Epitaxial Growth and Device Design Optimization of Full-Vertical GaN <Emphasis Type="Italic">p</Emphasis>-<Emphasis Type="Italic">i</Emphasis>-<Emphasis Type="Italic">n</Emphasis> Rectifiers

The optimization of growth parameters, epitaxial structure, and device design for full-vertical gallium nitride (GaN) p-i-n rectifiers grown on n-type 6H-SiC substrates employing AlGaN:Si conducting buffer layers have been studied. The Al _x Ga_1−x N:Si (x = ~0.1) nucleation layer is calibrated to be capable of acting as a good buffer layer for subsequent GaN growth as well as to provide excellent electrical properties. Two types of full-vertical devices were fabricated and compared: one without any current guiding and the other with the current guiding in the p-layer. The reverse breakdown voltage for rectifiers with a relatively thin 2.5-μm-thick i-region without p-current guiding was found to be over −330 V, while one with p-current guiding was measured to be over −400 V. Devices with p-current guiding structures exhibit reduced reverse leakage current by an order of magnitude >4 at −100 V.     

Study of the influence of the sulfide and ultraviolet treatment of the <Emphasis Type="Italic">n</Emphasis>-<Emphasis Type="Italic">i</Emphasis>-GaAs surface on the parameters of ohmic contacts

The possibility of improving the parameters of AuGe/Ni- and Ge/Cu-based ohmic contacts to n-i-GaAs by modifying the preliminarily oxidized GaAs surface in a sulfide-containing solution, as well as via the effect of ultraviolet radiation generated with a KrCl excimer lamp on a chalcogenated surface, is studied. It is shown that preliminary oxidation of the n-i-GaAs surface with subsequent chalcogenation makes it possible to decrease the density of the surface states, to increase the reproducibility of the passivation of the surface, and to decrease the reduced contact resistance of the AuGe/Ni ohmic contacts by a factor of 1.5. The treatment of the chalcogenated surface of n-i-GaAs with an ultraviolet radiation with wavelength λ = 222 nm and emission power density W = 12 mW cm⁻² performed in vacuum before the deposition of metal layers of the Ge/Cu ohmic contacts makes it possible to decrease the reduced contact resistance by 25–50% andimprove the morphological characteristics of the surface of the contact area.     

Electrical Characteristics of <Emphasis Type="Italic">n</Emphasis>-ZnO/<Emphasis Type="Italic">p</Emphasis>-Si Heterojunction Diodes Grown by Pulsed Laser Deposition at Different Oxygen Pressures

Heterojunction diodes of n-type ZnO/p-type silicon (100) were fabricated by pulsed laser deposition of ZnO films on p-Si substrates in oxygen ambient at different pressures. These heterojunctions were found to be rectifying with a maximum forward-to-reverse current ratio of about 1,000 in the applied voltage range of −5 V to +5 V. The turn-on voltage of the heterojunctions was found to depend on the ambient oxygen pressure during the growth of the ZnO film. The current density–voltage characteristics and the variation of the series resistance of the n-ZnO/p-Si heterojunctions were found to be in line with the Anderson model and Burstein-Moss (BM) shift.     

AUTOCORRELATIONS OF l-SEQUENCES WITH CERTAIN SHIFTS

In this paper, the autocorrelations of maximal period Feedback with Carry Shift Register sequences （l-sequences） are discussed. For an l-sequence a with connection integer q = p^e（e ≥ 2） and period T = p^t-1（p- 1）, and for any integer i, 1 ≤ i ≤ e/2, by calculating the number of certain sets, it is shown that the autocorrelation of a with shift τ= kT/2p^i is Ca（τ） =（-1）^k-1 T/p^2i-1, where 1 ≤ k ≤ 2p^i - 1, and gcd（k,2p^i） = 1. This result shows there do exist some shifts such that the autocorrelations of l-sequences are high although most autocorrelations are low. Such result also holds for the decimations of l-sequences.     

