A 920 gate DSA MOS masterslice

A DSA MOS (diffusion self-aligned MOS) masterslice circuit with up to 920 gates and a delay of 3 ns per gate has been developed for random logic computer circuits, utilizing the performance and economical advantages of the LSI masterslice approach. To attain high packing density and high speed with conventional design rules, the DSA MOSFET technology has been used for the basic device. The chip comprises 50 by 16 gate cells and 116 input/output buffers. This LSI chip is two to three times better than bipolar S-TTL in packing density and is comparable in propagation delay time. As an example of an LSI device obtained through customized metallization, an 8 bit ALU is described which has an average delay time of 3 ns and a power dissipation of 3 W.     

Design and Application of a 20K Gate Array

This paper describes the design and architecture of a novel VLSI gate array in CMOS technology and its application for a 3-bit error checking and correcting (ECC) unit. The cell rows of the master are arranged without intermediate channels for routing (``sea of gates'). This scheme can be utilized to build large macro cells and functional blocks like data paths or systolic array cells which are very area consuming to realize in conventional gate arrays. In addition, special pull-up/pull-down cells are included on the chip which can be used for data buses and timing circuits. The technology used is an advanced p-well CMOS process with 1.8-μm geometric channel lengths and a two-layer metallization. There are 260 programmable pads for input/output functions and 20 additional power pads (280 pads in total). Depending on the logic, circuits with up to 25 000 gates can be realized with this device.     

Logic synthesis of race-free asynchronous CMOS circuits

A synthesis method for generating race-free asynchronous CMOS circuits that are independent of the internal and output delays is presented. The design method is based on the properties of the negative gates. An inertial delay is associated with each negative gate in a CMOS circuit. Such a gate model is quite realistic. The basic principle of the method presented is to augment and to modify the original flow table in such a way that the obtained logic diagram contains only negative gates. In addition, the synthesis method is capable of avoiding any race, and consequently any critical race or hazard. The method minimizes the number of internal variables and therefore the number of gates, providing new simple cells for fast and low-power integrated circuits     

A comprehensive delay macro modeling for submicrometer CMOS logics

The increasing need for high-performance, cost-effective, application-specific integrated circuits, associated to the reduction of design cycle time, compels designers to manage and optimize the circuit speed performance at each step of the design flow. Circuits are usually designed at gate level; the gate selection or sizing and their placement are driven by estimated delay, hence the need for accurate estimations at the logical level. In the submicrometer range, the gap between gate-level logical estimations and transistor-level electrical simulations dramatically increases. We propose here a comprehensive analytical modeling of the speed performance of CMOS gates with an accuracy comparable to electrical simulators. A design-oriented expression of delay is first developed for CMOS inverters, considering input slope, input-to-output capacitance coupling, and short-circuit current effects. The extension to more complex gates is proposed using a serial array reduction technique taking account of the gate input dependency and the input-slope-induced nonlinearity. Validations are obtained over a large range of design, load, and input slope conditions by comparison with SPICE simulations (level 6 with 0.65-μm foundry specified card model) used as a reference     

Graphene nanoribbon crossbar architecture for low power and dense circuit implementations

Crossbar array is a promising nanoscale architecture which can be used for logic circuit implementation. In this work, a graphene nanoribbon (GNR) based crossbar architecture is proposed. This design uses parallel GNRs as device channel and metal as gate, source and drain contacts. Schottky-barrier type graphene nanoribbon field-effect transistors (SB-GNRFETs) are formed at the cross points of the GNRs and the metallic gates. Benchmark circuits are implemented using the proposed crossbar, Si-CMOS and multi-gate Si-CMOS approaches to evaluate the performance of the crossbar architecture compared to the conventional CMOS logic design. The compact SPICE model of SB-GNRFET was used to simulate crossbar-based circuits. The CMOS circuits are also simulated using 16 nm technology parameters. Simulation results of benchmark circuits using SIS synthesis tool indicate that the GNR-based crossbar circuits outperform conventional CMOS circuits in low power applications. Area optimized cell libraries are implemented based on the asymmetric crossbar architecture. The area of the circuit can be more reduced using this architecture at the expense of higher delay. The crossbar cells can be combined with CMOS cells to exhibit better performance in terms of EDP.     

