溶胶–凝胶法制备BNBT系陶瓷的热释电性能

研究了采用溶胶–凝胶工艺制备的(Bi0.5Na0.5)1xBaxTiO3(x=0,0.06,0.08)系(简称BNBT)无铅压电陶瓷的热释电性能。研究发现该工艺制备的(Bi0.5Na0.5)1xBaxTiO3系陶瓷室温附近具有较强的热释电性,热释电系数P大大高于传统工艺制备的同种样品的性能。随着Ba离子浓度的增加,热释电系数P在x=0.06时达到最大,P为3.9104 Cm2·K1。溶胶–凝胶工艺制备的(Bi0.5Na0.5)1xBaxTiO3系陶瓷具有较大热释电系数,起因于该类材料压电性较强、退极化温度较低。     

锰掺杂(Bi0.5 Na0.5)0.94Ba0.06TiO3陶瓷的热释电性

研究了溶胶-凝胶(Sol-Gel)工艺制备的锰掺杂(Bi0.5Na0.5)0.94Ba0.06TiO3系陶瓷的热释电性能。研究发现,该系列材料具有优良的热释电性,适量锰的掺杂可有效降低材料的介电常数和介电损耗,从而进一步提高材料的热释电电压响应优值和热释电探测优值。对于Sol-Gel工艺制备的(Bi0.5Na0.5)0.94Ba0.06TiO3 x%Mn(x=0~0.4,质量分数)陶瓷,x=0.1~0.2范围内材料的热释电性能较好,主要的热释电参数:热释电系数p≈3.1×10-4~3.9×10-4Cm-2K-1,电压响应优值FV≈1.9×10-13~2.0×10-13Cm/J,探测优值FD≈3.3×10-11~3.8×10-11Cm/J。     

Bi基BNT-BKT-BiFeO_3陶瓷的准同型相界和电性能

采用固相反应法,制备了Bi基(1–x–y)(Bi0.5Na0.5)TiO3-x(Bi0.5K0.5)TiO3-yBiFeO3(x=0.12～0.24,y=0～0.07)钙钛矿型三元系无铅压电陶瓷,研究了该陶瓷组分与其晶相结构、电性能的关系。结果表明:除x=0.24,y=0.03的组分析出第二相外,其他组分均能形成纯钙钛矿固溶体,陶瓷三方、四方相共存的准同型相界(MPB)组分范围为x=0.18～0.21,y=0～0.05。在MPB附近陶瓷具有较好的压电性能,其d33和kp在x=0.18,y=0.03达到最大值:d33=171pC/N,kp=0.366。     

Bi过量和Mn掺杂的钛酸铋钠基无铅压电陶瓷

采用传统电子陶瓷制备工艺制备(1–y)(Na0.5Bi0.5)TiO3-yBa(ZrxTi1–x)O3无铅压电陶瓷,获得了d33高达185pC/N的0.94(Na0.5Bi0.5)TiO3-0.06Ba(Zr0.055Ti0.945)O3压电陶瓷。对Bi的挥发进行了补偿,添加过量Bi2O3(摩尔分数z=0.08)的钛酸铋钠基压电陶瓷,d33高达218pC/N。研究了Mn掺杂对钛酸铋钠基陶瓷压电、介电性能和损耗的影响,获得了高性能的无铅压电陶瓷,其中d33为214pC/N,kt为0.44,k33为0.52。     

溶胶–凝胶法制备NBT-KBT系陶瓷及其电性能

采用sol-gel法制备(1–x)Na0.5Bi0.5TiO3-xK0.5Bi0.5TiO3(x=0.12~0.50)系无铅压电陶瓷。XRD分析表明,当x=0.18~0.30时陶瓷具有三方–四方相共存的晶体结构,为该陶瓷的准同型相界(MPB)。在MPB附近存在最佳的电性能:d33为150pC/N,kp为36.7%,ε3T3/ε0为1107,tanδ为1.1×10–2,Qm为168.8,Np为2949.7Hz·m。与常规固相法相比,sol-gel法有利于提高该陶瓷的电性能。分析了该陶瓷材料在1,10和100kHz下的介电温谱,发现该陶瓷是一类弛豫型铁电体材料。     

