Chip-package codesign of a low-power 5-GHz RF front end

Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low-power and highly integrated transceiver solutions. The integration of the RF front end especially poses a great challenge in these applications, as traditional front-end implementations require a large number of external passive components. In this paper, we present the single-package integration of complete transceivers based on a thin-film multichip module (MCM) technology with integrated passives. The MCM substrate is a a common carrier onto which different ICs are mounted. passive components such as RF bandpass filters, inductors, capacitors, and resistors are directly integrated into the MCM substrate with the use of the multilayer structure of the MCM technology. The “system-on-a-package” approach is illustrated with a voltage-controlled oscillator for Digital European Cordless Telephone (DECT) applications and a 5-GHz WLAN front end. These examples indicate that this approach yields a compact low-power implementation of complete transceivers for high-performance wireless applications     

Integration of microstrip patch antenna on ceramic ball grid arraypackage

A novel concept of integration of an antenna on an integrated circuit package is proposed for the single-chip solutions of wireless transceivers. A prototype antenna integrated on a thin ceramic ball grid array package is reported. Results show that the antenna achieved impedance bandwidth of 4.65% and radiation efficiency of 65% at 5.52 GHz     

Dual-Band Microstrip Bandpass Filter Using Stepped-Impedance Resonators With New Coupling Schemes

A microstrip bandpass filter using stepped-impedance resonators is designed in low-temperature co-fired ceramic technology for dual-band applications at 2.4 and 5.2 GHz. New coupling schemes are proposed to replace the normal counterparts. It is found that the new coupling scheme for the interstages can enhance the layout compactness of the bandpass filter; while the new coupling scheme at the input and output can improve the performance of the bandpass filter. To validate the design and analysis, a prototype of the bandpass filter was fabricated and measured. It is shown that the measured and simulated performances are in good agreement. The prototype of the bandpass filter achieved insertion loss of 1.25 and 1.87 dB,$ S_11$of$-$29 and$-$40 dB, and bandwidth of 21% and 12.7% at 2.4 and 5.2 GHz, respectively. The bandpass filter is further studied for a single-package solution of dual-band radio transceivers. The bandpass filter is, therefore, integrated into a ceramic ball grid array package. The integration is analyzed with an emphasis on the connection of the bandpass filter to the antenna and to the transceiver die.     

Integrated RF architectures in fully-organic SOP technology

Future wireless communications systems require better performance, lower cost, and compact RF front-end footprint. The RF front-end module development and its level of integration are, thus, continuous challenges. In most of the presently used microwave integrated circuit technologies, it is difficult to integrate the passives efficiently with required quality. Another critical obstacle in the design of passive components, which occupy the highest percentage of integrated circuit and circuit board real estate, includes the effort to reduce the module size. These issues can be addressed with multilayer substrate technology. A multilayer organic (MLO)-based process offers the potential as the next generation technology of choice for electronic packaging. It uses a cost effective process, while offering design flexibility and optimized integration due to its multilayer topology. We present the design, model, and measurement data of RF-microwave multilayer transitions and integrated passives implemented in a MLO system on package (SOP) technology. Compact, high Q inductors, and embedded filter designs for wireless module applications are demonstrated for the first time in this technology.     

Finite-difference time-domain analysis of integrated ceramic ball grid array package antenna for highly integrated wireless transceivers

This paper presents a study of the integration of an antenna in a ceramic ball grid array package for highly integrated wireless transceivers. The study has been carried out on an 11/spl times/11.66 mm/sup 2/ small microstrip antenna in a thin 48-ball ceramic ball grid array package with the finite-difference time-domain (FDTD) method in C band. The impedance and radiation characteristics of the antenna are examined. More importantly, the loading effects of the complementary metal-oxide-semiconductor (CMOS) chip and bond wires on the performance of the antenna are investigated. It is found that the loading generally increases the impedance bandwidth but decreases the radiation efficiency of the antenna. To minimize detrimental loading, the shield of the antenna from the CMOS chip is considered. A new design has been realized. The new antenna achieves impedance bandwidth of 4.65%, radiation efficiency of 63%, and gain of 5.6 dBi at 5.52 GHz.     

