高性能1mm AlGaN/GaN功率HEMTs研制

报道了基于蓝宝石衬底的高性能1mm AlGaN/GaN HEMTs功率器件.为了提高微波功率器件性能,采用新的欧姆接触和新型空气桥方案.测试表明,器件电流密度为0.784A/mm,跨导197mS/mm,击穿电压大于40V,截止态漏电较小,1mm栅宽器件的单位截止频率达到20GHz,最大振荡频率为28GHz,功率增益为11dB,功率密度为1.2W/mm,PAE为32%,两端口阻抗特性显示了在微波应用中的良好潜力.     

1 A/mm高电流密度金刚石微波功率器件

基于自对准栅电极制备技术,研制了具有低导通电阻和高电流密度的氢终端金刚石微波功率器件。采用高功函数金属Au与氢终端金刚石实现了良好的欧姆接触,接触电阻为0.73Ω·mm。得益于较低的源漏串联电阻和低损伤Al2O3栅介质原子层沉积工艺,金刚石微波器件的导通电阻低至4Ω·mm,饱和电流密度达1.01 A/mm,最大跨导为213 mS/mm,最大振荡频率达58 GHz。研究了该器件在2 GHz和10 GHz频率下连续波功率输出特性,发现在15 V低工作电压下即可分别实现1.56 W/mm和1.12 W/mm的输出功率密度,展现出自对准技术在研制高电流和高输出功率金刚石微波器件上的潜力。     

凹槽栅场调制板结构AlGaN/GaN HEMT

研制的SiC衬底上的AlGaN/GaN微波功率HEMTs,采用凹槽栅和场调制板结构有效抑制了器件的电流崩塌,提高了器件的击穿电压和器件的微波功率特性.研制的1mm栅宽器件在8GHz,34V工作电压下,饱和输出功率达到了9.05W,功率增益为7.5dB,功率附加效率为46%.     

凹槽栅场调制板结构AlGaN/GaN HEMT

研制的SiC衬底上的AlGaN/GaN微波功率HEMTs,采用凹槽栅和场调制板结构有效抑制了器件的电流崩塌,提高了器件的击穿电压和器件的微波功率特性.研制的1mm栅宽器件在8GHz,34V工作电压下,饱和输出功率达到了9.05W,功率增益为7.5dB,功率附加效率为46%.     

蓝宝石衬底AlGaNöGaN 功率HEM Ts 研制

基于蓝宝石衬底的高微波特性 Al Ga N/Ga N HEMTs功率器件 ,器件采用了新的欧姆接触和新型空气桥方案。测试表明 ,器件电流密度 0 .784A/mm,跨导 1 97m S/mm,关态击穿电压 >80 V,截止态漏电很小 ,栅宽 1 mm的器件的单位截止频率 ( f T)达到 2 0 GHz,最大振荡频率 ( fmax) 2 8GHz,2 GHz脉冲测试下 ,栅宽 0 .75 mm器件 ,功率增益1 1 .8d B,输出功率 3 1 .2 d Bm,功率密度 1 .75 W/mm。     

高性能1mm SiC基AlGaN/GaN功率HEMT研制

在6H-SiC衬底上,外延生长了AlGaN/GaN HEMT结构,设计并实现了高性能1mm AlGaN/GaN微波功率HEMT,外延材料利用金属有机物化学气相淀积技术生长.测试表明,该lmm栅宽器件栅长为0.8μm,输出电流密度达到1.16A/mm,跨导为241mS/mm,击穿电压＞80V,特征频率达到20GHz,最大振荡频率为28GHz.5.4GHz连续波测试下功率增益为14.2dB,输出功率达4.1W,脉冲条件测试下功率增益为14.4dB,输出功率为5.2W,两端口阻抗特性显示了在微波应用中的良好潜力.     

高性能1mm SiC基AlGaN/GaN功率HEMT研制

在6H-SiC衬底上,外延生长了AlGaN/GaN HEMT结构,设计并实现了高性能1mm AlGaN/GaN微波功率HEMT,外延材料利用金属有机物化学气相淀积技术生长.测试表明,该lmm栅宽器件栅长为0.8μm,输出电流密度达到1.16A/mm,跨导为241mS/mm,击穿电压＞80V,特征频率达到20GHz,最大振荡频率为28GHz.5.4GHz连续波测试下功率增益为14.2dB,输出功率达4.1W,脉冲条件测试下功率增益为14.4dB,输出功率为5.2W,两端口阻抗特性显示了在微波应用中的良好潜力.     

