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1.
应用电子束直写技术成功制作了栅长0.15μm的高性能In0.52Al0.48As/In0.53Ga0.47As GaAs MHEMT。从工艺角度,结合器件的小信号等效电路的理论分析,优化了器件源漏间距,从而减小了器件寄生参数,达到了较好的器件性能。最终制作的In0.52Al0.48As/In0.53Ga0.47As MHEMT饱和电流达到495mA/mm,夹断电压-0.8V,在Vgs为-0.19V时的最大非本征跨导gm为1032mS/mm,截止频率ft达到156GHz,最大振荡频率fmax大于150GHz。  相似文献   

2.
应用电子束直写技术成功制作了栅长0.18μm的高性能In0.52Al0.48As/In0.53Ga0.47As MHEMT。从工艺角度,结合器件的小信号等效电路的理论分析,优化了器件结构,特别是T形栅结构,从而减小了器件寄生参数,达到了较好的器件性能。最终制作的In0.52Al0.48As/In0.53Ga0.47As MHEMT饱和电流达到275mA/mm,夹断电压-0.8V,在Vgs为-0.15V时的最大非本征跨导gm为650mS/mm,截止频率ft达到136GHz,最大振荡频率fmax大于120GHz。  相似文献   

3.
应用电子束直写技术成功制作了栅长0.18μm的高性能In0.52Al0.48As/In0.53Ga0.47As MHEMT.从工艺角度,结合器件的小信号等效电路的理论分析,优化了器件结构,特别是T形栅结构.从而减小了器件寄生参数,达到了较好的器件性能.最终制作的In0.52Al0.48As/In0.53Ga0.47As MHEMT饱和电流达到275 mA/mm,夹断电压-0.8 V,在Uga为-0.15 V时的最大非本征跨导gm为650 mS/mm,截止频率ft达到136 GHz,最大振荡频率fmax大于120 GHz.  相似文献   

4.
报道了用 MBE技术生长的 Ga As基 In Al As/In Ga As改变结构高电子迁移率晶体管 (MHEMT)的制作过程和器件的直流性能。对于栅长为 0 .8μm的器件 ,最大非本征跨导和饱和电流密度分别为 3 5 0 m S/mm和1 90 m A/mm。源漏击穿电压和栅反向击穿电压分别为 4V和 7.5 V。这些直流特性超过了相同的材料和工艺条件下 Ga As基 PHEMT的水平 ,与 In P基 In Al As/In Ga As HEMT的性能相当  相似文献   

5.
建立了SACM型In0.53Ga0.47As/In0.52Al0.48As雪崩光电二极管(APD)的分析模型,通过数值研究和理论分析设计出高性能的In0.53Ga0.47As/In0.52Al0.48As APD。器件设计中,一方面添加了In0.52Al0.48As势垒层来阻挡接触层的少数载流子的扩散,进而减小暗电流的产生;另一方面,雪崩倍增区采用双层掺杂结构设计,优化了器件倍增区的电场梯度分布。最后,利用ATLAS软件较系统地研究并分析了雪崩倍增层、电荷层以及吸收层的掺杂水平和厚度对器件电场分布、击穿电压、IV特性和直流增益的影响。优化后APD的单位增益可以达到0.9 A/W,在工作电压(0.9 Vb)下增益为23.4,工作暗电流也仅是纳安级别(@0.9 Vb)。由于In0.52Al0.48As材料的电子与空穴的碰撞离化率比InP材料的差异更大,因此器件的噪声因子也较低。  相似文献   

6.
跨导为220 mS/mm的AlGaN/GaNHEMT   总被引:2,自引:1,他引:1  
介绍了 Al Ga N/ Ga N HEMT器件的研制及室温下器件特性的测试。漏源欧姆接触采用 Ti/ Al/ Pt/ Au,肖特基结金属为 Pt/ Au。器件栅长为 1 μm,获得最大跨导 2 2 0 m S/ mm,最大的漏源饱和电流密度 0 .72 A/ mm。由 S参数测量推出器件的截止频率和最高振荡频率分别为 1 2 GHz和 2 4GHz。  相似文献   

7.
设计并制作了双异质结双平面掺杂的Al0.24Ga0.76As/In0.22Ga0.78As/Al0.24Ga0.76As功率PHEMT器件,采用双选择腐蚀栅槽结构,有效提高了PHEMT器件的输出电流和击穿电压.对于1μm栅长的器件,最大输出电流为500mA/mm,跨导为275mS/mm,阈值电压为-1.4V,最大栅漏反向击穿电压达到了33V.研究结果表明,在栅源间距一定时,栅漏间距对于器件的输出电流、跨导和击穿电压有很大关系,是设计功率PHEMT的关键之一.  相似文献   

