S波段温度补偿型FBAR窄带滤波器的研制

研制了一种以SiO2材料作为温度补偿层的S波段温度补偿型薄膜体声波谐振器(FBAR)窄带滤波器.研究了SiO:层厚度对FBAR温度漂移特性的影响,对不同厚度SiO:层时的温度补偿特性进行了仿真.仿真结果表明,当Mo/AlN/Mo的厚度为0.15,1.35和0.15 μm,SiO2层的厚度为10 nm时,FBAR的频率温度系数(TCF)约为3×10-6/℃.采用MEMS工艺制备了温度补偿型FBAR滤波器芯片并进行了测试.测试结果表明,滤波器的中心频率为2 492 MHz,中心插损为3.74 dB,3 dB带宽为17 MHz,相对带宽为0.68％,在2 477和2 507 MHz处阻带抑制分别为27.44和33.81 dBc.在三温(常温25℃、高温85℃、低温-55℃)对该滤波器的S参数进行了测试,计算得出频率温度系数为5×10-6/℃.与未加入温度补偿层的传统滤波器相比,频率温度系数改善明显.     

S波段FBAR滤波器芯片的研制

采用完全自主的薄膜体声波谐振器(FBAR)滤波器设计、工艺技术,制备了S波段FBAR滤波器芯片。该FBAR滤波器的电路结构为梯形结构,采用一维Mason模型进行了仿真、优化。在工艺上采用空气隙型结构,突破了高c轴取向AlN压电薄膜淀积、精密空气腔制作等关键工艺技术,制备的4节FBAR滤波器中心频率为2 340MHz,3dB带宽为25MHz,中心插损为3.8dB,矩形系数达2.24∶1,输入、输出阻抗均为50Ω,芯片体积仅为1mm×1mm×0.3mm,该性能与同频率、同带宽的介质滤波器性能进行了对比,体积可缩小几千倍,矩形系数优于介质滤波器。     

基于裸芯片覆膜的薄膜体声波滤波器

该文研制了一种空腔型的薄膜体声波谐振器（FBAR）滤波器裸芯片。利用 FBAR一维 Mason 等效电路模型对谐振器进行设计,然后采用实际制作的谐振器模型形成阶梯型结构FBAR滤波器,利用 ADS 软件对 FBAR滤波器裸芯片进行优化设计。仿真结果表明,FBAR滤波器裸芯片尺寸为1 mm×1 mm×0.4 mm,滤波器的中心频率为3 GHz,中心插损为1.3 dB。采用空腔型结构并制备出FBAR滤波器裸芯片,同时采用覆膜工艺对FBAR裸芯片表面进行覆膜保护,避免裸芯片在使用或运输等过程中被损坏。测试结果显示,覆膜前滤波器裸芯片的中心频率为2.993 GHz,中心插损为1.69 dB;覆膜后滤波器的中心频率为2.997 GHz,中心插损为1.51 dB。对覆膜的影响和覆膜前后的差异进行了分析。     

体声波双工器的优化设计方法

体声波(BAW)双工器中Rx滤波器对Tx滤波器的负载效应,会使Tx滤波器的插入损耗性能退化而带外抑制性能过剩,进而使得BAW双工器性能不佳。为了解决这一问题,提出了一种BAW双工器的优化设计方法。设置BAW双工器中Tx滤波器的串联薄膜体声波谐振器(FBAR)单元谐振区面积,及并联FBAR单元与串联FBAR单元谐振区面积比值为两组优化变量,通过牺牲Tx滤波器过剩带外抑制性能的方式,采用基于梯度的优化算法计算得到了两组优化变量的最终取值。以一个工作在FDD-LTE band 7的BAW双工器优化设计案例展示了该方法的应用流程。优化设计结果的仿真验证表明,Tx滤波器的插入损耗性能从2dB提升至1.1dB,带内波动性能从1dB提升至0.3dB。由此验证了该方法的可行性。     

S波段网格型FBAR滤波器的研制

介绍了一种单端口,端口阻抗为50 Ω的S波段宽带薄膜体声波谐振器(FBAR)滤波器,该滤波器采用网格型结构的FBAR滤波器芯片级联巴伦芯片实现.对宽带FBAR滤波器芯片的设计过程、工艺实现过程进行了说明.采用0.35 μm GaAs工艺实现了3～8 GHz频率范围的巴伦芯片,在FBAR滤波器芯片的中心频率处,幅度不平衡度为0.53 dB,相位不平衡度为0.55°.制备的FBAR滤波器通带频率范围为3 100～3 400 MHz,1 dB带宽约为369 MHz,在2 660 MHz和3 840 MHz处带外抑制分别为45.6 dBc和41.3 dBc,尺寸仅为12 mm×7 mm×2.9 mm.将实测结果与仿真结果进行了对比,两者一致性很好.     

