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高击穿电压AlGaN/GaN HEMT电力开关器件研究进展 总被引:1,自引:1,他引:0
作为第三代宽禁带半导体材料的典型代表,GaN材料在各个应用领域的研究工作都受到了高度的重视。概述了基于AlGaN/GaN HEMT结构的新型高压、高频、低损耗电力开关器件的最新研究进展。从器件的结构特征入手,详细介绍了改善器件击穿特性的途径、高频开关特性的研究情况、Si衬底上AlGaN/GaN HEMT结构材料的生长、增强型器件的制备技术和功率集成电路的研究等几个国际上的热点问题。最后,对该项研究面临的问题及未来的发展趋势做了展望。 相似文献
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1引言 Ⅲ族氮化物具有宽禁带、高击穿电压、异质结通道中高峰值电子漂移速度和高薄层电子浓度等特点,是大功率和高温半导体器件的理想材料.目前可实现的实用器件主要有:紫外探测器、X射线探测器、发光二极管、场效应晶体管、异质结双极晶体管、微波电子器件、高温电子器件等.目前最主要的、应用最广的Ⅲ族氮化物器件是紫外探测器和光发射器件. 相似文献
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以高电子迁移率晶体管,异质结双极晶体管和微波/毫米波集成电路为全,介绍化合物半导体器件的特点,封装,测试及其应用。 相似文献
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以高电子迁移率晶体管,异质结双极晶体管和微波/毫米波集成电路为例,介绍化合物半导体器件的特点,封装,测试及其应用。 相似文献
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以高电子迁移率晶体管、异质结双极晶体管和微波/毫米波集成电路为例,介绍化合物半导体器件的特点、封装、测试及其应用. 相似文献
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以高电子迁移率晶体管、异质结双极晶体管和微波/毫米波集成电路为例,介绍化合物半导体器件的特点,封装,测试及其应用。 相似文献
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使用量子阱能带混合隧穿共振理论及MonteCarlo模拟方法计算了GaAs/AlAs异质谷间转移电子器件的静态和动态工作特性。 相似文献
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Recently there has been a rapid domestic development in groupⅢnitride semiconductor electronic materials and devices.This paper reviews the important progress in GaN-based wide bandgap microelectronic materials and devices in the Key Program of the National Natural Science Foundation of China,which focuses on the research of the fundamental physical mechanisms of group III nitride semiconductor electronic materials and devices with the aim to enhance the crystal quality and electric performance of GaN-based electronic materials, develop new GaN heterostructures,and eventually achieve high performance GaN microwave power devices.Some remarkable progresses achieved in the program will be introduced,including those in GaN high electron mobility transistors(HEMTs) and metal-oxide-semiconductor high electron mobility transistors(MOSHEMTs) with novel high-k gate insulators,and material growth,defect analysis and material properties of InAlN/GaN heterostructures and HEMT fabrication,and quantum transport and spintronic properties of GaN-based heterostructures,and highelectric -field electron transport properties of GaN material and GaN Gunn devices used in terahertz sources. 相似文献
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高性能1mm AlGaN/GaN功率HEMTs研制 总被引:3,自引:4,他引:3
报道了基于蓝宝石衬底的高性能1mm AlGaN/GaN HEMTs功率器件.为了提高微波功率器件性能,采用新的欧姆接触和新型空气桥方案.测试表明,器件电流密度为0.784A/mm,跨导197mS/mm,击穿电压大于40V,截止态漏电较小,1mm栅宽器件的单位截止频率达到20GHz,最大振荡频率为28GHz,功率增益为11dB,功率密度为1.2W/mm,PAE为32%,两端口阻抗特性显示了在微波应用中的良好潜力. 相似文献
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Masayoshi Umeno Takashi Egawa Hiroyasu Ishikawa 《Materials Science in Semiconductor Processing》2001,4(6)
A recessed gate AlGaN/GaN high-electron mobility transistor (HEMT) on sapphire (0 0 0 1), a GaN metal-semiconductor field-effect transistor (MESFET) and an InGaN multiple-quantum well green light-emitting diode (LED) on Si (1 1 1) substrates have been grown by metalorganic chemical vapor deposition. The AlGaN/GaN intermediate layers have been used for the growth of GaN MESFET and LED on Si substrates. A two-dimensional electron gas mobility as high as 9260 cm2/V s with a sheet carrier density of 4.8×1012 cm−2 was measured at 4.6 K for the AlGaN/GaN heterostructure on the sapphire substrate. The recessed gate device on sapphire showed a maximum extrinsic transconductance of 146 mS/mm and a drain–source current of 900 mA/mm for the AlGaN/GaN HEMT with a gate length of 2.1 μm at 25°C. The GaN MESFET on Si showed a maximum extrinsic transconductance of 25 mS/mm and a drain–source current of 169 mA/mm with a complete pinch-off for the 2.5-μm-gate length. The LED on Si exhibited an operating voltage of 18 V, a series resistance of 300 Ω, an optical output power of 10 μW and a peak emission wavelength of 505 nm with a full-width at half-maximum of 33 nm at 20 mA drive current. 相似文献
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Li Xianjie Zeng Qingming Zhou Zhou Liu Yugui Qiao Shuyun Cai Daomin Zhao Yonglin Cai Shujun 《半导体学报》2005,26(11):2049-2052
制作了蓝宝石衬底上生长的AlGaN/GaN高电子迁移率晶体管.0V栅压下,0.3μm栅长、100μm栅宽的器件的饱和漏电流密度为0.85A/mm,峰值跨导为225mS/mm;特征频率和最高振荡频率分别为45和100GHz;4GHz频率下输出功率密度和增益分别为1.8W/mm和9.5dB,8GHz频率下输出功率密度和增益分别为1.12W/mm和11.5dB. 相似文献
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简要回顾了 Al Ga N/Ga N HEMT器件电流崩塌效应研究的进展 ,着重阐述了虚栅模型、应力模型等几种解释电流崩塌效应形成机理的模型和器件钝化、生长盖帽层等减小电流崩塌效应的措施。 相似文献