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1.
在模拟电路设计过程中难免会使用功率器件,如何处理和解决这些功率器件散热问题对于设计师来说非常重要,因为这些功率器件的工作温度将直接影响到整个电路的工作稳定性和安全性,文中介绍了功率器件的热性能参数,并根据作者的实际工作经验,阐述了功率器件的热设计方法和散热器的合理选择。  相似文献   

2.
功率变换器是开关磁阻电机调速系统(以下简称SRD)中保证电机可靠稳定运行的关键部件。在大功率功率变换器设计过程中,对电路的杂散参数以及功率器件的散热等问题的处理是功率变换器结构设计的关键。针对电路中的杂散参数,本文在设计功率变换器过程中构建了60KW开关磁阻电机功率变换器逆变回路杂散电感等效分布模型,分析了杂散电感在器件关断过程中的影响。在此基础上,引入低感叠层母线技术,从结构设计与工程运用角度出发对该母线进行分析,理论计算与仿真结果均表明设计方案比传统设计方案更有效地抑制了主回路杂散电感值。针对功率器件的散热问题,提出一种针对SRM负载的功率电路热损耗估算方法。通过损耗计算得出功率变换器主电路中损耗的来源和器件温升变化,对功率变换器的进一步设计改进有重要意义。  相似文献   

3.
介绍了在无线应用中的两种 Si Ge器件工艺 :低压 IC电路和高压分立功率器件工艺。给出了器件的关键参数 ,并且讨论了这些参数对于诸如功放和射频前端电路的影响  相似文献   

4.
功率型LED散热器的研究   总被引:1,自引:0,他引:1  
吴军  李抒智  杨卫桥  张建华 《半导体技术》2010,35(10):964-967,1027
分析了目前功率型LED发展存在的瓶颈问题,以及散热对LED器件正常工作的重要性.散热器的设计决定了功率型LED芯片产生的热量能否顺利传至工作环境,基于现有的文献和专利总结了大功率LED散热器的技术手段及其研究内容.从对流散热、辐射散热、热传导和相变散热等多个方面介绍了一些典型散热器在功率型LED散热中的应用,并提出了未来LED照明散热设计的方向.  相似文献   

5.
自然空气冷却情况下功率器件散热器的优化设计   总被引:3,自引:0,他引:3  
介绍了功率器件散热器的散热原理,提出散热器的优化问题。叙述了功率器件在自然空气冷却状态下如何初选散热器,并采用散热器优化软件对散热器进行优化设计。讨论了散热器的理论优化和工程优化的不同,在工程实际情况下功率器件如何与散热器达到最优匹配;还分析了不同工作状态下界面热阻、功耗和热辐射等因素对散热效果的影响。  相似文献   

6.
介绍了在无线应用中的两种SiGe器件工艺:低压IC电路和高压分立功率器件工艺。给出了器件的关键参数,并且讨论了这些参数对于诸如功放和射频前端电路的影响。  相似文献   

7.
<正> 一、前言最近在电力电子学的领域内,使功率器件的外围电路集成化的工作不断进展。特别是在使马达实现可变速控制的通用逆变器及空调器方面。对外围电路集成化的要求更为强烈。通过外围电路的集成化,才能实现系统的多功能,小型化和高可靠。外围电路包括输入输出的接口电路、功率器件的驱动电路和保护电路(即过电流、过负载、负载短路、负载开路、过热、过电压等的保护)。最近还介绍了将功率器件与外围电路集成到单片上的所谓“功率IC”和“智能型功率电路”。但是,上面说的这些电路,耐压大都在50~100V的范围,因此在采用市电的逆变器等马  相似文献   

8.
《现代电子技术》2019,(12):81-85
基于三维集成技术的功率MOSFET器件,在发热量大和散热难的双重压力下,热可靠性设计凸显得尤为重要。文中采用硅通孔散热方式,在三维功率器件内嵌入大量的散热硅通孔,以降低芯片内热阻,疏导功率器件产生的热量,保证器件有源区结温低于极限安全结温,可有效提高芯片的热可靠性。以100 V,60 A的功率VDMOS器件为研究对象,以提高芯片的热可靠性为目的,合理设计和充分优化了三维功率MOSFET器件的版图和散热硅通孔的布局。基于多物理场分析软件开展了大量的热可靠性仿真分析工作,并流片验证了设计的正确性。  相似文献   

