Si(111)衬底上生长的GaN的形貌与AlN缓冲层生长温度的关系

利用LP-MOCVD技术在Si(111)衬底上,用不同温度生长AlN缓冲层,再在缓冲层上外延GaN薄膜.采用高分辨率双晶X射线衍射(DCXRD)技术和扫描电子显微镜(SEM)分析这些样品,比较缓冲层生长温度对缓冲层和外延层的影响,并提出利用动力学模型解释这种温度的影响.进一步解释了GaN外延层表面形貌中"凹坑"的形成及"凹坑"与缓冲层生长温度的关系.结果表明,温度的高低通过影响缓冲层初始成核密度和成核尺寸来影响外延层表面形貌.     

Si(111)衬底上生长的GaN的形貌与AlN缓冲层生长温度的关系

利用LP-MOCVD技术在Si（111）衬底上,用不同温度生长AlN缓冲层,再在缓冲层上外延GaN薄膜．采用高分辨率双晶X射线衍射（DCXRD）技术和扫描电子显微镜（SEM）分析这些样品，比较缓冲层生长温度对缓冲层和外延层的影响，并提出利用动力学模型解释这种温度的影响．进一步解释了GaN外延层表面形貌中“凹坑”的形成及“凹坑”与缓冲层生长温度的关系．结果表明，温度的高低通过影响缓冲层初始成核密度和成核尺寸来影响外延层表面形貌．     

Si衬底上侧向外延生长GaN的研究

采用条形Al掩模在Si(111)衬底上进行了GaN薄膜侧向外延的研究.结果显示,当掩模条垂直于Si衬底[11-2]方向,也即GaN[10-10]方向时,GaN无法通过侧向生长合并得到表面平整的薄膜;当掩模条平行于Si衬底[11-2]方向,也即GaN[10-10]方向时,GaN侧向外延速度较快,有利于合并得到平整的薄膜.同时,研究表明,升高温度和降低生长气压都有利于侧向生长.通过优化生长工艺,在条形Al掩模Si(111)衬底上得到了连续完整的GaN薄膜.原子力显微镜测试显示,窗口区域生长的GaN薄膜位错密度约为1×109/cm2,而侧向生长的GaN薄膜位错密度降低到了5×107/cm2以下.     

AlN成核层厚度对Si上外延GaN的影响

采用低温AlN成核层,在Si(111)衬底上,用金属有机化学气相沉积(MOCVD)法生长了GaN薄膜。采用高分辨X射线衍射(XRD)、椭圆偏振光谱仪和原子力显微镜(AFM)研究了AlN成核层的厚度对GaN外延层的影响。对AlN的测试表明,AlN的表面粗糙度(RMS)随着厚度增加而变大。对GaN的测试表明,所有GaN样品在垂直方向处于压应变状态,并且随AlN厚度增加而略有减弱。GaN的(0002)_ω扫描的峰值半宽(FWHM)随着AlN成核层厚度增加而略有升高,GaN(10-12)_ω扫描的FWHM随着厚度增加而有所下降。(10-12)_ω扫描的FWHM与GaN的刃型穿透位错密度相关,A1N成核层的厚度较大时会降低刃型穿透位错密度,并减弱c轴方向的压应变状态。     

插入δAl/AlN缓冲层在Si(111)上生长GaN

采用MOCVD(metal organic chemical vapor deposition)生长方法,对比在AlN层上加入δAl/AlN缓冲层和不加入δAl/AlN缓冲层两种生长结构,在Si(111)衬底上生长GaN.实验结果表明,在加入δAl/AlN缓冲层后,GaN外延层的裂纹密度得到了有效的降低,晶体质量也得到了明显的提高.通过MOCVD生长方法,利用光学显微镜、XRD和Raman等分析测试手段,研究了δAl/AlN缓冲层对GaN外延层的影响,获得了裂纹密度小、晶体质量高的GaN材料.     

