200Ms/s 177mW 8位折叠内插结构的CMOS模数转换器

介绍了一个采用折叠内插结构的CMOS模数转换器,适合于嵌入式应用.该电路与标准的数字工艺完全兼容,经过改进的无需电阻就能实现的折叠模块有助于减小芯片面积.在输入级,失调平均技术降低了输入电容,而分布式采样保持电路的运用则提高了信号与噪声的失真比.该200MHz采样频率8位折叠内插结构的CMOS模数转换器在3.3V电源电压下,总功耗为177mW,用0.18μm 3.3V标准数字工艺实现.     

折叠内插模数转换器分析及实现

应用Matlab/Simulink工具对折叠内插模数转换器进行了建模,研究了具有8bit分辨率、200MHz采样频率的该模数转换器的芯片设计和实现.系统设计时采用Matlab/Simulink进行行为级建模并分别分析了预放大的增益、折叠电路的带宽以及比较器的失调对动态性能的影响.设计实现的模数转换器实测结果表明,积分非线性误差和微分非线性误差分别小于0.77和0.6LSB,在采样频率为200MHz及输入信号频率为4MHz时,信号与噪声及谐波失真比为43.7dB.电路采用标准0.18μm CMOS数字工艺实现,电源电压为3.3V,功耗181mW,芯核面积0.25mm2.     

折叠内插模数转换器分析及实现

应用Matlab/Simulink工具对折叠内插模数转换器进行了建模,研究了具有8bit分辨率、200MHz采样频率的该模数转换器的芯片设计和实现．系统设计时采用Matlab/Simulink进行行为级建模并分别分析了预放大的增益、折叠电路的带宽以及比较器的失调对动态性能的影响．设计实现的模数转换器实测结果表明,积分非线性误差和微分非线性误差分别小于0.77和0.6LSB,在采样频率为200MHz及输入信号频率为4MHz时,信号与噪声及谐波失真比为43.7dB．电路采用标准0.18μｍ CMOS数字工艺实现,电源电压为3.3V,功耗181mW,芯核面积0.25mm2．     

基于0.18 μm CMOS工艺8 bit/150 MHz折叠插值ADC

折叠插值模数转换器的转换速度快,可实现并行一步转换,但由于受到面积、功耗以及CMOS工艺线性度和增益的限制,其精度较低.提出了一种电流模均衡电路,能够有效地消除折叠电路中的共模影响,提高折叠电路增益及线性度,从而提高电路的转换精度.应用此技术,设计了一款折叠插值A/D转换器,工作电压为3.3 V,采样时钟为150 MHz,并通过0.18μm CMOS工艺实现,版图总面积为0.22 mm2.     

1.4伏25毫瓦600兆赫兹采样频率6位0.13微米CMOS折叠内插模数转换器

本文介绍了一个6位600兆采样频率折叠内插模数转换器。该模数转换器采用了级联折叠放大器和输入改进型有源内插放大器。测试结果显示,工作在500兆赫兹采样频率时,输入信号频率10兆赫兹,模数转换器的有效位数和无杂散动态范围分别是5.55位和47.84分贝;输入信号200兆赫兹,模数转换器的ENOB和SFDR分别是4.3位和35.65分贝。工作在600兆赫兹采样频率时,输入信号频率1兆赫兹,模数转换器的有效位数和无杂散动态范围分别是5.48位和43.52分贝;输入信号30.1兆赫兹,模数转换器的ENOB和SFDR分别是4.66位和39.56分贝。该模数转换器工作电压1.4伏,总功耗25毫瓦,采用0.13微米CMOS工艺实现,面积0.17平方毫米。     

一个嵌入式应用的8位300MS/s折叠内插模数转换器

本文设计了一个1.4V电源电压8位300MS/s折叠内插结构的模数转换器。该模数转换器利用0.13μm CMOS工艺实现,有效面积仅为0.6mm2,非常适合嵌入式应用。系统对低功耗进行了优化。流水线式采样开关节省了用于实现信号完整建立而增加的额外功耗。失调平均电阻阵列被置于两级折叠电路之间也是出于节省功耗的考虑。该转换器在1MHz下达到了43.4dB的信噪失真比和53.3dB的无杂散动态范围,在奈奎斯特频率输入情况下信噪失真比和无杂散动态范围分别为42.1dB和49.5dB。测试结果表明在1.4V电源250MHz采样率下功耗为34mW,FoM值为1.14pJ/转换步长。     

12位800 MS/s ADC设计

提出了一种基于0.18 μm CMOS工艺设计的12位800 MS/s高速ADC。采用独特的折叠/内插与流水线相组合的结构,兼具折叠/内插结构的高转化率与流水线结构的高分辨率的优点。介绍了ADC的总体结构,分析了采样保持电路的设计原理,阐述了折叠/插值与流水线结构电路的机理,描述了数字自校正原理。在采样率800 MS/s和模拟输入397 MHz条件下进行版图后仿真,SFDR达到62 dB。     

0.25 μm CMOS工艺10位100MHz流水线型ADC设计

采用流水线结构完成了一个10位精度100MHz采样频率的模数转换器的设计.该模数转换器采用采样保持电路、8级1.5位和最后一级2位子模数转换器的结构,电路使用全差分和开关电容电路技术.芯片采用台积电(TSMC)0.25 μm CMOS工艺,电路典型工作电压为2.5V,在室温下,输入信号为5MHz,采样频率100MHz时信号噪声失真比为59.7dB.     