9.
基于LED照明灯具的散热片设计与分析   总被引:3,自引:1,他引:2  
新一代大功率白光LED光源具有很多优点,如节能、环保、寿命长等,但大功率LED的散热也是一个至关重要的问题。如果LED散热问题解决不好,LED灯具工作一段时间后就会输出光功率减小,芯片加速老化,工作寿命缩短。文章从LED散热问题着手,详细介绍了目前广泛商用的大功率LED器件结构及导热途径、所用散热基片的特点,以及LED所用的散热片设计和计算方法。另外介绍了一种大功率LED在散热片上不同位置温度变化的测试结果,并推导出用于计算LED器件散热的有效公式。  相似文献   

10.
徐波 《家庭电子》2001,(8):46-46
纯甲类放大电路的失真小,音质醇厚,久听不厌,正受到越来越多的发烧友青睐,也正是因为电路工作在纯甲类状态,因此,电路的效率很低,发热量大,散热就成了首要问题。只有功放的散热条件比较好,热量可以迅速散发到空气中,才能保证功率器件不至于过热烧毁。为了达到较好的散热效果,必须选用面积足够大的散热器。但是,专业散热器的价格也令人望而生畏。既然是土炮发烧,当然要本着自己动手的原则。本文介绍一款自制的高效散热机箱,其外形尺寸为150×430×440mm,所用的原料可在铝合金装饰部买到。  相似文献   

11.
Inductively powered devices are finding increasing use in many applications, such as biomedical implants and radio frequency identification (RFID) tags. In these systems, because of transmitter and receiver movements, the receiver coil may get close to the transmitter coil, which results in more than needed power delivered to the receiver load. This increases heat dissipated in the receiver circuit. In order to avoid overheating the receiver in such a high magnetic field (short coil separation distance) condition, the received power should be monitored and controlled. This paper introduces a clocked power control circuit integrated in the implant receiver, which is an independent, automatic power adjustment solution to limit heat dissipation with response to the coil separation distance. In this circuit, the rectified voltage across the load is monitored, and converted to a digital representation to selectively detune the receiver inductor-capacitor (LC) tank. To demonstrate this concept, a design example applied to inductively powered implants is given. Measurements on the prototype with a varied coil separation distance validate the desired power control functionality. Less power dissipation is achieved for the receiver compared to no power control condition.  相似文献   

12.
The heat dissipation in GaN devices grown on low thermal conductivity lithium gallate (LGO) substrates was investigated. The thermal conductivity of single-crystal LGO was measured utilizing the 3/spl omega/ technique for temperatures ranging from 100 K-500 K. For the GaN layer, the thermal conductivity was estimated using a phonon transport model which included dislocation density and temperature dependence. These data were then used in a finite element program to determine the thermal behavior of a heterojunction field-effect transistor. Based on a maximum junction temperature of 500 K, it was found that devices with a power dissipation of 1 W/mm were possible if the primary heat dissipation path was through the low thermal conductivity substrate. However, in using a front side cooling scheme, results suggest that it may be possible to develop devices with power dissipation in the range of 10 W/mm.  相似文献   

13.
随着玻璃通孔(TGV)转接板在微波系统集成中的应用越来越广泛,其微波大功率应用情况下的散热性能成为研究重点。针对TGV转接板高效散热性能的要求,进行TGV散热结构的设计和性能分析。建立TGV转接板封装集成结构的有限元模型,设计TGV转接板铜柱阵列散热结构。通过TGV工艺制作TGV高密度阵列。在4.82~14.47 W功率范围内对TGV转接板的散热性能进行测试,相应的TGV散热结构区域的热流密度为40.03~120.18 W/cm2,测得热阻芯片表面温度高达54.0~126.5℃,低于微波功率芯片最高结温150℃,可以满足大功率微波系统集成高效散热的需求。  相似文献   