插入δAl/AlN缓冲层在Si(111)上生长GaN

采用MOCVD(metal organic chemical vapor deposition)生长方法,对比在AlN层上加入δAl/AlN缓冲层和不加入δAl/AlN缓冲层两种生长结构,在Si(111)衬底上生长GaN.实验结果表明,在加入δAl/AlN缓冲层后,GaN外延层的裂纹密度得到了有效的降低,晶体质量也得到了明显的提高.通过MOCVD生长方法,利用光学显微镜、XRD和Raman等分析测试手段,研究了δAl/AlN缓冲层对GaN外延层的影响,获得了裂纹密度小、晶体质量高的GaN材料.     

SiNx插入层对Si衬底上生长GaN薄膜晶体质量和表面形貌的影响

在Si(111)衬底上采用金属有机化合物化学气相沉积(MOCVD)技术外延生长GaN薄膜,对外延生长所得GaN薄膜的晶体结构和表面形貌进行表征,并研究SiNx插入层对GaN薄膜的晶体质量和表面形貌的影响.结果表明,在Si衬底上生长GaN薄膜过程中引入SiNx插入层可使GaN薄膜的(10-12)面的X-射线回摆曲线的半峰宽(FWHM)值从974.01减小到602.01arcsec;表面凹坑等缺陷减少、表面平整度提高.可见,SiNx插入层对在Si衬底上外延生长GaN薄膜的晶体质量和表面形貌有着重要的影响.     

前处理蓝宝石衬底上生长高质量GaN薄膜

采用化学方法腐蚀部分c面蓝宝石衬底,在腐蚀区域形成一定的图案,利用LP-MOCVD在经过表面处理的蓝宝石衬底上外延生长GaN薄膜.采用高分辨率双晶X射线衍射(DCXRD)、透射光谱分析GaN薄膜的晶体质量和光学质量.分析结果表明,GaN薄膜透射谱反映出的GaN质量与X射线双晶衍射测量的结果一致,即透射率越大,半高宽越小,结晶质量越好;对蓝宝石衬底进行前处理可以大大改善GaN薄膜的晶体质量和光学质量,其(0002)面及(1012)面XRD半高宽(FWHM)分别降低到208.80"及320.76"     

前处理蓝宝石衬底上生长高质量GaN薄膜

采用化学方法腐蚀部分c面蓝宝石衬底,在腐蚀区域形成一定的图案,利用LP-MOCVD在经过表面处理的蓝宝石衬底上外延生长GaN薄膜.采用高分辨率双晶X射线衍射(DCXRD)、透射光谱分析GaN薄膜的晶体质量和光学质量.分析结果表明,GaN薄膜透射谱反映出的GaN质量与X射线双晶衍射测量的结果一致,即透射率越大,半高宽越小,结晶质量越好;对蓝宝石衬底进行前处理可以大大改善GaN薄膜的晶体质量和光学质量,其(0002)面及(1012)面XRD半高宽(FWHM)分别降低到208.80"及320.76"     

预处理蓝宝石衬底上生长高质量 GaN 显示薄膜

采用化学方法腐蚀部分 c-面蓝宝石衬底,在腐蚀区域形成一定的图案,利用 LP-MOCVD 在此经过表面处理的蓝宝石衬底上外延生长 GaN 薄膜.采用高分辨率双晶X射线衍射(DCXRD)、光致发光光谱(PL)、透射光谱分析GaN薄膜的晶体质量和光学质量.分析结果表明,CaN 薄膜透射谱反映出的 CaN 质量与 X射线双晶衍射测量的结果一致,即透射率越大,半高宽越小,结晶质量越好;对蓝宝石衬底进行前处理可以大大改善GaN薄膜的晶体质量和光学质量,其(0002)面及(1012)面XRD半高宽(FWHM)分别降低到 208.80arcsec 及 320.76arcsec,而且其光致发光谱中的黄光带几乎可以忽略.     

