Grafting of Epoxy Resin on Surface-modified Poly(tetrafluoroethylene) Films

An epoxy/PTFE composite was prepared by curing the epoxy resin on the surface-modified PTFE film. Surface modification of PTFE films was carried out via argon plasma pretreatment, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The film composite achieved a 90°-peel adhesion strength above 15 N/cm. The strong adhesion of the epoxy resin to PTFE arose from the fact that the epoxide groups of the grafted GMA chains were cured into the epoxy resin matrix to give rise to a highly crosslinked interphase, as well as the fact that the GMA chains were covalently tethered on the PTFE film surface. Delamination of the composite resulted in cohesive failure inside the PTFE film and gave rise to an epoxy resin surface with a covalently-adhered fluoropolymer layer. The surface composition and microstructures of the GMA graft-copolymerized PTFE (GMA-g-PTFE) films and those of the delaminated epoxy resin and PTFE film surfaces were characterized by X-ray photoelectron spectroscopy (XPS), water contact angle and scanning electron microscope (SEM) measurements. The delaminated epoxy resin surfaces were highly hydrophobic, having water contact angles of about 140°C. The value is higher than that of the pristine PTFE film surface of about 110°. The epoxy resin samples obtained from delamination of the epoxy/GMA-g-PTFE composites showed a lower rate of moisture sorption. All the fluorinated epoxy resin surfaces exhibited rather good stability when subjected to the Level 1 hydrothermal reliability tests.     

Modification of poly(tetrafluoroethylene) and copper foil surfaces by graft polymerization for adhesion improvement

Thermal graft polymerization-induced lamination of surface-modified copper foil to surface-modified poly(tetrafluoroethylene) (PTFE) film was achieved in the presence of an epoxy resin adhesive and glycidyl methacrylate (GMA) monomer, or in the presence of GMA and hexamethylenediamine (HEDA). The copper foil surfaces were pretreated with an organosilane coupling agent (SCA), such as (3-mercaptopropyl)trimethoxysiane, 3-(trimethoxysilyl)propyl methacrylate, or N¹-[3-(trimethoxysilyl)propyl]diethylene-triamine. The silanized copper foils were subjected to brief Ar plasma treatment and subsequently to UV-induced graft polymerization with GMA (the Cu-SCA-g-GMA surface). Surface modification of PTFE film included Ar plasma treatment alone, or Ar plasma pretreatment followed by UV-induced graft polymerization with GMA (the GMA-g-PTFE surface). The modified surfaces and interfaces were characterized by X-ray photoelectron spectroscopy (XPS) and water contact angle measurements. The Cu-SCA-g-GMA/epoxy resin-GMA/PTFE or Cu-SCA-g-GMA/GMA–HEDA/GMA-g-PTFE laminates exhibited T-peel adhesion strengths in excess of 9 N/cm and the joints delaminated by cohesive failure inside the bulk of the PTFE film. The strong adhesion in these Cu foil-PTFE laminates is attributable to the fact that the GMA chains are covalently tethered on both the PTFE and the silanized Cu surfaces, as well the fact that these grafted GMA chains are covalently incorporated into the highly crosslinked network structure of the adhesive at the interphase.     

Thermal imidization of poly(amic acid) precursors on surface-modified poly(tetrafluoroethylene) films via graft copolymerization with glycidyl methacrylate

A novel method for preparing composites of polyimides (PI) laminated to poly(tetrafluoroethylene) (PTFE) films is reported. PI/PTFE composites were developed through thermal imidization of poly(amic acid) (PAA) precursors on surface-modified PTFE films. Surface modification of PTFE films was carried out via Ar plasma pretreatment of the films, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The surface composition and topography of the graft copolymerized PTFE films and the delaminated PI and PTFE surfaces were characterized by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM), respectively. The adhesion strengths of the PI (imidized PAA) on the GMA graft copolymerized PTFE films were evaluated as a function of various thermal imidization schedules. The adhesion reliability of the PI/PTFE composites was tested by a series of hydrothermal cycles. The development of strong Tpeel adhesion strengths of about 8 N/cm with excellent reliability for the PI/PTFE composites was attributable to the synergistic effect of coupling the curing of the epoxide functional groups of the grafted GMA chains with the imidization process of the PAA and the fact that the GMA chains were covalently tethered onto the PTFE surface. The PI/PTFE composites delaminated via cohesive failure inside the PTFE substrates. The delaminated PI film with a covalently adhered 'rough' PTFE surface layer exhibited a water contact angle as high as 140°.     

