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1.
Zn diffusion into InP was carried out ex-situ using a new Zn diffusion technique with zinc phosphorus particles placed around InP materials as zinc source in a semi-closed chamber formed by a modified diffusion furnace.The optical characteristics of the Zn-diffused InP layer for the planar-type InGaAs/InP PIN photodetectors grown by molecular beam epitaxy (MBE) has been investigated by photoluminescence (PL) measurements.The temperature-dependent PL spectrum of Zn-diffused InP samples at different diffusion temperatures showed that band-to-acceptor transition dominates the PL emission,which indicates that Zn was commendably diffused into InP layer as the acceptor.High quality Zn-diffused InP layer with typically smooth surface was obtained at 580 ℃ for 10 min.Furthermore,more interstitial Zn atoms were activated to act as acceptors after a rapid annealing process.Based on the above Zn-diffusion technique,a 50μm planar-type InGaAs/InP PIN photodector device was fabricated and exhibited a low dark current of 7.73 pA under a reverse bias potential of-5 V and a high breakdown voltage of larger than 41 V (I < 10 μA).In addition,a high responsivity of 0.81 A/W at 1.31 μm and 0.97 A/W at 1.55 μm was obtained in the developed PIN photodetector.  相似文献   

2.
肖雪芳  谢生  陈朝 《半导体技术》2010,35(3):245-247,251
以GaAs和InP材料为例,对化合物半导体材料中的快速热退火扩Zn可行性进行比较分析,研究表明,化合物半导体材料中快速热退火扩Zn可行性与化合物半导体材料的分解温度有着密切关系。化合物半导体材料分解温度越低,对扩散源、帽层和阻挡层要求越高。针对InP材料高于360℃就分解、低温Zn扩散困难的特点,提出了直接溅射Zn层在410℃低温扩散的方法。对InP快速热退火扩散结果进行分析,初步分析表明其掺杂机理是形成合金结。  相似文献   

3.
采用闭管扩散方式实现了Zn元素在晶格匹配InP/In_(0.53)Ga_(0.47)As及晶格失配InP/In_(0.82)Ga_(0.18)AS两种异质结构材料中的P型掺杂,利用二次离子质谱(SIMS)以及扫描电容显微技术(SCM)对Zn在两种材料中的扩散机制进行了研究.SIMS测试表明:Zn元素在晶格失配材料中的扩散速度远大于在晶格匹配材料中的扩散速度,而SCM测试表明:两种材料中的实际PN结深度与SIMS测得的Zn扩散深度之间存在一定的差值,这是由于扩散进入材料中的Zn元素并没有被完全激活,而晶格失配材料中Zn的激活效率相对更低,使得晶格失配材料中Zn元素扩散深度与PN结深度的差值更大.SCM法是一种新颖快捷的半导体结深测试法,对于半导体器件工艺研究具有重要的指导意义.  相似文献   

4.
利用闭管扩散方法以Zn3P2为扩散源,在不同扩散温度和扩散时间下对非故意掺杂InP (100)晶片进行扩散. 用电化学C-V法(ECV)和二次离子质谱法(SIMS)分别测出了空穴浓度和Zn的浓度随深度的分布曲线. 结果表明扩散后InP表面空穴和Zn的浓度在扩散结附近突然下降,InP表面空穴浓度主要取决于扩散温度,扩散深度随着扩散时间的增长而变大,InP表面Zn浓度一般比空穴浓度高一个数量级. 另外对扩散后的样品进行光致发光(PL) 测试,表明在保证表面载流子浓度的同时,适当降低扩散温度和增加扩散时间能减小对InP表面性质的影响.  相似文献   

5.
Diffusion of Zn in InP during growth of InP epitaxial layers has been investigated in layer structures consisting of Zn-InP epilayers grown on S-InP and Fe-InP substrates, and on undoped InP epilayers. The layers were grown by metalorganic chemical vapour deposition (MOCVD) atT = 625° C andP = 75 Torr. Dopant diffusion profiles were measured by secondary ion mass spectrometry (SIMS). At sufficiently high Zn doping levels ([Zn] ≥8 × 1017 cm−3) diffusion into S-InP substrates took place, with accumulation of Zn in the substrate at a concentration similar to [S]. Diffusion into undoped InP epilayers produced a diffusion tail at low [Zn] levels, probably associated with interstitial Zn diffusion. For diffusion into Fe-InP, this low level diffusion produced a region of constant Zn concentration at [Zn] ≈ 3 × 1016 cm−3, due to kick-out of the original Fe species from substitutional sites. We also investigated diffusion out of (Zn, Si) codoped InP epilayers grown on Fe-InP substates. The SIMS profiles were characterised by a sharp decrease in [Zn] at the epilayer-substrate interface; the magnitude of this decrease corresponded to that of the Si donor level in the epilayer. For [Si] ≫ [Zn] in the epilayer no Zn diffusion was observed; Hall measurements indicated that the donor and acceptor species in those samples were electrically active. All these results are consistent with the presence of donor-acceptor interactions in InP, resulting in the formation of ionised donor-acceptor pairs which are immobile, and do not contribute to the diffusion process.  相似文献   