MOCVD法横向外延过生长GaN薄膜

介绍了金属有机化学气相沉积(Metal-Organic Chemical Vapor Deposition,MOCVD)法横向外延过生长GaN薄膜的原理,阐述了该技术形成选择生长和减少GaN薄膜缺陷密度的机理。综述了该技术的发展历程以及最新进展。新型的横向外延过生长技术大大简化了生长工艺以及降低了晶向倾斜。     

The growth and characterization of GaN on sapphire and silicon

MOCVD (metalorganic chemical vapor deposition) of GaN on both silicon and sapphire substrates was studied over the temperature range of 370 to 1050° C. The crystallinity and surface morphology of the films varied with the deposition temperatures. By first depositing an AlN buffer layer, the crystallinity of GaN was improved for low temperature depositions, but little improvement in the surface morphology was observed. On sapphire (0001) substrates, epitaxial layers were produced at a deposition temperature as low as 500° C. With silicon substrates, polycrystalline films were produced which were randomly oriented on the (111) plane and highly oriented on the (100) plane. The surfaces of the films were smooth and specular at low deposition temperatures, but degraded at higher temperatures. The energy band gaps of these films are in the vicinity of 3.4 eV, close to where they are expected. Elemental analysis by Auger electron spectroscopy (AES) showed the films to be stoichiometric with low residual impurity concentrations.     

Properties of GaN epitaxial layers grown at high growth rates by metalorganic chemical vapor deposition

GaN epitaxial layers were grown at high growth rates by increasing the input trimethylgallium (TMG) flow rate while keeping the NH₃ flow rate constant in metalorganic chemical vapor deposition. The electrical and optical properties of the grown layers have been investigated. With the increasing TMG flow rate, the electron concentration tends to decrease gradually and the Hall mobility decreases significantly. Considering the temperature dependence of the Hall mobility and the correlation between the Hall mobility and the electron concentration, it has been indicated that the more acceptors are incorporated and consequently the compensation ratio becomes higher with increasing the TMG flow rate. Photoluminescence measurements have revealed that the intensity ratio of the bound exciton emission to the 2.2 eV band emission, which is assumed to correlate to carbon or Ga vacancies, was decreased with increasing the TMG flow rate. It might be reasonable to take a lot of acceptor incorporation to explain the degradation of the electrical and optical properties in the samples grown at high growth rates by increasing the TMG flow rate.     

Infrared reflectance analysis of GaN epitaxial layers grown on sapphire and silicon substrates

Infrared reflectance (IR) of GaN grown on sapphire and silicon substrates has been studied both theoretically and experimentally. The theoretical calculation of the IR spectra is based on the transfer matrix method. The IR spectral characteristics influenced by several factors, such as film thickness, incident angle, free carriers, are systematically examined. Combined with experimental results, surface scattering and interface layer effects are also studied. For GaN epilayers grown on sapphire, carrier concentrations and mobility are determined by fitting to the IR reststrahlen band and compared with the Hall measurement. The interface effect is demonstrated to cause a damping behaviour of the interference fringes away from the reststrahlen band. For GaN grown on Si, the IR spectra predicted the large surface roughness of the epilayers. A variation of IR reststrahlen band is correlated to the microstructures of the films, i.e. their polycrystalline nature of the GaN films grown on Si. A three-component effective medium model is proposed to calculate the IR spectra for polycrystalline GaN, and a qualitative correlation between the IR spectra and structure of the film is established. All results show that IR, as a non-destructive method, is efficient for characterising GaN epilayers in semiconductor processing.     

The role of the low temperature buffer layer and layer thickness in the optimization of OMVPE growth of GaN on sapphire

In agreement with previous work,¹² a thin, low temperature GaN buffer layer, that is used to initiate OMVPE growth of GaN growth on sapphire, is shown to play a critical role in determining the surface morphology of the main GaN epilayer. X-ray analysis shows that the mosaicity of the main GaN epilayer continues to improve even after several μm of epitaxy. This continuing improvement in crystal perfection correlates with an improvement in Hall mobility for thicker samples. So far, we have obtained a maximum mobility of 600 cm²/V-s in a 6 μm GaN epilayer. Atomic force microscopy (AFM) analysis of the buffer layer and x-ray analysis of the main epilayer lead us to conclude that the both of these effects reflect the degree of coherence in the main GaN epitaxial layer. These results are consistent with the growth model presented by Hiramatsu et al., however, our AFM data indicates that for GaN buffer layers partial coherence can be achieved during the low temperature growth stage.     