Bi0.5(Na1-x-yKxLiy)0.5TiO3压电陶瓷的制备、性能与微结构

采用传统陶瓷工艺制备了新型无铅压电陶瓷Bi0.5(Na1-x-yKxLiy)0.5TiO3,研究了制备工艺的稳定性、放大效应、预烧粉体的研磨方式、成型工艺以及烧结方式对陶瓷压电性能的影响。研究结果表明,Bi0.5(Na1-x-yKxLiy)0.5TiO3陶瓷的压电常数d33可达230 pC/N,其机电耦合系数kp可达0.40;采用传统陶瓷工艺能够制备单相钙钛矿结构的Bi0.5(Na1-x-yKxLiy)0.5TiO3陶瓷,制备工艺的稳定性好,放大效应小,预烧粉体的研磨方式对性能的影响小,干压成型的样品压电性能最佳,烧结方式对性能无明显影响。显然,Bi0.5(Na1-x-yKxLiy)0.5TiO3陶瓷具有压电性能优、工艺性好的特点,具有实用化价值。     

Ba_(0.7)Sr_(0.3)TiO_3热释电陶瓷材料研究

采用Pechini法制备了100 nm的Ba0.7Sr0.3TiO3纳米粉体,并用凝胶注模成型工艺制备不同Mn含量的BST陶瓷。研究表明,在Mn掺杂量为0.5%(摩尔分数),烧结温度为1 280℃时制备的样品,其热释电性能较好,在居里温度附近,30～40℃时,其平均热释电系数为450μC.m–2.K–1,对应平均探测率优值为5.6μC.m–3.K–1,1kHz频率条件下tanδ低于0.5%,εr为3 500左右(室温20℃,外加偏压200 V/mm)。     

BiFeO_3改性Bi_(1/2)Na_(1/2)TiO_3-BaTiO_3基陶瓷电性能

采用固相反应法制备了新型(0.95–x)Bi1/2Na1/2TiO3-0.05BaTiO3-xBiFeO3(x=0~0.09)系无铅压电陶瓷,研究了BiFeO3掺杂量对其晶体结构、介电及压电性能的影响。结果表明:在所研究的组成范围内陶瓷均能形成纯钙钛矿型固溶体。介温曲线(10kHz)显示该陶瓷体系具有明显的弥散相变特征。该陶瓷体系的压电性能较Bi1/2Na1/2TiO3-BaTiO3陶瓷(d33=125pC/N)有较大提高,当x=0.05时,具有最佳的压电性能:d33=142pC/N,kp=0.29;此时εr=891,tanδ=0.046,Qm=110。     

0.8Na0.5Bi0.5TiO3-0.2K0.5Bi0.5TiO3复合掺杂铌酸钾钠压电陶瓷的结构及性能

采用液相包覆法制备了(1-x)(0.5NaNbO3-0.5KNbO3)-x(0.8Na0.5Bi0.5Ti03-0.2K0.5Bi0.5TiO3)(x=0,0.01,0.02,0.03,0.04,0.05)(KNN-BNKT)无铅压电陶瓷.研究了BNKT掺杂量x对KNN陶瓷的结构、介电、压电性能的影响.结果表明,制备的...     

Bi1/2(Na1-xLix)1/2TiO3压电陶瓷的性能和微结构

利用传统陶瓷工艺制备了Bi1/2(Na1-xLix)1/2TiO3(简写BNLT100x,其中x为摩尔含量)系无铅压电陶瓷,研究了该陶瓷的微结构、压电和介电性能。X-射线衍射分析(XRD)结果表明,在x=0~0.20时,Bi1/2(Na1-xLix)1/2TiO3陶瓷为单相三方晶系钙钛矿结构;在x=0.30时,会有影响压电性能的第二相产生。扫描电镜(SEM)结果表明,Li含量越高,陶瓷的烧结温度越低,Li促进了晶粒特定方向的生长;在x=0.15时,压电系数d33达极大值109 pC/N;同时研究了极化工艺条件对材料压电性能的影响。     

