a-Si∶H/SiO2多层膜晶化过程中的发光机理

采用在等离子体增强化学气相沉积（PECVD）系统中淀积a-Si∶H薄膜结合原位等离子体氧化的技术，制备了一系列不同a-Si∶H子层厚度的a-Si∶H/SiO2多层膜. 通过对其进行三步热处理：脱氢、快速热退火及准静态退火,使a-Si∶H/SiO2多层膜中a-Si∶H层发生非晶态到晶态的相变，获得尺寸可控的纳米硅nc-Si/SiO2多层膜. 结合Raman谱，FTIR谱和TEM测试，对退火过程中多层膜的光致发光性质进行跟踪研究，分析了a-Si∶H/SiO2多层膜在各个热处理阶段发光机理的演变，讨论了a-Si∶H/SiO2多层膜晶化为nc-Si/SiO2多层膜过程中，发光机制与微结构之间的相互联系.     

激光定域晶化技术制备纳米硅的研究

利用相移光栅模板使KrF准分子激光形成强度周期分布的激光束,定域晶化a-Si∶H(4nm)/a-SiNx∶H(10nm)多层膜中的超薄a-Si∶H层,成功地制备出了三维有序分布的nc-Si阵列。原子力显微镜(AFM)、微区喇曼光谱、剖面透射电子显微镜(X-TEM)及高分辨电子显微镜(HREM)技术分析揭示了晶化后薄膜中形成了横向周期与移相光栅周期相同、纵向周期与a-Si∶H/a-SiNx∶H多层膜周期(14nm)相等的nc-Si阵列。     

a-Si:H/SiO2多层膜晶化过程中的发光机理

采用在等离子体增强化学气相沉积(PECVD)系统中淀积a-Si:H薄膜结合原位等离子体氧化的技术,制备了一系列不同a-Si:H子层厚度的a-Si:H/SiO2多层膜.通过对其进行三步热处理:脱氢、快速热退火及准静态退火,使a-Si:H/SiO2多层膜中a-Si:H层发生非晶态到晶态的相变,获得尺寸可控的纳米硅nc-Si/SiO2多层膜.结合Raman谱,FTIR谱和TEM测试,对退火过程中多层膜的光致发光性质进行跟踪研究,分析了a-Si:H/SiO2多层膜在各个热处理阶段发光机理的演变,讨论了a-Si:H/SiO2多层膜晶化为nc-Si/SiO2多层膜过程中,发光机制与微结构之间的相互联系.     

a-Si:H/SiO2多层膜晶化过程中的发光机理

采用在等离子体增强化学气相沉积(PECVD)系统中淀积a-Si:H薄膜结合原位等离子体氧化的技术,制备了一系列不同a-Si:H子层厚度的a-Si:H/SiO2多层膜.通过对其进行三步热处理:脱氢、快速热退火及准静态退火,使a-Si:H/SiO2多层膜中a-Si:H层发生非晶态到晶态的相变,获得尺寸可控的纳米硅nc-Si/SiO2多层膜.结合Raman谱,FTIR谱和TEM测试,对退火过程中多层膜的光致发光性质进行跟踪研究,分析了a-Si:H/SiO2多层膜在各个热处理阶段发光机理的演变,讨论了a-Si:H/SiO2多层膜晶化为nc-Si/SiO2多层膜过程中,发光机制与微结构之间的相互联系.     

在SiO_2中掺Al对Au/纳米(SiO_2/Si/SiO_2)/p-Si结构电致发光的影响

利用射频磁控溅射方法 ,制成纳米 Si O2 层厚度一定而纳米 Si层厚度不同的纳米 (Si O2 / Si/ Si O2 ) / p- Si结构和纳米 (Si O2 ∶ Al/ Si/ Si O2 ∶ Al) / p- Si结构 ,用磁控溅射制备纳米 Si O2 ∶ Al时所用的 Si O2 / Al复合靶中的 Al的面积百分比为 1% .上述两种结构中 Si层厚度均为 1— 3nm ,间隔为 0 .2 nm .为了对比研究 ,还制备了 Si层厚度为零的样品 .这两种结构在 90 0℃氮气下退火 30 m in,正面蒸半透明 Au膜 ,背面蒸 Al作欧姆接触后 ,都在正向偏置下观察到电致发光 (EL ) .在一定的正向偏置下 ,EL强度和峰位以及电流都随 Si层厚度的增加而     