铁掺杂对氮化镓外延材料表面形貌的影响与改善

铁掺杂是获得高阻氮化镓外延材料的有效方法,但是在某些情况下,铁掺杂会导致材料的表面形貌恶化进而影响高电子迁移率晶体管中二维电子气的电学特性。本文主要研究铁掺杂对氮化镓外延材料表面形貌的影响。相关实验结果表面通过提高氮化镓材料的生长速率可以有效改善其表面形貌,而且电阻率也相应提高,获得了铁掺杂浓度为9×1019cm-3且表面形貌良好的氮化镓外延片,电阻率可以达到1×109Ω.cm。     

High quality GaN-based LED epitaxial layers grown in a homemade MOCVD system

A homemade 7×2 inch MOCVD system is presented.With this system,high quality GaN epitaxial layers,InGaN/GaN multi-quantum wells and blue LED structural epitaxial layers have been successfully grown. The non-uniformity of undoped GaN epitaxial layers is as low as 2.86%.Using the LED structural epitaxial layers, blue LED chips with area of 350×350μm~2 were fabricated.Under 20 mA injection current,the optical output power of the blue LED is 8.62 mW.     

使用自制MOCVD系统外延高质量GaN基LED材料

A homemade 7×2 inch MOCVD system is presented.With this system,high quality GaN epitaxial layers,InGaN/GaN multi-quantum wells and blue LED structural epitaxial layers have been successfully grown. The non-uniformity of undoped GaN epitaxial layers is as low as 2.86%.Using the LED structural epitaxial layers, blue LED chips with area of 350×350μm~2 were fabricated.Under 20 mA injection current,the optical output power of the blue LED is 8.62 mW.     

A new buffer layer for MOCVD growth of GaN on sapphire

High quality GaN films have been grown on sapphire substrates (C face and A face) by atmospheric pressure metalorganic chemical vapor deposition (MOCVD) using a new buffer layer. With our reactor configuration and growth parameters, a GaN film grown on a single GaN buffer layer appears opaque with high density of hexagonal pits. Using a single A1N buffer layer results in extremely nonuniform morphology with mirror-like areas near the edge of the substrates and opaque areas in the center. The double buffer layer we report here, with GaN as the first layer and A1N as the second, each with an optimized thickness, leads to mirror-like films across the entire substrate. Scanning electron microscopy, photoluminescence, x-ray diffraction, and van der Pauw geometry Hall measurement data are presented to establish the quality of our films. The mechanism for this new buffer layer is also discussed.     

MOCVD growth of cubic GaN on 3C-SiC deposited on Si (100) substrates

The growth of cubic GaN on 3C-SiC/Si(100) by metal-organic chemical vapor deposition (MOCVD) under various growth temperatures, thicknesses of 3C-SiC, and V/III ratios was studied. The fractions of cubic and hexagonal phases in the films were estimated from the integrated x-ray diffraction intensities of the cubic (002) and hexagonal (1011) planes. A smooth SiC layer, a high growth temperature, and a moderate V/III ratio are three key factors for the nucleation of the cubic phase and its subsequent growth. Hexagonal GaN with its c-axis perpendicular to the substrate preferentially grows at the low temperature of 750°C. The inclusion of the cubic phase increases with increasing growth temperature. The optimum growth conditions for dominant cubic GaN formation were a growth temperature of 950°C, a 1.5 μm thick SiC layer, and a V/III ratio of 1500. With these growth conditions, a cubic GaN layer with the cubic component of 91% was obtained.