A compact LTCC-based Ku-band transmitter module

Presents design, implementation, and measurement of a three-dimensional (3-D)-deployed RF front-end system-on-package (SOP) in a standard multi-layer low temperature co-fired ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based transmitter module integrated with an embedded bandpass filter was built on LTCC 951AT tapes. The up-converter MMIC integrated with a voltage controlled oscillator (VCO) exhibits a measured up-conversion gain of 15 dB and an IIP3 of 15 dBm, while the power amplifier (PA) MMIC shows a measured gain of 31 dB and a 1-dB compression output power of 26 dBm at 14 GHz. Both MMICs were integrated on a compact LTCC module where an embedded front-end band pass filter (BPF) with a measured insertion loss of 3 dB at 14.25 GHz was integrated. The transmitter module is compact in size (400 /spl times/ 310 /spl times/ 35.2 mil/sup 3/), however it demonstrated an overall up-conversion gain of 41 dB, and available data rate of 32 Mbps with adjacent channel power ratio (ACPR) of 42 dB. These results suggest the feasibility of building highly SOP integrated RF front ends for microwave and millimeter wave applications.     

基于LTCC的Ka波段带通滤波器的设计

设计了一种基于低温共烧陶瓷技术带状线形式的Ka波段带通滤波器,该滤波器被埋入11层的基板中。提出一种类同轴结构来减小共面波导到带状线转换之间的阻抗不连续性。整个带状线滤波器采用了金属直通孔来实现接地和屏蔽功能。测试结果表明,滤波器中心频率为34.69GHz,带宽1.73GHz内最大插入损耗为-4.5dB,通带内回波损耗低于-13.45dB。该测试结果包含两个射频接头。整个滤波器尺寸为9.8mm×5mm×1.056mm。这种紧凑埋置式的结构和测试结果表明,该带状线滤波器适合于毫米波多芯片组件的应用。     

Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System

Toward the realization of ultra-fast wireless communications systems, the inherent broad bandwidth of the terahertz (THz) band is attracting attention, especially for short-range instant download applications. In this paper, we present our recent progress on InP-based THz MMICs and packaging techniques based on low-temperature co-fibered ceramic (LTCC) technology. The transmitter MMICs are based on 80-nm InP-based high electron mobility transistors (HEMTs). Using the transmitter packaged in an E-plane split-block waveguide and compact lens receiver packaged in LTCC multilayered substrates, we tested wireless data transmission up to 27 Gbps with the simple amplitude key shifting (ASK) modulation scheme. We also present several THz antenna-in-packaging solutions based on substrate integrated waveguide (SIW) technology. A vertical hollow (VH) SIW was applied to a compact medium-gain SIW antenna and low-loss interconnection integrated in LTCC multi-layer substrates. The size of the LTCC antennas with 15-dBi gain is less than 0.1 cm³. For feeding the antenna, we investigated an LTCC-integrated transition and polyimide transition to LTCC VH SIWs. These transitions exhibit around 1-dB estimated loss at 300 GHz and more than 35 GHz bandwidth with 10-dB return loss. The proposed package solutions make antennas and interconnections easy to integrate in a compact LTCC package with an MMIC chip for practical applications.     

C波段LTCC高频前端模块的研究与实现

针对现有雷达高频接收组件尺寸大、集成度不高的情况,采用低温共烧陶瓷(LTCC)多层基板、单片微波集成电路(MMIC)芯片和微组装技术,设计和实现了C波段LTCC高频前端模块。该模块采用二次混频方案,包含限幅器、放大器、滤波器、衰减器、混频器等;其中主要器件用MMIC芯片实现,滤波器埋置在LTCC多层基板中实现,极大减小了模块的尺寸,模块最终尺寸为64 mm×20 mm×1.1 mm,比现有的接收组件尺寸减小了50%。经测试,该LTCC高频前端模块的增益大于40 dB,带内平坦度小于2 dB,噪声系数小于5 dB,镜像抑制度优于51 dB。可将高频前端模块应用于雷达高频接收组件中,从而减小组件尺寸。     