Surface structures and adhesion enhancement of poly(tetrafluoroethylene) films after modification by graft copolymerization with glycidyl methacrylate

Surface modifications of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) film were carried out via near-UV light-induced graft copolymerization with glycidyl methacrylate (GMA). The structure and chemical composition of the copolymer surface and interface were studied by angle-resolved X-ray photoelectron spectroscopy (XPS). For PTFE substrate with a substantial amount of grafting, the grafted GMA polymer penetrates or becomes partially submerged beneath a thin surface layer of dense substrate chains to form a stratified surface microstructure. The concentration of the surface-grafted GMA polymer increases with the plasma pretreatment time, the near-UV light illumination time, and the monomer concentration. The GMA graft copolymerized PTFE surfaces adhere strongly to one another when brought into direct contact and cured (i) in the presence of a diamine alone or (ii) in the presence of an epoxy adhesive (epoxy resin plus diamine curing agent). In the presence of diamine alone, failure occurs in the interfacial region. For epoxy adhesive-promoted adhesion, the failure mode is cohesive, i.e. it takes place in the bulk of one of the delaminated PTFE films. The lap shear strengths in both cases increase with the amount of surface-grafted epoxide polymer. The development of the adhesion strength depends on the concentration of the surface graft, the microstructure of the graft copolymerized PTFE surface, the interfacial reactions, and the nature of the bonding agent.     

Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper

Surface modification of H₂ plasma-pretreated poly(tetrafluoroethylene) (PTFE) films, either by plasma polymerization and deposition of GMA, or by UV-induced graft copolymerization with glycidyl methacrylate (GMA), was carried out for adhesion enhancement with the electrolesslydeposited copper. XPS and FTIR results revealed that the epoxide groups in the plasma-polymerized GMA (pp-GMA) layer had been preserved to various extents, depending on the glow discharge conditions. The T-peel adhesion test results showed that the adhesion strengths of the electrolesslydeposited copper on both the pp-GMA modified PTFE (pp-GMA-PTFE) film and the GMA graftcopolymerized PTFE (GMA-g-PTFE) film were much higher than that of the electrolessly-deposited copper on the pristine or the H₂ plasma-treated PTFE film. The high adhesion strength between the electrolessly-deposited copper and the surface-modified PTFE film was attributed to the fact that the plasma-polymerized and the UV graft-copolymerized GMA chains were covalently tethered on the H₂ plasma-pretreated PTFE surface, as well as the fact that these GMA chains were spatially and interactively distributed into the copper matrix.     

Modification of poly(tetrafluoroethylene) and gold surfaces by thermal graft copolymerization for adhesion improvement

The adhesion between a poly(tetrafluoroethylene) (PTFE) film and a gold substrate was achieved by surface graft copolymerization of glycidyl methacrylate (GMA) on an argon plasma-pretreated PTFE film at elevated temperature with simultaneous lamination to a surface-modified gold substrate. The plasma pretreatment introduces peroxides which are thermally degraded into radicals to initiate the graft copolymerization of GMA on the PTFE surface. The gold surface, on the other hand, was first pretreated with 3-mercaptopropionic acid (MPA), 3-mercaptopropionic acid-2-ethylhexyl ester (MPAEE), or (3-mercaptopropyl)trimethoxysilane (MPTMS) to form self-assembled monolayers (SAMs) and then subjected to Ar plasma treatment. The simultaneous graft copolymerization and lamination of the PTFE film to the gold surface was carried out in the presence of GMA and an amine hardener at an elevated temperature under atmospheric conditions. The modified surfaces and interfaces were characterized by X-ray photoelectron spectroscopy (XPS) and contact angle measurements. The gold/GMA/PTFE assembly exhibited a T-peel adhesion strength above 10 N/cm and the joint delaminated by cohesive failure inside the bulk of the PTFE film. The strong adhesion of the Au/PTFE laminate is the result of concurrent graft copolymerization on both the Ar plasma-pretreated PTFE surface and the SAM of the Au surface to form a covalent network. The network is further strengthened by the crosslinking reaction promoted by the presence of the hardener.     

