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热释电非制冷红外焦平面现状及发展趋势 总被引:3,自引:5,他引:3
一维和二维阵列的热释电非制冷红外焦平面非常适合应用于热成像.混合式的BST铁电探测器降低了成本,市场潜力巨大.分析了热释电非制冷红外焦平面阵列探测技术的优势,介绍了热释电非制冷红外探测器工作原理及热释电非制冷红外焦平面阵列对探测材料的要求,指出了混合式及单片式热释电非制冷红外焦平面阵列发展趋势.制备高一致性和高性能的大阵列的探测元是发展非制冷红外焦平面的关键,针对我国在热释电非制冷红外焦平面阵列研究方面存在的问题,提出了下一步研究的方向及重点. 相似文献
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红外焦平面读出电路技术及发展趋势 总被引:2,自引:0,他引:2
从红外焦平面技术的发展背景出发,论述了读出电路在红外焦平面信号传输中的作用并介绍其基本框图,讨论了CCD读出电路和CMOS读出电路各自的特点,并分析了国内外红外焦平面读出电路的现状,最后提出了红外焦平面阵列读出电路今后的研究方向. 相似文献
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红外焦平面阵列读出电路技术分析 总被引:14,自引:7,他引:7
从红外焦平面技术的发展背景出发,论述了读出电路在红外焦平面信号传输中的作用;讨论了用于实现红外焦平面阵列读出电路的一些实施技术;并对各种实现技术进行了分析比较;最后提出了红外焦平面阵列读出电路今后的研究方向。 相似文献
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讨论了热释电型红外焦平面阵列成像系统及基本的信号处理,包括信号差分处理、非均匀性校正等,利用自扫描光电二极管列阵(SSPA)对热释电型红外焦平面阵列成像系统进行了模拟实验,获得了满意的图像,为进一步研制热释电型红外焦平面阵列成像系统打下了基础。 相似文献
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Chih-Cheng Hsieh Chung-Yu Wu Tai-Ping Sun Far-Wen Jih Ya-Tung Cherng 《Solid-State Circuits, IEEE Journal of》1998,33(8):1188-1198
A new CMOS current readout structure for the infrared (IR) focal-plane-array (FPA), called the buffered gate modulation input (BGMI) circuit, is proposed in this paper. Using the technique of unbalanced current mirror, the new BGMI circuit can achieve high charge sensitivity with adaptive current gain control and good immunity from threshold-voltage variations. Moreover, the readout dynamic range can be significantly increased by using the threshold-voltage-independent current-mode background suppression technique. To further improve the readout performance, switch current integration techniques, shared-buffer biasing technique, and dynamic charging output stage with the correlated double sampling circuit are also incorporated into the BGMI circuit. An experimental 128×128 BGMI readout chip has been designed and fabricated in 0.8 μm double-poly-double-metal (DPDM) n-well CMOS technology. The measurement results of the fabricated readout chip under 77 K and 5 V supply voltage have successfully verified both readout function and performance improvement. The fabricated chip has the maximum charge capacity of 9.5×107 electrons, the transimpedance of 2.5×109 Ω at 10 nA background current, and the arrive power dissipation of 40 mW. The uniformity of background suppression currents can be as high as 99%. Thus, high injection efficiency, high charge sensitivity, large dynamic range, large storage capacity, and low noise can be achieved In the BGMI circuit with the pixel size of 50×50 μm2. These advantageous characteristics make the BCMI circuit suitable for various IR FPA readout applications with a wide range of background currents 相似文献
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Chih-Cheng Hsieh Chung-Yu Wu Tai-Ping Sun 《Solid-State Circuits, IEEE Journal of》1997,32(8):1192-1199
A new current readout structure for the infrared (IR) focal-plane-array (FPA), called the switch-current integration (SCI) structure, is presented in this paper. By applying the share-buffered direct-injection (SBDI) biasing technique and off focal-plane-array (off-FPA) integration capacitor structure, a high-performance readout interface circuit for the IR FPA is realized with a pixel size of 50×50 μm2. Moreover, the correlated double sampling (CDS) stage and dynamic discharging output stage are utilized to improve noise and speed performance of the readout structure under low power dissipation. In experimental SCI readout chip has been designed and fabricated in 0.8-μm double-poly-double-metal (DPDM) n-well CMOS technology. The measurement results of the fabricated readout chip at 77 K with 4 and 8 V supply voltages have successfully verified both the readout function and the performance improvement. The fabricated chip has a maximum charge capacity of 1.12×108 electrons, a maximum transimpedance of 1×109 Ω, and an active power dissipation of 30 mW. The proposed CMOS SCI structure can be applied to various cryogenic IR FPA's 相似文献
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在理论上分析了红外焦平面组件中光敏元、读出电路以及两者耦合的总噪声特性,对大周长面积比(38×500μm2)延伸波长InGaAs组件的噪声与温度、积分时间的关系进行了实验和分析.实验结果指出,在一定条件下组件噪声与积分时间的根号并不成正比.测量了不同温度下的组件暗信号、噪声,得到组件噪声与暗电流的关系,分析表明,该种组件噪声主要来自于1/f噪声及读出电路输入级电流噪声. 相似文献
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设计了一款低噪声InGaAs焦平面读出电路.提出一种新型相关双采样电路结构,可在边积分边读出模式下有效抑制积分电容(0.15 pF)的KTC噪声.电路经0.5 μn5 V Nwell CMOS工艺流片,测试结果符合设计目标,在高帧频边积分边读出模式下工作状态良好,电路噪声约1.7×10-4V,动态范围大于80 dB. 相似文献
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在过去的10年里红外焦平面阵列成像技术逐渐进入了成熟期,从红外焦平面的发展背景出发,简要介绍了一种新颖的非制冷焦平面成像技术,论述了读出电路在红外焦平面信号传输中的作用并介绍了其基本框图,分析了国内外焦平面读出电路的现状,最后提出了一些在红外焦平面阵列读出电路设计中所需要注意的问题。 相似文献