structured cell achieves a cell area of 4F/sup 2//N per bit, where N is the number of stacked memory cells in one silicon pillar, without using multibit per memory cell technology. The S-SGT structured cell consisting of two stacked memory cells in one silicon pillar achieves a cell area per bit of less than 50% of the smallest reported NAND structured cell. The novel S-SGT structured cells are fabricated by vertical self-aligned processes using a 0.2 /spl mu/m design rule. The S-SGT structured cell can be programmed and erased by uniform injection and uniform emission of Fowler-Nordheim (F-N) tunneling electrons over the whole channel area of the memory cell, respectively, which is the same program and erase mechanism as in conventional NAND structured cell. This high performance S-SGT structured cell is applicable to high-density nonvolatile memories for 16 G/64 G bit Flash memories and beyond.     

A 45 nm 2-port 8T-SRAM Using Hierarchical Replica Bitline Technique With Immunity From Simultaneous R/W Access Issues

We propose a new 2-port SRAM with a single read bit line (SRBL) eight transistors (8 T) memory cell for a 45 nm system-on-a-chip (SoC). Access time tends to be slower as a fabrication is scaled down because of threshold voltage (V_t) random variations. A divided read bit line scheme with shared local amplifier (DBSA) realizes fast access time without increasing area penalty. We also show an additional important issue of a simultaneous read and write (R/W) access at the same row by using DBSA with the SRBL-8T cell. A rise of the storage node causes misreading. A read end detecting replica circuit (RER) and a local read bit line dummy capacitance (LDC) are introduced to solve this issue. A 128 bit lines - 512 word lines 64 kb 2-port SRAM macro using these schemes was fabricated by a 45 nm bulk CMOS low-standby-power (LSTP) CMOS process technology [1]. The memory cell size is 0.597 mum². This 2-port SRAM macro achieves 7 times faster access time without misreading.     

Nonvolatile flash memory device using Ge nanocrystals embedded in HfAlO high-/spl kappa/tunneling and control oxides: Device fabrication and electrical performance

We fabricated a nonvolatile Flash memory device using Ge nanocrystals (NCs) floating-gate (FG)-embedded in HfAlO high-/spl kappa/ tunneling/control oxides. Process compatibility and memory operation of the device were investigated. Results show that Ge-NC have good thermal stability in the HfAlO matrix as indicated by the negative Gibbs free energy changes for both reactions of GeO/sub 2/+Hf/spl rarr/HfO/sub 2/+Ge and 3GeO/sub 2/+4Al/spl rarr/2Al/sub 2/O/sub 3/+3Ge. This stability implies that the fabricated structure can be compatible with the standard CMOS process with the ability to sustain source-drain activation anneal temperatures. Compared with Si-NC embedded in HfO/sub 2/, Ge-NC embedded in HfAlO can provide more electron traps, thereby enlarging the memory window. It is also shown that this structure can achieve a low programming voltage of 6-7 V for fast programming, a long charge retention time of ten years maintaining a 0.7-V memory window, and good endurance characteristics of up to 10/sup 6/ rewrite cycles. This paper shows that the Ge-NC embedded in HfAlO is a promising candidate for further scaling of FG Flash memory devices.     

A fault-tolerant associative memory with high-speed operation

An 8-kb (128-word×64-b) CMOS associative memory with word and bit-parallel operation is described. The highly parallel and pipelined architecture is optimized for high-speed associative operations. The data processing capability is one word/cycle corresponding to 16 MIPS at a typical cycle time of 60 ns. The memory is fault tolerant under software control. A faulty word location in the memory can be made inaccessible by on-chip circuitry. The device is a complete single-chip associative memory with internally controlled addressing and associative data as output     

Quadruply self-aligned stacked high-capacitance RAM using Ta2O5high-density VLSI dynamic memory

A new one-transistor, one-capacitor RAM cell structure called a Quadruply Self-Aligned Stacked High Capacitance (QSA SHC) RAM is proposed as a basic cell for a future one-million-bit VLSI memory. This cell consists of a QSA MOSFET and a Ta2O5capacitor stacked on it. By this cell, the ultimate cell area3F times 2Fcan be realized with sufficient operating margin. Here,Fis the minimum feature size. The basic cell was fabricated and its operation was experimentally verified. The leakage current of Ta2O5film was small enough for the storage capacitor dielectric. Using a3F times 4Fcell and a4Fpitch sense amplifier, a one-million-bit memory was designed with a 2-µm rule. A cell size of 6.5 × 8 µm², and a chip size of 9.2 × 9.5 mm²were obtained. The access time, neglecting the RC time constant of the word line, was estimated to be about 170 ns. Based on this design, it is argued that a future one-million-bit memory can be realized by QSA SHC technology with a 2-1-µm process. The mask set of the 1-Mbit RAM was actually fabricated by an electron-beam mask maker. A photomicrograph of the 1-Mbit RAM chip patterned by the mask set is shown. This chip was patterned not to get an operating sample but to show an actual chip image of the future 1- Mbit RAM. The area of each circuit block including storage array can be seen in this chip image.     