激光干涉结晶法制备三维有序分布的nc-Si阵列

利用准分子激光干涉结晶法使a Si∶H/a SiNx∶H多层膜中的超薄a Si∶H层定域晶化 ,成功地制备出三维有序分布的nc Si阵列。原子力显微镜 (AFM )、微区拉曼 (micro Raman)光谱及剖面透射电子显微镜 (X TEM)的分析结果揭示在晶化薄膜中已形成平均尺寸约为 3 6nm ,横向周期 2 μm ,纵向周期与a Si∶H/a SiNx∶H多层膜周期 (14nm)相等的nc Si阵列。     

基于PECVD工艺的a-SiC_x∶H发光微腔的研究

以 PECVD为制备工艺 ,a-Si O2 ∶ H/a-Si∶ H为布拉格反射镜多层膜 ,a-Si Cx∶ H为中间腔体发光材料 ,制备垂直腔面的发光微腔。文章通过模拟确定了微腔的多层膜层数和排列顺序 ,并对微腔的发光特性进行了反射谱和荧光谱研究。结果表明 ,该微腔性能良好 ,能激射出半高宽为 9nm、波长为 743 nm的荧光峰 ,与设计值70 0 nm基本吻合。     

μc-Si∶H/a-Si∶H多层膜的周期性结构和量子尺寸效应

利用射频辉光放电法,通过周期性交替切换两种耦合电极的方式,制备了μc-Si∶H/a-Si∶H多层膜．低角度X射线衍射(LAXRD)测试表明,这种多层膜具有良好的周期性结构．观察了上述多层膜的光学性质及电导率与温度的关系,发现其吸收边随着a-Si∶H层的减薄而蓝移,低温下的电导激活能Ea随着a-Si∶H层的减薄而减小     

SiC/nc-Si多层薄膜的光致可见发光谱的紧束缚理论

用Vogl提出的sp3s紧束缚模型来研究碳化硅/纳米硅（SiC/nc-Si）多层薄膜的能带结构与其光致发光谱的关系，并设计出SiC/nc-Si多层薄膜最佳结构为{Si}1{SiC}8，即碳化硅层的厚度是纳米硅层厚度的8倍时的超晶格结构蓝光发射的效率最高. 在等离子体增强化学气相沉积系统中,通过控制进入反应室的气体种类逐层沉积含氢非晶SiCx∶H(a-SiCx∶H)和非晶Si∶H (a-Si∶H) 薄膜,然后经过高温热退火处理,成功制备出了晶化纳米SiC/nc-Si(多晶SiC和纳米Si)多层薄膜. 利用截面透射电子显微镜技术分析了a-SiCx∶H/nc-Si∶H多层薄膜的结构特性,表明制得的超晶格结构稍微偏离设计，它的结构为{Si}1{SiC}5. 最后对晶化样品的光致发光谱进行研究，详细分析了各个光致发光峰的物理本质.     

Au、Al/a-Si:H热退火行为研究

本文借助改进的干涉增强喇曼散射技术、AES分析和高温金相显微镜在位观察研究了Au、Al/a-Si∶H系统的真空热退火行为.发现受金属复盖的a-Si∶H的晶化温度和其激活能均比未复盖的a-Si∶H要低得多;a-Si∶H上的Al-Si互溶温度也比C-Si上的低,并且该互溶作用在350℃退火后加剧;Al诱导的a-Si∶H晶化后,在表面上有一连续的低阻Si(Al)析出层,它可Al/a-Si∶H的肖特基结转为欧姆结.     

在SiO2中掺Al对Au/纳米(SiO2/Si/SiO2)/p-Si 结构电致发光的影响

利用射频磁控溅射方法,制成纳米SiO2层厚度一定而纳米Si层厚度不同的纳米(SiO2/Si/SiO2)/p-Si结构和纳米(SiO2∶Al/Si/SiO2∶Al)/p-Si结构,用磁控溅射制备纳米SiO2∶Al时所用的SiO2/Al复合靶中的Al的面积百分比为1%．上述两种结构中Si层厚度均为1—3nm,间隔为0.2nm．为了对比研究,还制备了Si层厚度为零的样品．这两种结构在900℃氮气下退火30min,正面蒸半透明Au膜,背面蒸Al作欧姆接触后,都在正向偏置下观察到电致发光（EL）．在一定的正向偏置下,EL强度和峰位以及电流都随Si层厚度的增加而同步振荡,位相相同．但掺Al结构的发光强度普遍比不掺Al结构强．另外,这两种结构的EL具体振荡特性有明显不同．对这两种结构的电致发光的物理机制和SiO2中掺Al的作用进行了分析和讨论．     

