Characterization of high quality RTCVD relaxed Si1−xGex grown on ge graded buffer layers on Si by photoluminescence spectroscopy

Relaxed Si_1−xGe_x layers grown by rapid thermal chemical vapor deposition (RTCVD) have been characterized by photoluminescence (PL) spectroscopy. The structures consist of a Si_1−xGe_x capping layer with a 0.32 and 0.52 Ge concentration, grown on a compositionally graded Si_1−xGe_x buffer layer. The effect of the composition grading rate on the layer quality has been intensively studied. Well-resolved near band edge luminescence (excitonic lines with no-phonon and phonon replica similar as in bulk SiGe alloys) coming from the relaxed alloy capping layer and dislocation-related bands (Dl, D2, D3, D4 lines) in the graded buffer layer have been measured. The electronic quality of this relaxed capping layer, controlled by the design of the compositionally graded buffer layer, has been determined by the excitonic photoluminescence. A detailed analysis of the energy of the D4 dislocation band demonstrates that the main misfit dislocations remain confined in the first steps of the graded buffer layer. Si_1−xGe_x layers grown on these pseudo-substrates either under compressive or tensile strain and the well-defined PL results obtained are discussed on the bases of strain symmetrization and of high quality of the layers. This points out the possibility of using such high quality relaxed Si_1−xGe_x layers as substrates for the integration of new devices associated with Si technology.     

The kinetics of dislocation glide in SiGe alloy layers

A general expression for the glide velocity of misfit dislocations in Si_1-xGe_x layers on Si substrates as a function of composition, thickness and temperature is presented. The relaxation of Si/Si_1-xGe_x/Si buried layer structures, which can proceed by the glide of two segment or three segment dislocations, is also considered. Expressions for the glide velocity of the two configurations are also given, allowing the behaviour of a Si/Si_1-xGe_x/ Si structure to be predicted from the cap and alloy thicknesses and the alloy concentration. Use of this theory has enabled the design of structures that clearly demonstrate the different glide processes. Samples of MBE material designed in this way have been annealed at a range of temperatures. The dislocation configuration and glide velocity are as predicted by the theory.     

Effects of mesa area and orientation on defects in strained InxGa1−xAs films grown by LPOMCVD

We have selectively grown In_xGa_1?xAs (0.04 <x < 0.20, 200 ? 7000Å) on rectangular growth areas (100 μm by 200 mil) patterned on GaAs substrates with very low etch pit densities (～200 cm^?2). The edge orientations of the growth areas were varied on the substrate resulting in distinct facet formation on the deposited mesa structures. Layers were grown using Low-Pressure Organometallic Chemical Vapor Deposition (LPOMCVD) and all samples were annealed for 1 hr at 700° C. Indium content and film thicknesses were very uniform across a wafer so that only the facet shape was varied. Observation of Crosshatch defect densities as a function of growth window orientation showed that 2900Å In_0.08Ga_0.92As mesas with [010] edge orientations exhibited no Crosshatch defects. Identical mesas grown in windows with other edge orientations exhibited varying crosshatch defect densities. Large unpatterned areas of growth were heavily crosshatched. This variation in Crosshatch defect density as a function of mesa orientation appears to be associated with non-area related dislocation nucleation mechanisms at the mesa edges. Proper choice of window orientation for patterned substrate epitaxy will allow the mesa facets to be controlled thereby reducing misfit dislocations in the heterostructure interface.     

Room temperature λ=1.3 µm photoluminescence from InGaAs quantum dots on (001) Si substrate

GaAs/In_xGa_1−x As quantum dot heterostructures exhibiting high-intensity λ=1.3 μm photoluminescence at room temperature have been grown on (001) Si substrate with a Si_1−x Ge_x buffer layer. The growth was done successively on two MBE machines with sample transfer via the atmosphere. The results obtained by the study of the structure growth process by means of high-energy electron diffraction are presented. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 36, No. 5, 2002, pp. 565–568. Original Russian Text Copyright ? 2002 by Burbaev, Kazakov, Kurbatov, Rzaev, Tsvetkov, Tsekhosh.     

