共查询到19条相似文献,搜索用时 40 毫秒
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如今IC器件的封装集成度越来越高,芯片的封装朝着小间距、高密度的方向发展.利用各向异性导电胶来实现高密度、高稳定性的倒装封装成为近几年的研究热点.本从国内外专利申请量、申请人等多方面进行统计分析.最后总结了在倒装封装用各向异性导电胶领域的国际、国内专利申请分布情况,并对该领域的发展路线进行了梳理. 相似文献
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各向异性导电胶粘接可靠性研究进展 总被引:12,自引:0,他引:12
介绍各向异性导电胶导电机理和粘接工艺,以及影响它的粘接可靠性因素和最佳参数的研究,如粘接温度、固化时间、粘接压力、粒子含量等。对各向异性导电胶粘接可靠性中的开路、短路、接触电阻与粘接压力和温度循环的关系进行了讨论,并介绍了各向异性导电胶可靠性的理论计算模型。 相似文献
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随着微电子封装技术的发展,各向异性导电胶作为一种绿色的连接材料,广泛应用于电子产品中。文中主要介绍各向异性导电胶互连器件的粘接原理和影响其可靠性的各种因素,如粘接工艺参数、外界环境的干扰、各向异性导电胶的物理特性等。 相似文献
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ACF作为一种实装材料,可以方便地实现精细电极的导通连接。其原理是通过加热、加压、树脂受热固化、ACF中的导电粒子连接上下电极,从而实现电极固定和电极导通。实际上受ACF成份的影响,每种ACF的特性都不一样,而在生产应用中,温度、压力、时间、位置、辅助材料等因素又会对连接的效果产生影响。为了确保ACF适用于厂内的工艺,把ACF的应用风险降低。评价一种ACF的过程,通常分为单体评价、工艺评价和产品评价。文中将以屏侧ACF为例,讨论ACF工艺评价的方法。 相似文献
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文章阐述了一种新型的基底结构,通过使用各向异性导电胶来连接两层基底,从而实现封装叠加。这种基底结构来源于一种传统的折叠基底结构,不同的是,它采用各向异性导电胶代替折叠基底结构中的弯曲区域来实现两层基底的电路和物理连接。折叠基底结构中的弯曲区域是一个弱点,其本身存在很高的断裂几率,需要大量冗余线路支撑来提高物理强度。新的基底结构不但降低了断裂几率,消除了冗余线路,而且拓广了适用性并降低成本。 相似文献
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《固体电子学研究与进展》2017,(4)
提出一种基于各向异性导电胶(ACA)的封装方法,即利用ACA实现介质基板之间垂直互连过渡。该方法与传统的锡铅焊料工艺相比,ACA板间互连工艺具有互连距离短、固化温度低、工艺流程简单、绿色环保等特点。测试结果表明,ACA在垂直互连过程中拥有良好的微波传输性能。在0.1~19.0GHz内,回波损耗小于-10dB,插入损耗小于1.5dB;在26~30GHz频段范围内,回波损耗小于-10dB,插入损耗小于3dB。测试结果与电磁仿真结果吻合。 相似文献
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Physical Factors Determining Thermal Conductivities
of Isotropic Conductive Adhesives 总被引:3,自引:0,他引:3
Masahiro Inoue Hiroaki Muta Takuji Maekawa Shinsuke Yamanaka Katsuaki Suganuma 《Journal of Electronic Materials》2009,38(3):430-437
The thermal conductivities of a typical isotropic conductive adhesive (ICA) composed of an epoxy-based binder containing flake-shaped
and spherical Ag particles have been studied. The ICA specimens exhibit anisotropy in their thermal conductivities between
the vertical and in-plane directions. In addition, their thermal conductivities apparently depend on their thermal history
during the curing and subsequent annealing processes, even if they are fully cured during the preliminary curing stage. The
thermal conductivities tend to increase with decreasing electrical resistivities. The experimental values for the thermal
conductivities of the ICA specimens were apparently higher than␣those predicted using Bruggemann’s equation. Analysis using
the Wiedemann–Franz (W–F) law indicates that their thermal conductivities increase with increasing contribution from electrical
conduction. In order to discuss the thermal conductivities of ICA specimens that exhibit relatively low electrical resistivities
(below 10−3 Ω cm), the contribution of the conducting electrons must be included. 相似文献
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用于微电子组装的导电胶粘接剂的研究现状 总被引:4,自引:0,他引:4
综述了当前电子组装业中导电胶粘接剂的研究情况,主要介绍国外正在重点研究的几大类导电胶粘接剂及其组成,与传统锡铅焊料的对比,以及它们的电性能、机械性能、热性能等,并简要介绍其发展趋势。 相似文献
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Masahiro Inoue Hiroaki Muta Shinsuke Yamanaka Katsuaki Suganuma 《Journal of Electronic Materials》2009,38(9):2013-2022
The electrical properties of isotropic conductive adhesives (ICAs) with two different types of silicone-based binder containing