120-ns 128 K*8-bit/64 K*16-bit CMOS EEPROMs

A 1-Mbit CMOS full-featured EEPROM using a 1.0- mu m triple-polysilicon and double-metal process is described. The design is aimed at developing a manufacturable 120-ns 1-Mbit EEPROM with small chip size. Therefore, an advanced memory cell with high read current, an improved differential sensing technique, and an efficient ECC scheme are developed. The differential sensing amplifier utilizes the output of a current sensing amplifier connected to unselected memory as a reference level. The cell size is 3.8*8 mu m/sup 2/ and the chip size is 7.73*11.83 mm/sup 2/. The device is organized as either 128 K*8 or 64 K*16 by via-hole mask options. A 256-byte/128-word page-mode programming is implemented.<>     

Direct Observation of Ag Filamentary Paths in Organic Resistive Memory Devices

We demonstrate bipolar switching of organic resistive memory devices consisting of Ag/polymer/heavily‐doped p‐type poly Si junctions in an 8 × 8 cross‐bar array structure. The bistable switching mechanism appears to be related to the formation and rupture of highly conductive paths, as shown by a direct observation of Ag metallic bridges using transmission electron microscopy and energy‐dispersive X‐ray spectroscopy. Current images of high‐ and low‐conducting states acquired by conducting atomic force microscopy also support this filamentary switching mechanism. The filamentary formation can be described by an electrochemical redox reaction model of Ag. Our results may also be applied to other kinds of organic materials presenting similar switching properties, contributing to the optimization of device scaling or memory performance improvement.     

N-type polymeric organic flash memory device: Effect of reduced graphene oxide floating gate

In this paper, n type nonvolatile memory devices were fabricated by implanting a bilayer (rGO sheets/Au NP) floating gates, using n-type polymer semiconductor, poly {[N, N′ bis (2octyldodecyl) - naphthalene-1, 4, 5, 8 - bis (dicarboximide)-2,6-diyl] – alt - 5,5′ - (2, 2′ bithiophene)} [P(NDI2OD-T2)n]. In the developed organic field effect transistor memory devices, electrons are trapped/detrapped in rGO sheet/Au NP's nano-floating gates by controlling the charge carrier density in the active layer through back gate bias control. The devices showed interesting non-volatile memory properties with a large memory window of ∼34 V, a programming-reading-erasing cycling endurance of 103 times and most importantly, an improved retention time characteristics estimated by extrapolation (longer than the technological requirement of commercial memory devices (>10 years)). This approach provides a great potential for fabricating high-performances organic nano-floating gate memory devices and opens up a new way for the development of next-generation non-volatile memory devices.     

A novel MONOS-type nonvolatile memory using high-/spl kappa/ dielectrics for improved data retention and programming speed

This paper presents a novel metal-oxide-nitride-oxide-silicon (MONOS)-type nonvolatile memory structure using hafnium oxide (HfO/sub 2/) as tunneling and blocking layer and tantalum pentoxide (Ta/sub 2/O/sub 5/) as the charge trapping layer. The superiorities of such devices to traditional SiO/sub 2/-Si/sub 3/N/sub 4/-SiO/sub 2/ stack devices in obtaining a better tradeoff between faster programming and better retention are illustrated based on a band engineering analysis. The experimental results demonstrate that the fabricated devices can be programmed as fast as 1 /spl mu/s and erased from 10 ns at an 8-V gate bias. The retention decay rate of this device is improved by a factor more than three as compared to the conventional MONOS/SONOS type devices. Excellent endurance and read disturb performance are also demonstrated.     

A 7-ns 140-mW 1-Mb CMOS SRAM with current sense amplifier

A 7-ns 140-mW 1-Mb CMOS SRAM was developed to provide fast access and low power dissipation by using high-speed circuits for a 3-V power supply: a current-sense amplifier and pre-output buffer. The current-sense amplifier shows three times the gain of a conventional voltage-sense amplifier and saves 60% of power dissipation while maintaining a very short sensing delay. The pre-output buffer reduces output delays by 0.5 ns to 0.75 ns. The 6.6-μm² high-density memory cell uses a parallel transistor layout and phase-shifting photolithography. The critical charge that brings about soft error in a memory cell can be drastically increased by adjusting the resistances of poly-PMOS gate electrodes. This can be done without increasing process complexity or memory cell area. The 1-Mb SRAM was fabricated using 0.3-μm CMOS quadrupole-poly and double-metal technology. The chip measures 3.96 mm×7.4 mm (29 mm²)