LiNbO_3/SiO_2/Si薄膜的蓝光发射

采用射频磁控溅射方法制备了LiNbO3/SiO2／Si薄膜。通过X射线衍射（XRD）、电感耦合等离子体质谱（ICP-MS）和傅立叶变换红外吸收光谱（FT-IR）对薄膜的物相、晶体取向和成分进行了表征。采用荧光分光光度计研究了LiNbO3／SiO2／Si薄膜的光致发光。研究结果表明：在280nm激发光的激发下,LiNbO3／SiO2／Si薄膜在室温下发射470nm的蓝光,来源于LiNbO3薄膜与SiO2层界面处白捕获激子的辐射复合,发现在SiO2／Si薄膜上生长LiNbO3薄膜调制SiO2／Si薄膜的发光机制。     

nc-SiC/SiO_2镶嵌薄膜材料的制备、结构和发光特性

采用二氧化硅/碳化硅复合靶,用射频磁控共溅射技术和后高温退火的方法在Si(111)衬底上制备了碳化硅纳米颗粒/二氧化硅基质(nc-SiC/SiO2)镶嵌结构薄膜材料。用X射线衍射(XRD),傅里叶红外吸收(FTIR),扫描电子显微镜(SEM)和光致发光(PL)实验分析了薄膜的微结构以及光致发光特性。实验结果表明,样品薄膜经高温退火后,部分无定形SiC发生晶化,形成β-SiC纳米颗粒而较均匀地镶嵌在SiO2基质中。以280nm波长光激发薄膜表面,有较强的365nm的紫外光发射以及458nm和490nm处的蓝光发射,其发光强度随退火温度的升高显著增强,发光归结为薄膜中与Si—O相关的缺陷形成的发光中心。     

Visible light emitting Si/SiO2 superlattices

Six-period superlattices of Si/SiO₂ have been grown at room temperature using molecular beam epitaxy. With this mature technology, the ultra-thin (1–3 nm) Si layers were grown to atomic layer precision. These layers were separated by 1 nm thick SiO₂ layers whose thickness was also well controlled by using a rate-limited oxidation process. The chemical and physical structures of the multilayers were characterized by cross-sectional TEM, X-ray diffraction, Raman spectroscopy, Auger sputter-profile, and X-ray photoelectron spectroscopy. The analysis showed that the Si layer is free of impurities and is amorphous, and that the SiO₂/Si interface is sharp (0.5 nm). Photoluminescence (PL) measurements were made at room temperature using 457.9 nm excitation. The PL peak occurred at wavelengths across the visible range for these multilayers. The peak energy position E was found to be related to the Si layer thickness d by E (eV) = 1.60+0.72d⁻² in accordance with a quantum confinement mechanism and the bulk amorphous-Si band gap.     

Light emission from Si/SiO2 superlattices fabricated by RPECVD

Si/SiO₂ superlattices that exhibit intense luminescence properties were fabricated by remote plasma enhanced chemical vapor deposition. (RPECVD) and subsequent rapid thermal annealing for silicon crystallization. The effects of charge carrier confinement like blue shifting of the PL spectra and intensity increase with decreasing Silicon quantum well thickness are observed in low temperature photoluminescence experiments. The Si/SiO₂ interface quality is calculated from capacitance voltage (CV) measurements on metal oxide semiconductor teststructures showing excellent layer and Si/SiO₂ interface properties. The Si crystallization process is investigated and analyzed by Raman and transmission electron microscopy. Decreasing the Si quantum well thickness to 2 nm leads to light emission at room temperature.     

Defect-enhanced visible electroluminescence of multi-energy silicon-implanted silicon dioxide film