Adhesion enhancement of thermally evaporated aluminum to surface graft copolymerized poly(tetrafluoroethylene) film

Surface modifications of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) film via UV-induced graft copolymerization with glycidyl methacrylate (GMA) and 1-vinylimidazole (VIDz) were carried out to improve the adhesion with evaporated aluminum metal. The surface compositions of the graft copolymerized PTFE films were studied by X-ray photoelectron spectroscopy (XPS). The adhesion strength of the evaporated aluminum to the surface graft copolymerized PTFE film was affected by the type of monomer used for graft copolymerization, the graft concentration, the plasma post-treatment of the graft copolymerized PTFE surface prior to metallization, and the extent of thermal treatment after metallization. The optimum T-peel adhesion strengths of the Al/PTFE laminates were in excess of 10 and 5 N/cm, respectively, for the GMA and VIDz graft copolymerized PTFE films. These adhesion strengths are significantly higher than those obtained between the evaporated aluminum and the pristine or plasma-pretreated PTFE film. The mechanism of adhesion enhancement and the failure of the metal-polymer assembly were also investigated. It was observed that the failure occurred within the PTFE film. The strong adhesion between Al and PTFE arises from the charge-transfer interaction between the Al atom and the epoxide moiety of the grafted GMA polymer, as well as from the fact that the graft chains are covalently tethered on the PTFE film surface as a result of the grafting process.     

Lamination of conductive polypyrrole films to poly(tetrafluoroethylene) films via interfacial graft copolymerization

A simple technique for the lamination of a conductive polymer film to an inert dielectric polymer film was demonstrated. The electrochemically synthesized and p‐toluenesulfonic acid‐doped polypyrrole (PPY) film was laminated simultaneously to the argon plasma‐pretreated PTFE film during the thermally induced graft copolymerization of the PTFE surface with a functional monomer. The graft copolymerization was carried out using glycidyl methacrylate (GMA) monomer containing 20% v/v hexamethyldiamine (HMDA) and in the absence of any polymerization initiator. Thermally induced graft copolymerization of the GMA monomer on the PPY surface was minimal. The lap shear and T‐peel adhesion strengths of the laminates were found to be dependent on the GMA graft concentration on the PTFE surface, which, in turn, was affected by the plasma pretreatment time of the film. To increase the GMA graft concentration for the enhancement of adhesion strength, the plasma‐pretreated PTFE surfaces were premodified via UV‐induced graft copolymerization with GMA prior to the simultaneous thermal graft copolymerization and lamination process. The modified surfaces and interfaces were characterized by X‐ray photoelectron spectroscopy (XPS). Through XPS measurements of the delaminated surfaces, it was found that the PPY/PTFE laminates failed predominantly by cohesive failure inside the PTFE substrate. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 716–727, 2001     

Fluorination of epoxy surfaces by a physical method

To enhance the surface hydrophobicity of epoxy polymers, a simple physical method for the simultaneous surface fluorination during curing of epoxy resins was proposed and evaluated. Curing of epoxy resins against a polytetrafluoroethylene (PTFE) mold gave rise to fluorinated epoxy polymer surfaces due to the anchorage of PTFE molecules on the epoxy polymer surface. The modified epoxy surfaces were characterized using contact‐angle measurements and X‐ray photoelectron spectroscopy (XPS). The fluorinated epoxy resin surfaces are highly hydrophobic, exhibiting contact angles of similar magnitude to that of the pristine PTFE film surface. The PTFE mold can be used repeatedly to give fluorinated epoxy surfaces with large contact angles. Aging and solvent extraction tests indicated that the fluorinated epoxy surfaces were very stable. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 296–304, 2000     

Surface modification of plasma‐pretreated high density polyethylene films by graft copolymerization for adhesion improvement with evaporated copper

