叉指式散热器结构的优化设计

为了解决大功率器件的高热流密度问题,以数值计算的方法研究叉指式散热器内部流体的流动换热特性,验证广义温度梯度均匀化原则是强化对流换热的基本规律。分析钉柱高度、基座高度、钉柱个数和钉柱直径等几何参数对叉指式散热器综合散热性能的影响。采用有约束条件的遗传优化算法,以散热器热阻为目标函数,对散热器几何结构进行多参数优化,得到特定条件下能够强化换热的叉指式散热器较优几何结构。研究为散热器结构的优化设计提供了理论依据和计算数据。     

CPU散热器多学科优化热设计

基于DOE、RSM、GA和MOST组合优化算法,结合熵特性采用CFD方法对有约束条件的平板直肋片散热器进行多参数结构优化,利用优化过程得到的样本数据对平板直肋片散热器进行特性分析,通过多元线性回归建立散热器换热和流动准则关系式,提供散热器热阻和熵产率具体表达式.优化结果与特性分析结论一致,和相关文献吻合.     

CPU散热器的优化设计及数值模拟

散热器的散热性能对维持中央处理器(CPU)的运行速率和使用寿命具有重要影响.通过对CPU散热器进行热设计,优化散热器的结构,采用热阻分析法建立CPU散热器的数学模型,利用CFD数值模拟方法研究不同肋片长度的CPU散热器的散热性能,并对肋长为21mm的CPU散热器进行案例分析.研究结果表明:实验范围内,加长散热器肋片长度到27mm可有效降低传热热阻,提高散热性能;超过该长度,肋片长度的增加对散热性能的影响不大.     

大功率LED路灯散热器自然对流的数值研究

采用CFD软件对常规型大功率LED路灯散热器建立了三维数值模型,在大空间中进行了耦合数值传热计算,并用实验验证了数值计算的可靠性。研究了自然对流散热过程中散热器的温度场和周围扰流空气的速度矢量场分布。针对散热器散热过程中,扰流空气不能进入散热器肋片中间让肋片充分发挥自然对流冷却效果,提出了一种新的结构设计,通过数值计算得到了较理想的结构。在同等功率下散热器基板底面最高温度比原模型低了5℃,肋片平均换热系数提高了17.6%,显著提高了大功率LED路灯散热器的散热能力。     

CPU散热器热分析与优化设计

利用CFD方法分析了平板直肋片散热器特性,通过多元线性回归建立了散热器换热和流动准则关系式,提供了散热器热阻和熵产率具体表达式;结合熵特性以本文提出的准则关系式采用约束条件的遗传优化算法对散热器结构进行多参数优化,优化结果与特性分析结论和相关文献吻合。     

高热流密度热沉散热能力数值仿真分析

固体激光器增益介质的热效应问题严重制约了高功率固体激光器的发展。本文从实际应用角度出发,通过数值仿真实验对比散热热沉的主要几何参数(包括热沉基底厚度、肋片高度、肋片宽度、肋片间距)对散热效果的影响;同时也分析了不同的外部流量条件下热沉的散热性能。计算结果表明:优化热沉几何参数,选取适宜的流量,热沉散热效果会有一定提升。     

半圆柱板翅片散热器传热特性的数值模拟

在板式翅片散热器的基础上,通过增加不同数量和半径的半圆柱肋片,构造了6种不同结构的半圆柱板翅片散热器(HPPFHS),并通过数值模拟的方法对这两种散热器的流动和传热特性进行了研究。结果表明,随着入口风速的增加,两种散热器的热阻减小的同时压降随之增大,但其热阻减小的趋势变小。入口风速相同时,相比板式翅片散热器,流经半圆柱板翅片散热器的空气受到半圆柱肋片的影响产生涡流,因而减少了热阻,同时增加了压降,但其综合性能远好于板式翅片散热器。     

