共查询到18条相似文献,搜索用时 125 毫秒
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Sn-Zn系无铅钎料最新进展 总被引:1,自引:0,他引:1
Sn-Zn系钎料熔点与传统Sn-37Pb钎料十分接近,成本低廉,被研究者所推崇。由于Zn的存在导致Sn-Zn钎料润湿性差及抗氧化性不足,阻碍了该钎料的发展。添加合金元素和纳米颗粒是改善Sn-Zn钎料组织和性能行之有效的方法之一,为国内外研究者所推崇。结合国内外Sn-Zn系无铅钎料最新研究成果,探讨添加微量的合金元素In、Ni、Cr、Ga、Bi、Cu、Al、Ag、稀土元素及纳米颗粒对钎料润湿性、抗氧化性、力学性能、显微组织和界面组织的影响,同时简述有关钎剂对Sn-Zn的影响,并对Sn-Zn系钎料的发展趋势进行分析与展望。 相似文献
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无铅波峰焊钎料抗氧化影响的研究 总被引:5,自引:0,他引:5
研究了目前常用的Sn-0.7Cu无铅钎料在手浸锡炉和模拟波峰炉中的抗氧化情况.主要研究了微量P元素的加入对钎料抗氧化性的影响.通过钎料在液态下表面颜色变化和锡渣的产生量的比较可以发现微量P元素的加入可以提高钎料的抗氧化性能.通过比色分析发现微量P元素在钎料表面或亚表面富集,形成"阻挡层",抑制了钎料的进一步氧化.通过实验得出P的最佳质量分数为0.011%. 相似文献
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铝软钎焊时钎料元素的化学选择吸附作用 总被引:2,自引:0,他引:2
铝软钎焊的关键问题是钎焊接头耐蚀性差。本文以普通 Pb—Sn 软钎料为基体,加入能与 Al 形成界面化合物的合金元素改变钎焊接头界面电极电位和改善钎料与母材间的结合,从而提高铝软钎钎焊接头的耐蚀性。试验研究表明:加入合金元素 Ag的 Pb—Sn 钎料钎焊 Al 时,Ag 向 Al 表面的化学选择吸附作用明显,由于形成 Ag—Al 化合物使耐蚀性显著提高。本文还提出不同工艺因素对铝软钎焊接头耐蚀性影响的试验结果。 相似文献
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微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响 总被引:2,自引:0,他引:2
以Sn-0.7Cu系无铅钎料合金为基础,添加微量的P、Ge、Ga、RE元素,进行了280℃大气环境下氧化试验,通过对含有不同微量元素的无铅钎料表面氧化状况的对比及分析,研究了不同微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响。发现当P和Ga同时添加时,得到Sn-0.7Cu-(0.001~0.1)P-(0.0001~0.1)Ga无铅钎料的抗氧化性能高于Sn-0.7Cu-(0.001~0.1)P和Sn-0.7Cu-(0.0001~0.1)Ga的抗氧化性能。 相似文献
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Sn-Zn alloys have been considered for use as lead-free solders. Their poor wetting and oxidation resistance properties are
the main obstacles that prevent them from becoming commercially viable solders. The effects of alloying elements, such as
lanthanum, titanium, aluminum, and chromium, on oxidation resistance, wetting properties, and tensile properties of eutectic
Sn-Zn solder are described herein. Results show the addition of alloying Ti, Al, and Cr can improve the oxidation resistance
of Sn-9Zn solder. La, Ti, and Cr do not have much effect on the wetting properties, whereas Al worsens the wetting. Differential
scanning calorimetry investigations reveal the solidus temperature of these solders to be ∼200°C. Addition of Cr improves
ductility while maintaining tensile strength. 相似文献
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无铅焊料在清华大学的研究与发展 总被引:2,自引:0,他引:2
清华大学材料科学与工程系电子材料与封装技术研究室研制了6个系列的无铅焊料:Sn-3.5Ag添加Cu或Bi; Sn-3.5Ag-1.0Cu添加In或Bi; Sn-Ag-Cu-In添加Bi; Sn-Ag-Cu添加Ga; Sn-Zn添加Ga; Sn-Zn添加多种元素。重点介绍了Sn-Zn添加多种元素。对6个系列无铅焊料的研究取得了较好的实验结果,得到比较理想的低温焊料体系,有的合金熔点已非常接近铅锡共晶焊料熔点183℃。 相似文献
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The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements 总被引:25,自引:0,他引:25
The Sn-Zn alloys have been considered as lead-free solders. It is well known that their poor properties of wetting and oxidation
resistance are the main problems to prevent them from becoming commercially viable solders. In this paper, trace rare earth
(RE) elements of mainly Ce and La have been used as alloying elements into the Sn-9Zn alloy. The results indicated that with
the RE addition the originally coarse β-Sn grains in the microstructure of the alloy were refined. The tensile strength significantly
increased with only a slight decrease in ductility. The surface tension was decreased, resulting in great improvement in wetting
properties with rosin-based active flux. 相似文献
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无铅钎料的高熔点、差润湿性给SMT传统的焊接工艺带来了很大冲击,并且对焊点质量也产生了很大的影响。为了防止氧化,改善钎料与焊盘、元件引脚之间的润湿性,提高产品合格率,目前在电子纽装中普遍采用氮气保护。针对几种常用无铅钎料进行了氮气气氛中润湿性和焊点组织的分析,并初步研究了氮气保护对焊点质量和氧化渣的影响。结果表明:氮气保护可以改善无铅钎料润湿性,细化焊点组织,减少氧化渣量,而且对焊点外观和成品率也有一定的影响。 相似文献
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Lili Gao Liang Zhang Feng Ji Sheng-lin Yu Guang Zeng 《Microelectronic Engineering》2010,87(11):2025-7059
Recent years, the SnAgCu family of alloys has been found a widely application as a replacement for the conventional SnPb solders in electronic industry. In order to further enhance the properties of SnAgCu solder alloys, alloying elements such as rare earth, Bi, Sb, Fe, Co, Mn, Ti, In, Ni, Ge and nano-particles were selected by lots of researchers as alloys addition into these alloys. Rare earth (RE) elements have been called the ‘‘vitamin” of metals, which means that a small amount of RE elements can greatly enhance the properties of metals, such as microstructure refinement, alloying and purification of materials and metamorphosis of inclusions. In addition, a small amount of Zn addition has the ability to reduce undercooling efficiently and suppress the formation of massive primary Ag3Sn plates, and Bi/Ga has the ability to enhance the wettability of SnAgCu alloys as well as Ni. Moreover, adding Co/Fe/Ge can effectively refine microstructure, modify interfacial Cu-Sn compounds and increase the shear strength of joints with Cu. This paper summarizes the effects of alloying elements on the wettability, mechanical properties, creep behavior and microstructures of SnAgCu lead-free solder alloys. 相似文献