新型WLAN平面倒F双频天线的设计

提出了一种新型的应用于2.4/5GHz蓝牙和无线局域网的双频内置平面倒F天线。该天线结构紧凑,可以方便地植入无线通信设备中,有较强的实用性。通过加载F形槽和阶梯形槽使天线能够满足无线局域网中小型化双频天线的技术要求。天线在蓝牙频段阻抗带宽达到300MHz(2.21~2.51GHz),在无线局域网频段阻抗带宽达到1070MHz(4.95~6.02GHz),辐射方向图表明该天线全向性能较好,增益在3.1~6.7dBi范围内。     

基于硅基IPD技术的新型S波段带通滤波器设计

将无源器件内埋或集成在封装基板中,是射频系统级封装(SIP)的小型化面临的首要问题之一.基于硅基集成无源器件(IPD)技术,借鉴经典的级联四角元件(CQ)滤波器拓扑,提出一种四电感互耦结构.利用集总LC谐振器和分布式互感耦合原理,在交叉耦合节点处以加载电容的方式引入频变耦合节点,实现了一款新颖的S波段四阶带通滤波器,尺寸仅为1.5 mm×l mm,其通带内最小插损约为-3.5 dB@ 2.8 GHz,-1 dB带宽为2.63～2.96 GHz,在带外形成两个传输零点位置:-41.5 dB@2.29 dB@3.34 GHz.该滤波器结构形式新颖,可以整体集成到硅基板中,为射频系统级封装一体化集成提供支持.     

Gigabit wireless: system-on-a-package technology

The system-on-a-package (SOP) concept is considered as the solution of future communication modules, where more functionality, better performance, low cost, and more integrity is needed. We demonstrate how SOP technology can address the integration platform for future communication systems, especially gigabit wireless communications. After the introduction of the SOP concept, we introduce the critical design building blocks which are required in a viable SOP technology: integrated passives, embedded RF functions, including high-performance filters and baluns, and integrated antenna technologies. Second, we review how the three-dimensional deployment of core elements, such as baluns, lumped inductors, capacitors, and resistors, as well as IF or low-pass filters, enables RF-SOP module development. We demonstrate how advanced radio architectures, including direct conversion, antenna diversity, and collaborative signal processing, are enabled using the SOP technology format. Various ceramic and organic material based multilayer packaging technologies have been used for building such integrated modules as well as circuit blocks. The critical issues and challenges for developing advanced communication platforms using the SOP approach are discussed.     

集群通信与无线局域网多天线共口径设计

针对地面集群无线电通信800 MHz频段和无线局域网5 GHz频段, 融合共口径技术和多输入多输出技术设计了一种新颖四单元双模式天线, 该无线局域网天线采用双层微带结构结合多输入多输出技术, 实现高通信容量; 集群通信天线采用单层空气微带结构结合贴片耦合馈电技术, 并与无线局域网天线共口径设计, 实现多天线小型化.仿真和测试结果表明:集群通信天线(驻波比小于2)的阻抗带宽为806~866 MHz, 天线增益大于6 dBi; 无线局域网天线的阻抗带宽为4.9~6.1 GHz, 天线增益大于8 dBi; 各天线间的端口隔离度大于22 dB, 无线局域网天线的包络相关系数远小于0.01, 满足多输入多输出天线的分集要求.     

Wireless Dosimeter: System-on-Chip Versus System-in-Package for Biomedical and Space Applications

A new floating-gate (FG) MOSFET based wireless dosimeter system-in-package (SiP) is presented. This miniature and completely integrated wireless dosimeter SiP comprises a CMOS FG radiation sensor and transmitter (TX) in a low-temperature co-fired ceramic (LTCC) package. The design is very well suited to wireless transmission of radiation sensor data in radiotherapy and to Extra Vehicular Activity Radiation Monitoring (EVARM) in space. Two different solutions, namely system-on-chip (SoC) and SiP, are demonstrated. In the SoC, which is size and power efficient, the TX includes an on-chip loop antenna which also acts as the inductor for the VCO resonant tank circuit. The SiP solution has an LTCC antenna with optimized impedance to conjugate match the TX chip. The radiation sensor demonstrates a measured sensitivity of 5 mV/rad. The SoC module size is only 2 ${hbox {mm}}^{2}$, consumes 5.3 mW of power and delivers $-$0.9 dBm of radiated power, sufficient to communicate with a low noise receiver connected to an off-chip patch antenna placed 1.38 m away. The SiP design provides a larger communication range of 75 m at the cost of additional power consumption and size.      

