碲镉汞的液相外延生长

设计了一种使用良好的石墨舟,建立了一套能进行开管液相外延的系统,并利用此系统在CdZnTe衬底上和在富Te的生长条件下生长了不同x值的HgCdTe外延薄膜.通过对外延生长工艺的控制,外延薄膜的表面形貌有很大的改善,残留母液大为减少,外延薄膜的组分比较均匀,其电学性能得到较大改善,HgCdTe外延薄膜与CdZnTe衬底之间的互扩散非常少,外延膜的晶体结构也较完整.     

昆明物理研究所大面积水平推舟液相外延碲镉汞薄膜技术进展

报道了近年来昆明物理研究所在富碲水平推舟液相外延碲镉汞外延薄膜制备技术方面的进展。2019年以来,突破了?120 mm碲锌镉晶体定向生长技术,使碲锌镉衬底沉积相和夹杂相密度≤5×103 cm－2,位错腐蚀坑密度（EPD）≤4.0×104 cm－2,?120 mm（111）晶圆衬底的Zn组份分布极差≤0.36%。基于碲锌镉衬底技术的进步,液相外延碲镉汞薄膜的最大生长尺寸达到了70 mm×75 mm,薄膜位错腐蚀坑密度均值为5×104 cm－2,X射线双晶回摆曲线半峰宽（DCRC-FWHM）≤35 arcsec,部分可控制到25 arcsec以下;50 mm×60 mm尺寸长波碲镉汞薄膜的厚度极差≤±1.25 μm,室温截止波长极差≤±0.1 μm,中波碲镉汞薄膜相应指标分别为≤±1 μm、≤±0.05 μm。材料技术的进展促进了制冷型碲镉汞探测器产能提升和成本的降低,也支撑了高性能长波/甚长波探测器、高工作温度（HOT）探测器以及2048×2048、4096×4096等甚高分辨率高性能探测器的研制。     

液相外延碲镉汞贯穿型缺陷研究

液相外延碲镉汞材料的贯穿型缺陷会在后续器件制备中导致多个盲元的形成。采用共聚焦显微镜对该类缺陷的深度进行了表征,并对缺陷底部的成分进行了测试。使用聚焦离子束(Focused Ion Beam, FIB)将缺陷挖开后对其进行观察。对于贯穿型缺陷较多的碲锌镉衬底外延生长碲镉汞薄膜,统计后发现碲镉汞表面的贯穿型缺陷与衬底缺陷存在一定的对应关系,因此推测液相外延贯穿型缺陷起源于碲锌镉衬底缺陷。     

碲镉汞富碲垂直液相外延技术

研究了碲镉汞富碲垂直液相外延技术.在研究该关键技术的过程中,提出了一种方法以检查外延前(Hg1-xCdx)1-yTey母液的均匀性.并且,通过减小生长腔体中的自由空间,对气体的对流和汞回流进行了抑制,及通过改进工艺过程中的温度控制方式来应对因对流和汞回流而造成的生长温度不确定性.在解决上述关键技术后,实现了碲镉汞垂直液相外延工艺的稳定性,所外延的中波碲镉汞材料的组分可重复性做到了±0.005,厚度控制能力达到了±5μm ,40×30mm2外延材料的横向组分均匀性(相对均方差)小于1.3×10-3,同生长批次材料片与片之间的组分和厚度差异分别小于0.001和1μm.在10mm线度上,表面起伏小于1μm.经热处理后,中波汞空位p型材料在77K下具有较高的空穴迁移率.另外,和水平推舟技术相比,垂直碲镉汞液相外延在提供大批量和大面积相同性能材料方面具有明显的优势,这对于二代碲镉汞红外焦平面批生产技术和拼接型超大规模红外焦平面技术的发展都具有重要的意义.     