Recombination of charge carriers in the GaAs-based <Emphasis Type="Italic">p</Emphasis>-<Emphasis Type="Italic">i</Emphasis>-<Emphasis Type="Italic">n</Emphasis> diode

It is established that the radiative recombination of charge carriers plays a substantial role in the GaAs-based p-i-n diodes at high densities of the forward current. It is shown experimentally that the diodes operating in microwave integrated circuits intensely emit light in the IR range with wavelengths from 890 to 910 nm. The obtained results indicate the necessity of taking into account the features of recombination processes in the GaAs-based microwave p-i-n diodes.     

Planar <Emphasis Type="Italic">n</Emphasis>-on-<Emphasis Type="Italic">p</Emphasis> HgCdTe FPAs for LWIR and VLWIR Applications

Mainly driven by space applications, mercury cadmium telluride (MCT) focal-plane arrays (FPAs) have been successfully developed for very long wavelengths (λ _CO > 14 μm at 55 K). For this purpose, the standard n-on-p technology based on MCT grown by liquid-phase epitaxy (LPE) and involving vacancy doping has been modified to extrinsic doping by a monovalent acceptor. Due to the planar diode geometry obtained by ion implantation, most of the carrier generation volume is located in the p-type region with a thickness of approximately 8 μm. According to our understanding, the Shockley–Read centers connected with the Hg vacancies are thus significantly reduced. This situation should lead to longer minority-carrier lifetimes and smaller generation rates under equilibrium conditions, therefore yielding lower dark current. We indeed observe a reduction by a factor of approximately 15 by using extrinsic doping. Recent dark current data obtained in the temperature range from 55 K to 85 K on 288 × 384 FPAs with λ _CO(60 K) = 12 μm, either intrinsically or extrinsically doped, corroborate this finding. These data, new results on a 112 × 112 pixel demonstrator array with λ _CO(55 K) = 14.4 μm, and earlier measurements are compared with Tennant’s Rule 07 established for p-on-n technology.     

A DLTS study of 4<Emphasis Type="Italic">H</Emphasis>-SiC-based <Emphasis Type="Italic">p</Emphasis>-<Emphasis Type="Italic">n</Emphasis> junctions fabricated by boron implantation

Deep-level transient spectroscopy (DLTS) has been used to study p-n junctions fabricated by implantation of boron into epitaxial 4H-SiC films with n-type conductivity and the donor concentration (8–9) × 10¹⁴ cm⁻³. A DLTS signal anomalous in sign is observed; this signal is related to recharging of deep compensating boron-involved centers in the n-type region near the metallurgical boundary of the p-n junction.     

Study of the <Emphasis Type="Italic">p</Emphasis>-Ge-<Emphasis Type="Italic">n</Emphasis>-GaAs heterojunction under hydrostatic pressure

The current-voltage characteristic of the p-Ge-n-GaAs heterojunction is experimentally studied under hydrostatic pressure as high as 8 GPa and temperature of 300 K. The baric coefficient of the edge of the valence band of Ge is calculated using the experimental results.     

Effect of different chemical treatments of surface on the height of Al-<Emphasis Type="Italic">p</Emphasis>-SiGe and Au-<Emphasis Type="Italic">n</Emphasis>-SiGe barriers

The effect of different chemical treatments on the properties of Au-n-SiGe and Al-p-SiGe Schottky barriers has been investigated. Etching under different conditions was used to prepare surfaces with different densities of surface states (D _ss). It is shown that the barrier height in the structures under study correlates with the D _ss value and germanium content in the Si_{1 − x} Ge _x alloy.     

Electric properties of (SiC)<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>(AlN)<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>/SiC anisotropic heterostructures

The heterostructures of p-(SiC)_{1 − x} (AlN) _x / _n -6H-SiC are synthesized by means of sublimation epitaxy of (SiC)_{1 − x} (AlN) semiconductor solid solutions at 6H-SiC substrates. The results of the investigation of the concentration and temperature dependences on current-voltage characteristics (CVCs) are presented. It is revealed that due to the high potential barriers the forward current is caused by the tunneling and recombination processes of charge carriers via states at the boundary surface.     

Photosensitivity of <Emphasis Type="Italic">n</Emphasis>-CdS/<Emphasis Type="Italic">p</Emphasis>-CdTe heterojunctions obtained by chemical surface deposition of CdS

A new technology of chemical surface deposition is developed, and thin CdS films (35–100 nm) on the p-CdTe substrates are obtained. Electrical and photoelectric properties of n-CdS/p-CdTe heterojunctions are studied, and it is shown that the developed method provides high efficiency of photoconversion in the range restricted by the CdTe and CdS band gaps. It is shown that the method of chemical surface deposition of CdS can be used in the design of thin-film n-CdS/p-CdTe.     