Phonon-resolved and broad photoluminescence in strained Si1−xGex alloy MBE layers

In the photoluminescence (PL) spectra of Si_1?xGe_x multi-quantum wells (MQW) grown by conventional solid source molecular beam epitaxy (MBE), phonon-resolved, near-bandgap transitions due to shallow dopant bound exciton or free exciton recombination were observed when the well thickness was less than 40–100Å, depending on x. Increasing the Si_1?xGe_x well thickness caused the emergence of a broad, unresolved PL peak ～120 meV lower in energy than the expected bandgap energy. Interstitial-type platelets, less than 15Å in diameter, were measured by plan view transmission microscopy to occur in densities that correlated well with the intensity of the broad PL peak. A platelet density of ～10⁸ cm^?2 per well was sufficient to completely quench the phonon-resolved PL. Etching experiments revealed that within a given MQW, the platelet density is lowest in the first grown well and progressively increases in subsequent wells with increasing strain energy density, indicating that platelet formation is strictly a morphological phenomenon and suggesting that a strain relaxation mechanism is in effect before the onset of relaxation by misfit dislocation injection.     

The influence of defects on device performance of MBE-grown Si homojunction and strained Si1-xGex/Si heterostructures

Different Si homojunction and strained Si_1-xGe_x/Si heterojunction diodes and bipolar transistors have been fabricated by Si-MBE. The effect of annealing on Si homojunction diodes and transistors are studied. It is found that annealing generally improves the Si device performance, such as the ideality factor and breakdown characteristics. The influence of⁶⁰Co γ irradiation on the Si_1-xGe_x/Si diode performances are investigated by studying the temperature dependence of their electrical characteristics, and the results are correlated with the quality of the MBE-films. γ irradiation causes a drop in material conductivity due to the generation of atom-displacement defects in the whole volume of the wafers and increases the defect density at hetero-interfaces. The forward I-V curves of Si_1-xGe_x/Si devices may shift towards lower or higher voltages, depending on the film quality and the irradiation dose. The increase of defect density in strained Si_1-xGe_x/Si films appears to occur easier for the films with lower quality. Electrical measurements and calculations show that the defect-associated tunneling process is important in current transport for these MBE grown Si homojunction and strained Si_1-xGe_x/Si heterojunction devices, which have initially medium film quality or have been treated by irradiation.     

Photoluminescence spectra of Si1-xGex/Si quantum well structures grown by three different techniques

Photoluminescence (PL) spectra of Si_1-xGe_x/Si multiple quantum wells have been measured at 4.2 K for the samples grown by three different techniques; conventional molecular beam epitaxy (MBE), gas-source MBE, and ultra high vacuum chemical vapor deposition (UHV-CVD). Only in the case of conventional MBE, strong emission bands appear about 80 meV below the band gap of Si_1-xGe_x. These strong emission bands disappear after the annealing at 800° C. From the dependence of the PL intensity on the excitation power, strong emission is considered to be due to some recombination center. On the other hand, in the case of gas-source MBE and UHV-CVD, the strong emission bands are undetectable, although the band-edge PL lines of Si_1-xGe_x are clearly observed. There is no significant change in the PL spectra after the annealing. The origin of the strong emission band is considered to be defects which are characteristic of conventional MBE.     

Charge collection microscopy of annealing induced electrically active defects in Si1−xGex/Si strained layer epitaxy

Images of electrically active defects in Si_1−xGe_x strained epilayers onn-type Si(100) have been obtained using charge collection microscopy (CCM) in a scanning electron microscope. Electrically active defects were generated in the defect-free as-grown material by rapid thermal annealing treatments (3 min) over a temperature range of 550 to 850° C. Point-like contrast, attributed to threading dislocations, as well as an additional line contrast due to the formation of an interface misfit dislocation network, were observed as the metastable strained Si_1−xGr_x layers relaxed upon annealing. Cross-sectional and plan-view transmission electron microscopy were used to examine the Si_1−xGe_x epilayers in finer detail. Double crystal x-ray diffraction and Raman scattering spectra were also obtained and the annealing induced peak shifts investigated.     