开管汽相外延法生长碲镉汞晶膜

报道用开管汽相外延法生长长波碲镉汞晶膜的结果。实验表明,用这种方法容易得到适合红外焦平面列阵器件制备用的大面积均匀优质碲镉汞晶膜。     

MOCVD外延碲镉汞薄膜的生长工艺选择

金属有机化合物汽相沉积（ＭＯＣＶＤ）技术是制备用于红外焦平面阵列（ＩＲＦＦＰＡ）的高质量碲镉汞（ＨｇＣｄＴｅ）薄膜材料的重要手段。文中讨论了汞源温度、生长温度、衬底材料及互扩散多层工艺（ＩＭＰ）等因素在ＭＯＣＶＤ外延生长碲镉汞薄膜过程中的作用机理,并选择适合的生长条件获得了质量优良的碲镉汞薄膜。     

碲镉汞外延用衬底材料的现状和发展

文章综合论述了碲镉汞外延用的衬底材料的现状,着重介绍了几种衬底材料CdTe、 Al2O3、GaAs、Ge、Si等的性能特点与各自的优缺点,评述了它们在碲镉汞外延中的使用情况,并对其未来的发展方向做出了预测。     

CdZnTe中富碲沉积相缺陷引起的液相外延HgCdTe薄膜表面缺陷

为了研究液相外延碲镉汞薄膜表面缺陷形成机制,采用光刻工艺结合化学腐蚀方法在碲锌镉衬底表面实现了网格化,研究了碲锌镉近表面富碲沉积相与外延薄膜表面缺陷的关系.结果表明:衬底近表面富碲沉积相会导致碲镉汞薄膜表面孔洞、类针形凹陷坑缺陷以及三角形凹陷坑聚集区;在液相外延过程中,高温碲镉汞熔液与CdZnTe衬底间的回熔作用可以减少与富碲沉积相相关的表面缺陷,薄膜表面缺陷与衬底表面富碲沉积相的匹配度与回熔深度负相关;回熔过程以及富碲沉积相形态、深度影响HgCdTe薄膜表面缺陷形态和分布.     

采用(211)碲锌镉衬底制备碲镉汞液相外延薄膜

文中对(211)晶向的CdZnTe衬底进行液相外延生长HgCdTe。获得的碲镉汞液相外延材料的组分为0. 30 ～0. 33,薄膜厚度为10 ～15μm,表面缺陷密度为500cm- 2 ,材料的FWHM达到24弧秒,位错腐蚀坑密度约为2 ×105 cm- 2 ,该材料的表面形貌与采用(111)晶向衬底的HgCdTe外延材料有较大区别。     

高质量HgCdTe薄膜的液相外延生长

用固态HgTe作为Hg补偿源,采用开管、水平滑块推舟的富Te液相外延(LPE)方法在碲锌镉(Cd1-yZnyTe, y＝0.04)衬底上外延生长大面积Hg1-xCdxTe(x＝0.2)薄膜材料,通过适当的生长条件得到组分均匀、结构完整、表面形貌良好的长波碲镉汞薄膜.测试结果表明本方法生长的HgCdTe薄膜能满足目前研制红外焦平面器件的要求.     

Progress in the Molecular Beam Epitaxy of HgCdTe on Large-Area Si and CdZnTe Substrates

This paper presents the progress in the molecular beam epitaxy (MBE) growth of HgCdTe on large-area Si and CdZnTe substrates at Raytheon Vision Systems. We report a very high-quality HgCdTe growth, for the first time, on an 8 cm × 8 cm CdZnTe substrate. This paper also describes the excellent HgCdTe growth repeatability on multiple 7 cm × 7 cm CdZnTe substrates. In order to study the percentage wafer area yield and its consistency from run to run, small lots of dual-band long-wave infrared/long-wave infrared triple-layer heterojunction (TLHJ) layers on 5 cm × 5 cm CdZnTe substrates and single-color double-layer heterojunction (DLHJ) layers on 6-inch Si substrates were grown and tested for cutoff wavelength uniformity and micro- and macrovoid defect density and uniformity. The results show that the entire lot of 12 DLHJ-HgCdTe layers on 6-inch Si wafers meet the testing criterion of cutoff wavelength within the range 4.76 ± 0.1 μm at 130 K and micro- and macrovoid defect density of ≤50 cm⁻² and 5 cm⁻², respectively. Likewise, five out of six dual-band TLHJ-HgCdTe layers on 5 cm × 5 cm CdZnTe substrates meet the testing criterion of cutoff wavelength within the range 6.3 ± 0.1 μm at 300 K and micro- and macrovoid defect density of ≤2000 cm⁻² and 500 cm⁻², respectively, on the entire wafer area. Overall we have found that scaling our HgCdTe MBE process to a 10-inch MBE system has provided significant benefits in terms of both wafer uniformity and quality.     