An ultra-low-power CMOS symmetrical OTA for low-frequency <Emphasis Type="Italic">G</Emphasis><Subscript><Emphasis Type="Italic">m</Emphasis></Subscript>-<Emphasis Type="Italic">C</Emphasis> applications

In this paper an ultra-low-power CMOS symmetrical operational transconductance amplifier (OTA) for low-frequency G _m -C applications in weak inversion is presented. Its common mode input range and its linear input range can be made large using DC shifting and bulk-driven differential pair configuration (without using complex approaches). The symmetrical OTA was successfully verified in a standard CMOS 0.35-μm process. The measurements show an open loop gain of 61 dB and a unit gain frequency of 195 Hz with only 800 mV of power supply voltage and just 40 nW of power consumption. The transconductance is 66 nS, which is suitable for low-frequency G _m -C applications.     

Fabrication and Electrical Characterization of Heterojunction Mn-Doped GaN Nanowire Diodes on <Emphasis Type="Italic">n</Emphasis>-Si Substrates (GaN:Mn NW/<Emphasis Type="Italic">n</Emphasis>-Si)

We demonstrated that manganese (Mn)-doped GaN nanowires (NWs) exhibit p-type characteristics using current–voltage (I–V) characteristics in both heterojunction p–n structures (GaN:Mn NWs/n-Si substrate) and p–p structures (GaN:Mn NWs/p-Si). The heterojunction p–n diodes were formed by the coupling of the Mn-doped GaN NWs with an n-Si substrate by means of an alternating current (AC) dielectrophoresis-assisted assembly deposition technique. The GaN:Mn NWs/n-Si diode showed a clear current-rectifying behavior with a forward voltage drop of 2.4 V to 2.8 V, an ideality factor of 30 to 37, and a parasitic resistance in the range of 93 kΩ to 130 kΩ. On the other hand, we observed that other heterojunction structures (GaN:Mn NWs/p-Si) showed no rectifying behaviors as seen in p–p junction structures.     

A 5.4-GHz high-<Emphasis Type="Italic">Q</Emphasis> tunable active-inductor bandpass filter in standard digital CMOS technology

A transistor-only CMOS active-inductor with an all-NMOS signal path is presented. By tuning the varactor-augmented parasitic capacitance at the only internal node the circuit losses from submicron MOSFETs can be partially or fully compensated to permit realizing unlimited values of Q, with little frequency and no power-consumption penalties. Transistor-only second-order bandpass filters using the active inductor were built in the TSMC 0.18-μm CMOS process, and high filter Q was obtained by tuning the varactor. The highest center frequency measured was f ₀ = 5.7 GHz for 0.2-μm gate lengths and the maximum repeatably measured Q was 665. Lower Qs can be obtained by reducing the capacitive compensation or by adjusting the circuit biasing. f ₀ and Q are tunable via separate varactors. IIP ₃ and input 1-dB compression point were simulated as 0.523 V_PP and 0.128 V_PP (−1.65 and −13.9 dBm from a 50-Ω source) at 5.7 GHz with Q = 100 and midband gain equal 4.7 dB. For the same conditions, the output noise and noise figure (R _S = 50 kΩ) were simulated to be 0.8 μV/Hz^1/2 and 25.6 dB, respectively. The filter core occupies an area of 26.6 μm × 30 μm and dissipates 4.4 mW at 5.4 GHz from a 1.8-V power supply. As the circuits use only MOSFETs they are fully compatible with standard digital CMOS processes. f ₀ statistics were obtained by measuring 40 chips at identical biasing condition.     