Structural analysis of Ge x Si1−x /Si layers by remote plasma-enhanced chemical vapor deposition on Si (100)

In this work, remote plasma-enhanced chemical vapor deposition (RPCVD) has been used to grow Ge _x Si_1−x /Si layers on Si(100) substrates at 450° C. The RPCVD technique, unlike conventional plasma CVD, uses an Ar (or He) plasma remote from the substrate to indirectly excite the reactant gases (SiH₄ and GeH₄) and drive the chemical deposition reactions. In situ reflection high energy electron diffraction, selected area diffraction, and plan-view and cross-sectional transmission electron microscopy (XTEM) were used to confirm the single crystallinity of these heterostructures, and secondary ion mass spectroscopy was used to verify abrupt transitions in the Ge profile. XTEM shows very uniform layer thicknesses in the quantum well structures, suggesting a Frank/ van der Merwe 2-D growth mechanism. The layers were found to be devoid of extended crystal defects such as misfit dislocations, dislocation loops, and stacking faults, within the TEM detection limits (∼10⁵ dislocations/cm²). Ge _x Si_1−x /Si epitaxial films with various Ge mole fractions were grown, where the Ge contentx is linearly dependent on the GeH₄ partial pressure in the gas phase for at leastx = 0 − 0.3. The incorporation rate of Ge from the gas phase was observed to be slightly higher than that of Si (1.3:1).     

Advances in remote plasma-enhanced chemical vapor deposition for low temperature In situ hydrogen plasma clean and Si and Si1-xGex epitaxy

Remote plasma-enhanced chemical vapor deposition (RPCVD) is a low temperature growth technique which has been successfully employed inin situ remote hydrogen plasma clean of Si(100) surfaces, silicon homoepitaxy and Si_{1- x}Ge_x heteroepitaxy in the temperature range of 150–450° C. The epitaxial process employs anex situ wet chemical clean, anin situ remote hydrogen plasma clean, followed by a remote argon plasma dissociation of silane and germane to generate the precursors for epitaxial growth. Boron doping concentrations as high as 10²¹ cm^?3 have been achieved in the low temperature epitaxial films by introducing B₂H₆/He during the growth. The growth rate of epitaxial Si can be varied from 0.4Å/min to 50Å/min by controlling therf power. The wide range of controllable growth rates makes RPCVD an excellent tool for applications ranging from superlattice structures to more conventional Si epitaxy. Auger electron spectroscopy analysis has been employed to confirm the efficacy of this remote hydrogen plasma clean in terms of removing surface contaminants. Reflection high energy electron diffraction and transmission electron microscopy have been utilized to investigate the surface structure in terms of crystallinity and defect generation. Epitaxial Si and Si_1-xGe_x films have been grown by RPCVD with defect densities below the detection limits of TEM (~10⁵ cm^-2 or less). The RPCVD process also exploits the hydrogen passivation effect at temperatures below 500° C to minimize the adsorption of C and 0 during growth. Epitaxial Si and Si_1-xGe_x films with low oxygen content (~3 × 10₁₈ cm^-3) have been achieved by RPCVD. Silicon and Si/Si_1-xGe_x mesa diodes with boron concentrations ranging from 10¹⁷ to 10¹⁹ cm^-3 in the epitaxial films grown by RPCVD show reasonably good current-voltage characteristics with ideality factors of 1.2-1.3. A Si/Si_1-xGe_x superlattice structure with sharp Ge transitions has been demonstrated by exploiting the low temperature capability of RPCVD.In situ plasma diagnostics using single and double Langmuir probes has been performed to reveal the nature of the RPCVD process.     

Characterization of reduced pressure chemical vapor deposited Si0.8Ge0.2/Si multi-layers

We have investigated the Si_0.8Ge_0.2/Si multi-layer grown directly onto the Si (001) substrates using reduced pressure chemical vapor deposition. The thicknesses of the Si_0.8Ge_0.2/Si multi-layer were determined using transmission electron microscopy. From the results of energy-dispersive X-ray spectroscopy and X-ray diffraction analyses on the Si_0.8Ge_0.2/Si multi-layer, Ge composition in the Si_1?xGe_x layers was determined as ～20% and the value of residual strain ε of the Si_0.8Ge_0.2 layer is calculated to be 0.012. Three peaks are observed in Raman spectrum, which are located at approximately 514, 404, and 303 cm^?1, corresponding to the vibration of Si–Si, Si–Ge, and Ge–Ge phonons, respectively. The photoluminescence spectrum originates from the radiative recombinations both from the Si substrate and the Si_0.8Ge_0.2/Si multi-layer. For the Si_0.8Ge_0.2/Si multi-layer, the transition peaks related to the quantum well region observed in the photocurrent spectrum were preliminarily assigned to e–hh and e–lh fundamental excitonic transitions.     