确定BAW梯形滤波器阶数的方法

为确定体声波(BAW)梯形滤波器的阶数,使用仿真法研究了滤波器的带外抑制与并、串联薄膜体声波谐振器(FBAR)的电容比Cps和滤波器阶数N的关系。基于FBAR的Mason 解析电路模型构建了1~6阶BAW梯形滤波器,Cps取值为1~6,对1~6阶BAW梯形滤波器进行仿真,取滤波器的左带外抑制进行统计并绘制曲线图。此外,BAW梯形滤波器的阶数可包括半阶数,用同样仿真法改变阶数(N=1.5,…,5.5)对滤波器进行仿真。仿真结果表明,当Cps一定时,带外抑制基本随滤波器的阶数等量增加。当滤波器的阶数一定时,带外抑制随Cps的增加而增加。在优化设计时,并、串联FBAR谐振器区面积比(即Cps)一般设置为1~4,在此范围内滤波器阶数每增加一阶,带外抑制平均增加约10 dB;滤波器的阶数增加半阶时,带外抑制约增加整阶数的一半,即5 dB,而此时通带内的插损基本保持不变。故设计滤波器时,根据设计指标中的带外抑制可初步确定滤波器的阶数。     

薄膜体声波滤波器结构和设计

随着无线通信设备的小型化发展,薄膜体声波谐振器(FBAR)已成为国内外研究热点.该文综述了FBAR滤波器的拓扑结构、工作原理和仿真模型,并选择梯形滤波器方案,通过ADS射频仿真软件建立起MBVD一维等效电路模型模拟其传输特性.按照全球定位系统(GPS)滤波器设计要求,设计了频带为1 530～1 590 MHz的窄带滤波器.仿真表明,增加串、并联谐振器阶数可有效提高带外抑制,而减少其面积比在进一步增加带外抑制的同时,减少了插损和器件整体面积.设计所得滤波器带宽60 MHz,带外抑制50 dB,插损3 dB.     

S波段低插损FBAR陷波器的研制

该文介绍了一种单端口、端口阻抗50 Ω的S波段薄膜体声波谐振器（FBAR）陷波器,其采用了梯形拓扑结构与外围匹配电路相结合的方式。对FBAR陷波器芯片的设计过程、工艺实现进行了说明。测试制备的FBAR陷波器,其陷波频段为2 399~2 412 MHz,陷波抑制达35 dBc;通带频率分别为1 800~2 300 MHz和2 500~2 800 MHz,通带插损仅1 dB;3 dBc开口宽度为69 MHz。FBAR陷波器芯片尺寸为1.2 mm×1.2 mm×0.35 mm。结果表明,陷波器实测与仿真结果两者相吻合。     

FBAR有效机电耦合系数的影响因素分析

针对有效机电耦合系数(k2eff)的两种影响因素-薄膜体声波谐振器(FBAR)的电极/压电层厚度比与压电层薄膜的c轴取向,分别建立了厚度比可变与c轴取向可变的三层复合结构的FBAR三维仿真模型。以一个谐振频率为2.185GHz的FBAR谐振器作为分析案例,通过仿真得出,设计得到的膜层厚度比为0.206时,虽然FBAR的k2eff略有下降,但此时Mo电极厚为0.247μm,AlN压电层厚为1.119 7μm,使得FBAR电学性能较好,工艺制备复杂度及时间降低。另外,c轴倾斜角度为3°时,会使FBAR的k2eff下降,同时FBAR阻抗特性曲线产生较强的寄生谐振,这会引起FBAR横向能量泄露,恶化FBAR滤波器的带内插损。因此,在制备AlN薄膜时应该严格把握各项工艺参数。此外,通过适当放宽FBAR谐振器谐振频率增量能使k2eff具有一定冗余量来弥补工艺制备引起的k2eff下降。     