MOCVD grown CdZn Te/GaAs/Si substrates for large-area HgCdTe IRFPAs

Large-area HgCdTe 480×640 thermal-expansion-matched hybrid focal plane arrays were achieved by substituting metalorganic chemical vapor deposition (MOCVD)-grown CdZnTe/GaAs/Si alternative substrate in place of bulk CdZnTe substrates for the growth of HgCdTe p-on-n double-layer heterojunctions by controllably-doped mercury-melt liquid phase epitaxy (LPE). (100) CdZnTe was grown by MOCVD on GaAs/Si using a vertical-flow high-speed rotating disk reactor which incorporates up to three two-inch diameter substrates. Layers having specular surface morphology, good crystalline structure, and surface macro defect densities <50 cm⁻² are routinely achieved and both the composition uniformity and run-to-run reproducibility were very good. As the composition of the CdZnTe layers increases, the x-ray full width at half maximum (FWHM) increases; this is a characteristic of CdZnTe grown by VPE techniques and is apparently associated with phase separation. Despite a broader x-ray FWHM for the fernary CdZnTe, the FWHM of HgCdTe grown by LPE on these substrates decreases, particularly for [ZnTe] compositions near the lattice matching condition to HgCdTe. An additional benefit of the ternary CdZnTe is an improved surface morphology of the HgCdTe layers. Using these silicon-based substrates, we have demonstrated 78K high-performance LWIR HgCdTe 480×640 arrays and find that their performance is comparable to similar arrays fabricated on bulk CdZnTe substrates for temperatures exceeding approximately 78K. The performance at lower temperatures is apparently limited by the dislocation density which is typically in the low-mid 10⁶ cm⁻² range for these heteroepitaxial materials.     

碲锌镉衬底缺陷对液相外延碲镉汞薄膜结构的影响

采用红外显微镜、X射线双晶回摆衍射法、X射线貌相术对CdZnTe衬底中的沉淀相、亚结构、组分偏析等缺陷进行了研究,并对用此衬底液相外延的HgCdTe薄膜作了测试。结果显示：CdZnTe衬底中亚晶界处聚集的位错在外延生长中呈发散状向薄膜中延伸,造成了薄膜形成亚晶界和更大面积的由位错引起的晶格畸变应力区域,影响了薄膜结构的完整性。     

液相外延碲镉汞薄膜表面的结晶类缺陷分析

利用扫描电镜、能谱分析、光学轮廓仪以及金相显微镜等测试手段对液相外延碲镉汞薄膜表面缺陷的形貌、成分和断面进行了分析,并研究了不同种类表面缺陷的特征及来源。结果表明,液相外延碲镉汞薄膜表面上存在的结晶类缺陷往往尺寸较大或成片分布,对后续器件产生明显影响。通过分析其成因可以发现,母液均匀性的提升是减少该类缺陷和提高碲镉汞薄膜质量的关键。     

Lattice mismatch induced morphological features and strain in HgCdTe epilayers on CdZnTe substrates

HgCdTe epilayers on CdZnTe substrates can exhibit a cross-hatch pattern of periodically varying strain and surface undulations as revealed by x-ray topography, and in some cases by Nomarski optical microscopy. On { 111 } oriented material, the pattern appears as three sets of parallel lines in the 〈 110 〉 slip directions (60° apart). To investigate this phenomenon and its impact on photovoltaic device performance, we have characterized several liquid phase epitaxy (LPE)-grown HgCdTe epilayer samples by means of Lang x-ray reflection topography, synchrotron white beam x-ray topography (SWBXT), etch pit density, and other techniques. The cross hatching generally shows a correlation with the ZnTe mole fraction of the substrate. In particular, the pattern is likely to appear when the natural lattice parameter of the layer at room temperature is slightly larger or smaller than that of the substrate in the same region. We also find the corresponding pattern in { 211 } oriented layers grown by MBE. Although substantial compositional interdiffusion occurs at the layer/substrate interface during LPE growth at around 500°C, this is not a necessary condition for the cross-hatch pattern, as demonstrated by the occurrence of the pattern in MBE material grown at less than 200°C. In terms of device performance, the pattern is manifested as lines of diodes in an array having greater leakage than their neighbors. In addition to these results, we have investigated other anomalies, by means of SWBXT applied to large-area diodes that have been electrically tested. A novel technique called absorption edge contour mapping, using synchrotron white beam x-rays with a molybdenum filter, was applied to reveal the longer range lattice strain.