基于组合参数分析的LED散热结构优化研究

为了提高LED的散热性能,利用数值计算软件Icepak对其散热过程仿真模拟。LED散热受众多结构参数影响,选定影响芯片结温的主要因素,并逐一进行模拟计算,确定目标函数随各变量的变化趋势。为了进一步合理设计散热主体结构,通过正交试验优化参数组合,分析肋片个数、肋片高度、散热器高度以及基板厚度等4个因素对芯片结温的综合影响,得到优化后的参数组合。将所得最优组合参数解模拟计算,与初始结构相比芯片结温降低了9.02℃,达到了优化目标。     

SiC外延工艺中的气体流体模型

构建了热壁CVD法生长α-SiC外延的气体流体力学模型,并通过COMSOL模拟软件计算对基座的几何形状进行设计.结果表明基座的几何形状改变,影响衬底表面的气流分布;基座有一定的倾斜角度,可以使其表面气流分布均匀,有利于得到高质量的α-SiC外延片.     

SiC外延工艺中的气体流体模型

构建了热壁CVD法生长α-SiC外延的气体流体力学模型,并通过COMSOL模拟软件计算对基座的几何形状进行设计.结果表明基座的几何形状改变,影响衬底表面的气流分布;基座有一定的倾斜角度,可以使其表面气流分布均匀,有利于得到高质量的α-SiC外延片.     

高温环境下封装有相变材料的热沉结构优化

高温环境下工作的封装有相变材料的热沉,一方面利用固液相变潜热存储系统吸收电子器件散发的热量,另一方面还要吸收从高温环境传递过来的热量。热沉结构的几何外形是影响上述两个热量传递的关键因素。以热沉总体尺寸、边界条件、热沉和相变材料为约束条件,热沉基部最高温度到达临界温度的最大时间为优化目标,通过数值模拟,获得了热沉翅片高度和宽度、热沉基部宽度和厚度的优化值,优化值兼顾了热沉传热效率和蓄热能力两个方面,并对优化过程中的热沉进行了传热分析。     

Thermal design and optimization of natural convection polymer pin fin heat sinks

The design and optimization methodology of a thermally conductive polyphenylene sulphide (PPS) polymer staggered pin fin heat sink, for an advanced natural convection cooled microprocessor application, are described using existing analytical equations. The geometric dependence of heat dissipation and the relationships between the pin fin height, pin diameter, horizontal spacing, and pin fin density for a fixed base area and excess temperature are discussed. Experimental results of a pin finned thermally conductive PPS heat sink in natural convection indicate substantially high thermal performance. Numerical results substantiate analytical modeling results for heat sinks within the Aihara et al. fin density range. The cooling rates and coefficient of thermal performance, COP/sub T/, that relates cooling capability to the energy invested in the formation of the heat sink, has been determined for such heat sinks and compared with conventional aluminum heat sinks.     

不同环境中翅片散热器性能的仿真研究

通过理论分析和仿真计算相结合的方法,以VD-MOS高热流器件的散热器为冷却对象,分别在大气环境和真空环境中建立了翅片散热器的数学物理模型,应用FLUENT公司的Icepak电子热设计分析软件对不同参数下的翅片散热器在两种环境中的性能进行了数值模拟,分别得到了翅片高度、翅片间距、翅片个数以及散热器的安装方位等多个参数对散热器散热性能的影响规律,并通过对比分析得到了真空和大气环境中的不同影响规律和最优结构参数.     

Geometrical Design of Plate-Fin Heat Sinks Using Hybridization of MOEA and RSM

The work in this paper is aimed at demonstrating the practical multiobjective optimization of plate-fin heat sinks and the superiority of using a combined response surface method and multiobjective evolutionary optimizer over solely using the evolutionary optimizer. The design problem assigned is to minimize a heat sink junction temperature and fan pumping power. Design variables determine a heat sink geometry and inlet air velocity. Design constraints are given in such a way that the maximum and minimum fin heights are properly limited. Function evaluation is carried out by using finite volume analysis software. Two multiobjective evolutionary optimization strategies, real-code strength Pareto evolutionary algorithm with and without the use of a response surface technique, are implemented to explore the Pareto optimal front. The optimum results obtained from both design approaches are compared and discussed. It is illustrated that the multiobjective evolutionary technique is a powerful tool for the multiobjective design of electronic air-cooled heat sinks. With the same design conditions and an equal number of function evaluations, the multiobjective optimizer in association with the response surface technique totally outperforms the other. The design parameters affecting the diversity of the Pareto front include fin thickness, fin height distribution, and inlet air velocity while the plate base thickness and the total number of fins of the non-dominated solutions tend to approach certain values.     

