A low-jitter mutual-correlated pulsewidth control loop circuit

This work presents a low-jitter pulsewidth control loop (PWCL) circuit. A mutual-correlated scheme is implemented to adjust the duty cycle and increase the stability of the PWCL. The design is less sensitive to process variation. The jitter induced by voltage ripple is suppressed. The circuit is implemented using 0.35 /spl mu/m 1P4M CMOS process. The area of the PWCL is 136 /spl times/ 143 /spl mu/m/sup 2/. At an operating frequency of 300 MHz, the power dissipation and voltage ripple are reduced by 35.4% and 93.7%, respectively. A test chip is successfully verified to obtain 42-ps jitter at an operating frequency of 900 MHz.     

On-chip test circuit for measuring substrate and line-to-line coupling noise

An on-chip test circuit has been developed to directly measure substrate and line-to-line coupling noise. This test circuit has been manufactured in a 0.35 /spl mu/m double-well double polysilicon CMOS process and consists of noise generators and switched-capacitor signal processing circuitry. On-chip analog-to-digital conversion and calibration are used to eliminate off-chip noise and to extend the measurement accuracy by removing system noise. A scan circuit is described that enables the noise waveform to be reconstructed. On-chip generators ranging in area from 0.25 /spl mu/m/sup 2/ to 1.5 /spl mu/m/sup 2/ produce noise at the receiver decreasing from 3.14 mV//spl mu/m to 0.73 mV//spl mu/m. Open and closed guard rings reduce the noise by 20% and 85%, respectively. Measurement of test circuits manufactured with an epitaxial process-5.5-/spl mu/m-thick epitaxy with 20 /spl Omega//spl middot/cm resistivity on top of a 120 /spl mu/m bulk with 0.03 /spl Omega//spl middot/cm-exhibits a frequency limit of 50MHz below which coupling is insensitive to substrate noise. The difference between experimental results and an analytic model of the line-to-line coupling capacitance ranges from 8.5% to 17.7% for different metal layers.     

A 4 /spl mu/m NMOS NAND structure PLA

A PLA of NAND structure, using a NMOS Si gate process, has been developed to minimize chip area and maintain medium fast speed. The smallest memory cell size of 7/spl times/9 /spl mu/m is achieved by using ion implantation for PLA bit programming with 4 /spl mu/m design rules. Dynamic clocking scheme and self-timing circuits which are used in this PLA are described. With PLA size at 20/spl times/20/spl times/20, transistor size of 8 /spl mu/m/4 /spl mu/m, and cell size of 7/spl times/12 /spl mu/m, an internal access time of 150 ns is achieved with an external 4 MHz clock. Measured circuit power dissipation is 20 mW under normal conditions.     

A wide-range delay-locked loop with a fixed latency of one clock cycle

A delay-locked loop (DLL) with wide-range operation and fixed latency of one clock cycle is proposed. This DLL uses a phase selection circuit and a start-controlled circuit to enlarge the operating frequency range and eliminate harmonic locking problems. Theoretically, the operating frequency range of the DLL can be from 1/(N/spl times/T/sub Dmax/) to 1/(3T/sub Dmin/), where T/sub Dmin/ and T/sub Dmax/ are the minimum and maximum delay of a delay cell, respectively, and N is the number of delay cells used in the delay line. Fabricated in a 0.35 /spl mu/m single-poly triple-metal CMOS process, the measurement results show that the proposed DLL can operate from 6 to 130 MHz, and the total delay time between input and output of this DLL is just one clock cycle. From the entire operating frequency range, the maximum rms jitter does not exceed 25 ps. The DLL occupies an active area of 880 /spl mu/m/spl times/515 /spl mu/m and consumes a maximum power of 132 mW at 130 MHz.     

The design of wideband and low-power CMOS active polyphase filter and its application in RF double-quadrature receivers

In this work, a new technique to implement the transfer function of polyphase filter with CMOS active components is proposed and analyzed. In the proposed polyphase filter structure, the currents mirrored from capacitors and the transistors in a single-stage are used to realize high-pass and low-pass functions, respectively. The multistage structure expands the frequency bandwidth to more than 20 MHz. Furthermore, a constant-gm bias circuit is employed to decrease the sensitivity of image rejection to temperature and process variations. HSPICE simulations are performed to confirm the performance. With the current-mode operation, the low-voltage version of proposed active polyphase filters was designed. It can be operated at 1-V power supply with similar performance but with only 50% of the power dissipation of the normal-voltage version. The proposed four-stage polyphase filter is fabricated in 0.25-/spl mu/m CMOS 1P5M technology. The measured image rejection ratio is higher than -48 dB at frequencies of 6.1 MHz/spl sim/30 MHz. The measured voltage gain is 6.6 dB at 20 MHz and IIP3 is 8 dBm. The power dissipation is 11 mW at a supplied voltage of 2.5 V and the active chip area is 1162/spl times/813 /spl mu/m/sup 2/.     