Low profile multiband rectenna for efficient energy harvesting at microwave frequencies

This paper presents the design and development of a multiband rectenna for ambient RF energy harvesting. The proposed rectifying antenna consists of fractal-based geometry to obtain GSM 0.9 GHz (0.8–1.2 GHz), GSM 1.8 GHz (1.6–2.1 GHz), WLAN 2.5 GHz (2.2–2.8 GHz), Wi-MAX 3.5 GHz (3.1–4.0 GHz), WLAN 5.5 GHz (5.3–6.4 GHz) and 7.35 GHz (7.0–7.8 GHz) resonating bands. The designed sensing antenna is low profile, lightweight and small in size with two circularly polarized bands at frequencies 1.8 and 2.5 GHz. In the proposed rectenna, a dual-stage voltage doubler rectifying circuit is utilized for converting surrounding RF signals into DC power. A matching network is connected between the fractal antenna and the rectifying circuitry for realizing a good impedance matching between them. To verify the proposed design, a prototype rectenna is fabricated and measured results are compared with the simulated results. The proposed rectifier provides an RF to DC conversion efficiency of 78%.     

多频印刷单极子天线的设计

〗提出一种应用于2.4/5.2/5.8 GHz WLAN和2.5/3.5/5.5 GHz WiMAX共面波导印刷单极子天线。该天线结构紧凑,可以方便地植入无线通讯设备中,有较强的实用性。此天线由50 Ω的微带传输线通过共面波导馈电的方式对具有对称结构的蝶型贴片馈电。在设计中,通过开缝和添加倾斜微带条,使天线获得的阻抗带宽可以覆盖WLAN和WiMAX频段。天线的总体尺寸为30 mm×32 mm,其结构紧凑、便于集成和加工,适合无线通讯应用。     

Cost and performance tradeoff analysis in radio and mixed-signal system-on-package design

An optimal total solution for radio and mixed-signal system integration needs tradeoffs between different design options. Among various design metrics, cost and performance are probably the two most important factors for design decisions. In this paper, we review and analyze cost-performance tradeoffs of system-on-chip (SOC) versus system-on-package (SOP) solutions for radio and mixed-signal applications. A new design methodology, which quantitatively predicts performance and cost gains of SOP versus SOC, is presented. The performance model evaluates various mixed-signal isolation techniques between sensitive analog/RF circuits and noisy digital circuits in SOC or SOP. The cost analysis includes new factors such as extra chip area and additional process steps for mixed-signal isolation, seamless integration of "virtual components" or intellectual property (IP) modules, yield and technology compatibility for merging logic, memory and analog/RF circuits on a single chip, and extra costs for moving passives off chip. In addition to these, a complete and systematic analysis method for on-chip versus off-chip passives tradeoffs is presented. The analysis and modeling techniques explore tradeoffs between performance, cost, robustness, and yield when different on-chip or off-chip passives are used. It thus provides a complete picture of quantitative tradeoffs for using on-chip or off-chip passives. The design methodology and analysis techniques are then demonstrated through several design examples in wireless applications. It is clearly shown that for all complex and high performance mixed-signal systems, SOP is a lower cost solution than SOC. Finally, some design guidelines for SOC versus SOP and on-chip versus off-chip are concluded.     

SOP integration and codesign of antennas

The successful deployment of wireless systems requires the integration of small, cost-effective antennas while preserving a reasonable electrical performance in the required bandwidth. This paper begins with a short overview of the most important antenna characteristics, and then uses these to describe the minimum requirements and fundamental performance-size limits for electrically small integrated antennas. The performance-size tradeoff is further illustrated by the design of a planar integrated antenna for WLAN. Codesign guidelines are given to avoid parasitic coupling between the integrated antenna and RF circuits. A concluding comparison is made between on-chip and on-package integration of a small antenna for microwave and millimeter wave systems.     

