溅射压强对ITO/Cu2O复合膜结构和光学性能的影响

利用脉冲磁控溅射制备技术,以氧化铟锡(ITO)导电玻璃为基底,采用单质金属Cu 靶作为溅射靶,在O₂和Ar的混合气氛下沉积了Cu₂O薄膜。通过调控溅射压强,研 究了脉冲磁控溅射沉积法在不同溅 射压强下对Cu₂O薄膜的物相结构、表面形貌及光学性能的影响。结果表明,在O₂、Ar流 量比(O₂/Ar)为20∶90的气 氛条件下,在2～3Pa的溅射压强范围内,可获得纯相的Cu₂O薄膜;薄膜表面形貌依赖于 溅射压强,薄膜表面粗糙度的 均方根(RMS)值随溅射压强的增大而减小;在ITO上沉积Cu₂O 薄膜后,薄膜的光学吸收边红移至780 nm, ITO/Cu₂O复合膜的光谱吸收范围拓展至300～780 nm,复合膜的吸收强度随溅射压强的增 大而减小,光学带隙E_g 随溅射压强的增大而增大,E_g值为2.28～2.39eV。     

退火Cu2O薄膜的结构及光学特性

采用射频(RF)磁控溅射单质金属铜(Cu)靶, 在O₂和Ar的混合气氛下制备了Cu₂O薄 膜,并在N₂气氛下对预沉积的Cu₂O薄膜进行快速光热退火(RTA)处理,研究了 衬底温度及退火温度对Cu₂O 薄膜的生长行为、物相结构、表面形貌及光学性能的影响。结果表明,衬底温度在300℃以 下预沉积的Cu₂O薄膜 为非晶薄膜,退火处理对Cu₂O薄膜的结晶行为有明显影响,在N₂气氛下对Cu₂O薄膜进 行退火处理不影响薄膜的物 相结构;预沉积和退火Cu₂O薄膜在650nm以下波长范围内均有较强 吸收,吸收强度随退火温度的增加而增强,薄 膜在400nm以下波长范围内出现两个由缺陷引起的中间带(IB)吸收行 为,快速热退火处理不能减少或消除薄膜沉积 过程中形成的缺陷态;退火处理影响薄膜的光学带隙Eg,预沉 积薄膜经600℃退火处理,E_g值增大了 0.26eV。     

高压退火气氛对溶液法制备a-IGZO薄膜光学特性的影响

利用椭圆偏振光谱仪和原子力显微镜,研究了相同温度下不同退火气氛及压强处理对溶液旋涂法制备a-IGZO光学特性和薄膜微观结构的影响。实验结果表明,当退火气氛为O₂时,压强由0.1 MPa增加到1.5 MPa,薄膜的光学带隙由3.23 eV增大到3.31 eV,表面粗糙层由6.77 nm降低到4.77 nm。与N₂气氛相比,1.5 MPa O₂气氛下薄膜的光学带隙有所提高,表面粗糙度也有所降低。因此,在1.5 MPa O₂气氛下,可以有效降低薄膜内部有机物的残留及缺陷,形成更加致密的非晶a-IGZO薄膜。     

衬底温度对Na-Mg共掺ZnO薄膜光学性能的影响

采用超声喷雾热解法,以石英玻璃为衬底,以乙酸 锌(Zn(CH₃COO)₂·2H₂O)、硝酸镁(Mg(NO₃)₂·6H₂O) 和醋酸钠(CH₃COONa·3H₂O)为前驱体溶液,在不同衬底温 度(480～560℃)下制备Na-Mg共掺杂ZnO薄膜。通过X-射线衍射(X RD)、扫描电子显微镜(SEM)、 光致发光(PL)谱和紫外-可见(UV-Vis)分光光度计等表征手段对样品的晶格结构 、表面形貌、PL性能 和透过率进行了研究。结果表明,衬底温度对薄膜结构和光学特性影响显著,当衬底温度为 500 ℃时制备的 Na-Mg共掺杂ZnO薄膜的c轴择优最明显,表面形貌更加致密,结 晶质量最好,PL性能最佳。     