High-resolution transmission electron microscopy of silicide formation and morphology development of Ni/Si and Ni/Si<Subscript>1−x</Subscript>Ge<Subscript>x</Subscript>

Nickel-silicide phase formation in the Ni/Si and Ni/Si_1−xGe_x (x=0.20) systems and its correlation with variations in sheet resistance have been studied using high-resolution transmission electron microscopy (HRTEM) and related techniques. Following a 500°C anneal, uniform and low-resistivity NiSi and NiSi_1−xGe_x (x<0.20) crystalline films were formed in the respective systems. Annealed at 900°C, NiSi₂, in the form of pyramidal or trapezoidal islands, is found to replace the NiSi in the Ni/Si system. After a 700°C anneal, threading dislocations were observed for the first time in the Ni/Si_1−xGe_x system to serve as heterogeneous nucleation sites for rapid lateral NiSi_1−xGe_x growth.     

Si/Si1−x Gex epitaxial layers and superlattices. Growth and structural characteristics

Si, Ge, and Si_1−x Ge_x epitaxial layers and Si/Si_1−x Ge_x superlattices have been obtained on (100) and (111) silicon substrates by molecular-beam epitaxy. The growth processes and the structural characteristics and chemical composition of the structures were studied by x-ray diffraction and Auger spectroscopy. It is shown that under the experimental conditions for obtaining Si/Si_1−x Ge_x superlattices structurally perfect, strained superlattices with satellites up to ±5 orders can be obtained. Fiz. Tekh. Poluprovodn. 31, 922–925 (August 1997)     

Solid- and gas-source “hybrid” Si molecular beam epitaxy for a Si1−xGex/Si single quantum well electroluminescent device

A p-i-n diode for a Si_1−xGe_x/Si single quantum well (SQW) electroluminescent (EL) device was successfully fabricated by solid-source (SS) and gas-source (GS) “hybrid” Si molecular beam epitaxy (MBE). First, the undoped SQW layer was grown on a p-type Si(100) substrate by GSMBE using disilane (Si₂H₆) and germane (GeH₄). Then the n-type Si contact layer was regrown by SSMBE after transferring the sample through the air. A (2 × 1) reconstruction was observed on a GSMBE-prepared Si surface even after the sample was exposed to air for 15 h. The excellent quality of the EL p-i-n device was shown by the sharpest emission lines, ≈5.5 meV, ever reported in the EL spectra of an SiGe system. Linear polarization along the SQW plane was also observed for no-phonon replica of EL.     

Study of threading dislocations in the plan-view sample of SiGe/Si(001) superlattices by transmission electron microscopy

Interfacial defects due to a mismatch of 1.378% between substrate and epilayer were examined in a Si_0.67Ge_0.33/Si(001) superlattice by transmission electron microscopy (TEM). Plan-view specimens from the superlattice were prepared to investigate the defects in the structure. It was observed that 60°C-type misfit dislocations associate with point contrast on and at their ends. This point contrast was found to represent threading dislocations by using tilt experiments in the microscope. Consequently, stereo electron microscopy was used to examine the threading dislocations. It was discovered that the threading dislocations are not on the {111} slip planes but can be almost parallel to the [001] zone axis.     

Damage and strain in pseudomorphic vs relaxed GexSi1−x layers on Si(100) generated by Si ion irradiation

We compare both the strain and damage that 100 keV Si irradiation at room temperature introduces in pseudomorphic and relaxed Ge_xSi_1−x films grown on Si(100) substrates. The ion range is such that the Si/Ge_xSi_1−x interface is not significantly damaged. The amount of damage produced in pseudomorphic and relaxed Ge_xSi_1−x layers of similar x for irradiation doses up to 2.5 × 10¹⁴ Si/cm² is the same, which proves that a pre-existing uniform strain does not noticeably affect the irradiation-induced damage. However, the irradiation-induced strain does depend on the pre-existing strain of the samples. Possible interpretations are discussed. On leave from Inst. voor Kern en Stralingsfysika, Catholic University of Leuven, Belgium.     

Thin film solar cells incorporating microcrystalline Si1–xGex as efficient infrared absorber: an application to double junction tandem solar cells

We have fabricated efficient (∼7–8%) hydrogenated microcrystalline Si_1–xGe_x (µc‐Si_1–xGe_x:H, x ∼ 0.1–0.17) single junction p‐i‐n solar cells with markedly higher short‐circuit current densities than for µc‐Si:H (x = 0) solar cells due to enhanced infrared absorption. By replacing the conventional µc‐Si:H with the µc‐Si_1–xGe_x:H as infrared absorber in double junction tandem solar cells, the bottom cell thickness can be reduced by more than half while preserving the current matching with hydrogenated amorphous silicon (a‐Si:H) top cell. An initial efficiency of 11.2% is obtained for a‐Si:H/µc‐Si₀.₉Ge₀.₁:H solar cell with bottom cell thickness less than 1 µm. Copyright © 2009 John Wiley & Sons, Ltd.     