10 bit 40 MS/s流水线模数转换器的研制

设计了一种10 bit 40 MS/s流水线模数转换器.通过采用自举开关和增益提升的套筒式共源共栅运放,保证了采样保持电路和级电路的性能.该模数转换器采用TSMC 0.35 p.m CMOS3.3 V工艺流片验证,芯片核心面积为5.6 jmm2.测试结果表明,该模数转换器在采样率为40 MHz输入频率为280 kHz时,获得54.5 dB的信噪比和60.2 dB的动态范围;在采样率为46 MHz输入频率为12.6 MHz时,获得52.1 dB的信噪比和60.6 dB的动态范围.     

一个10位、50MS/s CMOS折叠流水结构A/D转换器

在0.6μm DPDM标准数字CMOS工艺条件下,实现10位折叠流水结构A/D转换器,使用动态匹配技术,消除折叠预放电路的失调效应;提出基于单向隔离模拟开关的分步预处理,有效压缩了电路规模,降低了系统功耗.在5V电源电压下,仿真结果为:当采样频率为50MSPS时,功耗为120mW,输入模拟信号和二进制输出码之间延迟为2.5个时钟周期,芯片面积1.44mm2.     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

Performance improvement in tensile-strained In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As metamorphic HEMT

This paper proposes a In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As (x=0.3-0.5-0.3) metamorphic high-electron mobility transistor with tensile-strained channel. The tensile-strained channel structure exhibits significant improvements in dc and RF characteristics, including extrinsic transconductance, current driving capability, thermal stability, unity-gain cutoff frequency, maximum oscillation frequency, output power, power gain, and power added efficiency.     

Lanthanum diffusion in the TiN/LaOx/HfSiO/SiO2/Si stack

Band edge Complementary Metal Oxide Semiconductor (CMOS) devices are obtained by insertion of a thin LaO_x layer between the high-k (HfSiO) and metal gate (TiN). High temperature post deposition anneal induces Lanthanum diffusion across the HfSiO towards the SiO₂ interfacial layer, as shown by Time of Flight Secondary Ions Mass Spectroscopy (ToF-SIMS) and Atom Probe Tomography (APT). Fourier Transform Infrared Spectroscopy in Attenuated Total Reflexion mode (ATR-FTIR) shows the formation of La-O-Si bonds at the high-k/SiO₂ interface. Soft X-ray Photoelectron Spectroscopy (S-XPS) is performed after partial removal of the TiN gate. Results confirm La diffusion and changes in the La chemical environment.     

The C-V-f and G/ω-V-f characteristics of Al/SiO2/p-Si (MIS) structures

The frequency dependence of capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the Al/SiO₂/p-Si metal-insulator-semiconductor (MIS) structures has been investigated taking into account the effect of the series resistance (R_s) and interface states (N_ss) at room temperature. The C-V and G/ω-V measurements have been carried out in the frequency range of 1 kHz to 1 MHz. The frequency dispersion in capacitance and conductance can be interpreted only in terms of interface states and series resistance. The N_ss can follow the ac signal and yield an excess capacitance especially at low frequencies. In low frequencies, the values of measured C and G/ω decrease in depletion and accumulation regions with increasing frequencies due to a continuous density distribution of interface states. The C-V plots exhibit anomalous peaks due to the N_ss and R_s effect. It has been experimentally determined that the peak positions in the C-V plot shift towards lower voltages and the peak value of the capacitance decreases with increasing frequency. The effect of series resistance on the capacitance is found appreciable at higher frequencies due to the interface state capacitance decreasing with increasing frequency. In addition, the high-frequency capacitance (C_m) and conductance (G_m/ω) values measured under both reverse and forward bias were corrected for the effect of series resistance to obtain the real diode capacitance. Experimental results show that the locations of N_ss and R_s have a significant effect on electrical characteristics of MIS structures.     

Al/sub 0.3/Ga/sub 0.7/As/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) doped-channel field-effect transistors (DCFET's)

The properties of both lattice-matched and strained doped-channel field-effect transistors (DCFET's) have been investigated in AlGaAs/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) heterostructures with various indium mole fractions. Through electrical characterization of grown layers in conjunction with the dc and microwave device characteristics, we observed that the introduction of a 150-/spl Aring/ thick strained In/sub 0.15/Ga/sub 0.85/As channel can enhance device performance, compared to the lattice-matched one. However, a degradation of device performance was observed for larger indium mole fractions, up to x=0.25, which is associated with strain relaxation in this highly strained channel. DCFET's also preserved a more reliable performance after biased-stress testings.<>     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

A 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode array

We report a 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode (APD) array. The mean breakdown voltage of the APD was 57.9 V and the standard deviation was less than 0.1 V. The mean dark current was /spl sim/2 and /spl sim/300 nA, and the standard deviation was /spl sim/0.19 and /spl sim/60 nA at unity gain (V/sub bias/ = 13.5 V) and at 90% of the breakdown voltage, respectively. External quantum efficiency was above 40% in the wavelength range from 1.0 to 1.6 /spl mu/m. It was /spl sim/57% and /spl sim/45% at 1.3 and 1.55 /spl mu/m, respectively. A bandwidth of 13 GHz was achieved at low gain.