Surface modification of Ar plasma‐pretreated high density polyethylene (HDPE) film via UV‐induced graft copolymerization with glycidyl methacrylate (GMA) and 2‐hydroxyethylacrylate (HEA) was carried out to improve the adhesion with evaporated copper. The surface compositions of the modified HDPE surfaces were characterized by X‐ray photoelectron spectroscopy (XPS). The adhesion strengths of evaporated copper with the graft‐copolymerized HDPE films were affected by the Ar plasma pretreatment time, the monomer concentration used for graft copolymerization, and the graft concentration. Post‐treatments, such as plasma post‐treatments after graft copolymerization and thermal treatment (curing) after metalization, further enhanced the adhesion strength of the Cu/HDPE laminates. The T‐type peel strengths of the laminates involving the graft‐modified and plasma posttreated HDPE films were greater than 15 N/cm. The enhanced adhesion strength resulted from the strong affinity of the graft chains for Cu and the fact that the graft chains were covalently tethered on the HDPE surface. XPS characterization of the delaminated surfaces of the Cu/HDPE laminates revealed that the failure mode of the laminates with T‐peel adhesion strengths greater than 5 N/cm was cohesive in nature.     

Thermal conductivity and dynamic mechanical property of glycidyl methacrylate‐grafted multiwalled carbon nanotube/epoxy composites

The well dispersed multiwalled carbon nanotube (MWCNT)/epoxy composites were prepared by functionalization of the MWCNT surfaces with glycidyl methacrylate (GMA). The morphology and thermal properties of the epoxy nanocomposites were investigated and compared with the surface characteristics of MWCNTs. GMA‐grafted MWCNTs improved the dispersion and interfacial adhesion in epoxy resin, and enhanced the network structure. The storage modulus of 3 phr GMA‐MWCNTs/epoxy composites at 50°C increased from 0.32 GPa to 2.87 GPa (enhanced by 799%) and the increased tanδ from 50.5°C to 61.7°C (increased by 11.2°C) comparing with neat epoxy resin, respectively. Furthermore, the thermal conductivity of 3 phr GMA‐MWCNTs/epoxy composite is increased by 183%, from 0.2042 W/mK (neat epoxy) to 0.5781 W/mK. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Surface modification of poly(tetrafluoroethylene) films by graft copolymerization for adhesion enhancement with electrolessly deposited copper

The surface modification of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) films via UV-induced graft copolymerization with either 3-(trimethoxysilyl)propyl methacrylate (TM-SPMA) or glycidyl methacrylate (GMA) was carried out to enhance their adhesion to electrolessly deposited copper. The surface compositions of the PTFE films at various stages of surface modification and electroless plating were studied by X-ray photoelectron spectroscopy (XPS). The adhesion strength of the graft-copolymerized PTFE film to the electrolessly deposited copper was affected by the type of monomer used for graft copolymerization, the graft concentration, the plasma post-treatment time after graft copolymerization, and the extent of thermal post-treatment after metallization. The maximum T-peel strength achieved between the electrolessly deposited copper and the GMA graft-copolymerized PTFE film was about 11 N/cm. This adhesion strength represented a more than 20-fold increase over what could be achieved when the PTFE film was treated by Ar plasma alone. The mechanisms of the adhesion strength enhancement and the failure mode in the metal-polymer laminates were also investigated. It was found that the failure was cohesive in nature within the PTFE film.     

Surface Modification of Poly(Tetrafluoroethylene) Films by Graft Copolymerization for Adhesion Improvement with Sputtered In-Sn Oxides

Surface modification of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) films was carried out via UV-induced graft Copolymerization with glycidyl methacrylate (GMA), acrylamide (AAm) and hydroxylethylacrylate (HEA) to improve the adhesion strength with sputtered indium-tin-oxide (ITO). The surface compositions of the graftcopolymerized PTFE films were studied by X-ray photoelectron spectroscopy (XPS). The graft yield increases with increasing monomer concentration and Ar plasma pre-treatment time of the PTFE films. The T-peel adhesion strength was affected by the type of monomer used for graft Copolymerization, the graft concentration, and the thermal post-treatment after ITO deposition. A double graft-copolymerization process, which involved initially the graft copolymeri/ation with AAm or HEA, followed by graft Copolymerization with GMA. was also employed to enhance the adhesion of sputtered ITO to PTFE. T-peel adhesion strengths in excess of 8 N cm were achieved in the ITO graft-modified PTFE laminates. The adhesion failure of the ITO/PTFE laminates in T-peel tests was found to occur inside the PTFE films. The electrical resistance of ITO on all graft-modified PTFE surfaces before and after thermal post-treatment remained conslant at about 30 Ω square, suggesting that the graft layer did not have any significant effect or. the electrical properties of the deposited ITO.     