A combined gate replacement and input vector control approach for leakage current reduction

Input vector control (IVC) is a popular technique for leakage power reduction. It utilizes the transistor stack effect in CMOS gates by applying a minimum leakage vector (MLV) to the primary inputs of combinational circuits during the standby mode. However, the IVC technique becomes less effective for circuits of large logic depth because the input vector at primary inputs has little impact on leakage of internal gates at high logic levels. In this paper, we propose a technique to overcome this limitation by replacing those internal gates in their worst leakage states by other library gates while maintaining the circuit's correct functionality during the active mode. This modification of the circuit does not require changes of the design flow, but it opens the door for further leakage reduction when the MLV is not effective. We then present a divide-and-conquer approach that integrates gate replacement, an optimal MLV searching algorithm for tree circuits, and a genetic algorithm to connect the tree circuits. Our experimental results on all the MCNC91 benchmark circuits reveal that 1) the gate replacement technique alone can achieve 10% leakage current reduction over the best known IVC methods with no delay penalty and little area increase; 2) the divide-and-conquer approach outperforms the best pure IVC method by 24% and the existing control point insertion method by 12%; and 3) compared with the leakage achieved by optimal MLV in small circuits, the gate replacement heuristic and the divide-and-conquer approach can reduce on average 13% and 17% leakage, respectively.     

A 64-bit carry look ahead adder using pass transistor BiCMOS gates

This paper describes a 64-bit two-stage carry look ahead adder utilizing pass transistor BiCMOS gate. The new pass transistor BiCMOS gate has a smaller intrinsic delay time than conventional BiCMOS gates. Furthermore, this gate has a rail-to-rail output voltage. Therefore the next gate does not have a large degradation of its driving capability. The exclusive OR and NOR gate using the pass transistor BiCMOS gate shows a speed advantage over CMOS gates under a wide variance in load capacitance. The pass transistor BiCMOS gates were applied to full adders, carry path circuits, and carry select circuits. In consequence, a 64-bit two-stage carry look ahead adder was fabricated using a 0.5 μm BiCMOS process with single polysilicon and double-metal interconnections. A critical path delay time of 3.5 ns was observed at a supply voltage of 3.3 V. This is 25% better than the result of the adder circuit using CMOS technology. Even at the supply voltage of 2.0 V, this adder is faster than the CMOS adder     

Design and realization of high-performance wave-pipelined 8×8b multiplier in CMOS technology

Wave pipelining is a design technique for increasing the throughput of a digital circuit or system without introducing pipelining registers between adjacent combinational logic blocks in the circuit/system. However, this requires balancing of the delays along all the paths from the input to the output which comes the way of its implementation. Static CMOS is inherently susceptible to delay variation with input data, and hence, receives a low priority for wave pipelined digital design. On the other hand, ECL and CML, which are amenable to wave pipelining, lack the compactness and low power attributes of CMOS. In this paper we attempt to exploit wave pipelining in CMOS technology. We use a single generic building block in Normal Process Complementary Pass Transistor Logic (NPCPL), modeled after CPL, to achieve equal delay along all the propagation paths in the logic structure. An 8×8 b multiplier is designed using this logic in a 0.8 μm technology. The carry-save multiplier architecture is modified suitably to support wave pipelining, viz., the logic depth of all the paths are made identical. The 1 mm×0.6 mm multiplier core supports a throughput of 400 MHz and dissipates a total power of 0.6 W. We develop simple enhancements to the NPCPL building blocks that allow the multiplier to sustain throughputs in excess of 600 MHz. The methodology can be extended to introduce wave pipelining in other circuits as well     

Efficient algorithm for glitch power reduction [CMOS logiccircuits]

An efficient algorithm is proposed for reducing glitch power dissipation in CMOS logic circuits. The proposed algorithm takes a path balancing approach that is achieved using gate sizing and buffer insertion methods. The gate sizing technique reduces not only glitches but also the effective circuit capacitance. After gate sizing, buffers are inserted into the remaining unbalanced paths which have not been subjected to gate sizing. ILP has been employed to determine the location of inserted buffers. The proposed algorithm has been tested on LGSynth91 benchmark circuits. Experimental results show that 61.5% of glitches are reduced on average     

Bootstrapped full-swing BiCMOS/BiNMOS logic circuits for 1.2-3.3 Vsupply voltage regime

Novel full-swing BiCMOS/BiNMOS logic circuits using bootstrapping in the pull-up section for low supply voltage down to 1 V are reported. These circuit configurations use noncomplementary BiCMOS technology. Simulations have shown that they outperform other BiCMOS circuits at low supply voltage using 0.35 μm BiCMOS process. The delay and power dissipation of several NAND configurations have been compared. The new circuits offer delay reduction between 40 and 66% over CMOS in the range 1.2-3.3 V supply voltage. The minimum fanout at which the new circuits outperform CMOS gate is 5, which is lower than that of other gates particularly for sub-2.5 V operation     