A 0.83-2.5-GHz continuously tunable quadrature VCO

A quadrature VCO with /spl plusmn/50% continuous 0.83-2.5-GHz tuning range is presented. It is based on a core LC-QVCO with /spl plusmn/20% tuning range, a single sideband mixer (SSBM), two frequency dividers and a multiplexer. The circuit has been implemented in a 0.13-/spl mu/m 1.2-V CMOS technology. The additional area with respect to the core LC-QVCO is 100 /spl mu/m/spl times/100 /spl mu/m. Quadrature error is less than 2/spl deg/; the phase noise is less than -120 dBc/Hz @ 1 MHz over the whole tuning range and is mainly due to the LC-QVCO. Spurs are more than 34 dB below the fundamental in the worst case.     

A 5.6-mW 1-Gb/s/pair pulsed signaling transceiver for a fully AC coupled bus

This paper describes a low-power synchronous pulsed signaling scheme on a fully AC coupled multidrop bus for board-level chip-to-chip communications. The proposed differential pulsed signaling transceiver achieves a data rate of 1 Gb/s/pair over a 10-cm FR4 printed circuit board, which dissipates only 2.9 mW (2.9 pJ/bit) for the driver and channel termination and 2.7 mW for the receiver pre-amplifier at 500 MHz. The fully AC coupled multipoint bus topology with high signal integrity is proposed that minimizes the effect of inter-symbol interference (ISI) and achieves a 3 dB corner frequency of 3.2 GHz for an 8-drop PCB trace. The prototype transceiver chip is implemented in a 0.10-/spl mu/m 1.8-V CMOS DRAM technology and packaged in a WBGA. It occupies an active area of 330/spl times/85 /spl mu/m/sup 2/.     

On-chip high-voltage generation in MNOS integrated circuits using an improved voltage multiplier technique

An improved voltage multiplier technique has been developed for generating +40 V internally in p-channel MNOS integrated circuits to enable them to be operated from standard +5- and -12-V supply rails. With this technique, the multiplication efficiency and current driving capability are both independent of the number of multiplier stages. A mathematical model and simple equivalent circuit have been developed for the multiplier and the predicted performance agrees well with measured results. A multiplier has already been incorporated into a TTL compatible nonvolatile quad-latch, in which it occupies a chip area of 600 /spl mu/m/spl times/240 /spl mu/m. It is operated with a clock frequency of 1 MHz and can supply a maximum load current of about 10 /spl mu/A. The output impedance is 3.2 M/spl Omega/.     

A 1-V 10.7-MHz switched-opamp bandpass /spl Sigma//spl Delta/ modulator using double-sampling finite-gain-compensation technique

A 1 V switched-capacitor (SC) bandpass sigma-delta (/spl Sigma//spl Delta/) modulator is realized using a high-speed switched-opamp (SO) technique with a sampling frequency of up to 50 MHz, which is improved ten times more than prior 1 V SO designs and comparable to the performance of the state-of-the-art SC circuits that operate at much higher supply voltages. On the system level, a fast-settling double-sampling SC biquadratic filter architecture is proposed to achieve high-speed operation. A low-voltage double-sampling finite-gain-compensation technique is employed to realize a high-resolution /spl Sigma//spl Delta/ modulator using only low-DC-gain opamps to maximize the speed and to reduce power dissipation. On the circuit level, a fast-switching methodology is proposed for the design of the switchable opamps to achieve a switching frequency up to 50 MHz. Implemented in a 0.35-/spl mu/m CMOS process (V/sub TP/=0.82 V and V/sub TN/=0.65 V) and at 1 V supply, the modulator achieves a measured peak signal-to-noise-and-distortion ratio (SNDR) of 42.3 dB at 10.7 MHz with a signal bandwidth of 200 kHz, while dissipating 12 mW and occupying a chip area of 1.3 mm/sup 2/.     