一种双靶磁控溅射制备的Mg掺杂的NiO薄膜

采用磁控溅射“共溅射”方法,将Ar气作为溅射气体,高纯NiO和MgO双陶瓷靶作为溅射靶材。当控制NiO和MgO靶的溅射功率分别为190 W和580 W,溅射真空度为2 Pa,衬底温度为300℃时,得到了Mg掺杂的NiO(Ni_0.61Mg_0.39O)薄膜。该薄膜是一种具有(200)择优取向的晶态薄膜。薄膜表面比较平整,晶粒分布致密,晶粒尺寸约46.9 nm。(200)衍射峰位置相对未掺杂的NiO薄膜向小角度偏移约0.2°。合金薄膜在可见光波段具有较大的透过率,而在300 nm附近透过率陡然下降,其光学带隙向高能方向移动到了3.95 eV。该研究为采用磁控溅射制备高质量的Mg掺杂的NiO薄膜提供了技术支撑。     

In+Cd共掺杂ZnO薄膜的光电性能研究

通过脉冲激光沉积(PLD)在石英玻璃基底上沉积了 四元Zn0.86Cd0.11In0.03O(ZCIO)合金半导体薄膜 。其中,Cd的掺杂是 用以改变ZnO的光学禁带宽度,In是用以提高载流子浓度。X射线衍射(XRD)分析证实,ZCIO 具有六方纤锌 矿结构而没有其它相(如CdO和In₂O₃相)出现。场发射扫描电子显微镜(FE-SEM)观察到Z CIO薄膜的晶粒尺 寸要比未掺杂ZnO的小。所有薄膜在可见光范围内都有很高的透过率(≈85%)。最重要 的是,在保持了Zn1－xCdxO 薄膜的光学特性外,ZCIO薄膜的电学性能得到了改善 ,低的电阻率(4.42×10－3 Ω·cm)和高的载流子浓度(5.50×10¹⁹ cm－ 3),使得它比Zn1－xCdxO 薄膜更具应用价值。     

脉冲激光沉积Er:LiNbO3薄膜及1.54μm光致发光的研究

利用脉冲激光沉积(PLD)技术,通过双靶(Er₃O₂/LiNbO₃)交替与脉冲激光作用,在SiO ₂/Si 衬底上制备了c-轴择优取向的Er掺杂LiNbO₃(Er:LiNbO₃)薄 膜。用X射线衍射(XRD)、 场发射扫描电子显微镜(FESEM)、台阶仪及光致发光(PL)光 谱对制备的掺杂薄膜进行了表征。研究了衬底温度、O₂压及沉积时间对Er:LiNbO₃薄膜 结晶、表面形貌及 PL性能的影响。结果发现,衬底温度低于300℃时制备的Er:LiNbO 3薄膜为非晶膜,随衬底温度升高,薄膜出 现(006)衍射峰,并且其强度随衬底温度升高而增大;O₂压变化对 利用双靶沉积获得的Er:LiNbO₃薄膜择优 取向及(006)衍射峰强度影响不明显;沉积时间越长Er:LiNbO₃薄膜 中Er³⁺浓度越大,但结晶择优取向 变差;利用532nm波长激光泵浦,室温下,在1537nm波长处测得很强的光致荧光峰,而且沉积时间越长谱峰越尖锐强 度越大。     

衬底温度对ITO/Ga2O3深紫外透明导电薄膜性能的影响

用磁控溅射的方法在石英玻璃上制备了ITO/Ga₂O₃双层膜。用X射线衍射仪、扫描电镜、双光束分光光度计和霍尔效应测试仪研究了衬底温度对ITO/Ga₂O₃双层膜的结构、表面形貌、光学性能和电学性能的影响。双层膜结构受衬底温度的影响,当衬底温度从100C 升高到 350C时,薄膜的电阻率由6.71′10^-3 Ω.cm 降到 1.91′10^-3 Ω.cm。衬底温度300C制备的ITO(22nm)/Ga₂O₃(50nm)双层膜的面电阻为373.3Ω,在300nm波长的深紫外透过率为78.97%。     

