L波段0.5mm SiC SIT

作为测试小管芯,所研制的小栅宽(0.5 mm)L波段SiC SIT器件,台面和栅凹槽线宽分别为1.0 μm和1.5 μm,源间距2.5 μm,采用凹栅结构、Al注入形成PN结等优化手段,提高了器件的击穿特性和微波特性.0.5 mm栅宽SiC SIT器件,输出功率通过负载牵引系统进行测试,在1.2 GHz CW、50 V...     

The amorphous Si/SiC heterojunction color-sensitive phototransistor

An amorphous Si/SiC heterojunction color-sensitive phototransistor was successfully fabricated by plasma-enhanced chemical vapor deposition. The structure is glass/ITO/a-Si(n⁺-i)/a-SiC(p⁺-i-n⁺)/Al. The device is a bulk barrier transistor with wide-bandgap amorphous SiC emitter and base. The phototransistor revealed a very high optical gain of 40 and a response speed of 10 µs at an input light power of 5 µW and a collector current of 0.12 mA at a voltage of 14 V. The peak response occurs at 610 nm under 1-V bias and changes to 420 and 540 nm under 7- and 13-V biases, respectively.     

Dynamic power density, wavelength, and switching time modulation of optically triggered power transistor (OTPT) performance parameters

Optical modulation by varying the intensity, wavelength, or switching time can dynamically alter the performance parameters of direct optically controlled power semiconductor device. Understanding the effect of optical parameters on these parameters from a first principle approach is necessary for making optimal design choices and gaining design insights. We focus on performance parameters whose variations with direct optical modulation have not been reported previously for a power semiconductor such as switching times and on-state resistance. We carry out analytical modeling and two-dimensional (2D) finite-element simulations for a GaAs/AlGaAs based superjunction lateral optically controlled power transistor that has been fabricated and successfully tested for high-voltage capability. It is shown that optical power density can modulate on-state resistance and more importantly the trade-off curve between breakdown voltage and on-state resistance. A closed-form analytical equation relating switching times with optical parameters via logarithmic function is derived and the nonlinear variation of on-state resistance and switching time with optical wavelength is illustrated. We also derive the analytical expression for power device rise time as a function of optical signal rise time and show that they are related by Lambert's W-function with exponential coefficients.     

Optical devices from AlGaAs-GaAs HBTs heavily doped with amphotericSi

A new optoelectronic multifunctional device, having triple function of light emission, detection and amplification have been developed and some preliminary integrated circuits are demonstrated. The devices consist of N-p-n or N-P-n AlGaAs-GaAs HBT utilizing amphoteric Si heavily-doped GaAs or AlGaAs p-type base layer. Maximum current gain of 3600, and light output power of about 0.17 μW with 100 μA base current (I_b) in transistor mode operation and of about 10 μW with I_b=40 mA in diode mode operation are obtained. The optical emission wavelengths in both are about 0.85-0.86 μm. Optical gain of about 130 was obtained near the 0.86 μm wavelength as a detection transistor. Spectrum matching between emission and detection wavelength range is achieved. Some monolithic integrated circuits constituted of the transistors are proposed and demonstrated successfully. The relationship between current gain and radiative quantum efficiency at the transistor operation is also discussed     

基于石墨烯/硅微米孔阵列异质结的高性能近红外光探测器

本文报道了一种由石墨烯和硅微米孔阵列构筑的异质结探测器,具备高性能近红外光探测能力。通过光刻和反应离子刻蚀技术制备的硅微米孔阵列具有整齐光滑的表面,保证了较低的表面载流子复合速率。同时,孔阵列结构能有效地抑制入射光的反射,增加了有效光照面积,提高了石墨烯/硅异质结的吸收效率,从而提高了器件的光响应度。器件在±3 V偏压下表现出明显的电流整流特性,整流比为4.30×105,在功率密度为4.25 mW/cm2的810 nm入射光照射下器件的开关比达到了9.20×105。在入射光强为118.00 μW/cm2的810 nm光照下,光探测器的电流响应度可达到679.70 mA/W,探测率为3.40×1012 Jones;入射光强为7.00 μW/cm2电压响应度为1.79×106 V/W。更重要的是,该器件具有20.00/21.30 μs的升/降响应速度。相比于商业化硅光电二极管,石墨烯/硅微米孔阵列光电探测器结构简单、制备工艺简便,有望大幅降低制备成本。研究结果显示了石墨烯/硅微米孔阵列异质结探测器在未来低成本、稳定和高效近红外光探测应用方面的巨大潜力。     