8W AlGaN/GaN HEMT功率器件的研制

报道了基于国产衬底以及国产外延的AlGaN/GaN HEMT X波段功率器件的研究进展.利用国产衬底以及外延材料,优化了器件栅场板的结构,研制成功栅长0.35μm,栅宽为lmm的微波功率器件.该器件输出电流密度达到0.83A/mm,击穿电压大于100V,跨导为236mS/mm,截止频率(fT)达到30GHz,最大振荡频率(fmax)为32GHz,8GHz下在片进行连续波测试,漏端电压为40V时测试得到功率增益4.9dB,输出功率达8W,功率附加效率(PAE)为45%.     

8W AlGaN/GaN HEMT功率器件的研制

报道了基于国产衬底以及国产外延的AlGaN/GaN HEMT X波段功率器件的研究进展.利用国产衬底以及外延材料,优化了器件栅场板的结构,研制成功栅长0.35μm,栅宽为lmm的微波功率器件.该器件输出电流密度达到0.83A/mm,击穿电压大于100V,跨导为236mS/mm,截止频率(fT)达到30GHz,最大振荡频率(fmax)为32GHz,8GHz下在片进行连续波测试,漏端电压为40V时测试得到功率增益4.9dB,输出功率达8W,功率附加效率(PAE)为45%.     

用于移动通信的砷化镓高频PHEMT小功率晶体管

砷化镓PHEMT功率器件具有工作频率高，输出功率密度大，效率高，功率增益高等特点，我们研制的0．5μm栅长GaAsPHEMT小功率晶体管，栅宽1mm，直流跨导250ms/mm，栅漏反向击穿电压大于13V，在20GHz下最大可用增益为8dB，X波段输出功率为0．8W／mm，可应用于22GHz以下的窄带功率放大器和18GHz以下的宽带功率放大器。     

A high-current pseudomorphic AlGaAs/InGaAs double quantum-wellMODFET

Double quantum-well modulation-doped field-effect transistors (MODFETs) with planar-doped lattice-strained AlGaAs/InGaAs structure have been fabricated and characterized at DC and microwave frequencies. At 300 K the 0.3-μm gate devices show a full channel current of 1100 mA/mm with a constant extrinsic transconductance of 350 mS/mm over a broad gate voltage range of 1.6 V. Excellent microwave performance is also achieved with a maximum available gain cutoff frequency f _mag of 110 GHz and a current gain cutoff frequency f _r of 52 GHz. A maximum output power of 0.7 W/mm with 30% efficiency is obtained at 18 GHz     

High-performance E-mode AlGaN/GaN HEMTs

Enhancement-mode AlGaN/GaN high electron-mobility transistors have been fabricated with a gate length of 160 nm. The use of gate recess combined with a fluorine-based surface treatment under the gate produced devices with a threshold voltage of +0.1 V. The combination of very high transconductance (> 400 mS/mm) and low gate leakage allows unprecedented output current levels in excess of 1.2 A/mm. The small signal performance of these enhancement-mode devices shows a record current cutoff frequency (f/sub T/) of 85 GHz and a power gain cutoff frequency (f/sub max/) of 150 GHz.     

Performance of the AlGaN HEMT structure with a gate extension

The microwave performance of AlGaN/GaN HEMTs at large drain bias is reported. The device structures were grown by organometallic vapor phase epitaxy on SiC substrates with a channel sheet resistance less than 280 ohms/square. The breakdown voltage of the HEMT was improved by the composite gate structure consisting of a 0.35 /spl mu/m long silicon nitride window with a 0.18 /spl mu/m long metal overhang on either side. This produced an metal-insulator-semiconductor (MIS) gate extension toward the drain with the insulator, silicon nitride, approximately 40-nm-thick. Transistors with a 150 /spl mu/m total gate width have demonstrated a continuous wave (CW) 10 GHz output power density and power added efficiency of 16.5 W/mm and 47%, respectively when operated at 60 V drain bias. Small-signal measurements yielded an f/sub T/ and f/sub max/ of 25.7 GHz and 48.8 GHz respectively. Maximum drain current was 1.3 A/mm at +4 V on the gate, with a knee voltage of /spl sim/5 V. This brief demonstrates that AlGaN/GaN HEMTs with an optimized gate structure can extend the device operation to higher drain biases yielding higher power levels and efficiencies than have previously been observed.     

Trapping effects and microwave power performance in AlGaN/GaN HEMTs

The dc small-signal, and microwave power output characteristics of AlGaN/GaN HEMTs are presented. A maximum drain current greater than 1 A/mm and a gate-drain breakdown voltage over 80 V have been attained. For a 0.4 μm gate length, an f_T of 30 GHz and an f_max of 70 GHz have been demonstrated. Trapping effects, attributed to surface and buffer layers, and their relationship to microwave power performance are discussed. It is demonstrated that gate lag is related to surface trapping and drain current collapse is associated with the properties of the GaN buffer layer. Through a reduction of these trapping effects, a CW power density of 3.3 W/mm and a pulsed power density of 6.7 W/mm have been achieved at 3.8 GHz     

fmax为100GHz的蓝宝石衬底AlGaN/GaN高电子迁移率晶体管

制作了蓝宝石衬底上生长的AlGaN/GaN高电子迁移率晶体管.0V栅压下,0.3μm栅长、100μm栅宽的器件的饱和漏电流密度为0.85A/mm,峰值跨导为225mS/mm;特征频率和最高振荡频率分别为45和100GHz;4GHz频率下输出功率密度和增益分别为1.8W/mm和9.5dB,8GHz频率下输出功率密度和增益分别为1.12W/mm和11.5dB.     