氮气流量对磁控溅射C掺杂TiO2薄膜光学性能的影响

采用磁控溅射法制备了C掺杂TiO₂薄膜,并研究了氮气引入溅射过程对薄膜光学性能的影响。利用X射线衍射仪、拉曼光谱仪、X射线光电子能谱仪、分光光度计和原子力显微镜分析了不同氮气流量下薄膜的微结构、元素价态、透光性能和表面形貌。结果表明,沉积的薄膜主要是非晶结构,拉曼光谱中存在少量锐钛矿相,且随着氮气流量增大,锐钛矿特征峰强度减弱,意味着晶粒出现细化。当氮气流量增大为4cm³/min时,C掺杂TiO₂薄膜内氮元素含量为3.54%,其光学带隙从3.29eV变化至3.55eV,可见光区的光学透过率明显提高。可见改变氮气流量可实现对C掺杂TiO₂薄膜光学带隙和光吸收率的有效调控。     

Ti掺杂对Sb2Te3薄膜的结构及光学性质的调控

对Sb₂Te₃薄膜的结构、线性光学及非线性吸收性质的Ti掺杂影响进行了系统性探究。利用磁控溅射和高温退火手段制备了不同Ti掺杂浓度的晶态Sb₂Te₃薄膜。X射线光电子能谱分析显示Sb₂Te₃薄膜中的Ti元素以Ti⁴⁺化学态以TiTe₂的形式存在。线性光学性质结果表明,在保持非线性器件中宽工作波长特性的同时,Ti掺杂可以提高Sb₂Te₃薄膜的透射率,并降低光学带隙从1.32 eV至1.25 eV,根据Burstein-Moss理论,这取决于载流子的减少。利用自主搭建的开孔Z扫描系统,测试了薄膜样品在132 GW/cm²强度下800 nm飞秒激光激发的非线性吸收性质,结果显示的Ti掺杂引起的饱和吸收可调谐行为可归因于光学带隙减小与晶化抑制的竞争效应。此外,Ti掺杂将Sb₂Te₃薄膜的激光损伤阈值从188.6 GW/cm²提高到了265.5 GW/cm²。总而言之,Ti掺杂Sb₂Te₃薄膜在非线性光学器件领域具有广泛的应用前景。     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

The C-V-f and G/ω-V-f characteristics of Al/SiO2/p-Si (MIS) structures

The frequency dependence of capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the Al/SiO₂/p-Si metal-insulator-semiconductor (MIS) structures has been investigated taking into account the effect of the series resistance (R_s) and interface states (N_ss) at room temperature. The C-V and G/ω-V measurements have been carried out in the frequency range of 1 kHz to 1 MHz. The frequency dispersion in capacitance and conductance can be interpreted only in terms of interface states and series resistance. The N_ss can follow the ac signal and yield an excess capacitance especially at low frequencies. In low frequencies, the values of measured C and G/ω decrease in depletion and accumulation regions with increasing frequencies due to a continuous density distribution of interface states. The C-V plots exhibit anomalous peaks due to the N_ss and R_s effect. It has been experimentally determined that the peak positions in the C-V plot shift towards lower voltages and the peak value of the capacitance decreases with increasing frequency. The effect of series resistance on the capacitance is found appreciable at higher frequencies due to the interface state capacitance decreasing with increasing frequency. In addition, the high-frequency capacitance (C_m) and conductance (G_m/ω) values measured under both reverse and forward bias were corrected for the effect of series resistance to obtain the real diode capacitance. Experimental results show that the locations of N_ss and R_s have a significant effect on electrical characteristics of MIS structures.     