8.
应用电子束直写技术成功制作了栅长100nm的高性能In0.52Al0.48As/In0.53Ga0.47As GaAs MHEMT(渐变组分高电子迁移率晶体管)。从工艺角度,结合器件的小信号等效电路的理论分析,优化了器件T形栅尺寸与工艺,从而减小了器件寄生参数,达到了较好的器件性能。最终制作的In0.52Al0.48As/In0.53Ga0.47As MHEMT饱和电流达到460mA/mm,夹断电压-0.8V,在Vgs为-0.23V时的最大非本征跨导gm为940mS/mm,截止频率ft达到220GHz,最大振荡频率fmax大于200GHz。  相似文献   

9.
设计并制作了双异质结双平面掺杂的Al0 .2 4 Ga0 .76 As/ In0 .2 2 Ga0 .78As/ Al0 .2 4 Ga0 .76 As功率PHEMT器件,采用双选择腐蚀栅槽结构,有效提高了PHEMT器件的输出电流和击穿电压.对于1μm栅长的器件,最大输出电流为5 0 0 m A/ mm ,跨导为2 75 m S/ m m,阈值电压为- 1 .4 V,最大栅漏反向击穿电压达到了33V .研究结果表明,在栅源间距一定时,栅漏间距对于器件的输出电流、跨导和击穿电压有很大关系,是设计功率PHEMT的关键之一.  相似文献   

10.
陈效建  吴旭  李拂晓  焦刚 《半导体学报》2004,25(9):1137-1142
讨论了采用埋栅结构实现Ga As基改性高电子迁移率晶体管(MHEMT)增强型模式工作的有关问题,提出了增强型MHEMT的设计与实现方法.通过不同金属(Al,Pt,Ti) / In Al As Schottky势垒系统的实验比较研究,确定在增强型MHEMT工艺中采用具有最高势垒高度的Pt Schottky埋栅结构;并进行了以最佳“推栅”温度为重点的器件工艺的深入研究.在此基础上通过实验研制的原理性1.0 μm×10 0 μm Pt栅增强型MHEMT的特性获得了夹断电压为+0 .12 V,跨导为4 70 m S/ m m及截止频率为5 0 GHz的测试结果,优于使用同一外延片制作的D-MHEMT  相似文献   

11.
The authors report the successful demonstration of a 1.0-μm gate InAlAs/InGaAs heterojunction FET (HFET) on top of thick InGaAs layers using lattice-matched molecular beam epitaxy (MBE). This scheme is compatible with metal-semiconductor-metal (MSM) photodetector fabrication. The authors measured the performance of InAlAs/InGaAs HFETs from 0 to 40 GHz. Device performance is characterized by peak extrinsic transconductances of 390 mS/mm and as-measured cutoff frequencies up to 30 GHz for a nominal 1.0-μm-gate-length HFET. HFET device measurements are compared for samples growth with and without the thick underlying InGaAs optical-detector absorbing layer  相似文献   

12.
利用新型的PMMA/PMGI/ZEP520/PMGI四层胶T形栅电子束光刻技术制备出120nm栅长InP基雁配In0.7Ga0.3As/In0.52Al0.48As 高电子迁移率晶体管。制作出的InP基HEMT器件获得了良好的直流和高频性能,跨导、饱和漏电流密度、阈值电压、电流增益截止频率和最大单向功率增益频率分别达到520 mS/mm, 446 mA/mm, -1.0 V, 141 GHz 及 120 GHz。文中的材料结构和所有器件制备均为本研究小组自主研究开发。  相似文献   

13.
New In0.4Al0.6As/In0.4Ga0.6 As metamorphic (MM) high electron mobility transistors (HEMTs) have been successfully fabricated on GaAs substrate with T-shaped gate lengths varying from 0.1 to 0.25 μm. The Schottky characteristics are a forward turn-on voltage of 0.7 V and a gate breakdown voltage of -10.5 V. These new MM-HEMTs exhibit typical drain currents of 600 mA/mm and extrinsic transconductance superior to 720 mS/mm. An extrinsic current cutoff frequency fT of 195 GHz is achieved with the 0.1-μm gate length device. These results are the first reported for In0.4 Al0.6As/In0.4Ga0.6As MM-HEMTs on GaAs substrate  相似文献   