Gate delay variability estimation method for parametric yield improvement in nanometer CMOS technology

In digital CMOS circuits, parametric yield improvement may be achieved by reducing the variability of performance and power consumption of individual cell instances. Such improvement of variation robustness can be attained by evaluating parameter variation impact at gate level. Statistical characterization of logic gates are usually obtained by computationally expensive electrical simulations. An efficient gate delay variability estimation method is proposed for variability-aware design. The proposed method has been applied to different topologies (transistor network arrangements) and CMOS gates, and it has been compared to Monte Carlo simulations for data validation, resulting in computation time savings.     

A Comprehensive Delay Model for CMOS CML Circuits

MOS-transistor-based current-mode logic (CML)-type (MCML) circuits in high-speed circuit applications often operate as low-swing analog circuits rather than fully switched digital circuits. At these high-speed operations, the effect of the finite input signal slope on the delay of MCML gates significantly increases mainly due to incomplete current steering. Hence, for such cases, the conventional RC delay model which is based on ideal step input assumption fails to track the delay of MCML circuits with errors as high as 40% when a design is optimized for high-speed. In this paper, a comprehensive delay model is proposed that accurately predicts the delay of MCML circuits for all types of operation from low-speed and fully switched to high-speed and low-swing applications by including the input slope effect (ISE) into the conventional RC delay model. Furthermore, the proposed model is extended to multilevel complex logic gates without losing the general RC delay model format. Theoretical results are compared with Spice simulations in a 0.13-$mu{hbox {m}}$ CMOS technology. Results show that the error in delay of the proposed model is less than 20% for all practical designs. The proposed model is still sufficiently tractable to be use in back-of-envelope calculations that achieve close-to-optimum solutions without running extensive parametric simulations. In addition to the achieved accuracy and preserved simplicity, the proposed model enhances the intuitive understanding of MCML gates that simple RC delay model fails to provide.      

Dynamic internal testing of CMOS circuits using hot luminescence

Subnanosecond pulses of hot electron luminescence are shown to be generated coincident with logic state switching of individual devices in CMOS circuits. These pulses are used to directly observe 90 ps gate delays in a ring oscillator as well as the logic switching and gate delays of a counter. By use of a detector with both space- and time-resolution, the dynamics of all the gates of the circuit are simultaneously measured. This noninvasive technique can be extended to smaller device size, as well as probing from the backside of the wafer. The optical emission may provide an alternative to electron beam testing for measuring the dynamics of high-speed CMOS circuits     

On circuit techniques to improve noise immunity of CMOS dynamic logic

Dynamic CMOS logic circuits are widely employed in high-performance VLSI chips in pursuing very high system performance. However, dynamic CMOS gates are inherently less resistant to noises than static CMOS gates. With the increasing stringent noise requirement due to aggressive technology scaling, the noise tolerance of dynamic circuits has to be first improved for the overall reliable operation of VLSI chips designed using deep submicron process technology. In the literature, a number of design techniques have been proposed to enhance the noise tolerance of dynamic logic gates. An overview and classification of these techniques are first presented in this paper. Then, we introduce a novel noise-tolerant design technique using circuitry exhibiting a negative differential resistance effect. We have demonstrated through analysis and simulation that using the proposed method the noise tolerance of dynamic logic gates can be improved beyond the level of static CMOS logic gates while the performance advantage of dynamic circuits is still retained. Simulation results on large fan-in dynamic CMOS logic gates have shown that, at a supply voltage of 1.6 V, the input noise immunity level can be increased to 0.8 V for about 10% delay overhead and to 1.0 V for only about 20% delay overhead.     

A comprehensive submicrometer MOST delay model and its applicationto CMOS buffers

In this paper, an accurate delay model for MOS transistors in submicrometer CMOS digital circuits is presented. It takes into account a ramp shape input voltage and a feedforward capacitive coupling between gate and drain nodes, along with the main second-order effects present in short-channel MOS transistors. The proposed model shows an average agreement with SPICE simulations of 3% in the calculation of the propagation time, tested on a minimum inverter with a 0.7-μm CMOS reference technology for a wide range of input voltage slopes. An example of application in optimization algorithms regarding CMOS tapered buffers is also reported. A maximum error ranging from 3-6% with respect to SPICE has been found for the optimized circuits     

Design and analysis of low power high-speed 1-bit full adder cells for VLSI applications

