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导电胶正广泛地应用于电子封装中,例如,裸芯片的粘贴与互连,元器件的固定,以及作热转换和电互连的目的,本文将介绍导电胶应用于电子元器件组装中的最新进展,着重描述各向 异性导电胶(以下称ACA)这种新兴的电子互连材料及其组装工艺,同时介绍导电胶在电子封装领域以及在不久将来的更多产品的应用中所起举足轻重的作用,最后,讨论了发展趋势和存在的问题。 相似文献
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本文介绍了导电胶的组成和特点及其在印制板中的应用,如用于在多层板内层埋入电阻,多层板层间互连,在底板上印刷线路等.阐述了银导电胶和铜导电胶在印制电路板应用中各自的优缺点及其应用的可能性. 相似文献
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随着微电子封装技术的发展,各向异性导电胶作为一种绿色的连接材料,广泛应用于电子产品中。文中主要介绍各向异性导电胶互连器件的粘接原理和影响其可靠性的各种因素,如粘接工艺参数、外界环境的干扰、各向异性导电胶的物理特性等。 相似文献
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4.高密度互连技术(HDI) 此处所说的互连技术是指PCB内层间的互连技术。因此PCB的互连技术可分为传统的孔化电镀技术、直接电镀技术和导电胶技术等。4.1 常规的孔化电镀技术 已有30多年的历史,目前全世界6000多家的PCB厂中采用常规的孔化电镀技术仍占 相似文献
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Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization 总被引:5,自引:0,他引:5
Hongjin Jiang Kyoung-Sik Moon Jiongxin Lu C. P. Wong 《Journal of Electronic Materials》2005,34(11):1432-1439
Five different types of surfactants were employed for nanoparticle functionalization and the effects of the surfactants on
electrical properties of nano silver (Ag)-filled conductive adhesives were investigated. The Ag nanoparticles pretreated with
the surfactants were incorporated into isotropic conductive adhesives (ICA) formulations as conductive fillers. By using the
surfactants (S3, S4, and S5), the reduced resistivity of the nano Ag-filled adhesives could be achieved with 2×10−4 Θ-cm. The morphology studies showed that the low resistivity resulted from the sintering of nanoparticles. 相似文献
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用于微电子组装的导电胶粘接剂的研究现状 总被引:4,自引:0,他引:4
综述了当前电子组装业中导电胶粘接剂的研究情况,主要介绍国外正在重点研究的几大类导电胶粘接剂及其组成,与传统锡铅焊料的对比,以及它们的电性能、机械性能、热性能等,并简要介绍其发展趋势。 相似文献
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《Microelectronics Reliability》2014,54(9-10):2017-2022
The attachment and packaging of temperature sensors may be challenging due to their structure and materials. Sensing requires a structure which is open to the environment and the materials often differ from those used in silicon-based electronics. Thus, traditional attachment techniques and materials such as soldering may be inappropriate. Polymer-based electrically conductive adhesives (ECA) are an alternative. The operating environment of a sensor may, however, be very demanding. Very little research data is available on the use of ECAs in challenging conditions, thus restricting their use in many applications. This study tested the behaviour of temperature sensors attached with ECAs onto flexible polyimide (PI) substrates in thermal storage at 200 °C. More than 1000 h of testing without failures were conducted on the ECA sensor structures. Good high temperature reliability therefore seems to be possible with ECAs. However, the PI substrate was observed to be critical to reliability. An adhesive layer used in the PI substrate reacted at the test temperature and severe oxidation of the copper pads and reaction between the materials consequently destroyed the interconnection and caused failures. 相似文献
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各向异性导电胶粘接可靠性研究进展 总被引:12,自引:0,他引:12
介绍各向异性导电胶导电机理和粘接工艺,以及影响它的粘接可靠性因素和最佳参数的研究,如粘接温度、固化时间、粘接压力、粒子含量等。对各向异性导电胶粘接可靠性中的开路、短路、接触电阻与粘接压力和温度循环的关系进行了讨论,并介绍了各向异性导电胶可靠性的理论计算模型。 相似文献
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Soldering processes using tin/lead solder are standard interconnection technologies for electronic manufacturing. These processes
are currently under threat from the Waste Electrical and Electronic Equipment and the Restriction of Hazardous Substances
(RoHS) environmental directives, issued by the European Union in 2000. These directives explain that solder is to be free
from lead by 1986, as lead has been recognized by the European Union as an environmentally harmful material. One solder alternative
that has been investigated by the electronics industry is the area of electrically conductive adhesives (ECAs). This paper
outlines the electrical and mechanical analysis of two isotropic conductive adhesives where the main properties of joint resistance
and adhesive strength were examined before and after different environmental treatments. Joint resistance was measured with
a four-probe tester and adhesive strength was examined with the use of shear testing. Cross-sectional and scanning electron
microscopy analyses were used to determine problems such as oxidation and moisture absorption that may have an affect on the
adhesive properties of the connection. An experimental design was carried out to examine the adhesives on a standard production
line. Taguchi analysis was used to determine the build parameters required to produce an optimal adhesive joint. The results
show that although ECAs can pass a functionality test, the electrical properties of ECAs are inferior to that of solder with
ECAs having a high joint resistance. They also exhibit poor mechanical strength when shear or drop tested and illustrate that
current visual inspection techniques used to examine solder joints are not applicable to conductive adhesives. 相似文献