6.
锌(Zn)扩散是制作InP基光电探测器(PD)的重要工艺过程.分析了锌扩散的机制,利用金属有机化学气相沉积(MOCVD)设备对InP基PD及雪崩光电探测器(APD)材料进行了锌扩散,由于MOCVD设备具有精确的温度控制系统,所以该扩散工艺具有简单、均匀性好、重复性好的优点.对于扩散后的样品,采用电化学C-V方法和扫描电子显微镜(SEM)等测试分析手段,研究了退火、扩散温度、扩散源体积流量和反应室压力等主要工艺参数对InP材料扩散速率和载流子浓度的影响,并将该锌扩散工艺应用于InP基光电探测器和雪崩光电探测器的器件制作中,得到了优异的器件性能结果.  相似文献   

7.
Open-tube diffusion techniques used between 450 and 600° C are described which involve the supply of diffusant from a vapour source (via a solution) and a solid evaporated metal source. Investigations of Zn into InP and InGaAs(P) have been undertaken using both sources. SIMS profile analyses show that in the case of the vapour source the profiles indicate a concentration-dependent diffusion coefficient while the solid source diffusions can be well described by a Gaussian-type profile. The usefulness of the vapour source method has been demonstrated in the fabrication of bipolar transistors which exhibit good d.c. characteristics. The solid source method is limited by the slow diffusion velocity and more gradual profile. The InGaAs(P)/InP materials system has important applications in optical communications and future high speed microwave and switching devices. Useful technologies allied to the introduction of impurities into Si by diffusion, have gradually been emerging for use in the III-V semiconductor family. Closed tube systems1 have been used in order to contain the volatile group V species and prevent surface erosion. In addition, simpler open tube systems2,3 have been developed that maintain a sufficient overpressure of the group V element. Zn and Cd p-dopants have been studied extensively because of the volatility and relatively large diffusion rates in III-V semiconductors. Opentube diffusion into both InP and InGaAs2-6 has been studied but little detail has appeared concerning InGaAs and InGaAsP. In this paper we describe a comprehensive study of the diffusion of Zn into InP and InGaAs(P) using both open-tube vapour source and a Au/Zn/Au evaporated solid source with SiNx acting both as a mask and also an encapsulant to prevent loss of Zn and decomposition of the substrate material. The techniques have been successfully applied to the fabrication of InP/lnGaAs heterojunction bipolar transistors which show good dc characteristics. Reference to InGaAs in the text implies the InP lattice-matched composition In0.53Ga0.47As.  相似文献   

8.
The diffusion of Zn in InP at low temperature is investigated. The experiment is accomplished in an evacuated and sealed quartz ampoule using ZneP2 as the source of Zn. The electrical characteristics of the diffusion samples obtained by the isotemperature process and the two-temperature process have been compared. It is found that with the two-temperature process one can obtain a smooth, damageless and high-concentration surface layer. This process has been applied to fabricate InGaAsP/InP light emitting diodes, and the diodes obtained have an output power of ≥1mW with a series resistance of 2–5Ω. The behaviors of Zn diffusion in InP are discussed.  相似文献   

9.
为了在InP/InGaAs(P)材料中进行精确的选择扩散,同时又要保证外延生长的多层异质结构不被破坏,提出了一种新的低温开管Zn扩散方法。该法直至在T=500℃,t=5min的条件下,重复性仍很好。应用该法研究了低温条件下Zn在InP,InGaAs(P)材料中的扩散行为。实验首次发现,Zn在InGaAsP材料中的扩散速率与材料中P含量的平方成正比。  相似文献   

10.
The objective of this work is to study the incorporation process of Zn in InP and related ternary and quaternary layers for long wavelength laser applications in comparison with the alternative acceptor Mg. In InP above a critical concentration of (1–2)×1018 cm?3 a sudden onset of dopant diffusion during growth is observed for Zn and for Mg as well. This diffusion during growth can be markedly reduced by counter-doping with Si (Fermi level effect). Below the critical concentration Zn dopant profiles exhibit the same steep flanks as Mg dopant profiles suggesting the same low diffusion coefficients. However, Zn appears to be more suitable forp-type doping of InP, GaInAs and GaInAsP, because an accurate control of the dopant level in the epitaxial layers is easier to achieve with Zn than with Mg.  相似文献   

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