A 210-GHz fT SiGe HBT with a non-self-aligned structure

A record 210-GHz f_T SiGe heterojunction bipolar transistor at a collector current density of 6-9 mA/μm² is fabricated with a new nonself-aligned (NSA) structure based on 0.18 μm technology. This NSA structure has a low-complexity emitter and extrinsic base process which reduces overall thermal cycle and minimizes transient enhanced diffusion. A low-power performance has been achieved which requires only 1 mA collector current to reach 200-GHz f_T. The performance is a result of narrow base width and reduced parasitics in the device. Detailed comparison is made to a 120-GHz self-aligned production device     

P波段脉冲输出150W高增益功率晶体管

采用微波功率管二次发射极镇流和掺砷多晶硅发射极覆盖树枝状结构等新工艺技术，研制出用于工程的实用化P波段脉冲大功率晶体管。该器件由16个单胞内匹配而成，在该频带内，脉宽500μs，占空比15％，脉冲输出150W，增益大于10dB，集电极效率大于50％。     

脉宽调制型大功率LED恒流驱动芯片的研究

基于0.6μm5V标准CMOS工艺,研究并设计了一种脉宽调制型大功率照明LED恒流驱动芯片为1W大功率照明LED灯提供350mA恒定的平均驱动电流。实现了在5V电源电压有10%跳变时,平均驱动电流的变化可被控制在4.5%以内。输出级开关MOS管采用高密度的版图结构使单位面积的有效宽长比与普通结构的MOS管相比提高了一倍。芯片的电源效率可达87%,与以前设计的串联饱和型半导体照明LED恒流驱动芯片[1]相比提高近25%。     

应用于智能水表的低功耗低噪声放大器设计

提出了基于多管并联结构的低功耗低噪声放大器(LNA),讨论了这种结构下噪声与功耗的相互关系,提出了低功耗LNA基于"优化区"概念的设计准则.提出的电路具有结构简单对称的特点.在0.35 μm CMOS工艺下进行PSPICE仿真测试.结果表明,新的低噪声放大器在(2.5) V电压下功耗仅为110 μW,等效输入噪声为16.5 nV/Hz~(1/2).与已发表的低噪声放大器比较,具有明显的低功耗特点.     

S波段大功率GaAs PHEMT单片放大器

GaAs单片集成电路具有体积小、质量轻和可靠性高等特性,已经成为微波领域重要的器件。采用MBE技术生长出双面掺杂AlGaAs/InGaAs PHEMT结构的外延材料,研制了高效率的GaAs PHEMT器件,S波段功率附加效率大于55%。建立了基于EEHEMT的大信号模型,利用ADS软件搭建了有耗匹配的二级放大电路拓扑结构,进行最佳效率匹配,得到优化电路。采用4英寸(1英寸=2.54cm)GaAs0.35μm标准工艺研制了AlGaAs/InGaAs/GaAsPHEMT MMIC电路,测试结果表明,在测试频率为2.2~3.4GHz,测试电压VDS为10V时,输出功率大于12W,功率增益大于22dB,功率附加效率大于40%。     