14.
High reliability and performance of power semiconductor devices depend on an optimized design based on a good understanding of their electro-thermal behavior and of the influence of parasitic components on their operation. This leads to the need for electro-thermal 2/3-D numerical modeling and simulation in power electronics as an efficient tool for analysis and optimization of device structure design and identification of critical regions. In this paper we present an analysis and geometry optimization of a high power pin diode structure supported by advanced 2-D mixed mode electro-thermal device and circuit simulation. Lowering of the operation temperature by better power management and heat dissipation due to an optimized structure design will allow withstanding higher current pulses and suppressing the damage of the analyzed structure by thermal breakdown.  相似文献   

15.
研究了集成式大功率LED散热的二次优化设计方法。分析了集成式大功率LED的发热特性和LED路灯的散热要求,建立了散热分析模型。通过对散热器翅片的形状和布局的优化分析,得到一次优化结果。在此基础上,结合实际生产要求,提取凸台半径、凸台高度和拔模角度这三个参数进行了二次优化,得到了有效的优化组合。然后用优化分析结果来指导LED路灯和散热器的设计,并制作样品进行温度实验,结果表明散热器设计满足要求。  相似文献   

16.
It is well known that for the design and simulation of state-of-the-art circuits thermal effects like self-heating and coupling between individual devices must be taken into account. As compact models for modern or experimental devices are not readily available, a mixed-mode device simulator capable of thermal simulation is a valuable source of information, Considering self-heating and coupling effects results in a very complex equation system which can only be solved using sophisticated techniques. We present a fully coupled electrothermal mixed-mode simulation of an SiGe HBT circuit using the design of the μA709 operational amplifier. By investigating the influence of self-heating effects on the device behavior we demonstrate that the consideration of a simple power dissipation model instead of the lattice heat flow equation is a very good approximation of the more computation time consuming solution of the lattice heat flow equation  相似文献   

17.
This paper presents simulation of new cooling fins equipped with heat pipes for high power and high temperature electronic circuits and devices. Highly conductive heat pipe provides more effective energy dissipation to the ambient. Calculated thermal resistance shows quantitatively the improvement of cooling conditions for fins with heat pipe in comparison to traditional device  相似文献   

18.
照明用大功率LED散热研究   总被引:7,自引:0,他引:7  
大功率LED体积小、工作电流大,输入功率中大部分转化为热能,散热是需要解决的关键技术.文章介绍了大功率LED热设计的方法,针对大功率LED的封装结构,建立了热传导模型;对某照明用大功率LED阵列进行了散热设计,通过仿真分析和热评估试验验证了所采用的散热方法和设计的散热器满足LED阵列的散热要求.  相似文献   

19.
Power consumption and heat dissipation are becoming the major factors that limit the performance evolution of current state-of-the-art microprocessors. As they become key elements in the design of both high performance computers and battery powered devices, different power and thermal management strategies have been proposed and implemented during the last years in order to overcome this performance limitation. Considering that software applications have a large impact on power consumption and thermal map of the CPU cores, these design strategies tend to be addressed at higher levels even as they are usually implemented at lower levels of systems abstraction. The work presented in this paper evaluates the relation between power consumption and thermal response of CPU cores when different software applications are executed. The goal of this study is to identify how software applications can be used in thermal management process and whether it is feasible to implement thermal-aware software applications.  相似文献   

20.
郑伟  杜小辉  严伟 《微波学报》2012,28(S1):230-233
低温共烧陶瓷(LTCC)是制作微波多芯片组件(MMCM)基板的理想材料。本文介绍了基于LTCC 工艺的微 波传输线、集成腔体、功分器和散热过孔的设计。对于多通道微波组件,采用带状传输线和腔体结构有利于实现通道 间的高隔离度,集成功分器和浆料电阻有利于实现组件的小型化并可获得较好的微波性能,而矩阵散热过孔可以显著 改善基板导热性能,满足小功耗器件的散热要求。  相似文献   

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