共查询到20条相似文献,搜索用时 93 毫秒
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在模拟电路设计过程中难免会使用功率器件,如何处理和解决这些功率器件散热问题对于设计师来说非常重要,因为这些功率器件的工作温度将直接影响到整个电路的工作稳定性和安全性,文中介绍了功率器件的热性能参数,并根据作者的实际工作经验,阐述了功率器件的热设计方法和散热器的合理选择。 相似文献
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功率变换器是开关磁阻电机调速系统(以下简称SRD)中保证电机可靠稳定运行的关键部件。在大功率功率变换器设计过程中,对电路的杂散参数以及功率器件的散热等问题的处理是功率变换器结构设计的关键。针对电路中的杂散参数,本文在设计功率变换器过程中构建了60KW开关磁阻电机功率变换器逆变回路杂散电感等效分布模型,分析了杂散电感在器件关断过程中的影响。在此基础上,引入低感叠层母线技术,从结构设计与工程运用角度出发对该母线进行分析,理论计算与仿真结果均表明设计方案比传统设计方案更有效地抑制了主回路杂散电感值。针对功率器件的散热问题,提出一种针对SRM负载的功率电路热损耗估算方法。通过损耗计算得出功率变换器主电路中损耗的来源和器件温升变化,对功率变换器的进一步设计改进有重要意义。 相似文献
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介绍了在无线应用中的两种SiGe器件工艺:低压IC电路和高压分立功率器件工艺。给出了器件的关键参数,并且讨论了这些参数对于诸如功放和射频前端电路的影响。 相似文献
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基于LED照明灯具的散热片设计与分析 总被引:3,自引:1,他引:2
新一代大功率白光LED光源具有很多优点,如节能、环保、寿命长等,但大功率LED的散热也是一个至关重要的问题。如果LED散热问题解决不好,LED灯具工作一段时间后就会输出光功率减小,芯片加速老化,工作寿命缩短。文章从LED散热问题着手,详细介绍了目前广泛商用的大功率LED器件结构及导热途径、所用散热基片的特点,以及LED所用的散热片设计和计算方法。另外介绍了一种大功率LED在散热片上不同位置温度变化的测试结果,并推导出用于计算LED器件散热的有效公式。 相似文献
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Inductively powered devices are finding increasing use in many applications, such as biomedical implants and radio frequency
identification (RFID) tags. In these systems, because of transmitter and receiver movements, the receiver coil may get close
to the transmitter coil, which results in more than needed power delivered to the receiver load. This increases heat dissipated
in the receiver circuit. In order to avoid overheating the receiver in such a high magnetic field (short coil separation distance)
condition, the received power should be monitored and controlled. This paper introduces a clocked power control circuit integrated
in the implant receiver, which is an independent, automatic power adjustment solution to limit heat dissipation with response
to the coil separation distance. In this circuit, the rectified voltage across the load is monitored, and converted to a digital
representation to selectively detune the receiver inductor-capacitor (LC) tank. To demonstrate this concept, a design example
applied to inductively powered implants is given. Measurements on the prototype with a varied coil separation distance validate
the desired power control functionality. Less power dissipation is achieved for the receiver compared to no power control
condition. 相似文献
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Christensen A. Doolittle W.A. Graham S. 《Electron Devices, IEEE Transactions on》2005,52(8):1683-1688
The heat dissipation in GaN devices grown on low thermal conductivity lithium gallate (LGO) substrates was investigated. The thermal conductivity of single-crystal LGO was measured utilizing the 3/spl omega/ technique for temperatures ranging from 100 K-500 K. For the GaN layer, the thermal conductivity was estimated using a phonon transport model which included dislocation density and temperature dependence. These data were then used in a finite element program to determine the thermal behavior of a heterojunction field-effect transistor. Based on a maximum junction temperature of 500 K, it was found that devices with a power dissipation of 1 W/mm were possible if the primary heat dissipation path was through the low thermal conductivity substrate. However, in using a front side cooling scheme, results suggest that it may be possible to develop devices with power dissipation in the range of 10 W/mm. 相似文献
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随着玻璃通孔(TGV)转接板在微波系统集成中的应用越来越广泛,其微波大功率应用情况下的散热性能成为研究重点。针对TGV转接板高效散热性能的要求,进行TGV散热结构的设计和性能分析。建立TGV转接板封装集成结构的有限元模型,设计TGV转接板铜柱阵列散热结构。通过TGV工艺制作TGV高密度阵列。在4.82~14.47 W功率范围内对TGV转接板的散热性能进行测试,相应的TGV散热结构区域的热流密度为40.03~120.18 W/cm2,测得热阻芯片表面温度高达54.0~126.5℃,低于微波功率芯片最高结温150℃,可以满足大功率微波系统集成高效散热的需求。 相似文献
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P. Pribytny D. Donoval A. Chvala J. Marek M. Molnar 《Microelectronics Reliability》2012,52(3):463-468
High reliability and performance of power semiconductor devices depend on an optimized design based on a good understanding of their electro-thermal behavior and of the influence of parasitic components on their operation. This leads to the need for electro-thermal 2/3-D numerical modeling and simulation in power electronics as an efficient tool for analysis and optimization of device structure design and identification of critical regions. In this paper we present an analysis and geometry optimization of a high power pin diode structure supported by advanced 2-D mixed mode electro-thermal device and circuit simulation. Lowering of the operation temperature by better power management and heat dissipation due to an optimized structure design will allow withstanding higher current pulses and suppressing the damage of the analyzed structure by thermal breakdown. 相似文献
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It is well known that for the design and simulation of state-of-the-art circuits thermal effects like self-heating and coupling between individual devices must be taken into account. As compact models for modern or experimental devices are not readily available, a mixed-mode device simulator capable of thermal simulation is a valuable source of information, Considering self-heating and coupling effects results in a very complex equation system which can only be solved using sophisticated techniques. We present a fully coupled electrothermal mixed-mode simulation of an SiGe HBT circuit using the design of the μA709 operational amplifier. By investigating the influence of self-heating effects on the device behavior we demonstrate that the consideration of a simple power dissipation model instead of the lattice heat flow equation is a very good approximation of the more computation time consuming solution of the lattice heat flow equation 相似文献
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Legierski J. Wiecek B. 《Components and Packaging Technologies, IEEE Transactions on》2001,24(4):549-553
This paper presents simulation of new cooling fins equipped with heat pipes for high power and high temperature electronic circuits and devices. Highly conductive heat pipe provides more effective energy dissipation to the ambient. Calculated thermal resistance shows quantitatively the improvement of cooling conditions for fins with heat pipe in comparison to traditional device 相似文献
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Marius Marcu 《Microelectronics Journal》2011,42(4):601-608
Power consumption and heat dissipation are becoming the major factors that limit the performance evolution of current state-of-the-art microprocessors. As they become key elements in the design of both high performance computers and battery powered devices, different power and thermal management strategies have been proposed and implemented during the last years in order to overcome this performance limitation. Considering that software applications have a large impact on power consumption and thermal map of the CPU cores, these design strategies tend to be addressed at higher levels even as they are usually implemented at lower levels of systems abstraction. The work presented in this paper evaluates the relation between power consumption and thermal response of CPU cores when different software applications are executed. The goal of this study is to identify how software applications can be used in thermal management process and whether it is feasible to implement thermal-aware software applications. 相似文献