Surface modification of aromatic polyamide film by plasma graft copolymerization of glycidylmethacrylate for epoxy adhesion

The graft copolymerization of glycidyl methacrylate, GMA, onto poly(p-phenylene terephthalamide), PPTA, film surfaces was investigated to improve adhesion between the PPTA film and epoxy adhesives. The graft copolymerization of GMA was carried out in two steps; a peroxide formation by a combination of argon plasma irradiation and air exposure, and the polymerization reactions of GMA. XPS analyses showed the graft copolymerization of GMA on the PPTA film surface, and only 31–40% of the PPTA film surface was covered with the GMA graft polymers. The graft copolymerization of GMA improved the adhesion between the PPTA film and the epoxy adhesive. The adhesion strength was improved 2.7 times by the graft copolymerization. The failure from the adhesive joint occurred in the epoxy adhesive layer rather than at the interface between the PPTA film and the epoxy adhesive layer. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 69: 1179–1185, 1998     

Improvement of adhesion between poly(ethylene terephthalate) and polyethylene

Three-layer films were prepared with polyethylene (PE) and poly(ethylene terephthalate) (PET) films as the outer layers and a film of high-density polyethylene (HDPE)/ethylene-methyl acrylate-glycidyl methacrylate (E-MA-GMA) terpolymer blend as the inner layer using compression molding. E-MA-GMA, an elastomer containing an epoxy functional group, was used as the adhesion promoting agent in the multilayer films. The effects of processing temperature, pressure application time and elastomer concentration on adhesion were investigated. The adhesion strength between PE and PET films increased with increasing bonding temperature, bonding time and elastomer concentration. From contact angle measurements, it was observed that the work of adhesion between the polymers increased with increasing amount of elastomer. Improved adhesion between PET and HDPE with 30% elastomer films was confirmed by SEM analyses of the film layers. Using FT-IR analysis of PE/HDPE-30% elastomer/PET delaminated film, the decrease in peak intensity of the epoxy groups tends to indicate reaction of epoxy functionality with functional groups in PET.     

Thermal imidization of poly(amic acid) on Si(100) surface modified by plasma polymerization of glycidyl methacrylate

The plasma polymerization of glycidyl methacrylate (GMA) on pristine and Ar plasma-pretreated Si(100) surfaces was carried out. The epoxide functional groups of the plasma-polymerized GMA (pp-GMA) could be preserved, to a large extent, through the control of the glow discharge parameters, such as the radio-frequency (RF) power, carrier gas flow rate, system pressure, and monomer temperature. The pp-GMA film was used as an adhesion promotion layer for the Si substrate. The polyimide (PI)/pp-GMA-Si laminates, formed by thermal imidization of the poly(amic acid) (PAA) precursor poly(pyromellitic dianhydride-co-4,4′-oxydianiline) (PMDA-ODA) on the pp-GMA-deposited Si surface (the pp-GMA-Si surface), exhibited a 180°-peel adhesion strength as high as 9.0 N/cm. This value was much higher than the negligible adhesion strength for the PI/Si laminates obtained from thermal imidization of the PAA precursor on both the pristine and the argon plasma-pretreated Si(100) surfaces. The high adhesion strength of the PI/pp-GMA-Si laminates was attributed to the synergistic effect of coupling the curing of epoxide functional groups in the pp-GMA layer with the imidization process of the PAA, and the fact that the plasma-deposited GMA chains were covalently tethered onto the Si(100) surface. The chemical composition and structure of the deposited films were characterized, respectively, by X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy, while the surface morphology of the deposited films was characterized by atomic force microscopy (AFM).     

Functionalization and metallization of fluoropolymer surfaces through reduction1,2

