共查询到18条相似文献,搜索用时 125 毫秒
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AlGaN/GaN HFET的2DEG和电流崩塌研究(Ⅰ) 总被引:1,自引:0,他引:1
从不同的视角回顾和研究了A1GaN/GaN HFET的二维电子气(2DEG)和电流崩塌问题.阐述了非掺杂的AIGaN/GaN异质结界面存在2DEG的原动力是极化效应,电子来源是AlGaN上的施主表面态.2DEG浓度与AlGaN/GaN界面导带不连续性、AlGaN层厚和Al组分有密切关系.揭示了AlGaN/GaN HFET的2DEG电荷涨落受控于表面、界面和缓冲层中的各种缺陷及外加应力,表面空穴陷阱形成的虚栅对输入信号有旁路和延迟作用,它们导致高频及微波状态下的电流崩塌.指出由于构成电流崩塌因素的复杂性,各种不同的抑制电流崩塌方法都存在不足,因此实现该器件大功率密度和高可靠性还有很长的路要走. 相似文献
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AlGaN/GaN HEMT结构材料主要用于研制微电子器件,对其发光性质的研究相对较少。通过对AlGaN/GaN HEMT结构材料的光致发光谱(PL)研究,观测到了AlGaN势垒层中Al组分为40%的AlGaN/AlN/GaN结构中二维电子气(2DEG)光致发光及其能级分裂现象。在4.5 K低温下,其2DEG发光峰在GaN带边峰能量以下30和40 meV处分裂成两个峰位,直至温度持续升高至40 K后消失。根据GaN价带顶部在单轴晶格场和自旋-轨道耦合共同作用下的能级分裂理论,因自旋-轨道耦合引起的2DEG发光峰两个分裂能级差约为10 meV,与实验测得的结果一致,因此实验观测到的2DEG发光峰的分裂现象是由于氮化镓价带能级的自旋-轨道耦合而形成的。 相似文献
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对不同掺杂浓度AlGaN/GaN HEMTs施加直流偏置应力,研究掺杂AlGaN/GaN HEMTs电流崩塌效应.实验表明,掺杂AlGaN势垒层对器件电流崩塌效应有明显的抑制作用,随着掺杂浓度增加,掺杂对电流崩塌效应的抑制作用越显著.这是因为对于掺杂AlGaN/GaN HEMT,表面态俘获电子将耗尽掺杂AlGaN层,从而能对2DEG起屏蔽作用.AlGaN体内杂质电离后留下正电荷也能进一步屏蔽表面态对沟道2DEG的影响. 相似文献
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肖特基金属影响AlGaN/GaN异质结材料的电学特性。在AlGaN/GaN异质结材料上分别制备得到铱/金(Ir/Au)、镍/金(Ni/Au)和铼/金(Re/Au)三种不同肖特基接触的二极管器件,基于电流电压(I-V)和电容电压(C-V)测试结果,计算得到了三者的沟道二维电子气(2DEG)密度。并通过薛定谔和泊松方程自洽求解计算得到了三者的肖特基接触势垒高度、导带底能带图和沟道2DEG分布情况。研究发现金属功函数越小,势垒高度反而越高,沟道2DEG密度越小,GaN侧的沟道三角形势阱变得越浅。这主要是由于金属功函数越小,电子能量越高,与AlGaN势垒层表面态的电子耦合作用越强所致。 相似文献
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从正-逆压电极化效应对GaN材料的影响出发,通过自洽求解一维Poisson-Schr(o)dinger方程,研究了逆压电极化效应对AlGaN/GaN异质结中2DEG浓度的影响.计算结果显示,逆压电极化明显影响2DEG性质,当Al组分x=0.3,AlGaN层厚度为20 nm时,不考虑逆压电极化,2DEG浓度为1.53×1013 cm-2;当等效外加电压分别为10和15 V时,2DEG浓度降低至1.04×1013cm-2和0.789×1013cm-2,可见当等效外电压由0~15 V变化时,2DEG浓度下降了48.4%. 相似文献
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报道了利用南京电子器件研究所生长的蓝宝石衬底AlGaN/GaN异质结材料制作的HEMT,器件功率输出密度达4W/mm。通过材料结构及生长条件的优化,利用MOCVD技术获得了二维电子气(2DEG)面密度为0.97×1013cm-2、迁移率为1000cm2/Vs的AlGaN/GaN异质结构材料,用此材料完成了栅长1μm、栅宽200μm AlGaN/GaN HEMT器件的研制。小信号测试表明器件的fT为17GHz、最高振荡频率fmax为40GHz;负载牵引测试得到2GHz下器件的饱和输出功率密度为4.04W/mm。 相似文献
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Investigation of Self-Heating Effects in Submicrometer GaN/AlGaN HEMTs Using an Electrothermal Monte Carlo Method 总被引:1,自引:0,他引:1
Toufik Sadi Robert W. Kelsall Neil J. Pilgrim 《Electron Devices, IEEE Transactions on》2006,53(12):2892-2900
An electrothermal Monte Carlo (MC) method is applied in this paper to investigate electron transport in submicrometer wurtzite GaN/AlGaN high-electron mobility transistors (HEMTs) grown on various substrate materials including SiC, Si, GaN, and sapphire. The simulation method is an iterative technique that alternately runs an MC electronic simulation and solves the heat diffusion equation using an analytical thermal resistance matrix method. Results demonstrate how the extent of the thermal droop in the Id-Vds characteristics and the device peak temperature depend upon both the biasing conditions and the substrate material type. Polarization effects are considered in the simulations, as they greatly influence electron transport in GaN/AlGaN HEMTs by creating a highly concentrated two-dimensional electron gas (2DEG) at the GaN/AlGaN interface. It is shown that a higher 2DEG density provides the devices with a better current handling capability but also increases the importance of the thermal effects 相似文献
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Tuning Electrical and Thermal Transport in AlGaN/GaN Heterostructures via Buffer Layer Engineering 下载免费PDF全文
Ananth Saran Yalamarthy Hongyun So Miguel Muñoz Rojo Ateeq J. Suria Xiaoqing Xu Eric Pop Debbie G. Senesky 《Advanced functional materials》2018,28(22)