体声波滤波器的设计与微加工方法

提出了一种易于使用的薄膜体声波(FBAR)滤波器的4步设计方法,以一种FDD-LTE Band7的Rx滤波器为例展示了该方法的应用流程。第一步,根据FBAR滤波器的中心频率和带宽指标,确定FBAR薄膜叠层中各层薄膜的厚度。第二步,得到滤波器的电路结构。第三步,得到每个FBAR单元的谐振区面积;为此,将串联FBAR单元的谐振区面积、并联FBAR单元与串联FBAR单元的谐振区面积比值作为两组优化参数;将给定滤波器的插入损耗和带外抑制指标作为优化目标,利用ADS软件中的梯度优化算法,得到其优化值。第四步,旨在使滤波器的带内纹波最小化。设计中采用一种新的FBAR电极厚度调整方法,故意使串联FBAR的串联谐振频率与并联FBAR的并联谐振频率频率值不等,但相差很小,实现了该目标。由于案例设计结果中,SiO2支撑层的厚度仅300nm,需要在背面通孔刻蚀的微加工工艺中工序保留良好,因此,提出了一种基于绝缘衬底上的Si(SOI)圆片中埋氧层(BOX)缓冲的两步通孔刻蚀工艺方案,该方法利用了BOX的刻蚀自停止特性。研究结果表明,Rx滤波器插入损耗为0.6dB,在Tx频段的带外抑制为40.4dB,带内纹波为0.4dB。由此验证了该设计方法的可行性。     

Technology innovation and process integrations for sub-100nm gate patterning

This paper presents a brief overview of the Applied Centura(R)DPS(R)system,configured with silicon etch DPS Ⅱ chamber, with emphasis on discussing tuning capability for CD uniformity control. It also presents the studies of etch process chemistry and film integration impact for an overall successful gate patterning development. Discussions will focus on resolutions to key issues, such as CD uniformity, line-edge roughness, and multilayer film etching integration.     

White organic light-emitting devices based on fac tris（2- phenylpyridine） iridium sensitized 5,6,11,12-tetraphenylnap -hthacene

We have fabricated the white organic light-emitting devices （WOLEDs） based on 4,4＇ -bis（2,2 -diphenyl vinyl）-1,1＇ - biphenyl （DPVBi） and phosphorescence sensitized 5,6,11,12,-tetraphenylnaphthacene （rubrene）. The device structure is ITO/2T-NATA （20 nm）/NPBX （20 nm）/CBP： x%Ir（ppy）3：0.5% rubrene （8 nm）/NPBX （5 nm）/DPVBi （30 nm）/Alq（30 nm）/LiF（0.5 nm）/A1. In the devices, DPVBi acts as a blue light-emitting layer, the rubrene is sensitized by a phosphorescent material, fac tris （2-phenylpyridine） iridium [Ir（ppy）3], acts as a yellow light-emitting layer, and N,N＇ -bis- （1-naphthyl）- N,N＇ -diphenyl -1, 1＇ -biphenyl-4,4＇ -diamine （NPBX） acts as a hole transporting and exciton blocker layer, respectively. When the concentration of Ir （PPY）3 is 6wt%, the maximum luminance is 24960 cd/m^2 at an applied voltage of 15 V, and the maximum luminous efficiency is 5.17 cd/A at an applied voltage of 8 V.     

Complete approach to automatic identification and subpixel center location for ellipse feature

To meet the need of automatic image features extraction with high precision in visual inspection, a complete approach to automatic identification and sub-pixel center location for similar-ellipse feature is proposed. In the method, the feature area is identified automatically based on the edge attribute, and the sub-pixel center location is accomplished with the leastsquare algorithm. It shows that the method is valid, practical, and has high precision by experiment. Meanwhile this method can meet the need of instrumentation of visual inspection because of easy realization and without man-machine interaction.     

小角度扩展相关性近似算法分析

本论文提出一种在多天线MIMO信道相关性建模中小角度扩展近似理论算法,并应用于分析MIMO系统性能。分析中分别对三种不同角能量分布情况下的空间相关性研发快速近似计算法,并同时提出双模(Bi-Modal)角能量分布情况下的近似运算。通过分析这些新方法的近似效率,可以得到计算简单、复杂度低、而且符合实际的MIMO相关信道矩阵,对系统级的快速高效计算法的研究和系统级的评估以及误差分析具有重要的意义。     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

A Versatile Mixed-Signal Pin Approach for Cost-Effective Test of Automotive ICs

Integrated circuits (ICs) intended for increasingly sophisticated automotive applications bring unique test demands. Advanced ICs for applications such as highly integrated automatic braking system (ABS) and airbag controllers combine high voltage digital channels, significant VI demands and precise timing capability. Along with continued missioncritical reliability concerns, the trend toward higher voltage operation and increased device integration requires specialized test capabilities able to extend across the wide operating ranges found in automotive applications. Among these capabilities, automotive test requirements increasingly dictate a need for a cost-effective versatile mixed-signal pin electronics with very high data rates reaching up to 50MHz with a voltage swing of-2 V to +28 V.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

Optical vibration and deviation measurement of rotating machine parts

It is of interest to get appropriate information about the dynamic behaviour of rotating machinery parts in service. This paper presents an approach of optical vibration and deviation measurement of such parts. Essential of this method is an image derotator combined with a high speed camera or a laser doppler vibrometer （LDV）.