Ag particles were examined. The ICAs were printed on glass substrates in order to prepare specimens for evaluating the electrical
properties. In the case of adhesives containing a denatured silicone binder, both the curing and cooling steps in the isothermal
curing process generated electrical conductivity. Adhesives that were cured at 120°C to 200°C exhibited similar values of
electrical resistivity regardless of the different curing temperatures. By contrast, electrical conductivity was generated
only during the cooling step when adhesives containing a dimethyl methylvinyl siloxane were isothermally cured. In this case,
adhesives cured above 160°C exhibited high electrical resistivity. In evaluating the temperature dependence of the electrical
resistivity, we found physical annealing to have significantly different effects on these specimens. In addition, we were
able to make small sensitive variations in the properties of silicone-based ICAs by controlling the isothermal annealing and
thermal cycling processes. 相似文献
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基于导电性能退化数据的导电胶可靠性评估 总被引:1,自引:0,他引:1
性能退化表征的是产品的工作能力随时间逐渐降低的现象。提出用指数退化模型来描述导电胶导电性能退化过程,并根据退化数据给出了一个某型导电胶在任意时河的性能特征值的分布模型。根据这个分布模型,提出了两种可靠性评估的方法:1)相对于传统的寿命分布模型,所推导的可靠度函数中的参数易以通过实时跟踪测量性能参数时间序列数据估计得到;2)给出了针对不同样本量时的可靠性评估方法,且简便易行。最后通过试验数据对导电胶在使用环境下的可靠性进行了评估。 相似文献
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Zhuo Li Rongwei Zhang Kyoung‐Sik Moon Yan Liu Kristen Hansen Taoran Le C. P. Wong 《Advanced functional materials》2013,23(11):1459-1465
Flexible interconnects are one of the key elements in realizing next‐generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, adhesives to support flip‐chip and surface‐mount interconnections are less commonly used and reported. A polyurethane (PU)‐based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10?5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU‐ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die‐attach material for flip‐chip, as vertical interconnect access (VIA)‐filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio‐frequency devices. 相似文献
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The effect of thermal history on the electrical resistivity of a typical isotropic conductive adhesive (ICA) composed of an
epoxy-based binder has been investigated in the present work. The electrical resistivities of test specimens were found to
be different depending on the curing temperature, even if they exhibited similar degrees of conversion, although the values
of T
g
for the ICA specimens were determined by their degree of conversion, regardless of the curing temperature. Postannealing
effects in terms of decreased electrical resistivity could be induced at a temperature in the vicinity of the glass transition
temperature (T
g
), even if the specimens already achieved full conversion during the preliminary curing process. The magnitude of the annealing
effect was found to depend on the preliminary curing and postannealing temperatures. When the specimens exhibit conversions
of greater than 25% prior to the postannealing process, the preliminary curing state of the binder can influence the electrical
resistivity of the ICA that is obtained after annealing. 相似文献