Optimization of plate fin heat sinks using entropy generationminimization

The specification and design of heat sinks for electronic applications is not easily accomplished through the use of conventional thermal analysis tools because “optimized” geometric and boundary conditions are not known a priori. A procedure is presented that allows the simultaneous optimization of heat sink design parameters based on a minimization of the entropy generation associated with heat transfer and fluid friction. All relevant design parameters for plate fin heat sinks, including geometric parameters, heat dissipation, material properties and flow conditions can be simultaneously optimized to characterize a heat sink that minimizes entropy generation and in turn results in a minimum operating temperature. In addition, a novel approach for incorporating forced convection through the specification of a fan curve is integrated into the optimization procedure, providing a link between optimized design parameters and the system operating point. Examples are presented that demonstrate the robust nature of the model for conditions typically found in electronic applications. The model is shown to converge to a unique solution that gives the optimized design conditions for the imposed problem constraints     

散热器的电磁辐射和散热特性分析

利用Feko软件分析对比了两种集成电路散热器的电磁辐射特性,再用Flotherm软件分析了它们的散热特性。结果表明,散热器在某些频率产生较大辐射,针状散热器的辐射与片状散热器,在一定频率范围内差别不大,但针状散热器散热性能要好于片状散热器。     

密闭式红外传感器的结构热设计研究

通过对密闭式红外传感器在高温环境下工作时的稳态热设计计算,进行产品的结构分析,并对该产品的结构热设计进行研究。利用Icepak热仿真软件对产品散热翅片的结构和风扇的选择与位置进行优化。最后根据仿真结果进行辅助结构热设计,进而达到节约设计成本,提高产品研发效率和产品可靠性的效果。     

A numerical study of the thermal performance of an impingement heat sink-fin shape optimization

This paper presents the results of a numerical analysis of the performance of an impingement heat sink designed for use with a specific blower as a single unit. These self-contained heat sink/blower units, which cause impingement type flow on the heat sink fins, are now commonly used for desktop microprocessors. One of the objectives of this study is to examine the effect of the shape of the heat sink fins, particularly near the center of the heat sink, on the thermal performance of the package. The pressure gradient at the center of the heat sink, near the base, tends to be high. It significantly reduces the airflow, and hence, transport in that region. Different fin shapes and airflow rates have been studied with the objective of searching for an optimal heat sink design that would improve the thermal performance without increasing the pressure drop across the heat sink. Parallel plate fins have been studied by removing fin material from the region near the center of the heat sink along the length and height of the fins. Seventeen different designs have been compared, and an "optimum" heat sink shape is reported that results in a lower operating temperature and pressure drop. It is found that removal of fin material from the central region of the heat sink enhances the thermal as well as hydraulic performance of the heat sink.     

A novel hybrid heat sink using phase change materials for transient thermal management of electronics

A hybrid heat sink concept which combines passive and active cooling approaches is proposed. The hybrid heat sink is essentially a plate fin heat sink with the tip immersed in a phase change material (PCM). The exposed area of the fins dissipates heat during periods when high convective cooling is available. When the air cooling is reduced, the heat is absorbed by the PCM. The governing conservation equations are solved using a finite-volume method on orthogonal, rectangular grids. An enthalpy method is used for modeling the melting/re-solidification phenomena. Results from the analysis elucidate the thermal performance of these hybrid heat sinks. The improved performance of the hybrid heat sink compared to a finned heat sink (without a PCM) under identical conditions, is quantified. In order to reduce the computational time and aid in preliminary design, a one-dimensional fin equation is formulated which accounts for the simultaneous convective heat transfer from the finned surface and melting of the PCM at the tip. The influence of the location, amount, and type of PCM, as well as the fin thickness on the thermal performance of the hybrid heat sink is investigated. Simple guidelines are developed for preliminary design of these heat sinks.