Fluoropolymer films, such as Teflon?-TFE [poly(tetrafluoroethylene)], Teflon?-FEP [copolymer of tetrafluoroethylene and hexafluoropropylene], Teflon?-PFA [copolymer of tetrafluoroethylene and perfluoro(propyl vinyl ether)], and PCTFE [poly(chlorotrifluoroethylene)], are reduced by the mild reducing agent benzoin dianion/DMSO, while Teflon?-AF [copolymer of tetrafluoroethylene and perfluoro-2,2-dimethyl-1,3-dioxole] is unreactive. The reduction makes the films adherable toward epoxy resins, the adhesive strength decreasing in the order PCTFE>PFA≥FEP>PTFE. Surprisingly, Teflon?-AF films are totally inert except when the TFE content is high, and in these cases the adhesive strength of Teflon?-AF is close to that of PTFE. The surfaces of PTFE, FEP and PFA films are further modified by first treating these films with the benzoin dianion/DMSO reagent and then with an excess of sodium salts of mercaptans. Reactive PTFE films that are light colored with a metallic luster are formed rather than the dark, metallic color typical of PTFE surface reduction without mercaptan treatment. These films have poor adhesion toward epoxy resins but good adhesion toward gold applied by sputtering. FEP and PFA films behaved similarly. These results are attributed to the incorporation of sulfur onto the reduced surface. Unreduced fluoropolymer films reacted with only sodium mercaptan fail to show C—S bond incorporation. This newly developed method can be used to selectively metallize the fluoropolymer film surface with gold layers and affords very high conductivity of the metallized regions. © 1995 John Wiley & Sons, Inc.     

Surface modification of epoxy resin with fluorine-containing methacrylic ester copolymers

To improve oil and water repellency, fluorine-containing block copolymers, which were composed of methyl methacrylate (MMA), glycidyl methacrylate (GMA), and 1H, 1H, 2H, 2H-heptadecafluorodecyl acrylate (PFA), were blended with an epoxy resin. It was expected that a glycidyl group would mesh with the epoxy resin by primary bonding, and the low surface energy fluorocarbon segment would absorb and orient to the exterior to fluorinate the surface. X-ray photoelectron spectroscopy, contact angle, and peel strength of pressure-sensitive adhesives for modified epoxy resin surface were determined. The amount of fluorine obtained via angular-dependent ESCA investigation in the modified resin surfaces increased with the shallowing of the sampling depth. With increasing modifier content, the amount of fluorine in the modified resin surface layer increased, and the critical surface tension of modified resin surfaces and the peel strength of a silicone pressuresensitive adhesive affixed to the modified epoxy resin, decreased. A considerable amount of fluorine in the resin surface modified with GMA-containing block copolymers remained after Soxhlet extraction, whereas in the surface modified with copolymer without GMA, more fluorine was extracted. It was extracted. It was shown that these copolymers were good surface modifiers to improve oil and water repellency. © 1993 John Wiley & Sons, Inc.     

A FT-IR Reflection-Absorption Spectroscopic Study of an Epoxy Coating on Imidazole-Treated Copper

The effects of undecylimidazole complex on copper and untreated copper surfaces on polymerization of an epoxy resin were studied using FT-IR reflection-absorption spectroscopy. Catalytic effects have been observed on the polymerization of epoxy resin by the copper/imidazole complex and the copper surface. The epoxy resin showed an appreciable amount of polymerization on the imidazole complex at 100°C on copper. The thickness of the epoxy coating was increased while the imidazole complex dissolved into the bulk resin above this temperature. However, only a small amount of epoxy resin remained on the copper at elevated temperature. This phenomenon was observed only with the imidazole treated copper surface. The epoxy resin without any added catalysts polymerized above 150°C on untreated copper surface. The coating thickness increased rapidly and reached the asymptotic value (2.0 nm) at 150°C. A thicker and random layer was formed at elevated temperatures. The coating thickness was estimated from a calibration curve.     

Surface and Interfacial Studies of Plasma-Modified Composite Surfaces

Model epoxy and bismaleimide compounds in thin film form were used to simulate epoxy and bismaleimide composite surfaces, in order to study compositional changes and interfacial reactions induced by oxygen plasma treatment. X-ray photoelectron spectroscopy (XPS) and infrared reflection-absorption spectroscopy (IR-RAS) were used to probe chemical changes which occurred. XPS and IR-RAS were found to be complementary techniques in determining the nature of functional groups incorporated into surfaces by plasma treatment. IR-RAS analysis of the model surfaces following exposure to a liquid epoxy resin revealed that while adsorption of the liquid epoxy occurred on both plasma-treated and nonplasma-treated surfaces, the oxygen plasma-treated surface alone was capable of initiating ring-opening reactions in the epoxy. However, this effect was not observed unless immediate contact was made between the plasma-treated surface and the liquid epoxy resin, illustrating the short-lived reactivity of the functional groups on the plasma-treated surface.