Temperature dependent current-voltage characteristics of n-MgxZn1−xO/p-GaN junction diodes

This study investigates the temperature dependence of the current-voltage (I-V) characteristics of n-Mg_xZn_1−xO/p-GaN junction diodes. The n-Mg_xZn_1−xO films were deposited on p-GaN using a radio-frequency (rf) magnetron sputtering system followed by annealing at 500, 600, 700, and 800 °C in nitrogen ambient for 60 s, respectively. The n-Mg_xZn_1−xO/p-GaN diode at a substrate temperature of 25 °C had the lowest leakage current in reverse bias. However, the leakage current of the diodes increased with an increase in annealing temperatures. The temperature sensitivity coefficients of the I-V characterizations were obtained at different substrate temperatures (25, 50, 75 100, and 125 °C) providing extracted values of 26.4, 27.2, 17.9, and 0.0 mV/°C in forward bias and 168.8, 143.4, 84.6, and 6.4 mV/°C in reverse bias, respectively. The n-Mg_xZn_1−xO/p-GaN junction diode fabricated with Mg_xZn_1−xO annealed at 800 °C demonstrated the lowest temperature dependence. Based on these findings, the n-Mg_xZn_1−xO/p-GaN junction diode is feasible for GaN-based heterojunction bipolar transistors (HBTs).     

Effect of Mg doping on the superconducting properties of Cu/sub 1-x/Tl/sub x/Ba/sub 2/Ca/sub 3-y/Mg/sub y/Cu/sub 4/O/sub 12-/spl delta//

Superconducting properties of Cu/sub 1-x/Tl/sub x/Ba/sub 2/Ca/sub 3-y/Mg/sub y/Cu/sub 4/O/sub 12-/spl delta// (Cu/sub 1-x/Tl/sub x/Mg/sub y/-1234) material have been studied in the composition range y=0,1.5,2.25. The zero resistivity critical temperature [T/sub c/(R=0)] was found to increase with the increased concentration of Mg in the unit cell; for y=1.5 [T/sub c/(R=0)]=131 K was achieved which is hitherto highest in Cu/sub 1-x/Tl/sub x/-based superconductors. The X-ray diffraction analyses have shown the formation of a predominant single phase of Cu/sub 0.5/Tl/sub 0.5/Ba/sub 2/Ca/sub 3-y/Mg/sub y/Cu/sub 4/O/sub 12-/spl delta// superconductor with an inclusion of impurity phase. It is observed from the convex shape of the resistivity versus temperature measurements that our as-prepared material was in the region of carrier over-doping, and the number of carriers was optimized by postannealing experiments in air at 400/spl deg/C, 500/spl deg/C, and 600/spl deg/C. The T/sub c/(R=0) was found to increase with postannealing and the best postannealing temperature was found to be 600/spl deg/C. The mechanism of increased T/sub c/(R=0) is understood by carrying out infrared absorption measurements. It was observed through softening of Cu(2)-O/sub A/-Tl apical oxygen mode that improved interplane coupling was a possible source of enhancement of T/sub c/(R=0) to 131 K.     

Ta/NiFe/Cu/NiFe/FeMn/Ta自旋阀多层膜的X射线光电子能谱的研究

实验表明：Ta／NiFe／FeMn／Ta多层膜的交换耦合场(Hex)要大于Ta／NiFe／Cu／NiFe／FeMn／Ta自旋阀多层膜中的以Hex。为了寻找其原因，用X射线光电子能谱(XPS)研究了Ta(12nm)／NiFe(7nm)，Ta(12nm)／NiFe(7nm))／Cu(4nm)和Ta(12nm)／NiFe(7nm)／Cu(3nm)／NiFe(5nm)3种样品，研究结果表明，前两种样品表面无任何来自下层的元素偏聚；但在第3种样品最上层的NiFe表面上，探测到从下层偏聚上来的Cu原子。我们认为：Cu在NiFe／FeMn层间的存在是Ta／NiFe／Cu／NiFe／FeMn／Ta自旋阀多层膜的Hex低于Ta／NiFe／FeMn／Ta多层膜Hex的一个重要原因。     

Pseudomorphic In/sub 0.52/Al/sub 0.48/As/In/sub 0.7/Ga/sub 0.3/As HEMTs with an ultrahigh f/sub T/ of 562 GHz

We fabricated decananometer-gate pseudomorphic In/sub 0.52/Al/sub 0.48/As/In/sub 0.7/Ga/sub 0.3/As high-electron mobility transistors (HEMTs) with a very short gate-channel distance. We obtained a cutoff frequency f/sub T/ of 562 GHz for a 25-nm-gate HEMT. This f/sub T/ is the highest value ever reported for any transistor. The ultrahigh f/sub T/ of our HEMT can be explained by an enhanced electron velocity under the gate, which was a result of reducing the gate-channel distance.     