In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点的形貌和光学性质

提出了利用分子束外延方法生长In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点,并分析量子点的形貌和光学性质随GaAs隔离层厚度变化的特点.实验结果表明,随着耦合量子点中的GaAs隔离层厚度从2 nm增加到10 nm,In0.5Ga0.5As量子点的密度增大、均匀性提高,Al原子扩散和浸润层对量子点PL谱的影响被消除,而且InAlAs材料的宽禁带特征使其成为InGaAs量子点红外探测器中的暗电流阻挡层.由此可见,选择合适的GaAs隔离层厚度形成InGaAs/InAlAs应变耦合量子点将有益于InGaAs量子点红外探测器的研究.     

Ohmic contacts ton-type In0.5Ga0.5P

The contact properties of alloyed Ni/Au-Ge/Mo/Au metallization to npoststagger+In_0.5Ga_0.5P epilayers grown by gas-source molecular beam epitaxy on GaAs substrates are reported. A minimum specific contact resistance of 10⁻⁵ Ωcm² was obtained forn = 2 × 10¹⁹ cm⁻³ material after alloying at 360° C for 20 sec. Above this temperature outdiffusion of lattice elements and reactions of the metallization with the In_0.5Ga_0.5P lead to severe morphological changes and degraded contact properties. From the temperature dependence of the contact resistance, thermionic emission was identified as the predominant current transport mechanism in these contacts.     

Donor-acceptor interactions in Al0.5In0.5P

Dopant interactions are considered between Mg-acceptor atoms and various donor species, including the deep donor; oxygen; and the shallow donors, Te, S, and Si, in Al_0.5In_0.5P. While each of these donor species is shown to suppress Mg diffusion and enhance Mg incorporation in Al_0.5In_0.5P, careful analysis of the concentration profiles for these various donor species reveals subtle differences in the shape of the donor and acceptor dopant profiles, suggesting subtle differences in both the type of donor-acceptor interactions involved and in the effectiveness of the various donor species at suppressing Mg diffusion. Oxygen, in particular, is shown to have a profound effect on Mg diffusion in Al_0.5In_0.5P uniform-composition layers, while other donor species are less effective at suppressing Mg diffusion. Such differences suggest that a chemical bonding effect or complex formation may be more dominant between Mg and oxygen, while electrical compensation likely plays a larger relative role between Mg and the shallow-donor species.     

Na0.5Bi0.5TiO3-K0.5Bi0.5TiO3系无铅压电陶瓷的介电压电性能

研究了(Na1-xKx)0.5Bi0.5TiO3体系无铅压电陶瓷的介电、压电性能，通过XRD分析，发现随着x的增加，陶瓷的晶体结构由三方相逐渐转变为四方相，x=0．16～0．20范围内具有三方和四方共存相结构，为该体系的准同型相界(MPB)，材料在MPB附近具有最佳的压电性能．测试了陶瓷的介电温谱，表明该体系陶瓷为弛豫型铁电体，电滞回线表明陶瓷在升温过程中发生铁电-反铁电-顺电相变．     

(1-3x)NBT-2xKBT-xBT系无铅压电陶瓷性能研究R&D

通过XRD分析,发现该体系陶瓷都能形成单一的钙钛矿型固溶体,并在0.025≤x≤0.035范围内具有三方和四方共存结构,为该体系的准同型相界。当x=0.035时,陶瓷的压电常数d33达到150 pC/N,平面机电耦合系数kp达到0.297 7,均高于相应两元体系的压电性能。测定了该体系陶瓷材料的介电常数–温度曲线和电滞回线,发现该体系陶瓷的介电温谱都存在两个介电反常峰,分别对应于陶瓷材料的铁电–反铁电和反铁电–顺电相变。同时,该体系陶瓷具有弛豫铁电体性质。     