This paper presents a low power and high speed two hybrid 1-bit full adder cells employing both pass transistor and transmission gate logics. These designs aim to minimise power dissipation and reduce transistor count while at the same time reducing the propagation delay. The proposed full adder circuits utilise 16 and 14 transistors to achieve a compact circuit design. For 1.2 V supply voltage at 0.18-μm CMOS technology, the power consumption is 4.266 μW was found to be extremely low with lower propagation delay 214.65 ps and power-delay product (PDP) of 0.9156 fJ by the deliberate use of CMOS inverters and strong transmission gates. The results of the simulation illustrate the superiority of the newly designed 1-bit adder circuits against the reported conservative adder structures in terms of power, delay, power delay product (PDP) and a transistor count. The implementation of 8-bit ripple carry adder in view of proposed full adders are finally verified and was observed to be working efficiently with only 1.411 ns delay. The performance of the proposed circuits was examined using Mentor Graphics Schematic Composer at 1.2 V single ended supply voltage and the model parameters of a TSMC 0.18-μm CMOS.     

Shielding effect of on-chip interconnect inductance

Interconnect inductance introduces a shielding effect which decreases the effective capacitance seen by the driver of a circuit, reducing the gate delay. A model of the effective capacitance of an RLC load driven by a CMOS inverter is presented. The interconnect inductance decreases the gate delay and increases the time required for the signal to propagate across an interconnect, reducing the overall delay to drive an RLC load. Ignoring the line inductance overestimates the circuit delay, inefficiently oversizing the circuit driver. Considering line inductance in the design process saves gate area, reducing dynamic power dissipation. Average reductions in power of 17% and area of 29% are achieved for example circuits. An accurate model for a CMOS inverter and an RLC load is used to characterize the propagation delay. The accuracy of the delay model is within an average error of less than 9% as compared to SPICE.     

Process variation aware dual-Vth assignment technique for low power nanoscale CMOS design

This paper presents a novel sensitivity-based, transistor-level, dual threshold voltage (V_th) assignment technique for the design of low power nanoscale CMOS circuits. The proposed technique is based on the Plackett-Burman Design of Experiment method (PB-DOE) in which sensitivity of each transistor to delay variation due to change in its V_th is obtained. The various paths in the circuit are categorized into process sensitive and process-insensitive paths. Transistors in the process sensitive paths are assigned a high V_th to reduce the leakage power without affecting performance. The application of the proposed technique to ISCAS-85 C17 benchmark circuit shows 20% reduction in the leakage power as compared to conventional gate-level dual-V_th assignment technique. Moreover, it is shown that the proposed algorithm can be easily extended to assign dual gate length circuits to achieve a further 20% reduction in the leakage power. The robustness of the proposed technique against process variations is demonstrated with extensive Monte Carlo Simulations. The versatility of the proposed approach to reduce the leakage power for a general CMOS circuit is demonstrated using a Manchester carry chain adder.     

The impact of intra-die device parameter variations on path delaysand on the design for yield of low voltage digital circuits

The yield of low voltage digital circuits is found to he sensitive to local gate delay variations due to uncorrelated intra-die parameter deviations. Caused by statistical deviations of the doping concentration they lead to more pronounced delay variations for minimum transistor sizes. Their influence on path delays in digital circuits is verified using a carry select adder test circuit fabricated in 0.5 and 0.35 μm complementary metal-oxide-semiconductor (CMOS) technologies with two different threshold voltages. The increase of the path delay variations for smaller device dimensions and reduced supply voltages as well as the dependence on the path length is shown. It is found that circuits with a large number of critical paths and with a low logic depth are most sensitive to uncorrelated gate delay variations. Scenarios for future technologies show the increased impact of uncorrelated delay variations on digital design. A reduction of the maximal clock frequency of 10% is found for, for example, highly pipelined systems realized in a 0.18-μm CMOS technology     

Overview of complementary GaAs technology for high-speed VLSIcircuits

A self-aligned complementary GaAs (CGaAs) technology (developed at Motorola) for low-power, portable, digital and mixed-mode circuits is being extended to address high-speed VLSI circuit applications. The process supports full complementary, unipolar (pseudo-DCFL), source-coupled, and dynamic (domino) logic families. Though this technology is not yet mature, it is years ahead of CMOS in terms of fast gate delays at low power supply voltages. Complementary circuits operating at 0.9 V have demonstrated power-delay products of 0.01 μW/MHz/gate. Propagation delays of unipolar circuits are as low as 25 ps. Logic families can be mixed on a chip to trade power for delay. CGaAs is being evaluated for VLSI applications through the design of a PowerPC-architecture microprocessor