14.
InP-based high electron mobility transistors (HEMTs) were fabricated by depositing Pt-based multilayer metallization on top of a 6-nm-thick InP etch stop layer and then applying a post-annealing process. The performances of the fabricated 55-nm-gate HEMTs before and after the post-annealing were characterized and were compared to investigate the effect of the penetration of Pt through the very thin InP etch stop layer. After annealing at 250 °C for 5 min, the extrinsic transconductance (Gm) was increased from 1.05 to 1.17 S/mm and Schottky barrier height was increased from 0.63 to 0.66 eV. The unity current gain cutoff frequency (fT) was increased from 351 to 408 GHz, and the maximum oscillation frequency (fmax) was increased from 225 to 260 GHz. These performance improvements can be attributed to penetration of the Pt through the 6-nm thick InP layer, and making contact on the InAlAs layer. The STEM image of the annealed device clearly shows that the Pt atoms contacted the InAlAs layer after penetrating through the InP layer.  相似文献   

15.
A uniform In0.05Ga0.95As ternary substrate was grown by using liquid encapsulated Czochralski (LEC) technique with a method of supplying GaAs source material at a constant temperature, and InGaAs/InGaAsP strained single quantum well (SQW) lasers were fabricated on the substrate for the first time. The lasers lased at 1.03 μm and exhibited low threshold current density of 222 A/cm2 and excellent characteristic temperature of 221 K, showing that the ternary substrate has a sufficient quality for laser fabrication  相似文献   

16.
High-performance 0.3-μm-gate-length surface-undoped In0.52 Al0.48As/In0.53Ga0.47As/InP high-electron-mobility transistors (HEMTs) grown by molecular beam epitaxy (MBE) have been characterized and compared with a surface-doped structure. At 18 GHz, the surface-undoped HEMT has achieved a maximum stable gain (MSG) of 19.2 dB compared to 16.0 dB for the surface-doped structure. The higher MSG value of the surface-undoped HEMTs is obtained due to the improved gm/g0 ratio associated with the surface-induced electric field spreading effect. Comparison of identical 0.3-×150-μm-gate devices fabricated on surface-undoped and -doped structures has shown greatly improved gate leakage characteristics and much lower output conductance for the surface-undoped structure. It is demonstrated that the surface potential, modulated by different surface layer designs, affects the charge control in the conducting channel, especially the carrier injection into the buffer, resulting in excess output conductance. Several millimeter-wave coplanar waveguide (CPW) monolithic distributed amplifiers have been successfully fabricated by using the surface-undoped HEMT structure. A high gain per stage distributed amplifier with 170-dB±1-dB small-signal gain across a frequency band of 24-40 GHz, a W-band monolithic integrated circuit with 6.4-dB gain at 94 GHz, and a broad bandwidth distributed amplifier with 5-dB gain across a frequency band of 5 to 100 GHz have been demonstrated by using the surface-undoped structures  相似文献   

17.
P-n-p In0.52Al0.48As/In0.53Ga0.47 As double-heterojunction bipolar transistors with a p+-InAs emitter cap layer grown by molecular-beam epitaxy have been realized and tested. A five-period 15-Å-thick In0.53Ga0.47As/InAs superlattice was incorporated between the In0.53Ga0.47As and InAs cap layer to smooth out the valence-band discontinuity. Specific contact resistance of 1×10-5 and 2×10-6 Ω-cm2 were measured for nonalloyed emitter and base contacts, respectively. A maximum common emitter current gain of 70 has been measured for a 1500-Å-thick base transistor at a collector current density of 1.2×103 A/cm2. Typical current gains of devices with 50×50-μm2 emitter areas were around 50 with ideality factors of 1.4  相似文献   

18.
Temperature-dependent current-voltage measurement was employed to study the band offsets of the In0.30Ga0.70As/In 0.29Al0.71As heterojunction. The conduction band discontinuity was determined to be 0.71±0.05 eV which corresponds to a conduction band offset to bandgap difference ratio ~0.66. The comparison between experimental and theoretical results is presented  相似文献   

19.
Magneto-transport and cyclotron resonance measurements were made to determine directly the density, mobility, and the effective mass of the charge carriers in a high-performance 0.15-μm gate In0.52 Al0.48As/In0.53Ga0.47As high-electron-mobility transistor (HEMT) at low temperatures. At the gate voltage VG=0 V, the carrier density n g under the gate is 9×1011 cm-2, while outside of the gate region ng=2.1×1012 cm-2. The mobility under the gate at 4.2 K is as low as 400 cm2/V-s when VG<0.1 V and rapidly approaches 11000 cm2/V-s when VG>0.1 V. The existence of this high mobility threshold is crucial to the operation of the device and sets its high-performance region in VG>0.1 V  相似文献   

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