Very Low Pressure Magnetron Reactive Ion Etching of GaN and Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>N Using Dichlorofluoromethane (Halocarbon 12)

In this work we report on the magnetron reactive ion etch (MRIE) technology for gallium nitride (GaN) and aluminum gallium nitride (Al _x Ga_1−x N) using dichlorodifluoromethane (CCl₂F₂), commonly known as halocarbon 12, with etch rates greater than 1,000 and 840 ?/min, respectively. Magnetic confinement of a very low pressure (10⁻⁴ Torr range) radio frequency (RF) discharge generates high-density plasmas, with low sheath voltages at the bounding surfaces, and very high dissociation of the source gas. Furthermore, the very low pressure of the etch process is characterized by long mean free paths so that sputtering contamination is reduced. MRIE chemistry has been monitored in situ by means of mass spectroscopy. Finally, we report on the successful fabrication of an indium gallium nitride (In _x Ga_1−x N) blue light emitting diode (LED), whose fabrication sequence included the MRIE etching of GaN in CCl₂F₂.     

Development of Molecular Beam Epitaxially Grown Hg<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Cd<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Te for High-Density Vertically-Integrated Photodiode-Based Focal Plane Arrays

Hg_1−x Cd _x Te samples of x ~ 0.3 (in the midwave infrared, or MWIR, spectral band) were prepared by molecular beam epitaxy (MBE) for fabrication into 30-μm-pitch, 256 × 256, front-side-illuminated, high-density vertically-integrated photodiode (HDVIP) focal plane arrays (FPAs). These MBE Hg_1−x Cd _x Te samples were grown on CdZnTe(211) substrates prepared in this laboratory; they were ~10-μm thick and were doped with indium to ~5 × 10¹⁴ cm⁻³. Standard HDVIP process flow was employed for array fabrication. Excellent array performance data were obtained from these MWIR arrays with MBE HgCdTe material. The noise-equivalent differential flux (NEΔΦ) operability of the best array is 99.76%, comparable to the best array obtained from liquid-phase epitaxy (LPE) material prepared in this laboratory.     

Study of the current-voltage characteristic of the <Emphasis Type="Italic">n</Emphasis>-CdS/<Emphasis Type="Italic">p</Emphasis>-CdTe heterostructure depending on temperature

Current-voltage characteristics of the n-CdS/p-CdTe heterostructure are studied at different temperatures. It is established that the forward portion of the current-voltage characteristic of these structures at low voltages (as high as 0.5 V) is described by the exponential dependence, while at high voltages (as high as 2.6 V), there is a portion of sublinear growth of the current with voltage. Experimental results are interpreted based on the theory of the effect of injection depletion. It is shown that the product of mobility of majority carriers by the concentration of deep centers increases as the temperature is increased.     

Bistable low temperature (77 K) impurity breakdown in <Emphasis Type="Italic">p</Emphasis>-type 4<Emphasis Type="Italic">H</Emphasis>-SiC

Low-temperature (77 K) forward current-voltage characteristics of 4H-SiC p ⁺-p-n ⁺-n (substrate) mesa epitaxial diode structures have been measured. The characteristics are S-shaped, which is accounted for by the bistable nature of the impact ionization of frozen-out acceptor atoms of aluminum.     

Differential capacitance of a <Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript>-<Emphasis Type="Italic">p</Emphasis> junction

The differential capacitance of a p ⁺-p junction formed by charge redistribution near the junction, has been investigated taking into account the electric field in the quasi-neutral p region. The dependence of the capacitance and current of the p ⁺-p junction on its voltage is obtained. It is shown that a change in the sign of the p ⁺-p-junction capacitance with an increase in the injection level is caused by a decrease in the bipolar drift mobility in the p-type region. It is also demonstrated that a change in the sign of the p ⁺-p-junction capacitance with an increase in the reverse voltage determines the charge reduction near the junction, as the increase in the negative charge of acceptor ions predominates over the increase in the positive charge of holes.     

Charge-Compensated <Emphasis Type="Italic">n</Emphasis>-Type Skutterudites

Ba+Yb double-filled n-type skutterudites with a modest degree of charge compensation by Fe on the Co lattice have been synthesized and compacted by spark-plasma sintering, and their thermoelectric properties evaluated at temperatures up to 800 K. Although this approach to making n-type skutterudites seems counterintuitive, the presence of Fe leads to a reduction in the thermal conductivity while it preserves a robust Seebeck coefficient. Consequently, a high ZT in excess of 1.3 was achieved at 800 K in these Fe-containing n-type skutterudite compounds.