水热法制备纳米Na0.5Bi0.5TiO3粉体

采用Bi(NO3)3?5H2O、Ti(OC4H9)4为原料,在水热条件下研究了影响Na0.5Bi0.5TiO3(BNT)晶体生长和形成的各个影响因素,诸如:水热反应的温度、时间,NaOH浓度以及原料的种类等。实验结果表明,反应温度在160~180℃,保温时间在4~24 h,NaOH浓度为4~12 mol/L时,能制备出纯净的、立方形的纳米Na0.5Bi0.5TiO3晶体,其颗粒线度尺寸为15~55 nm。若温度低于160℃,Na0.5Bi0.5TiO3结晶程度低;若高于180℃,易形成Bi4Ti3O12。当NaOH浓度低于4 mol/L时,Na0.5Bi0.5TiO3晶相少,主要呈Bi4Ti3O12;当其高于12 mol/L时,产物主要是非晶态物质。     

Ordering and disordering of doped Ga0.5In0.5P

The band gap of Ga_0.5In_0.5P is reported as a function of doping level and growth rate. The lowest band gaps are obtained for hole concentrations of about 2 × 10¹⁷ cm⁻³. For samples doped p-type above 1 × 10¹⁸ cm⁻³, the band gap increases dramatically, regardless of growth rate. This effect is shown to be the result of disordering during growth rather than a change in the equilibrium surface structure with doping. The doping level dependence of the band gap of Ga_0.5In_0.5P samples grown at higher and lower growth rates differs for selenium and zinc doping even though the effects of high doping are the same for both dopants.     

Effects of trimethylindium on the purity of In0.5Al0.5P and In0.5Al0.5as epilayers grown by metalorganic chemical vapor deposition

In_0.5Al_0.5P lattice-matched to GaAs and In_0.5A1_0.5As lattice-matched to InP epilayers were grown by atmospheric pressure metalorganic chemical vapor deposition (AP-MOCVD). The effect of trimethylindium on the purity of the as-grown layers was systematically studied using secondary ion mass spectroscopy (SIMS), deep level transient spectroscopy (DLTS), and capacitance-voltage (C-V) measurements. The SIMS results showed that oxygen is the main impurity in all layers and the oxygen concentration in InAlP was approximately one to four orders of magnitude higher than the oxygen concentration found in InALAs when the same indium source was used, indicating that more oxygen was introduced by the phosphine source than by the arsine source. Two electron traps in the InAlP epilayers and four electron traps in the InALAs epilayers were observed in this study. When a high-purity indium source was used, the best InAlP epilayer showed only one deep electron trap at 0.50 eV while the best InALAs epilayer showed no deep levels measured by DLTS. In addition, we also found that a high concentration of oxygen is related to the high resistivity in both material systems; this suggests that semi-insulating (SI) materials can be achieved by oxygen doping and high quality conducting materials can only be obtained through the reduction of oxygen. The oxygen concentration measured by SIMS in the best InALAs epilayer was as low as 3 × 10¹⁷ cm⁻³.     

High‐Performance Near‐IR Photodetector Using Low‐Bandgap MA0.5FA0.5Pb0.5Sn0.5I3 Perovskite

Photodetectors with ultrafast response are explored using inorganic/organic hybrid perovskites. High responsivity and fast optoelectronic response are achieved due to the exceptional semiconducting properties of perovskite materials. However, most of the perovskite‐based photodetectors exploited to date are centered on Pb‐based perovskites, which only afford spectral response across the visible spectrum. This study demonstrates a high‐performance near‐IR (NIR) photodetector using a stable low‐bandgap Sn‐containing perovskite, (CH₃NH₃)_0.5(NH₂CHNH₂)_0.5Pb_0.5Sn_0.5I₃ (MA_0.5FA_0.5Pb_0.5Sn_0.5I₃), which is processed with an antioxidant additive, ascorbic acid (AA). The addition of AA effectively strengthens the stability of Sn‐containing perovskite against oxygen, thereby significantly inhibiting the leakage current. Consequently, the derived photodetector shows high responsivity with a detectivity of over 10¹² Jones ranging from 800 to 970 nm. Such low‐cost, solution processable NIR photodetectors with high performance show promising potential for future optoelectronic applications.