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在电子装联工艺中,互连线间的电磁耦合(串扰)是电子整机内各模块间互连线缆及模块内PCB印制迹线布线的主要考虑因素,本文通过对互连线的串扰分析,提出以有限元计算及电路仿真软件为工具,对布线的串扰进行预测。 相似文献
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提出了利用符号化矩计算模型进行性能驱动的多级布线方法.通过在模式布线阶段利用符号化矩计算模型,快速得到电路的高阶矩,并根据计算结果,采用合理的代价函数对时延串扰等性能指标进行预估,进而指导布线.实验结果显示,该算法在串扰优化方面得到较大的提高,布线结果兼顾了时延优化和信号波形质量优化. 相似文献
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本文在直导线的串扰分析的基础上,运用多导体传输线模型,对编织屏蔽线的串扰问题进行了深入研究,建立了屏蔽线的抗干扰预测模型,并设计了敏感线被屏蔽情况的串音干扰电压,计算结果表明编织屏蔽线对电磁耦合干扰控制是很有效的。 相似文献
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高速印刷电路板设计技术研究 总被引:1,自引:0,他引:1
为了解决高速印刷电路板设计中因高频辐射和边缘极值速度所产生的干扰、振铃、反射以及串扰等噪声对系统性能的损害问题,从电源分配系统及其影响、传输线及其相关的设计准则、串扰及其消除、电磁干扰等四个方面详细讨论了高速印刷电路板(PCB)的设计技术。结合实际应用给出了这些技术的实现方法和有关参数计算公式。实践表明:这些技术在高速印刷电路板的实际设计中是可行的。 相似文献
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《Electromagnetic Compatibility, IEEE Transactions on》2009,51(1):18-24
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The electromagnetic field coupling into the traces on a printed circuit board (PCB) is investigated. Based on a simplified equivalent-wire model, a practical simulation method is presented, which enables an efficient treatment by the method of moment, with minimum computational and modeling effort. Validation by analytic and measurement results shows an acceptable accuracy within the limits of quasi-TEM propagation. The gigahertz transverse electromagnetic cell is found to be a suitable means for measuring the field coupling into PCBs. To reduce additional common-mode coupling, special care has to be taken for the length of the measurement cable connected to the PCB within the cell. 相似文献
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ESD indirect coupling modeling 总被引:3,自引:0,他引:3
Cerri G. De Leo R. Primiani V.M. 《Electromagnetic Compatibility, IEEE Transactions on》1996,38(3):274-281
Electrostatic discharge (ESD) indirect coupling on electronic equipment is theoretically and experimentally investigated considering the effects for three typical structures: a coaxial cable, a multilayer PCB, and a metallic enclosure. The analytical approach is based on classical electromagnetic theory and is developed in a simple way that is easy to apply and accurate enough to give the designer a reliable estimation of the interference produced by an ESD event 相似文献
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Haixiao Weng Beetner D.G. DuBroff R.E. Jin Shi 《Electromagnetic Compatibility, IEEE Transactions on》2007,49(4):805-815
High-frequency currents on the pins of integrated circuits (ICs) and on printed circuit board (PCB) traces are needed to predict and analyze electromagnetic interference in high-speed devices. These currents can, however, be difficult to measure when traces are buried within the PCB or chip-package, especially when several current-carrying traces are in close proximity. Techniques for estimating high-frequency currents from near-field scan data are proposed in this paper. These techniques are applied to find currents on the pins of an IC, on traces buried beneath other traces in a PCB, and on traces over a slot in the ground plane. Methods of dealing with the ill-posed nature of the current-estimation problem are discussed, as are applications to electrically large structures. A study of the sensitivity of the technique to errors in the measured fields, errors in the circuit geometry, and errors in the estimated dielectric constant of the PCB or chip package show that, for reasonable errors in these parameters, currents can be estimated to within an average of 20% (1.6 dB) or less of their correct values. 相似文献
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当前电子产品日新月异,要求电路板高密度组装,安装方式由表面安装(SMT)取代通孔插装(THT)已是历史的必然,因此,印制板技术正向高密度、多层化方向飞速发展。而印制板的合理设计是SMT技术中的关键,也是SMT工艺质量的保证,并有助于提高生产效率。本文就表面安装PCB设计时需考虑的一些制造工艺性问题进行了阐述,给PCB设计人员提供一个参考。 相似文献
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当前电子产品日新月异,要求电路板高密度组装,安装方式由表面安装(SMT)取代通孔插装(THT)已是历史的必然,因此,印制板技术正向高密度、多层化方向飞速发展.而印制板的合理设计是SMT技术中的关键,也是SMT工艺质量的保证,并有助于提高生产效率.本文就表面安装PCB设计时需考虑的一些制造工艺性问题进行了阐述,给PCB设计人员提供一个参考. 相似文献
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表面安装技术在电子产品装联生产过程中正得到广泛应用。而印制板的合理设计是SMT技术中的关键,也是SMT工艺质量的保证,文中就表面安装PCB设计时需考虑的一些制造工艺性问题进行了阐述,给PCB设计人员提供一个参考。 相似文献