体积小重量轻的SiC微波脉冲功率晶体管

采用自主开发的工艺加工技术和设计方法,直接将两个微波SiC MESFET管芯在管壳内部进行并联,实现了器件在S波段脉冲状态下(工作频率2GHz,脉冲宽度30μs,占空比10%)输出功率大于30W、功率增益12dB、功率附加效率大于30%的性能指标。由于直接采用管芯并联结构,省略了内匹配网络,器件的体积和重量较以往的Si微波双极功率晶体管大为降低;采用高温氧化技术克服了传统MESFET工艺中PECVD介质产生较高界面态的不足,减小了器件的泄漏电流,提高了器件性能。器件的研制成功,初步显示了SiC微波脉冲功率器件在体积小、重量轻、增益高、脉冲大功率输出和制作工艺简单等方面的优势。     

An efficient low voltage, high frequency silicon CMOS lightemitting device and electro-optical interface

A silicon light emitting device was designed and realized utilizing a standard 2-μm industrial CMOS technology design and processing procedure. The device and its associated driving circuitry were integrated in a CMOS integrated circuit and can interface with a multimode optical fiber. The device delivers 8 nW of optical power (450-850 nm wavelength) per 20-μm diameter of chip area at 4.0 V and 5 mA. The device emits light by means of a surface assisted Zener breakdown process that occurs laterally between concentrically arranged highly doped n⁺ rings and a p⁺ centroid, which are all coplanarly arranged with an optically transparent Si-SiO₂ interface. Theoretical and experimental determinations with capacitances and series resistances indicate that the device has an intrinsic high-frequency operating capability into the near gigahertz range     

Power and linearity characteristics of field-plated recessed-gate AlGaN-GaN HEMTs

Record power density and high-efficiency operation with AlGaN-GaN high-electron mobility transistor (HEMT) devices have been achieved by adopting a field-plated gate-recessed structure. Devices grown on SiC substrate yielded very high power density (18.8 W/mm with 43% power-added efficiency (PAE) as well as high efficiency (74% with 6 W/mm) under single-tone continuous-wave testing at 4 GHz. Devices also showed excellent linearity characteristics when measured under two-tone continuous-wave signals at 4 GHz. When biased in deep-class AB (33 mA/mm, 3% I/sub max/) device maintained a carrier to third-order intermodulation ratio of 30 dBc up to a power level of 2.4 W/mm with 53% PAE; increasing bias current to 66 mA/mm (6% I/sub max/) allowed high linear operation (45 dBc) up to a power level of 1.4 W/mm with 38% PAE.     

Fabrication and optical-switching results on the integrated light-triggered and quenched static induction thyristor

An integrated structure of the light-triggered and light-quenched (LTQ) static induction (SI) thyristor is introduced and is fabricated by the combination of the SI thyristor and SI transistor process technology. The device consists of a buried-gate light triggered (LT) SI thyristor and a p,channel surface gate static induction photo-transistor (SIPT). An anode voltage VAKof 500 V at an anode current IAKof 1 A (600 A/cm²: channel current density) is optically switched with a triggering power ofP_{LT} = 11mW/cm²(92 µW) and a quenching power ofP_{LQ} = 11mW/cm²(110 µW) in a turn-on time of 0.7 µs and a turnoff delay time of 1.0 µs. The integrated LTQ SI thyristor is a novel type of self-turn-off power device that is turned on and off by optical means.     

半导体照明光源恒流驱动芯片的研究

介绍了一种半导体照明光源恒流驱动芯片的设计。该芯片采用0.6μm CM O S标准工艺制造,包含有大功率M O SFET、带隙基准源电路、输出缓冲电路和取样反馈控制电路几个主要功能模块,在标准工艺线上实现了功率器件与控制电路的单片集成。该芯片可为工作电压为3.5 V,工作电流为350 mA的单个半导体照明光源提供恒定的驱动电流。在5 V电源电压有10%跳变的情况下,半导体照明光源的驱动电流的变化可被控制在1.71%以内,而距离光源10 cm处的照度变化仅为1.28%。当环境温度由25°C升高至85°C时,半导体照明光源的驱动电流减小1.14%,而距离光源10 cm处的照度仅减小1.09%。该恒流驱动芯片的电源效率可达63.4%。     