SoC and SiP, the Yin and Yang of the Tao for the New Electronic Era

“More than Moore” is becoming the password for these coming years. New steps to overcome technology limitations to diffuse, on the same die, different chips to have a complete system have been developed. This approach is called system in package (SiP), a way to have in a package dies of logic, analog, memory, passive components, etc., assembled to obtain a miniaturized board. SiP performances and limitations are here analyzed to understand advantages versus system on chip (SoC). This paper is a discussion about the main items that can lead to the choice of the right approach—SiP or SoC—before a system design start. Three persons attend to our virtual meeting: an SoC technology development manager, expert in microcontroller embedded memories and technology integration; an SiP analog radio-frequency design senior expert; and a moderator that designed embedded memories and now SiP, all involved to understand how to reach a tradeoff among these two approaches. Like for the Yin and Yang, symbol of the equilibrium for the Taoist philosophy, the two opposites divide the circle of the life, with a piece of each in the other.      

Integrated circuit ceramic ball grid array package antenna

The recent advances in such highly integrated RF transceivers as radio system-on-chip and radio system-in-package have called for the parallel development of compact and efficient antennas. This paper addresses the development of a new type of dielectric chip antenna known as integrated circuit package antenna (ICPA) for highly integrated RF transceivers. A compact ICPA of this type has, for the first time, been designed and fabricated in a ceramic ball grid array (CBGA) package format. The novel ICPA, except economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured antenna performance of the ICPA is presented. The effects of the different physical parts of the ICPA on the antenna performance are investigated. Results show that the ICPA achieved impedance bandwidth of 4.1% and radiation efficiency of 72%, and gain of 4.8 dBi at 5.715 GHz.     

Integration and electrical isolation in CMOS mixed-signal wirelesschips

The technological trends underlying the application of CMOS technology in wireless applications are leading to the integration of the RF analog functions and the digital baseband processing into a single chip. Two key technical requirements for this integration are the capability to fabricate high Q passive components and the need to maintain electrical isolation between analog and digital components in the resulting mixed-signal chip. Some basic arguments that illustrate the technological conflict between these two important demands are presented, focusing on their implications for the structure of the IC substrate. This structure and the characteristics of the device package play important robs in determining the levels of coupled ground noise that will be present in the mixed-signal IC. A simple, high-level model for coupled ground noise is presented and used to illustrate the impact of design alternatives for the package and for the IC substrate     

基于SiP技术的胶囊内窥镜微型电路系统制造

胶囊内窥镜是近年发展起来的微型医疗仪器,其电路构造具有体积小、功能全等特点。文章提出用高密度封装SiP技术实现胶囊内窥镜的电路系统微型化。相对传统的芯片定制方式,采用堆叠式、表面贴装式或倒装焊式等组装方式具有成本低、难度低、开发周期短的优点。SiP封装、埋植式元件基板制造等高密度封装技术的不断发展,使得采用普通商用芯片实现胶囊内窥镜电路系统制造具有可行性。     

The package integration of RF-MEMS switch and control IC for wireless applications

The integration of microelectromechanical systems (MEMS) switch and control integrated circuit (IC) in a single package was developed for use in next-generation portable wireless systems. This packaged radio-frequency (RF) MEMS switch exhibits an insertion loss under -0.4 dB, and isolation greater than -45 dB. This MEMS switch technology has significantly better RF characteristics than conventional PIN diodes or field effect transistor (FET) switches and consumes less power. The RF MEMS switch chip has been integrated with a high voltage charge pump plus control logic chips into a single package to accommodate the low voltage requirements in portable wireless applications. This paper discusses the package assembly process and critical parameters for integration of MEMS devices and bi-complementary metal oxide semiconductor (CMOS) control integrated circuit (IC) into a single package.     

Wideband miniature G-shaped antenna for dual-band WLAN applications

A wideband miniature G-shaped coplanar waveguide fed dual-band antenna for a wireless local area network (WLAN) is proposed. The proposed antenna has good radiation pattern and can provide two separate measured impedance bandwidths of 0.55 GHz (about 22.9% centred at 2.42 GHz) and 2.85 GHz (about 50.9% centred at 5.60 GHz), so that it easily covers the required bandwidths for WLAN operation. This design results in a small antenna size of 22 times 18.5 mm with the ground plane regarded as part of the antenna structure.