Origination of misfit dislocations at the surface during the growth of GeSi/Si(001) films by low-temperature (300–400°C) molecular-beam epitaxy

The method of the molecular-beam epitaxy, at comparatively low temperatures (300–400°C), was used to grow Ge_xSi_{1 ? x} /Si(001) films with a constant composition (x = 0.19–0.32) across a film and as well as two-layer heterostructures with the Ge content at the upper layer no lower than 0.41. Using transmission electron microscopy, it is shown that the main cause of an increase in the density of threading dislocations with increasing Ge fraction in the plastically relaxed films is the origination of the dislocation half-loops at the film surface; in turn, these dislocation half-loops are generated owing to the formation of a three-dimensional profile at the surface of the growing or annealed film.     

Growth and characterization of superconducting V3Si on Si and Al2O3 by molecular beam epitaxial techniques

A study of the growth parameters governing the nucleation of metastable superconducting A15 V₃Si on Si and A1₂O₃ is presented. Nominally, 500Å films of V_1-xSi_x were produced through codeposition of V and Si onto heated (111) Si and (1102) A1₂O₃ substrates. Samples were prepared in a custom-built ultrahigh vacuum (UHV) chamber containing dual e-beam evaporation sources and a high temperature substrate heater. V and Si fluxes were adjusted to result in the desired average film composition. V_0.75Si_0.25 films prepared at temperatures in excess of 550° C on Si show significant reaction with the substrate and are nonsuperconducting while similar films grown on A1₂O₃ exhibit superconducting transition temperatures(@#@ T_c @#@) approaching bulk values for V₃Si (16.6-17.1 K). Codeposition at temperatures between 350 and 550° C results in superconducting films on Si substrates while growth at lower temperatures results in nonsuperconducting films. Lowering the growth temperature to 400° C has been shown throughex situ transmission electron microscopy (TEM) and Auger compositional profiling to minimize the reaction with the Si substrate while still activating the surface migration processes needed to nucleate A15 V₃Si. Variation of film composition aboutx = 0.25 is shown to result in nonsuperconducting films for highx and superconducting films with T_c approaching the bulk V value (5.4 K) for lowx. Finally, lowering the V_0.75Si_0.25 deposition rate is shown to raise T_c.     

Low temperature heteroepitaxial growth of Si1−xGexon-Si by photo-enhanced ultra high vacuum chemical vapor deposition using Si2H6 and Ge2H6

Strained-layer Si_1×Ge_x-on-Si heteroepitaxy has been achieved by photolytic decomposition of disilane (Si₂H₆) and digermane (G e₂H₆) in an ultra high vacuum (UHV) chamber at substrate temperatures as low as 275°C. An ArF excimer laser (193 nm) shining parallel to the Si substrate was used as the UV light source to avoid surface damage and substrate heating. The partial pressures of the source gases in the reactor were chosen to vary the Ge mole fraction x from 0.06 to 0.5 in the alloy. The Si₂H₆ partial pressure was kept at 10 mTorr and the Ge₂H₆ partial pressure was varied from 0.13 to 2 mTorr with the laser intensity fixed at 2.75 × 10¹⁵ photons/cm²·pulse. To fit the Si_1−xGe_x growth rate and Ge mole fraction data, the absorption cross section of Ge₂H₆ at 193 nm was set to 1 × 10⁻¹⁶ cm², which is 30 times larger than that of Si₂H₆ (3.4 × 10⁻¹⁸ cm2). For Si_1−xGe_x alloy growth, the deposition rate of Si increases with Ge mole fraction, resulting in increased Si_1−xGe_x alloy growth rates for higher Ge content. The increase of the Si growth rate was attributed to the enhanced adsorption rate of Si₂H₆ pyrolytically in the presence of Ge, rather than due to photolytic decomposition reaction. The Ge mole fraction in Si_1−xGe_x alloys can be predicted by a new model for Si and Ge pyrolytic and photolytic growth. The model describes the increased growth rate of Si_1−xGe_x alloys due to a Ge₂H₆ catalytic effect during photo-enhanced chemical vapor deposition.