White-light and blue-green electroluminescence (EL) of a multirecipe Si-ion-implanted SiO/sub 2/ (SiO/sub 2/:Si/sup +/) film on Si substrate are demonstrated. The blue-green photoluminescence (PL) is enhanced by the reaction of O/sub 3//spl equiv/Si-O-Si/spl equiv/O/sub 3//spl rarr/O/sub 3//spl equiv/Si-Si/spl equiv/O/sub 3/+O/sub interstitial/ during Si implantation. After annealing at 1100/spl deg/C for 180 min, the luminescence at both 415 and 455 nm is markedly enhanced by the complete activation of radiative defects, such as weak oxygen bonds, neutral oxygen vacancies (NOVs), and the precursors of nanocrystallite Si (E'/sub /spl delta// centers). Absorption spectroscopy and electron paramagnetic resonance confirm the existence of NOVs and E'/sub /spl delta// centers. The slowly rising E'/sub /spl delta//-related PL intensity reveals that the formation of nanocrystallite Si (nc-Si) requires longer annealing times and suggests that the activation energy for diffusion of excess Si atoms is higher than that of other defects in ion implanted SiO/sub 2/. The EL from the Ag-SiO/sub 2/:Si/sup +//n-Si-Ag metal-oxide-semiconductor diode changes from deep blue to green as the driving current increase from 0.28 to 3 A. The maximum white-light luminescent power is up to 120 nW at a bias current of 1.25 A.     

Optical characteristics of Si/SiO2 multilayers prepared by magnetron sputtering

Si/SiO₂ multilayers have been successfully prepared by magnetron sputtering and subsequently thermal annealed in an Ar atmosphere at a temperature of more than 500 °C. The surface of the as-deposited films is compact and smooth, and the distribution of grain size estimated to be 20 nm is uniform. For Si/SiO₂ multilayers annealed at 1100 °C, the Si sublayer sandwiched between potential barrier SiO₂ is crystalline structure by means of the analysis of Raman spectra and XRD data. The visible PL peak accompanying to a blue-shift with the decrease of Si sublayer thickness has been observed, and the intensity of this peak enhances with the increase of annealing temperature. The visible luminescence properties of Si/SiO₂ multilayers can be ascribed to quantum confinement of electron-hole pairs in quantum wells with grain size lower than 4.5 nm. In Si/SiO₂ multilayers, not only quantum confinement but also Si-SiO₂ interface states play an important role in the optical transition. The PL peak located at 779 nm is independent of the thickness of Si sublayer, so it may be ascribed to interface mediated transition. Typical Si dangling bonds defect could be a dominating obstacle to high luminescence efficiencies.     

Size Control of Nanoscale Silicon Particles Formed in Thermally Annealed A-Si∶H Films and Its Photoluminescence

A method to control the si ze of nanoscale silicon grown in thermally annealed hydrogenated amorphous silico n (a-Si∶H) films is reported. Using the characterizing techniques of micro-Ra man scattering, X-ray diffraction and computer simulation, it is found that the sizes of the formed silicon particles change with the temperature rising rate i n thermally annealing the a-Si∶H films. When the a-Si∶H films have been anne aled with high rising rate( ~100 ℃/s), the sizes of nanoscale silicon particle s are in the range of 1.6~15 nm. On the other hand, if the a-Si∶H films have been annealed with low temperature rising rate(~1 ℃/s), the sizes of nanoscale silicon particles are in the range of 23~46 nm. Based on the theory of crystal nucleation and growth, the effect of temperature rising rate on the sizes of th e formed silicon particles is discussed. Under high power laser irradiation, in situ nanocrystallization and subsequent nc-Si clusters are small enough for vis ible light emission, authors have not detected any visible photoluminescence(PL) from these nc-Si clusters before surface passivation. After electrochemical ox idization in hydrofluoric acid, however, intense red PL has been detected. Cycli c hydrofluoric oxidization and air exposure can cause subsequent blue shift in t he red emission. The importance of surface passivation and quantum confinement i n the visible emissions has been discussed.     

Si间隔层对Al(1wt.%Si)/Zr极紫外多层膜热稳定的作用研究

为了提升Al/Zr多层膜的热稳定性,采用直流磁控溅射方法制备了18个带有不同厚度Si间隔层的Al(1 wt.%Si)/Zr多层膜,并将这些样品分别进行了不同温度(100~500 ℃)的真空退火,退火时间为1 h.利用X射线掠入射反射(GIXR)和X射线衍射(XRD)的方法来研究Si间隔层对Al/Zr多层膜热稳定性的作用.GIXR测量结果表明:随着Si间隔层厚度的增大,Al膜层的粗糙度减小,而Zr膜层的粗糙度增大;XRD测量结果表明:Al和Zr膜层粗糙度的变化是由于退火后膜层中晶粒尺寸不同造成的.相比于没有Si间隔层的Al/Zr多层膜,引入厚度为0.6 nm的Si间隔层可以有效提升Al/Zr多层膜的热稳定性.