A 35-ns 128K/spl times/8 CMOS SRAM

A 128 K/spl times/8-b CMOS SRAM with TTL input/output levels and a typical address access time of 35 ns is described. A novel data transfer circuit with dual threshold level is utilized to obtain improved noise immunity. A divided-word-line architecture and an automatic power reduction function are utilized to achieve a low operational power of 10 mW at 1 MHz, and 100 mW at 10 MHz. A novel fabrication technology, including improved LOCOS and highly stable polysilicon loads, was introduced to achieve a compact memory cell which measures 6.4/spl times/11.5 /spl mu/m/SUP 2/. Typical standby current is 2 /spl mu/A. The RAM was fabricated with 1.0-/spl mu/m design rules, double-level polysilicon, and double-level aluminum CMOS technology. The chip size of the RAM is 8/spl times/13.65 mm/SUP 2/.     

Low-power fully integrated and tunable CMOS RF wireless receiver for ISM band consumer applications

A 0.25-/spl mu/m single-chip CMOS single-conversion tunable low intermediate frequency (IF) receiver operated in the 902-928-MHz industrial, scientific, and medical band is proposed. A new 10.7-MHz IF section that contains a limiting amplifier and a frequency modulated/frequency-shift-key demodulator is designed. The frequency to voltage conversion gain of the demodulator is 15 mV/kHz and the dynamic range of the limiting amplifier is around 80 dB. The sensitivity of the IF section including the demodulator and limiting amplifier is -72 dBm. With on-chip tunable components in the low-power low-noise amplifier (LNA) and LC-tank voltage-controlled oscillator circuit, the receiver measures an RF gain of 15 dB at 915 MHz, a sensitivity of -80 dBm at 0.1% bit-error rate, an input referred third-order intercept point of -9 dBm, and a noise figure of 5 dB with a current consumption of 33 mA and a 2450 /spl mu/m/spl times/ 2450 /spl mu/m chip area.     

A low-power half-delay-line fast skew-compensation circuit

A fast skew-compensation circuit is useful for a chip to safely recover from the halt state because it can quickly compensate the clock skew induced by the on-chip clock driver. A low-power half-delay-line fast skew-compensation circuit (HDSC) is proposed in this work. The HDSC circuit features several new design techniques. The first is a new measure-and-compensate architecture, with which the HDSC circuit gains advantages including an enlarged operation frequency range, more robust operation, more accurate phase alignment, higher scalability for using advanced technologies, and lower power consumption, as compared to the conventional fast skew-compensation circuits. The second is a frequency-independent phase adjuster, with which the delay line can be shortened by half and the maximal power consumption is reduced accordingly if the clock signal has a 50% duty cycle. The third is a fine delay cell, which is used to accompany the half-delay-line, comprising of minimum-sized coarse delay cells, to effectively reduce the static phase error. Extensive circuit simulations are carried out to prove the superiority of the proposed circuit. In addition, an HDSC test chip is implemented for performance verification at high frequencies. The test chip is designed based on a 0.35-/spl mu/m CMOS process, and has a coarse cell delay of 220 ps. It works successfully between 600/spl sim/800 MHz, as designed, with a power consumption of 25/spl sim/36 /spl mu/W/MHz. When measured at 616.9 and 791.6 MHz, the static phase error is 76.8 and 124.5 ps, respectively.     

Time interleaved converter arrays

High-speed monolithic converters normally use a variation of the flash technique, which 2/SUP n/ comparators in parallel to obtain a fast n-bit conversion. Although this method allows for high converter bandwidth, it is not very area efficient, and results in large die sizes for even modest resolution converters. In the technique presented here, a number of small but area efficient converters are operated in a time-interleaved fashion to achieve the bandwidth of a flash circuit, but in a substantially smaller area. This technique is analyzed with respect to noise and distortion resulting from nonideal array characteristics, and is demonstrated by way of a four-way array test-chip. This chip consists of four time-interleaved 7-bit weighted-capacitor A/D converters fabricated in a 10 /spl mu/m metal-gate CMOS process. Full 7-bit linearity is maintained up to a 2.5 MHz conversion rate, with operation at reduced linearity continuing to approximately 4 MHz. The design of this chip, and anticipated characteristics if fabricated in a modern 4-5 /spl mu/m process are described.     