Progress in wide bandgap, III–V material systems based on gallium nitride (GaN) has enabled the realization of high‐power and high‐frequency electronics. Since the highly conductive, 2D electron gas (2DEG) at the aluminum gallium nitride (AlGaN)/GaN interface is based on built‐in polarization fields and is confined to nanoscale thicknesses, its charge carriers exhibit much higher mobilities compared to their doped counterparts. This study shows that such 2DEGs also offer the unique ability to manipulate electrical transport separately from thermal transport, through the examination of fully suspended AlGaN/GaN diaphragms of varied GaN buffer layer thickness. Notably, ≈100 nm thin GaN layers can considerably impede heat flow without electrical transport degradation. These achieve 4× improvement in the thermoelectric figure of merit (zT) over externally doped GaN, with state‐of‐the‐art power factors of 4–7 mW m‐1 K‐2. The remarkable tuning behavior and thermoelectric enhancement, elucidated here for the first time in a polarization‐based heterostructure, are achieved because electrons are at the heterostructured interface, while phonons are within the material system. These results highlight the potential for using 2DEGs in III–V materials for on‐chip thermal sensing and energy harvesting. 相似文献
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Characteristics study of 2DEG transport properties of AlGaN/GaN and AlGaAs/GaAs-based HEMT 总被引:3,自引:0,他引:3
Growth of wide bandgap material over narrow bandgap material, results into a two dimensional electron gas (2DEG) at the heterointerface
due to the conduction band discontinuity. In this paper the 2DEG transport properties of AlGaN/GaN-based high electron mobility
transistor (HEMT) is discussed and its effect on various characteristics such as 2DEG density, C-V characteristics and Sheet resistances for different mole fractions are presented. The obtained results are also compared
with AlGaAs/GaAs-based HEMT for the same structural parameter as like AlGaN/GaN-based HEMT. The calculated results of electron
sheet concentration as a function of the Al mole fraction are in excellent agreement with some experimental data available
in the literature. 相似文献
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The influence of annealed ohmic contact metals on the electron mobility of a two dimensional electron gas (2DEG) is investigated on ungated AlGaN/GaN heterostructures and AlGaN/GaN heterostructure field effect transistors (AlGaN/GaN HFETs). Current-voltage (I-V) characteristics for ungated AlGaN/GaN heterostructures and capacitance-voltage (C-V) characteristics for AlGaN/GaN HFETs are obtained, and the electron mobility for the ungated AlGaN/GaN heterostructure is calculated. It is found that the electron mobility of the 2DEG for the ungated AlGaN/GaN heterostructure is decreased by more than 50% compared with the electron mobility of Hall measurements. We propose that defects are introduced into the AlGaN barrier layer and the strain of the AlGaN barrier layer is changed during the annealing process of the source and drain, causing the decrease in the electron mobility. 相似文献
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A new surface-potential-based model for AlGaN/AlN/GaN high electron mobility transistor(HEMT) is proposed in this paper. Since the high polarization effects caused by AlN interlayer favorably influence the two dimensional electron gas(2DEG) and scattering mechanisms, we first add spontaneous and piezoelectric charge terms to the source equation of surface-potential, and a mobility model for AlGaN/AlN/GaN HEMT is rewritten. Compared with TCAD simulations, the DC characteristics of AlGaN/AlN/GaN HEMT are faithfully reproduced by the new model. 相似文献
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采用高温Hall测量仪对一个全应变和一个部分应变弛豫的AlGaN/GaN异质结构中2DEG的高温输运特性进行了研究,温度变化范围从室温到680K.研究结果表明:在高温段2DEG的迁移率主要受LO声子散射限制; 在室温,异质界面处的非均匀压电极化场对2DEG迁移率的散射也是一个主要的散射机制.同时,计算结果显示,随着温度升高,更多的电子跃迁到更高的子带,在更高的子带,其波函数逐渐扩展到AlGaN层内部以及GaN体内更深的位置,导致LO声子散射的屏蔽效应减弱且来自AlGaN层内的合金无序散射增强. 相似文献
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首先论述了Al GaN/GaN高电子迁移率晶体管(HEMT)在微波大功率领域的应用优势和潜力;其次,介绍并分析了影响Al GaN/GaN HEMT性能的主要参数,分析表明要提高Al-GaN/GaN HEMT的频率和功率性能,需改善寄生电阻、电容、栅长和击穿电压等参数。然后,着重从材料结构和器件工艺的角度阐述了近年来Al GaN/GaN HEMT的研究进展,详细归纳了目前主要的材料生长和器件制作工艺,可以看出基本的工艺思路是尽量提高材料二维电子气的浓度和材料对二维电子气的限制能力的同时减小器件的寄生电容和电阻,增强栅极对沟道的控制能力。另外,根据具体情况调节栅长及沟道电场。最后,简要探讨了Al GaN/GaN HEMT还存在的问题以及面临的挑战。 相似文献