Microwave power double-heterojunction HEMT's

The RF and dc characteristics of microwave power double-heterojunction HEMt's (DH-HEMT's) with low doping density have been studied. Small-signal RF measurements indicated that the cutoff frequency and the maximum frequency of oscillation in DH-HEMT's with 0.8-1 µm gate length and 1.2 mm gate periphery are typically 11- 16 GHz and 36-41 GHz, respectively. However, the cutoff frequency in DH-HEMT's degrades strongly with increasing drain bias voltage. This may be caused by both effects of increasing effective transit length of electrons and decreasing average electron velocity, due to Gunn domain formation. In large-signal microwave measurement, the DH-HEMT (2.4 mm gate periphery) delivered a maximum output power of 1.05 W with 2.8 dB gain and 0.58 W with 1.6 dB gain at 20 and 30 GHz, respectively. These are the highest output powers yet reported for HEMT devices. For the dc characteristics, the onset of two-terminal gate breakdown voltage is found to correlate with the drain current Idssand recessed length, and three-terminal source-drain breakdown characteristics near pinchoff are limited by the gate-drain breakdown. A simple model on gate breakdown voltage in HEMT is also presented.     

Influence of quantum-well width on device performance ofAl0.30Ga0.70As/In0.25Ga0.75As (on GaAs) MODFETs

An experimental study in which the quantum well width (W) is varied from 45 to 200 Å is discussed. Optimum device performance was observed at a well width of 120 Å. The 0.2-μm×130-μm devices with 120-Å quantum-well width typically exhibit a maximum channel current density of 550 mA/mm, peak transconductance of 550 mS/mm, and peak current gain cutoff frequency ( f_T) of 122 GHz. These results have been further improved in subsequent fabrications employing a trilevel-resist mushroom-gate process. The 0.2-μm×50-μm devices with mushroom gate exhibit a peak transconductance of 640 mS/mm, peak f _T of 100 GHz, and best power gains cutoff frequency in excess of 200 GHz. These results are among the best ever reported for GaAs-based FETs and are attributed to the high two-dimensional electron gas (2DEG) sheet density, good low-field mobility, low ohmic contact, and the optimized mushroom gate process     

Enhanced microwave performance of ion-implanted MESFET with graded GaAs/AlGaAs heterojunctions

Ion-implanted MESFETs have been fabricated on an inverted GaAs/AlGaAs heterostructure. The aluminium concentration in the AlGaAs is graded from 0% at the substrate to 30% at the heterointerface. A maximum extrinsic transconductance of 410 mS/mm is achieved with 0.5 mu m gate devices. This heterojunction ion-implanted FET (HIFET) also exhibits enhanced microwave performance, especially at low drain current, when compared to conventional ion-implanted GaAs MESFETs. At 20% of I/sub dss/, the current gain cutoff frequency f/sub t/ is 40 GHz, which increases up to a maximum value of 47 GHz as the drain current rises. These characteristics of high f/sub t/ and high gain at low current are advantageous for low-noise applications.<>     

High microwave and noise performance of 0.17-/spl mu/m AlGaN-GaN HEMTs on high-resistivity silicon substrates

AlGaN-GaN high-electron mobility transistors (HEMTs) based on high-resistivity silicon substrate with a 0.17-/spl mu/m T-shape gate length are fabricated. The device exhibits a high drain current density of 550 mA/mm at V/sub GS/=1 V and V/sub DS/=10 V with an intrinsic transconductance (g/sub m/) of 215 mS/mm. A unity current gain cutoff frequency (f/sub t/) of 46 GHz and a maximum oscillation frequency (f/sub max/) of 92 GHz are measured at V/sub DS/=10 V and I/sub DS/=171 mA/mm. The radio-frequency microwave noise performance of the device is obtained at 10 GHz for different drain currents. At V/sub DS/=10 V and I/sub DS/=92 mA/mm, the device exhibits a minimum-noise figure (NF/sub min/) of 1.1 dB and an associated gain (G/sub ass/) of 12 dB. To our knowledge, these results are the best f/sub t/, f/sub max/ and microwave noise performance ever reported on GaN HEMT grown on Silicon substrate.