1 W/mm RF power density at 3.2 GHz for a dual-layer RESURF LDMOStransistor

In this letter, we present state-of-the-art performance, in terms of output power density, for an RF-power LDMOS transistor. The novel device structure has a dual-layer RESURF of the drift region, which allows for a sub-μm channel length and a high breakdown voltage of 110 V. The output power density is more than 2 W/mm at 1 GHz and a V_DS=70 V, with a stable gain of 23 dB at V_DS=50 V. At 3.2 GHz the power density is over 1 W/mm at V_DS=50 V and 0.6 W/mm at V_DS=28 V. These results are to our knowledge the best ever for silicon power MOSFETs     

单片BiCMOS超高频接收机中锁相环的设计

集成电荷泵锁相环的接收芯片工作在ISM频段：290-470MHz,采用AMS0．8μm BiCMOS工艺,npn管的特征频率为12GHz,横向pnp的特征频率为650MHz。锁相环中鉴频鉴相器和电荷泵的设计方案基本消除了死区。压控振荡器采用LC负阻结构,中心振荡频率为433MHz,调谐范围为290-520MHz,频偏为100kHz时的相位噪声约为-98dBC／Hz．分频器采用堆叠式结构以降低功耗,PLL在5V的工作电压下功耗仅为1．4mA。     

Directional light output from photonic-wire microcavity semiconductor lasers

We have obtained directional light output from a recently realized InGaAsP photonic-wire microcavity ring lasers. The output was achieved by fabricating a 0.45-/spl mu/m-wide U-shape waveguide next to a 10-/spl mu/m diameter microcavity ring laser. The laser has a threshold pump power of around 124 /spl mu/W when optically pumped at 514 nm. It is comparable to the former structure without output coupling. The output coupling efficiency can be controlled carefully by choosing the spacing between the laser cavity and the waveguide.     

1.3μm InGaAsP/InP双异质结发光二极管的研究

随着光纤通信系统的发展,长波(1.1—1.7μm)光源的研究巳广泛引起重视。因为在这一波长范围内,石英光纤具有低的传输损耗和材料色散。文献[1]指出,用InGaAsP/InP发光二极管(λ=1.3μm)作光源的系统的传输容量比目前常见的用GaAlAs/GaAs发光     

AlGaAs／InGaAs功率PHEMT用异质材料的计算机优化与器件实验结果

借助一新的工艺模拟与异质器件模型用ＣＡＤ软件──ＰＯＳＥＳ（Ｐｏｉｓｓｏｎ－ＳｃｈｒｏｅｄｉｎｇｅｒＥｑｕａｔｉｏｎＳｏｌｖｅｒ），对以ＡｌＧａＡｓ／ＩｎＧａＡｓ异质结为基础的多种功率ＰＨＥＭＴ异质层结构系统（传统、单层与双层平面掺杂）进行了模拟与比较，确定出优化的双平面掺杂ＡｌＧａＡｓ／ＩｎＧａＡｓ功率ＰＨＥＭＴ异质结构参数，并结合器件几何结构参数的设定进行器件直流与微波特性的计算，用于指导材料生长与器件制造。采用常规的ＨＥＭＴ工艺进行ＡｌＧａＡｓ／ＩｎＧａＡｓ功率ＰＨＥＭＴ的实验研制。对栅长０．８μｍ、总栅宽１．６ｍｍ单胞器件的初步测试结果为：ＩＤｓｓ２５０～４５０ｍＡ／ｍｍ；ｇｍ０２５０～３２０ｍＳ／ｍｍ；Ｖｐ－２．０－２．５Ｖ；ＢＶＤＳ５～１２Ｖ。７ＧＨｚ下可获得最大１．６２Ｗ（功率密度１．０Ｗ／ｍｍ）的功率输出；最大功率附加效率（ＰＡＥ）达４７％。