Ku波段高增益8通道T/R组件设计与实现

利用低温共烧陶瓷(LTCC)高集成化设计优势,设计并实现了一款Ku波段高增益8通道T/R组件。该组件通过双向放大器的合理运用,有效提高了组件的收发增益,同时利用液态金属材料的特性,将硅铝壳体与铝合金散热齿进行有机结合,大大提高了组件在连续波发射工作模式下的热量传导能力,保证了组件小体积下工作的可靠性。最终设计实现的Ku波段高增益8通道T/R组件,体积仅84 mm×48 mm×6 mm,质量约60 g,发射功率增益大于45 dB,发射输出功率大于1 W,接收增益大于29 dB,接收噪声系数小于3.5 dB。该组件8个通道收发性能一致性好,性能稳定,具有良好的工程实用价值。     

三个传输零点的三阶LTCC Ka-band 窄带滤波器

本文介绍了一种基于LTCC（低温共烧陶瓷）技术的Ka 波段三阶窄带滤波器,中心频率35.78GHz,带宽0.8GHz（2.24%）,带内插损小于0.1dB（未考虑介质和金属损耗）。并且在输入输出端口、各枝节之间引入交调耦合分量,在带外形成三个传输零点,带外抑制EM 仿真结果为：>20dB@f>36.9GHz,>30dB@f<34.9GHz。此滤波器可用于毫米波收发 组件中,对镜频信号和杂波进行抑制。     

A 30 GHz MMIC receiver for satellite transponders

The development of 30-GHz-band monolithic microwave integrated circuits (MMICs) and multichip MMIC modules (low-noise amplifier and frequency converters) is reported. A 30-GHz-band full-MMIC receiver for satellite transponders was successfully constructed using the MMIC modules and the performance of the full-MMIC receiver is evaluated. Test results verify its successful performance as a satellite receiver system. The design and performance of the MMICs (a two-stage amplifier, an image rejection mixer, and a frequency multiplier), of multichip-type MMIC modules (a 30-GHz-band low-noise amplifier module with 30 dB gain and 8.2 dB noise figure, and an image rejection frequency converter with a 10 dB conversion loss and an 18 dB image rejection ratio) and of the full-MMIC receiver, which weighs 1/6 as much as a conventional hybrid integrated circuit are presented     

LTCC基开关驱动低噪放一体化模块设计

基于LTCC技术设计了一款双通道应用的开关、驱动和低噪放一体化模块,利用HFSS对无源器件电感进行仿真,将电感嵌入LTCC基板中,不仅提高了模块的集成度,同时也降低了成本。在1.8~2.1 GHz频段内,ANT-RX通道增益达到23.8 dB,输入驻波比小于1.49,输出驻波比小于1.33,通道隔离大于44 dB,噪声系数小于1.21 dB(含评估板单端损耗约为0.15 dB);ANT-TX通道插入损耗小于0.42 dB(含评估版损耗约0.3 dB),输入输出驻波比均小于1.1。     

Ka波段一体化收发信机设计

Ka波段一体化收发信机是无线通信系统中的重要电路,它对整个系统的噪声系数,灵敏度等关键指标起决定性作用。文中对Ka波段一体化收发信机的工作原理进行了阐述,同时给出了整机功能实现框图,分析了接收通道单元、本振单元、发射通道单元和电源控制单元共4个单元的设计方案,并给出了仿真结果与测试结果。试验结果表明,Ka波段一体化收发信机接收机噪声系数≤2.2 dB、增益≥60 dB、输入输出驻波、相位噪声杂散、镜像抑制等指标均满足技术要求。发射机1 dB压缩点功率≥30 dBm,增益≥50 dB,三阶交调,杂波抑制等均满足实用技术要求,并根据测试结果对Ka波段一体化收发信机的部分技术指标提出了进一步优化的方案。     

A compact 220 GHz heterodyne receiver module with planar Schottky diodes

This letter presents the development of a compact 220 GHz heterodyne receiver module for radars application in which a novel low pass wide stop band intermediate frequency (IF) filter is integrated. The planar Schottky anti-parallel mixing diode based subharmonic mixer (SHM) is used as the receiver’s first stage. The diode is flip-chip mounted on a 50 μm thick quartz substrate. The accurate modeling of the self and mutual inductance of the diode’s air-bridges are discussed. The measured conversion loss (CL) of the SHM has a minimum value of 6.2 dB at 210.5 GHz, and is lower than 8.4 dB in the frequency range 209.4–219.6 GHz with a 10 mW input power from a local oscillator (LO). The LO chain consists of a 110 GHz passive tripler, two Ka-band amplifiers and a Ka-band active tripler. The tested minimum double side band (DSB) noise temperature of the integrated 220 GHz heterodyne receiver is 725 K at 205.2 GHz and lower than 1550 K in the frequency range 199–226 GHz.