An 8-bit video ADC incorporating folding and interpolation techniques

A flash-type analog-to-digital converter that operates without a sample-and-hold circuit and incorporates folding and interpolation techniques is presented. It achieves an excellent performance while dissipating only 300 mW from a single 5-V power supply. The folding and interpolation system and the corresponding block diagram are explained. Implementation of folding and interpolation circuitry and the design of the reference resistor are discussed in detail. Several advantages of the system are investigated. The effective resolution of the converter is given as a function of analog input frequency. An 8-bit resolution bandwidth of 8 MHz is achieved. Up to an analog input frequency of 5 MHz, every distortion component stays below -60 dB. The maximum sample rate is 55 MHz. The circuit occupies 6 mm/SUP 2/ of silicon area, bonding pads included. It is realized in a 2.5-/spl mu/m bipolar process with an f/SUB T/ of 7.5 GHz.     

Low phase noise IP VCO for multistandard communication using a 0.35-/spl mu/m BiCMOS SiGe technology

In this letter, we report that a commonly used 0.35-/spl mu/m, 60-GHz-F/sub MAX/ BiCMOS SiGe monolithic microwave integrated circuit (MMIC) technology is able to provide very low phase noise signal generation in the X-band frequency range. This statement has been demonstrated using a differential LC voltage-controlled oscillator (VCO) in which varactors are realized with metal-oxide semiconductor (MOS) transistors and inductors with a patterned ground shield technology. This VCO features an output power signal in the range of -5 dBm and exhibits a phase noise of -96 dBc/Hz at a frequency offset of 100kHz from carrier and -120 dBc/Hz at a frequency offset of 1 MHz. The VCO features a tuning range of 430 MHz or 4.3% of its operating frequency. Its power consumption is in the range of 70 mW (200 mW with buffers circuits) for a chip size of 800/spl times/1000 /spl mu/m/sup 2/ (including RF probe pads).     

A 40-GHz static frequency divider with quadrature outputs in 80-nm CMOS

The implemented static frequency divider provides quadrature (Q) clock outputs and divides frequencies up to 44GHz. The core divider circuit consists of two current-mode logic (CML) latches and consumes 3.2mW from a 1.1-V supply. The divided outputs result in a peak-to-peak and rms jitter of 6.3 and 0.8ps, respectively, and the maximum phase mismatch between the in-phase (I) and Q-outputs amounts to 1ps at an input frequency of 40GHz. The high division frequency is achieved by employing resistive loads, inductive peaking, and optimizing the circuit layout for reduced parasitic capacitances in the latches. The core divider consumes a chip area of 30/spl mu/m/spl times/40/spl mu/m only.     

A 1-V 5.2-GHz CMOS synthesizer for WLAN applications

A 1-V CMOS frequency synthesizer designed for WLAN 802.11a is presented. Novel circuit designs are demonstrated in the system for low-voltage applications including design of voltage-controlled oscillator and design of programmable divider. Implemented in a 0.18-/spl mu/m CMOS process and operated at 1-V supply voltage, the synthesizer measures phase noise of -136 dBc/Hz at a frequency offset of 20 MHz and spur performance of less than -80 dBc at an offset of 11 MHz. The synthesizer dissipates 27.5 mW from a single 1-V supply and occupies a chip area of 1.03 mm/sup 2/.     

A 60-mW 200-MHz continuous-time seventh-order linear phase filter with on-chip automatic tuning system

A full CMOS seventh-order linear phase filter based on g/sub m/-C biquads with a -3-dB frequency of 200 MHz is realized in 0.35-/spl mu/m CMOS process. The linear operational transconductance amplifier is based on complementary differential pairs in order to achieve both low-distortion figures and high-frequency operation. The common-mode feedback (CMFB) employed takes advantage of the filter architecture; incorporating the load capacitors into the CMFB loop improves further its phase margin. A very simple automatic tuning system corrects the filter deviations due to process parameter tolerances and temperature variations. The group delay ripple is less than 5% for frequencies up to 300 MHz, while the power consumption is 60 mW. The third-harmonic distortion is less than -44 dB for input signals up to 500 mV/sub pp/. The filter active area is only 900 /spl times/ 200 /spl mu/m/sup 2/. The supply voltages used are /spl plusmn/1.5 V.     

The universal opamp and applications in continuous-time resistorless and capacitorless linear weighted voltage addition

A versatile analog building block denoted the universal operational amplifier (opamp) is introduced. The circuit is a generalized version of the fully differential difference opamp with 2n weighted differential inputs. Applications in resistorless and capacitorless continuous-time linear weighted voltage addition are discussed. Experimental results of a test chip prototype are shown that validate the proposed approach. Simulations show potential for high frequency operation of the circuit with gain-bandwidth close to 140 MHz in 0.5-/spl mu/m CMOS technology.