Broadband microwave noise characteristics of high-linearity composite-channel Al/sub 0.3/Ga/sub 0.7/N/Al/sub 0.05/Ga/sub 0.95/N/GaN HEMTs

We report broadband microwave noise characteristics of a high-linearity composite-channel HEMT (CC-HEMT). Owing to the novel composite-channel design, the CC-HEMT exhibits high gain and high linearity such as an output third-order intercept point (OIP3) of 33.2 dBm at 2 GHz. The CC-HEMT also exhibits excellent microwave noise performance. For 1-/spl mu/m gate-length devices, a minimum noise figure (NF/sub min/) of 0.7 dB and an associated gain (G/sub a/) of 19 dB were observed at 1 GHz, and an (NF/sub mi/) of 3.3 dB and a G/sub a/ of 10.8 dB were observed at 10 GHz. The dependence of the noise characteristics on the physical design parameters, such as the gate-source and gate-drain spacing, is also presented.     

Materials characterization of WNxCy, WNx and WCx films for advanced barriers

A ternary WN_xC_y system was deposited in a thermal ALD (atomic layer deposition) reactor from ASM at 300 °C in a process sequence using tungsten hexafluoride (WF₆), triethyl borane (TEB) and ammonia (NH₃) as precursors. The WC_x layers were deposited by a novel ALD process at a process temperature of 250 °C. The WN_x layers were deposited at 375 °C using bis(tert-butylimido)-bis-(dimethylamido)tungsten (^tBuN)₂(Me₂N)₂W (imido-amido) and NH₃ as precursors. WN_x grows faster on plasma enhanced chemical vapor deposition (PECVD) oxide than WC_x does on chemical oxide. WN_xC_y grows better on PECVD oxide than on thermal oxide, which is opposite of what is seen for WN_x. In the case of the ternary WN_xC_y system, the scalability towards thinner layers and galvanic corrosion behavior are disadvantages for the incorporation of the layer into Cu interconnects. ALD WC_x based barriers have a low resistivity, but galvanic corrosion in a model slurry solution of 15% peroxide (H₂O₂) is a potential problem. Higher resistivity values are determined for the binary WN_x layers. WN_x shows a constant composition and density throughout the layer.     

M／PS／Si／M结构的电致发光

用阳极氧化工艺制作了多孔硅膜，采用第二次阳极氧化的方法看到了多孔硅的电致发光现象，并制作了一个Ｍ／ＰＳ／Ｓｉ／Ｍ类肖特基结构的发光二极管，观察到其电致发光，但其电致发光效率与强度很低，寿命很短，提出了研制实用化的多孔硅电致发光器件的努力方向。     

Thermoelectric Properties of Triple-Filled BaxYbyInzCo4Sb12 Skutterudites

Indium-filled skutterudites are promising power generation thermoelectric materials due to the presence of an InSb nanostructure that lowers the thermal conductivity. In this work, we have investigated thermoelectric properties of triple-filled Ba _x Yb _y In _z Co₄Sb₁₂ (0 ≤ x, y, z ≤ 0.14 actual) compounds by measuring their Seebeck coefficient, electrical conductivity, thermal conductivity, and Hall coefficient. All samples were prepared by a melting–annealing–spark plasma sintering method, and their structure was characterized by x-ray diffraction and transmission electron microscopy (TEM). TEM results show the development of an InSb nanostructure with a grain size of 30 nm to 500 nm. The nanostructure is present in all samples containing In and is also detected by specific heat measurements. The Seebeck and Hall coefficients indicate that the compounds are n-type semiconductors. Electrical conductivity increases with increasing Ba content. Thermal conductivity is strongly suppressed upon the presence of In in the skutterudite structure, likely due to enhanced boundary scattering of phonons on the nanometer-scale InSb inclusions. The highest thermoelectric figure of merit is achieved with Ba_0.09Yb_0.07In_0.06Co₄Sb_11.97, reaching ZT = 1.25 at 800 K.